CN120659461A - 异质材料之间的连续互连 - Google Patents

异质材料之间的连续互连

Info

Publication number
CN120659461A
CN120659461A CN202510817650.3A CN202510817650A CN120659461A CN 120659461 A CN120659461 A CN 120659461A CN 202510817650 A CN202510817650 A CN 202510817650A CN 120659461 A CN120659461 A CN 120659461A
Authority
CN
China
Prior art keywords
deformable
layer
electronic device
substrate
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202510817650.3A
Other languages
English (en)
Chinese (zh)
Inventor
马克·威廉·罗奈
小乔吉·E·卡博
特雷弗·安东尼奥·里维拉
查尔斯·J·金泽尔
迈克尔·阿德文彻·霍普金斯
赛·斯里尼瓦斯·德萨巴蒂娜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Liquid Wire Co
Original Assignee
Liquid Wire Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Liquid Wire Co filed Critical Liquid Wire Co
Publication of CN120659461A publication Critical patent/CN120659461A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/485—Adaptation of interconnections, e.g. engineering charges, repair techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49822—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
CN202510817650.3A 2019-05-28 2020-05-28 异质材料之间的连续互连 Pending CN120659461A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201962853481P 2019-05-28 2019-05-28
US62/853,481 2019-05-28
PCT/US2020/034854 WO2020243254A1 (en) 2019-05-28 2020-05-28 Continuous interconnects between heterogeneous materials
CN202080039373.3A CN114175280B (zh) 2019-05-28 2020-05-28 异质材料之间的连续互连

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN202080039373.3A Division CN114175280B (zh) 2019-05-28 2020-05-28 异质材料之间的连续互连

Publications (1)

Publication Number Publication Date
CN120659461A true CN120659461A (zh) 2025-09-16

Family

ID=73550791

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202510817650.3A Pending CN120659461A (zh) 2019-05-28 2020-05-28 异质材料之间的连续互连
CN202080039373.3A Active CN114175280B (zh) 2019-05-28 2020-05-28 异质材料之间的连续互连

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202080039373.3A Active CN114175280B (zh) 2019-05-28 2020-05-28 异质材料之间的连续互连

Country Status (6)

Country Link
US (3) US11682615B2 (enExample)
EP (1) EP3977524A4 (enExample)
JP (2) JP7384934B2 (enExample)
KR (2) KR102625030B1 (enExample)
CN (2) CN120659461A (enExample)
WO (1) WO2020243254A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120659461A (zh) 2019-05-28 2025-09-16 液态电线公司 异质材料之间的连续互连
US11937372B2 (en) 2020-06-24 2024-03-19 Yale University Biphasic material and stretchable circuit board
US12096563B2 (en) 2020-08-31 2024-09-17 Liquid Wire Inc. Flexible and stretchable structures
WO2022246402A1 (en) 2021-05-18 2022-11-24 Liquid Wire Inc. Flexible high-power electronics bus
US20250016931A1 (en) 2021-07-30 2025-01-09 Liquid Wire Inc. Flexible and stretchable structures
WO2023023482A1 (en) 2021-08-16 2023-02-23 Liquid Wire Inc. Stretchable and flexible metal film structures
EP4397143A1 (en) 2021-08-31 2024-07-10 Liquid Wire Inc. Flexible and stretchable structures
WO2023070090A1 (en) 2021-10-22 2023-04-27 Liquid Wire Inc. Flexible three-dimensional electronic component
US20240418495A1 (en) 2021-10-27 2024-12-19 Liquid Wire Inc. Two-dimensional motion capture strain sensors
JPWO2023171464A1 (enExample) * 2022-03-08 2023-09-14
JP2023162759A (ja) * 2022-04-27 2023-11-09 日本メクトロン株式会社 フレキシブルプリント配線板及び電気配線
WO2025192170A1 (ja) * 2024-03-14 2025-09-18 株式会社村田製作所 伸縮性デバイス

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3235212A1 (de) * 1982-09-23 1984-03-29 Schoeller & Co Elektronik Gmbh, 3552 Wetter Kontaktierungselement fuer gedruckte schaltungen
US4770641A (en) * 1986-03-31 1988-09-13 Amp Incorporated Conductive gel interconnection apparatus
US7327554B2 (en) * 2003-03-19 2008-02-05 Ngk Spark Plug Co., Ltd. Assembly of semiconductor device, interposer and substrate
US7141874B2 (en) * 2003-05-14 2006-11-28 Matsushita Electric Industrial Co., Ltd. Electronic component packaging structure and method for producing the same
US7959058B1 (en) * 2005-01-13 2011-06-14 The United States Of America As Represented By The Secretary Of The Navy Hybrid composite welded joint
JP2008235556A (ja) * 2007-03-20 2008-10-02 Sumitomo Electric Ind Ltd 配線板モジュール及び該配線板モジュールの製造方法
TWI393511B (zh) * 2007-05-29 2013-04-11 松下電器產業股份有限公司 Dimensional printed wiring board and manufacturing method thereof
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
TW201127246A (en) * 2010-01-22 2011-08-01 Ibiden Co Ltd Flex-rigid wiring board and method for manufacturing the same
EP2654556B1 (en) * 2010-12-22 2018-10-10 CardioInsight Technologies, Inc. Multi-layered sensor apparatus
TWI473218B (zh) * 2012-07-26 2015-02-11 欣興電子股份有限公司 穿孔中介板及其製法與封裝基板及其製法
KR102229384B1 (ko) * 2013-02-15 2021-03-18 오르멧 서키츠 인코퍼레이티드 다층 전자 기판의 z-축 상호 연결 구조물
WO2015077629A1 (en) 2013-11-21 2015-05-28 Atom Nanoelectronics, Inc. Devices, structures, materials and methods for vertical light emitting transistors and light emitting displays
CN107710887B (zh) * 2015-06-19 2020-02-21 日本电信电话株式会社 柔性印刷电路板的焊料接合构造
JP6982959B2 (ja) * 2016-02-05 2021-12-17 日本メクトロン株式会社 伸縮基板モジュール、伸縮性配線基板及びそれらの製造方法
WO2017151523A1 (en) * 2016-02-29 2017-09-08 Liquid Wire Llc Liquid wire
US10672530B2 (en) * 2016-02-29 2020-06-02 Liquid Wire Inc. Deformable conductors and related sensors, antennas and multiplexed systems
US10357171B2 (en) 2016-07-08 2019-07-23 General Electric Company Adjustable ECG sensor and related method
CN120659461A (zh) 2019-05-28 2025-09-16 液态电线公司 异质材料之间的连续互连

Also Published As

Publication number Publication date
CN114175280A (zh) 2022-03-11
KR102625030B1 (ko) 2024-01-16
KR20240009535A (ko) 2024-01-22
JP7384934B2 (ja) 2023-11-21
CN114175280B (zh) 2025-07-08
WO2020243254A1 (en) 2020-12-03
KR20220030949A (ko) 2022-03-11
US11682615B2 (en) 2023-06-20
JP2024035235A (ja) 2024-03-13
EP3977524A4 (en) 2023-11-08
US11688677B2 (en) 2023-06-27
JP2022534502A (ja) 2022-08-01
US12205878B2 (en) 2025-01-21
US20210272891A1 (en) 2021-09-02
EP3977524A1 (en) 2022-04-06
KR102810370B1 (ko) 2025-05-19
US20200381349A1 (en) 2020-12-03
US20240047334A1 (en) 2024-02-08

Similar Documents

Publication Publication Date Title
CN114175280B (zh) 异质材料之间的连续互连
EP3273754B1 (en) Stretchable cable and stretchable circuit board
US10297572B2 (en) Discrete flexible interconnects for modules of integrated circuits
US5468995A (en) Semiconductor device having compliant columnar electrical connections
JP2017531919A (ja) 集積回路ダイが埋設された可撓性電子回路並びにその製造方法及び使用方法
US20100330338A1 (en) Structured material substrates for flexible, stretchable electronics
CN112956283A (zh) 具有可变形导体的结构
CN109478516A (zh) 将电子组件连接至基板
US11882653B2 (en) Continuous interconnects between heterogeneous materials
CN109638149A (zh) 半导体封装设备
EP1796163A1 (en) Semiconductor device and electronic control unit using the same
US10548219B2 (en) Stress relaxation substrate and textile type device
CN115605770A (zh) 可变形电感器
US12358260B2 (en) Functional materials between deformable bonded layers
Al-Haidari Evaluation of a Novel Anisotropic Conductive Epoxy for Integration of Stretchable Wearable Electronics
Takakuwa et al. Device Integration Technology for Practical Flexible Electronics Systems
Malik et al. Flip chip bonding on stretchable printed substrates; the effects of stretchable material and chip encapsulation
Ostmann et al. Stretchable circuit board technology in textile applications
JP2019165049A (ja) 伸縮性配線板
Li Electronic packaging for functional electronic textiles
KR20220048886A (ko) 스트레처블 인쇄 회로 기판 및 스트레처블 인쇄 회로 기판 제조 방법
CN110567620A (zh) 一种导线及其制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination