JP7384934B2 - 異種材料間の連続した相互接続部 - Google Patents

異種材料間の連続した相互接続部 Download PDF

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Publication number
JP7384934B2
JP7384934B2 JP2021570380A JP2021570380A JP7384934B2 JP 7384934 B2 JP7384934 B2 JP 7384934B2 JP 2021570380 A JP2021570380 A JP 2021570380A JP 2021570380 A JP2021570380 A JP 2021570380A JP 7384934 B2 JP7384934 B2 JP 7384934B2
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Japan
Prior art keywords
substrate
materials
conductive
joint
fluid phase
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JP2021570380A
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English (en)
Japanese (ja)
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JPWO2020243254A5 (enExample
JP2022534502A (ja
Inventor
チャールズ ジェイ． キンツェル，
マーク ウィリアム ローナイ，
マイケル アドベンチャー ホプキンス，
ジョルジ イー．， ジュニア カルボ，
サイ スリニバス デサバシナ，
トレバー アントニオ リビエラ，
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Liquid Wire Inc
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Liquid Wire Inc
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Publication of JP2022534502A publication Critical patent/JP2022534502A/ja
Publication of JPWO2020243254A5 publication Critical patent/JPWO2020243254A5/ja
Priority to JP2023191774A priority Critical patent/JP2024035235A/ja
Application granted granted Critical
Publication of JP7384934B2 publication Critical patent/JP7384934B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
JP2021570380A 2019-05-28 2020-05-28 異種材料間の連続した相互接続部 Active JP7384934B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023191774A JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962853481P 2019-05-28 2019-05-28
US62/853,481 2019-05-28
PCT/US2020/034854 WO2020243254A1 (en) 2019-05-28 2020-05-28 Continuous interconnects between heterogeneous materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023191774A Division JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Publications (3)

Publication Number Publication Date
JP2022534502A JP2022534502A (ja) 2022-08-01
JPWO2020243254A5 JPWO2020243254A5 (enExample) 2023-03-30
JP7384934B2 true JP7384934B2 (ja) 2023-11-21

Family

ID=73550791

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JP2021570380A Active JP7384934B2 (ja) 2019-05-28 2020-05-28 異種材料間の連続した相互接続部
JP2023191774A Pending JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023191774A Pending JP2024035235A (ja) 2019-05-28 2023-11-09 異種材料間の連続した相互接続部

Country Status (6)

Country Link
US (3) US11682615B2 (enExample)
EP (1) EP3977524A4 (enExample)
JP (2) JP7384934B2 (enExample)
KR (2) KR102625030B1 (enExample)
CN (2) CN120659461A (enExample)
WO (1) WO2020243254A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120659461A (zh) 2019-05-28 2025-09-16 液态电线公司 异质材料之间的连续互连
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
US12096563B2 (en) 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
WO2022246402A1 (en) 2021-05-18 2022-11-24 Liquid Wire Inc. Flexible high-power electronics bus
US20250016931A1 (en) 2021-07-30 2025-01-09 Liquid Wire Inc. Flexible and stretchable structures
WO2023023482A1 (en) 2021-08-16 2023-02-23 Liquid Wire Inc. Stretchable and flexible metal film structures
EP4397143A1 (en) 2021-08-31 2024-07-10 Liquid Wire Inc. Flexible and stretchable structures
WO2023070090A1 (en) 2021-10-22 2023-04-27 Liquid Wire Inc. Flexible three-dimensional electronic component
US20240418495A1 (en) 2021-10-27 2024-12-19 Liquid Wire Inc. Two-dimensional motion capture strain sensors
JPWO2023171464A1 (enExample) * 2022-03-08 2023-09-14
JP2023162759A (ja) * 2022-04-27 2023-11-09 日本メクトロン株式会社 フレキシブルプリント配線板及び電気配線
WO2025192170A1 (ja) * 2024-03-14 2025-09-18 株式会社村田製作所 伸縮性デバイス

Citations (3)

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JP2014505529A (ja) 2010-12-22 2014-03-06 カーディオインサイト テクノロジーズ インコーポレイテッド 多層センサー装置
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer
US20180247727A1 (en) 2016-02-29 2018-08-30 Liquid Wire Inc. Deformable Conductors and Related Sensors, Antennas and Multiplexed Systems

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WO2017151523A1 (en) * 2016-02-29 2017-09-08 Liquid Wire Llc Liquid wire
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Publication number Priority date Publication date Assignee Title
JP2014505529A (ja) 2010-12-22 2014-03-06 カーディオインサイト テクノロジーズ インコーポレイテッド 多層センサー装置
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer
US20180247727A1 (en) 2016-02-29 2018-08-30 Liquid Wire Inc. Deformable Conductors and Related Sensors, Antennas and Multiplexed Systems

Also Published As

Publication number Publication date
CN114175280A (zh) 2022-03-11
KR102625030B1 (ko) 2024-01-16
KR20240009535A (ko) 2024-01-22
CN114175280B (zh) 2025-07-08
WO2020243254A1 (en) 2020-12-03
KR20220030949A (ko) 2022-03-11
US11682615B2 (en) 2023-06-20
JP2024035235A (ja) 2024-03-13
EP3977524A4 (en) 2023-11-08
US11688677B2 (en) 2023-06-27
CN120659461A (zh) 2025-09-16
JP2022534502A (ja) 2022-08-01
US12205878B2 (en) 2025-01-21
US20210272891A1 (en) 2021-09-02
EP3977524A1 (en) 2022-04-06
KR102810370B1 (ko) 2025-05-19
US20200381349A1 (en) 2020-12-03
US20240047334A1 (en) 2024-02-08

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