KR102625030B1 - 분리형 구조체 및 분리형 센서 구조체 - Google Patents

분리형 구조체 및 분리형 센서 구조체 Download PDF

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KR102625030B1
KR102625030B1 KR1020217042896A KR20217042896A KR102625030B1 KR 102625030 B1 KR102625030 B1 KR 102625030B1 KR 1020217042896 A KR1020217042896 A KR 1020217042896A KR 20217042896 A KR20217042896 A KR 20217042896A KR 102625030 B1 KR102625030 B1 KR 102625030B1
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substrate
materials
fluid phase
phase conductor
conductive
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KR20220030949A (ko
Inventor
마크 윌리엄 로나이
조지 이. 주니어 카보
트레보 안토니오 리베라
찰스 제이. 킨젤
마이클 어드벤처 홉킨스
사이 스리니바스 데사바티나
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리퀴드 와이어 인크.
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Publication of KR20220030949A publication Critical patent/KR20220030949A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
KR1020217042896A 2019-05-28 2020-05-28 분리형 구조체 및 분리형 센서 구조체 Active KR102625030B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020247000986A KR102810370B1 (ko) 2019-05-28 2020-05-28 변형가능 전자 디바이스

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962853481P 2019-05-28 2019-05-28
US62/853,481 2019-05-28
PCT/US2020/034854 WO2020243254A1 (en) 2019-05-28 2020-05-28 Continuous interconnects between heterogeneous materials

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020247000986A Division KR102810370B1 (ko) 2019-05-28 2020-05-28 변형가능 전자 디바이스

Publications (2)

Publication Number Publication Date
KR20220030949A KR20220030949A (ko) 2022-03-11
KR102625030B1 true KR102625030B1 (ko) 2024-01-16

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KR1020217042896A Active KR102625030B1 (ko) 2019-05-28 2020-05-28 분리형 구조체 및 분리형 센서 구조체

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US (3) US11682615B2 (enExample)
EP (1) EP3977524A4 (enExample)
JP (2) JP7384934B2 (enExample)
KR (2) KR102810370B1 (enExample)
CN (2) CN120659461A (enExample)
WO (1) WO2020243254A1 (enExample)

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EP3977524A4 (en) 2019-05-28 2023-11-08 Liquid Wire Inc. Continuous interconnects between heterogeneous materials
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
US12096563B2 (en) * 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
US20240147582A1 (en) * 2021-05-18 2024-05-02 Liquid Wire Inc. Flexible high-power electronics bus
US20250016931A1 (en) 2021-07-30 2025-01-09 Liquid Wire Inc. Flexible and stretchable structures
US20240389225A1 (en) * 2021-08-16 2024-11-21 Liquid Wire Inc. Stretchable and flexible metal film structures
EP4397143A1 (en) 2021-08-31 2024-07-10 Liquid Wire Inc. Flexible and stretchable structures
US20240428981A1 (en) 2021-10-22 2024-12-26 Liquid Wire Inc. Flexible three-dimensional electronic component
US20240418495A1 (en) 2021-10-27 2024-12-19 Liquid Wire Inc. Two-dimensional motion capture strain sensors
WO2023171464A1 (ja) * 2022-03-08 2023-09-14 株式会社村田製作所 伸縮性デバイス
JP2023162759A (ja) * 2022-04-27 2023-11-09 日本メクトロン株式会社 フレキシブルプリント配線板及び電気配線
WO2025192170A1 (ja) * 2024-03-14 2025-09-18 株式会社村田製作所 伸縮性デバイス

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US20110180307A1 (en) 2010-01-22 2011-07-28 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US20130281814A1 (en) 2010-12-22 2013-10-24 Cardioinsight Technologies, Inc. Multi-layered sensor apparatus
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer

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US4770641A (en) * 1986-03-31 1988-09-13 Amp Incorporated Conductive gel interconnection apparatus
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TWI393511B (zh) * 2007-05-29 2013-04-11 松下電器產業股份有限公司 Dimensional printed wiring board and manufacturing method thereof
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WO2015077629A1 (en) * 2013-11-21 2015-05-28 Atom Nanoelectronics, Inc. Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays
WO2016203774A1 (ja) * 2015-06-19 2016-12-22 日本電信電話株式会社 フレキシブルプリント配線板のはんだ接合構造
JP6982959B2 (ja) * 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
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Publication number Priority date Publication date Assignee Title
US20110180307A1 (en) 2010-01-22 2011-07-28 Ibiden Co., Ltd. Flex-rigid wiring board and method for manufacturing the same
US20130281814A1 (en) 2010-12-22 2013-10-24 Cardioinsight Technologies, Inc. Multi-layered sensor apparatus
US20150187692A1 (en) 2012-07-26 2015-07-02 Unimicron Technology Corporation Packaging substrate having a through-holed interposer

Also Published As

Publication number Publication date
US11688677B2 (en) 2023-06-27
KR20220030949A (ko) 2022-03-11
JP2022534502A (ja) 2022-08-01
CN114175280A (zh) 2022-03-11
JP2024035235A (ja) 2024-03-13
EP3977524A1 (en) 2022-04-06
EP3977524A4 (en) 2023-11-08
WO2020243254A1 (en) 2020-12-03
KR20240009535A (ko) 2024-01-22
KR102810370B1 (ko) 2025-05-19
US20200381349A1 (en) 2020-12-03
JP7384934B2 (ja) 2023-11-21
CN114175280B (zh) 2025-07-08
US11682615B2 (en) 2023-06-20
US20210272891A1 (en) 2021-09-02
CN120659461A (zh) 2025-09-16
US12205878B2 (en) 2025-01-21
US20240047334A1 (en) 2024-02-08

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