JP7379893B2 - Wiring board with support board, wiring board, wiring board laminate with element, and wiring board with element - Google Patents

Description

The present disclosure relates to a wiring board with a support substrate, a wiring board, a wiring board laminate with an element, and a wiring board with an element.

In recent years, with the miniaturization and higher performance of electronic devices, there has been a demand for thinner wiring boards. One technique for thinning wiring boards is, for example, by using a build-up method to form a laminate having an electrode layer, an insulating layer, etc. on a support substrate, and then peeling the obtained laminate from the support substrate. Development of technology for use as wiring boards is progressing. The wiring board obtained by the above technique has a coreless structure without a support substrate.

Regarding wiring boards having a coreless structure, for example, Patent Document 1 discloses a technique for simultaneously forming copper posts on the front and back sides of a semiconductor package board at an initial stacking stage.

Further, for example, Patent Document 2 discloses a wiring board laminate used for manufacturing a semiconductor device incorporating a semiconductor chip, the wiring board laminate including a glass support substrate and wiring formed on the glass support substrate. The wiring board and the glass support substrate are bonded to each other via a peelable adhesive layer, and the wiring board has an external surface formed on the adhesive layer on the glass support substrate. a connection terminal, a single or multilayer electrode layer provided above the external connection terminal, an insulating layer provided between the external connection terminal and the electrode layer and between the multilayer electrode layers, and the external connection terminal. A via hole for electrically connecting between the connection terminal and the electrode layer and between the layers of the multilayer electrode layer, an insulating film provided on the uppermost electrode layer, and a part of the insulating film are removed. A wiring board laminate is disclosed that includes chip connection terminals that are formed by exposing a portion of the uppermost electrode layer and serve as connection points with the semiconductor chip.

Further, for example, Patent Document 3 describes an insulating layer, an electronic component built into the insulating layer, and an electronic component formed in the insulating layer and having an opening on one side of the insulating layer to expose an electrode of the electronic component. a first electrode layer embedded in the insulating layer and having one surface exposed from one surface of the insulating layer, a wiring pattern formed on one surface of the first electrode layer, and the wiring. A wiring board is disclosed that includes a second electrode layer that includes a via wiring that extends from the pattern into the via hole and is directly connected to the electrode of the electronic component.

Further, for example, Patent Document 4 discloses a coreless printed wiring board having a laminate including two or more resin insulating layers, which is composed of conductor layers and resin insulating layers that are alternately laminated, The laminate has a first surface and a second surface each consisting of one surface of the outermost resin insulating layer on each of the front and back sides of the laminate, and a conductor layer including a plurality of conductor pads on the second surface. The first resin insulating layer constituting the first surface of the laminate is formed of a material containing a reinforcing material, and the resin insulating layers in the laminate other than the first resin insulating layer do not contain the reinforcing material. The conductor layer on the second surface of the laminate includes a plurality of first conductor pads connected to an external first electronic component, and an external first electronic component larger than the first electronic component. 2 electronic components, the plurality of second conductor pads are located closer to the outer periphery of the second surface than the plurality of first conductor pads, and the plurality of second conductor pads are connected to the plurality of first conductor pads. A printed wiring board is disclosed in which conductor pads are arranged at a pitch larger than that of the conductor pads.

Japanese Patent Application Publication No. 2014-220402 JP 2017-50464 Publication JP 2018-6712 Publication JP 2018-82084 Publication

However, in the wiring board having the above-mentioned coreless structure, when the electrode layer exposed on the side of the supporting substrate side of the wiring board is subjected to a treatment such as gold plating, the inside of the electrode layer corrodes. There was a problem with this, which could eventually lead to a disconnection. Furthermore, there is a possibility that other wiring boards, members, etc. may be mounted on the surface of the wiring board that was on the support substrate side. However, when performing the above-mentioned mounting, there was a problem in that the surface of the wiring board on the support substrate side was not smooth, which could cause problems in connection with the other members mentioned above.

The present disclosure is an invention made in view of the above circumstances, and there is no problem even when post-processing such as gold plating is applied to the surface that was on the support substrate side, and the smoothness of the surface that was on the support substrate side is good. The main purpose of this invention is to provide a wiring board having a coreless structure.

In order to solve the above-mentioned problems, the inventors of the present invention made extensive studies and found that when a wiring board having a coreless structure is peeled off from a supporting substrate, the electrode layer and the insulating layer existing on the supporting substrate side of the wiring board are separated. It was discovered that shear stress was applied during the process, causing problems such as peeling.

If such a problem occurs, the processing liquid will enter the peeled portion during the subsequent gold plating process, etc., which will continuously corrode the internal electrode layer, resulting in problems such as disconnection. Further, when the above-mentioned peeling occurs, the electrode layer becomes depressed or the insulating layer in the peeled portion protrudes, so that smoothness may not be maintained, which causes problems in subsequent mounting.

The present inventors conducted studies to solve these new problems, and found that the above problems can be solved by improving the adhesion at the interface between the electrode layer and the insulating layer on the peeling surface with the support substrate. This discovery led to the completion of the present invention.

That is, the present disclosure includes a support substrate and a wiring board disposed on one side of the support substrate and having an electrode layer and an insulating layer containing resin, and the wiring board is peeled from the support substrate. A wiring board with a supporting substrate, which is used as a wiring board having a coreless structure, wherein the electrode layer has a first electrode layer disposed closest to the supporting substrate, and the insulating layer includes: a first insulating layer disposed at a position closest to the support substrate and disposed on a side surface of the first electrode layer, between the side surface of the first electrode layer and the first insulating layer; A wiring board with a support substrate is provided, in which an adhesive layer is disposed at least in the region on the support substrate side.

According to the present disclosure, the adhesive layer is disposed between the side surface of the first electrode layer and the first insulating layer at least in the support substrate side region, so that when the wiring board is peeled off from the support substrate, , it is possible to provide a wiring board with a support substrate that can suppress peeling of the side surface of the electrode layer located on or near the peeling surface from the insulating layer. Therefore, the wiring board obtained after peeling off the support substrate can be a wiring board free from the above-mentioned defects.

In the present disclosure, it is preferable that the adhesive layer is formed in the entire area between the side surface of the first electrode layer and the first insulating layer. This is because the adhesion between the first electrode layer and the first insulating layer can be made stronger.

In the present disclosure, it is preferable that the adhesive layer is a seed layer and the first electrode layer is a plating layer. This is because when the electrode layer is formed by plating, the adhesion layer forming process can be performed in the same process as the seed layer forming process, so the process can be simplified.

In the present disclosure, it is preferable that the adhesion layer is made of a metal or an inorganic oxide, because the adhesion between the first electrode layer and the first insulating layer can be improved.

Further, in the present disclosure, the first insulating layer may have a via hole, and the first electrode layer may be a via electrode layer disposed inside the via hole, and the first insulating layer may have a via hole. The first electrode layer may be a land portion disposed on the support substrate side of the via hole.

The present disclosure provides a wiring board having a coreless structure having an electrode layer and an insulating layer containing resin and having no support substrate, wherein one of the front and back surfaces of the wiring board is connected to the support substrate. The electrode layer has a first electrode layer disposed closest to the smooth surface, and the insulating layer has a first electrode layer disposed closest to the smooth surface, and the insulating layer has a first electrode layer disposed closest to the smooth surface, and a first insulating layer disposed on a side surface of the first electrode layer; an adhesive layer disposed at least in a region on the support substrate side between the side surface of the first electrode layer and the first insulating layer; The company provides wiring boards.

According to the present disclosure, it is possible to provide a wiring board in which peeling of the side surface of the electrode layer located on or near the peeling surface from the insulating layer is suppressed for the same reason as the wiring board with a support substrate described above.

In the present disclosure, it is preferable that the adhesion layer is formed in the entire area between the side surface of the first electrode layer and the first insulating layer, and the adhesion layer is a seed layer, and It is preferable that the first electrode layer is a plating layer, and it is further preferable that the adhesive layer is made of a metal or an inorganic oxide. This is due to the same reason as in the case of the above-mentioned wiring board with support board.

Further, in the present disclosure, the first insulating layer may have a via hole, and the first electrode layer may be a via electrode layer disposed inside the via hole, and the first insulating layer may have a via hole. The first electrode layer may be a land portion disposed on the support substrate side of the via hole.

Further, the present disclosure provides a wiring board laminate with an element, which includes the above-mentioned wiring board with a support substrate and an element mounted on a surface of the wiring board with a support substrate on a side opposite to the support substrate. Furthermore, the present disclosure provides a wiring board with an element, which includes the wiring board described above and an element mounted on the wiring board. Both have the same advantages as explained in the case of the above-mentioned wiring board with supporting substrate.

The wiring board with a supporting substrate of the present disclosure can be obtained because when the wiring board is peeled off from the supporting substrate, the side surface of the electrode layer located on or near the peeled surface can be prevented from peeling off from the insulating layer. This has the effect of suppressing the occurrence of problems such as wire breakage in a wiring board having a coreless structure and problems such as mounting defects on the surface from which the support substrate is peeled off.

FIG. 2 is a schematic cross-sectional view showing an example of a wiring board with a support substrate and a wiring board of the present disclosure. It is a schematic sectional view showing other examples of a wiring board with a supporting board and a wiring board of the present disclosure. FIG. 3 is a schematic cross-sectional view showing another example of the wiring board with support substrate of the present disclosure. FIG. 3 is a schematic cross-sectional view showing another example of the wiring board with support substrate of the present disclosure. FIG. 3 is a process diagram showing an example of a method for manufacturing a wiring board with a support substrate according to the present disclosure. FIG. 7 is a process diagram showing another example of the method for manufacturing a wiring board with a support substrate according to the present disclosure. FIG. 3 is a schematic cross-sectional view showing another example of the wiring board of the present disclosure. FIG. 1 is a schematic cross-sectional view showing an example of an element-equipped wiring board laminate according to the present disclosure. FIG. 1 is a schematic cross-sectional view showing an example of a wiring board with an element according to the present disclosure. FIG. 7 is a process diagram showing a method for manufacturing a wiring board of a comparative example.

Embodiments of the present disclosure will be described below with reference to the drawings and the like. However, the present disclosure can be implemented in many different ways, and should not be construed as being limited to the description of the embodiments exemplified below. Further, in order to make the explanation clearer, the drawings may schematically represent the width, thickness, shape, etc. of each part compared to the actual form, but this is just an example and does not limit the interpretation of the present disclosure. It's not something you do. In addition, in this specification and each figure, the same elements as those described above with respect to the previously shown figures are denoted by the same reference numerals, and detailed explanations may be omitted as appropriate.

When we say "above" or "below," unless otherwise specified, there are cases where another member is placed directly above or directly below a certain member, and cases where another member is placed above or below a certain member. This also includes the case where another member is disposed via another member.

Hereinafter, details of a wiring board with a support substrate, a wiring board, a wiring board laminate with an element, and a wiring board with an element according to the present disclosure will be described.

A. Wiring board with support board The wiring board with support board of the present disclosure includes a support board, and a wiring board disposed on one side of the support board and having an electrode layer and an insulating layer containing resin, The wiring board is a wiring board with a support substrate that is peeled off from the support substrate and used as a wiring board having a coreless structure, and the electrode layer is a first electrode layer disposed at a position closest to the support substrate. The insulating layer has a first insulating layer disposed at a position closest to the support substrate and on a side surface of the first electrode layer, and the insulating layer has a first insulating layer disposed at a position closest to the supporting substrate and on a side surface of the first electrode layer; The present invention is characterized in that an adhesive layer is disposed at least in the support substrate side region between the first insulating layer and the first insulating layer.

A wiring board with a support substrate according to the present disclosure will be explained using figures. FIG. 1(a) is a schematic cross-sectional view showing an example of a wiring board with a support substrate of the present disclosure, and FIGS. 1(b) and (c) are coreless structures obtained from the wiring board with a support substrate of FIG. 1(a). FIG. 3 is a schematic cross-sectional view showing one example and another example of a wiring board having a wiring board.

A wiring board with a support board 10 shown in FIG. 1A includes a support board 1 and a wiring board 2 disposed on one surface of the support board 1. As shown in FIGS. 1(b) and 1(c), the wiring board 2 is peeled off from the support substrate 1 and used. The wiring board 2 includes an electrode layer 21 disposed on one surface of the support substrate 1 and an insulating layer 22 containing resin and disposed on the surface of the support substrate 1 on the electrode layer 21 side. As shown in the wiring board 2 of this example, the electrode layer 21 located closest to the support substrate 1 becomes the first electrode layer 21a, and the insulating layer 22 located closest to the support substrate 1 becomes the first insulating layer 22a. An adhesion layer 23 is disposed between the side surface of the first electrode layer 21a and the first insulating layer 22. Here, the first electrode layer 21a is a via electrode layer arranged in a via hole V provided in the first insulating layer 22a. The first electrode layer 21a, which is the via electrode layer, is formed integrally with the electrode layer 21b, which is an in-plane wiring layer, provided on the surface of the first insulating layer 22a opposite to the support substrate 1. . In this example, an adhesion layer 23 is also arranged between the electrode layer 21b, which is the in-plane wiring layer, and the first insulating layer 22a.

1(a), (b), and (c), the wiring board 2 has two electrode layers (21a and 21b, and 21c) and three insulating layers 22a, 22b, and 22c laminated. An example is shown below. Further, in this example, the wiring board 2 has a connection part 24 on the side opposite to the support board 1 side, and furthermore, as shown in FIG. A release layer 3 is arranged between the substrate 2 and the substrate 2 .

According to the present disclosure, the adhesive layer is disposed between the side surface of the first electrode layer and the first insulating layer at least in the support substrate side region, so that when the wiring board is peeled off from the support substrate, , it is possible to provide a wiring board with a support substrate that can suppress peeling of the side surface of the electrode layer located on or near the peeling surface from the insulating layer.

Normally, in a wiring board having a coreless structure, if a gap is created between the side surface of the electrode layer located at or near the peeling surface and the insulating layer, when a treatment liquid is used in a later process, the treatment liquid may cause the above-mentioned peeling. Although there is a problem that the electrode layer corrodes by penetrating into the gaps between surfaces, the wiring board with a supporting substrate of the present disclosure can suppress the generation of the above-mentioned gaps and peel the wiring board from the supporting substrate. , a wiring board with high electrical reliability can be obtained.

Furthermore, since the wiring board with a support substrate of the present disclosure can suppress the generation of the above-mentioned gap and peel the wiring board from the support substrate, the core-less wiring board obtained by peeling the support substrate from the wiring board with the support substrate described above can be removed. In the wiring board having the structure, the surface on the support substrate side can be made smooth. Thereby, it is possible to suppress the possibility of problems occurring when other members are mounted on the surface of the wiring board having the coreless structure on which the support substrate is disposed.
Hereinafter, each structure of the wiring board with support substrate of the present disclosure will be described in detail.

1. Wiring board The wiring board in the present disclosure is a member that is placed on one side of a support substrate, is a member that is used after being peeled off from the support substrate, and is used as a wiring board that has a coreless structure without a support substrate. It is something. Such a wiring board has at least an electrode layer, an insulating layer, and an adhesion layer. Each will be explained below.

(1) Adhesion layer The adhesion layer in the present disclosure includes an electrode layer disposed at a position closest to the support substrate as a first electrode layer, and an adhesion layer disposed at a position closest to the support substrate and the first electrode layer. When the insulating layer disposed on the side surface is a first insulating layer, it is a member disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer. The adhesion layer has a function of increasing adhesion between the side surface of the first electrode layer and the first insulating layer.

In the present disclosure, at least the support substrate side region between the side surface of the first electrode layer and the first insulating layer refers to the side surface of the first electrode layer on the support substrate side surface of the wiring board and the region on the support substrate side. This indicates a region including the boundary with the first insulating layer, and the range is not particularly limited, but is the entire region between the side surface of the first electrode layer and the first insulating layer. This is preferable from the viewpoint of improving adhesion.
The adhesion layer in the present disclosure may further be disposed in a region other than between the side surface of the first electrode layer and the first insulating layer.

For example, as shown in FIG. 1A, the adhesion layer 23 is formed on the side surface of the first electrode layer 21a, which is a via electrode layer, and the surface of the electrode layer 21b, which is an in-plane wiring layer, on the support substrate 1 side, that is, the support substrate 1 side surface of the electrode layer 21b, which is an in-plane wiring layer. It may be arranged between the substrate 1 and the electrode layer 21b. When the adhesive layer is used as a seed layer, it has the advantage that the electrode layer can be easily formed by electrolytic plating.

For example, as shown in FIG. 2(a), the adhesion layer 23 is disposed on the side surface of the first electrode layer 21a, which is the land portion, and on the surface of the first electrode layer 21a opposite to the support substrate 1 side. Good too. Although not shown, in the case where the adhesive layer is disposed on the surface of the first electrode layer opposite to the supporting substrate side and the adhesive layer does not have conductivity, the above-mentioned portion of the first electrode layer No adhesive layer is formed on the surface opposite to the support substrate.

The material for the adhesion layer is not particularly limited, and any material can be used as long as it can increase the adhesion between the side surface of the first electrode layer and the first insulating layer. However, in the present disclosure, metal materials or inorganic oxides are preferably used.

Examples of metal materials used for the adhesive layer include titanium (Ti), chromium (Cr), nickel (Ni), copper (Cu), aluminum (Al), tungsten (W), molybdenum (Mo), and silver (Ag). ), metals such as gold (Au), and alloys such as nickel-chromium alloy (Ni-Cr). The reason why the adhesion between the first electrode layer and the first insulating layer increases when the above-mentioned metal material is used is estimated as follows.

In other words, the optimal material for the adhesion layer differs depending on the materials of the first electrode layer and the first insulating layer, but there is a material that mediates between each layer with respect to at least one property such as surface energy, elastic modulus, and coefficient of thermal expansion. By selecting and using a metal material having the above-mentioned characteristics from the metal materials mentioned above, interlayer stress between the first electrode layer and the first insulating layer can be reduced, and good adhesion can be obtained. Presumed. As one specific example, between the first electrode layer containing Cu, which is suitably used as a wiring material, and the first insulating layer containing polyimide, which is suitably used as an insulating material, Ti or Cr, which has a low coefficient of thermal expansion, is used. Adhesion can be improved by intervening as an adhesion layer.
Among these, Ti is preferable as the metal material. This is because migration resistance can be imparted when a wiring material that easily diffuses, such as Cu or Al, is used as the first electrode layer.

Examples of inorganic oxides used in the adhesive layer include silicone, indium tin oxide (ITO), indium zinc oxide (IZO), titanium oxide, zinc oxide, and chromium oxide. , copper oxide, etc. The reason why the adhesion between the first electrode layer and the first insulating layer increases when the above-mentioned inorganic oxide is used is that by using the inorganic oxide in the adhesion layer, hydrogen bonds with the hydroxyl groups contained in the insulating layer are formed. It is presumed that this is because the knot adhesion can be improved.

When the inorganic oxide used for the adhesive layer is silicone, the adhesive layer can be formed by hydrolysis and condensation reaction using, for example, a silane coupling agent. A first insulating layer in which the Si-O-Si group of the obtained adhesive layer has an affinity with the first electrode layer containing a metal material or an inorganic oxide, and the organic functional group contained in the adhesive layer contains a resin. By having affinity for this, it is possible to increase the adhesion between the side surface of the first electrode layer and the first insulating layer.

When forming the first electrode layer described later in the present disclosure by a plating method, a seed layer formed when forming a plating layer can be used as an adhesion layer. When using a seed layer in a plating method, examples of materials for the adhesion layer include titanium (Ti), molybdenum (Mo), tungsten (W), tantalum (Ta), nickel (Ni), chromium (Cr), copper ( Cu), aluminum (Al), compounds thereof, alloys thereof, and the like.

The material used for the adhesion layer is preferably a material whose linear expansion coefficient is between the value of the linear expansion coefficient of the material of the first electrode layer and the linear expansion coefficient of the first insulating layer. This is because the adhesion between the first electrode layer and the first insulating layer can be improved. The linear expansion coefficient of the material used for the adhesive layer is preferably, for example, 1 (10 ^-6 /°C) or more and 100 (10 ^-6 /°C) or less, and 3 (10 ^-6 /°C) or more and 17 (10 ⁻⁶ /°C) or less is more preferable. The linear expansion coefficient can be measured using a measurement method based on JIS Z 2285 "Method for measuring linear expansion coefficient of metal materials".

The thickness of the adhesive layer is not particularly limited as long as it is thick enough to increase the adhesiveness between the side surface of the first electrode layer and the first insulating layer, and is appropriately selected depending on the material of the adhesive layer. can do. The thickness of the adhesive layer may be, for example, 0.001 μm or more, 0.01 μm or more, or 0.1 μm or more. Further, the thickness of the adhesive layer may be, for example, 10 μm or less, 1 μm or less, or 0.1 μm or less. This is because if the thickness of the adhesive layer is thinner or thicker than the above range, it may be difficult to form the adhesive layer. Further, if the thickness of the adhesive layer is thinner than the above range, it may be difficult to sufficiently increase the adhesiveness between the side surface of the first electrode layer and the first insulating layer. Further, it is preferable that the adhesive layer is thinner than the first electrode layer described later.

The method of forming the adhesive layer is not particularly limited as long as it is a method that allows the adhesive layer to be placed between the side surface of the first electrode layer and the first insulating layer. The adhesive layer may be formed by a wet process or a dry process. Examples of the wet process include electroless plating, a method using a silane coupling agent, and the like. On the other hand, as a dry process, for example, after forming an adhesive layer using a vapor deposition method such as a sputtering method, a physical vapor deposition method (PVD method), or a chemical vapor deposition method (CVD method), an adhesive layer is formed using a photolithography method or the like. A method for removing the adhesive layer can be mentioned.

(2) Electrode Layer The electrode layer in the present disclosure is a member that is disposed on one surface of the support substrate and constitutes a wiring board together with an insulating layer to be described later. The electrode layer in the present disclosure can be divided into a first electrode layer disposed closest to the support substrate and electrode layers other than the first electrode layer. Each will be explained below.

(a) First electrode layer The first electrode layer in the present disclosure is an electrode layer disposed on the wiring board at a position closest to the support substrate, and the side surface in contact with the insulating layer is the surface on the support substrate side of the wiring board. This is an electrode layer arranged to extend up to the point. Specifically, such a first electrode layer is a via electrode layer formed in a via hole formed in the first insulating layer (a via electrode layer arranged in a via hole V in FIG. 1(a)). 21a), a land portion disposed on the supporting substrate side of the via hole formed in the first insulating layer (land portion 21a shown in FIG. 2(a)); An example is an in-plane wiring layer disposed between them.
In the present disclosure, it can be said that it is preferable that the first electrode layer is the via electrode layer and the land portion from the viewpoint of improving adhesion.

The via electrode layer is usually arranged continuously on the inner side surface of a via hole provided in an insulating layer. The via electrode layer only needs to be disposed at least on the inner side surface of the via hole, and may or may not have a hollow structure. When having a hollow structure, it is preferable that a filling layer is disposed in the hollow part. This is because the strength of the wiring board can be increased. Examples of the material for the filling layer include resin.

Note that even if, for example, the via electrode layer is formed integrally with a land portion or an in-plane wiring layer disposed on the surface of the first insulating layer opposite to the supporting substrate, the present disclosure does not apply. The first electrode layer represents only a via electrode layer.

In the present disclosure, the adhesive layer is formed on the side surface of such a first electrode layer, but if a plurality of the first electrode layers are formed in the wiring board, at least one of the first electrode layers is formed on the side surface of the first electrode layer. It is sufficient that the adhesive layer is formed on the side surface of one electrode layer. Note that, from the viewpoint of preventing problems, it is usually preferable that the adhesive layer is formed on the side surfaces of all the first electrode layers.

The material of the first electrode layer in the present disclosure is not particularly limited as long as it is a conductive material. Examples of the material of the first electrode layer include metal elements contained in the metal material such as chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), and copper. (Cu), zinc (Zn), gallium (Ga), germanium (Ge), arsenic (As), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), indium (In), tin (Sn), antimony (Sb), osmium (Os), iridium (Ir), platinum (Pt), gold (Au), mercury (Hg), thallium (Tl), lead (Pb), bismuth (Bi), molybdenum (Mo), titanium (Ti), tungsten (W), tantalum (Ta), and aluminum (Al). Among these, the wiring material is preferably a simple metal such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, or chromium, or an alloy containing at least one of these metal elements; Alloys are more preferred. This is because copper has a low electrical resistance and can improve the electrical conductivity of the first electrode layer. Further, metal oxides such as indium tin oxide (ITO) and indium zinc oxide (IZO) can also be used.

In addition, when the first electrode layer is a plating layer, examples of the material of the first electrode layer include metals such as copper, gold, silver, platinum, rhodium, tin, aluminum, nickel, and chromium, or alloys using these. etc., or a laminate of these can be used. When the first electrode layer is a plating layer, it is preferable that the adhesive layer is a seed layer.

The linear expansion coefficient of the material of the first electrode layer is not particularly limited, but may be, for example, 3 (10 ^-6 /°C) or more and 50 (10 ^-6 /°C) or less, or 5 (10 ^-6 /°C) or less. ℃) or more and 17 (10 ⁻⁶ /°C) or less. The method for measuring the coefficient of linear expansion of the material of the first electrode layer can be the same as the method of measuring the coefficient of linear expansion of the material of the adhesive layer.

The thickness of the first electrode layer can be appropriately selected depending on the use of the wiring board, and is not particularly limited. The thickness of the first electrode layer is, for example, 0.1 μm or more, may be 0.5 μm or more, may be 1 μm or more, may be 3 μm or more, or may be 5 μm or more. . On the other hand, the thickness of the first electrode layer is, for example, 20 μm or less, and may be 15 μm or less.

The method for forming the first electrode layer is not particularly limited as long as a desired electrode layer can be formed, and may be an additive method or a subtractive method. In the additive method, a resist pattern is produced by, for example, photolithography, and a plating method is performed on the portions exposed from the resist pattern, thereby obtaining a patterned first electrode layer. When using electrolytic plating, a seed layer may be formed on the support substrate before producing the resist pattern. Further, the above seed layer may be used as an adhesion layer. In the subtractive method, for example, a resist pattern is formed on the first electrode layer formed on the entire surface, and the portion exposed from the resist pattern is etched, thereby obtaining a patterned first electrode layer.

(b) Other electrode layers The wiring board according to the present disclosure only needs to have at least the first electrode layer, but usually has other electrode layers. Such other electrode layers include land portions and in-plane wiring layers formed on the main surface of the first insulating layer opposite to the supporting substrate, and further, the supporting substrate of the first insulating layer. Examples include a via electrode layer filled in a via hole provided in another insulating layer further provided on the opposite side, a land portion, an in-plane wiring layer, and the like.
The number and type of these other electrode layers are not particularly limited, and can be appropriately selected depending on the use of the wiring board and the like.

(3) Insulating layer The insulating layer is a member that is placed on one side of the support substrate and constitutes the wiring board together with the electrode layer, and has the function of protecting the electrode layer, and is placed between the electrode layers to It has the function of preventing layer short circuits. The insulating layer in the present disclosure can be divided into a first insulating layer disposed closest to the supporting substrate and on a side surface of the first electrode layer, and an insulating layer other than the first insulating layer. can. Each will be explained below.

(a) First Insulating Layer The first insulating layer in the present disclosure refers to an insulating layer disposed closest to the support substrate and on the side surface of the first electrode layer. When the wiring board according to the present disclosure has only one insulating layer, the insulating layer corresponds to the first insulating layer. Further, in the case of having a multilayer wiring board in which two or more insulating layers are laminated, the insulating layer disposed closest to the support substrate among the multilayer insulating layers corresponds to the first insulating layer.

The first insulating layer in the present disclosure may be arranged over the entire surface of the support substrate, or may be arranged in a specific pattern. Further, the first insulating layer may have a via hole penetrating the first insulating layer. When the first insulating layer has a via hole, the via electrode layer arranged inside the via hole becomes the above-mentioned first electrode layer, and as described above, an adhesive layer is arranged between the side surface of the via electrode layer and the side surface of the via hole. It is preferable that the

The shape of the vertical cross section (the cross section in the direction perpendicular to the surface of the support substrate) of the via hole provided in the first insulating layer is not particularly limited as long as the via electrode layer can be arranged and the front and back sides of the first insulating layer can be electrically connected. For example, as shown in FIG. 3, the vertical cross-sectional shape of the via hole V may be rectangular, and as shown in FIG. The opening may have a tapered shape that is smaller than the opening on the side opposite to the substrate 1 side. When the via hole has the above-described tapered shape, peeling between the side surface of the first electrode layer and the first insulating layer can be further suppressed.

The first insulating layer in the present disclosure contains resin, and is usually composed of resin. The resin used for the insulating layer is not particularly limited as long as it has insulating properties, and may be, for example, a photosensitive resin or a non-photosensitive resin. Specifically, polyimide, polyamide, polyamideimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyetheretherketone, polyethersulfone, polycarbonate, polyetherimide, epoxy resin, phenolic resin, polyphenylene ether, acrylic resin, polyolefin. (eg, polyethylene, polypropylene), polycycloolefin (eg, polynorbornene), and liquid crystalline polymer compounds.

The linear expansion coefficient of the material of the first insulating layer is not particularly limited, but may be, for example, 1 (10 ^-6 /°C) or more and 100 (10 ^-6 /°C) or less, or 3 (10 ^-6 /°C) or less. ℃) or more and 50 (10 ⁻⁶ /°C) or less. The linear expansion coefficient of the material of the first insulating layer can be measured by a measurement method based on JIS K7197 "Linear expansion coefficient testing method by thermomechanical analysis of plastics".

The thickness of the insulating layer can be appropriately selected depending on the use of the wiring board, and is not particularly limited. The thickness of the insulating layer, for example, the thickness of the interlayer insulating layer is, for example, 1.5 μm or more, may be 2.0 μm or more, or may be 2.5 μm or more. On the other hand, the thickness of the insulating layer may be, for example, 8 μm or less, or 6 μm or less.

The method for forming the first insulating layer is preferably selected appropriately depending on the material of the first insulating layer. For example, when the material of the first insulating layer is a photosensitive material, a patterned first insulating layer can be obtained by exposing and developing the first insulating layer formed on the entire surface. On the other hand, when the material of the first insulating layer is a non-photosensitive material, a resist pattern is created on the first insulating layer formed on the entire surface, and the exposed part of the resist pattern is etched to form a patterned first insulating layer. You get layers. Further, for example, a patterned first insulating layer may be formed by performing laser processing on the first insulating layer.

When the adhesive layer is directly disposed on the first insulating layer, the surface of the first insulating layer may be roughened to improve adhesion to the adhesive layer (anchor treatment). In this case, the surface roughness Ra of the first insulating layer is, for example, 0.005 μm or more and 1 μm or less. Surface roughness Ra can be measured using, for example, an atomic force microscope (AFM). As a method for surface roughening treatment, for example, a plasma ashing method can be mentioned.

(b) Other Insulating Layers The wiring board according to the present disclosure only needs to have at least the first insulating layer, and may have only the first insulating layer. Further, in the case of a multilayer wiring board, another insulating layer may be further provided on the side of the first insulating layer opposite to the supporting substrate. The number of such insulating layers and the shape of the insulating layers are not particularly limited, and can be appropriately selected depending on the use of the wiring board, etc.

(4) Other members The wiring board according to the present disclosure is not particularly limited as long as it has an electrode layer, an insulating layer, and an adhesive layer, and can be formed by appropriately selecting necessary members.

(a) Anchor layer In the present disclosure, an anchor layer may be provided between the adhesive layer and the insulating layer. The anchor layer is a member used to increase the adhesion layer between the adhesion layer and the insulating layer.

The anchor layer is preferably a layer having a rough surface on at least one of the front and back surfaces. The surface roughness Ra of the anchor layer is, for example, 0.005 μm or more and 1 μm or less. Materials for the anchor layer include, for example, the metal materials and inorganic oxides described in the section "(1) Adhesion layer" above, and the materials explained in the section "(3) Insulating layer (a) First insulating layer" above. Examples of these resins include:

The thickness of the anchor layer is not particularly limited as long as it can improve the adhesion between the adhesion layer and the insulating layer, and can be approximately the same as the thickness of the adhesion layer described above. The anchor layer can be formed by, for example, forming a metal layer or an inorganic oxide layer and then roughening the surface using a reverse sputtering method, or, for example, forming a resin layer and then using a plasma ashing method. For example, a method of roughening the surface by, for example,

(b) Connection portion The wiring board according to the present disclosure may have a connection portion for connecting to the element when the element is mounted. For example, as shown in FIG. 1A, the connecting portion 24 may be arranged on the outermost surface of the wiring board 2 on the side opposite to the support substrate 1 side. The connection portion may be placed, for example, on the electrode layer exposed through the opening in the insulating layer. In this case, it is preferable that the connecting portion protrudes from the insulating layer. Further, it is preferable that the connecting portion has a convex shape.

The material for the connection part is not particularly limited as long as it has conductivity, but preferably contains Pd and Ni, for example. Moreover, it is preferable that the connection part is an electroless plated part formed by an electroless plating method. Further, the connecting portion may be a gold-plated portion.

(c) Solder Portion The wiring board may have a solder portion for connecting to the device when mounting the device. It is preferable that the solder part is arranged, for example, on the above-mentioned connection part. It is preferable that the solder part contains at least one of Sn, Cu, and Pb, for example. The solder portion can be formed by, for example, a printing method or an electroless plating method.

2. Support Substrate The support substrate is a member used to support each member of the wiring board when forming the wiring board.

The material of the support substrate is not particularly limited as long as a desired wiring board can be formed on the support substrate. For example, it may be an organic material or an inorganic material, and organic materials and inorganic materials may be used. It may also be a composite material containing. In the present disclosure, the supporting substrate is preferably made of an inorganic material, and particularly preferably glass. This is because it has high heat resistance and good dimensional stability, so that wiring boards can be formed with high precision.

When the support substrate is a glass substrate, examples of the glass used include soda lime glass, alkali-free glass, and quartz glass.

The thickness of the support substrate is not particularly limited, and can be appropriately selected depending on the layer structure of the wiring board, the application, and the like. The support substrate may or may not have flexibility.

3. Peeling Layer The wiring board with support substrate of the present disclosure may have a peeling layer disposed between the support substrate and the wiring board. By having the peeling layer, the wiring board can be easily peeled off from the support substrate.

The peeling layer is not particularly limited as long as it can easily peel the wiring board from the support substrate. For example, it may be a layer that facilitates peeling off the wiring board from the support substrate by burning off the peeling layer by laser irradiation. In this case, the material used for the release layer may be a resin. Examples of the resin used for the release layer include the resins described in the section "(3) Insulating layer (a) First insulating layer". The resin used for the release layer is preferably a resin that has a high absorption rate at the wavelength of laser light.

Further, the peeling layer may be a layer that makes it easier to peel off the wiring board from the support substrate when the wiring board is peeled off from the support substrate by a mechanical peeling method. In this case, the material for the release layer includes a removable adhesive. Here, "repeelable" means that when members bonded together using an adhesive are peeled off, each member can be peeled off without being damaged.

The removable adhesive may be, for example, an adhesive that exhibits removability upon irradiation with heat, light, or the like. Examples of such adhesives include inorganic adhesives such as silicone adhesives and ceramic adhesives, organic adhesives such as polymer adhesives and rubber adhesives, and inorganic adhesives such as silicone polymer adhesives. Examples include organic-based hybrid adhesives. Note that an adhesive such as a mixture of an inorganic adhesive and an organic adhesive can also be used.

The thickness of the release layer is not particularly limited, and can be adjusted as appropriate depending on the material of the release layer, the material of the wiring board, the support substrate, and the like.

4. Manufacturing method The method for manufacturing the wiring board with support substrate of the present disclosure is not particularly limited as long as a desired wiring board can be formed on one side of the support substrate, and can be selected as appropriate depending on the material and layer structure of the wiring board. can do. Further, the method for forming each member of the wiring board can be appropriately selected from the forming methods described in the section of each member in "1. Wiring board" above.

As an example of the method for manufacturing the wiring board with support substrate of the present disclosure, the method for manufacturing the wiring board with support substrate 10 shown in FIGS. 1(a) and 2(a) will be described below using FIGS. 5 and 6. explain.

FIGS. 5(a) to 5(e) are process diagrams showing an example of a method for manufacturing a wiring board with a support substrate according to the present disclosure. FIG. 5 shows an example of manufacturing the wiring board with support substrate 10 shown in FIG. 1(a). First, as shown in FIG. 5(a), a release layer 3 is formed on the entire surface of the support substrate 1. Next, as shown in FIG. 5(b), a first insulating layer 22a having a predetermined pattern is formed on the peeling layer 3. Next, as shown in FIG. 5C, an adhesive layer 23 is formed on the entire surface of the peeling layer 3 on which the first insulating layer 22a is disposed. Next, using the adhesion layer 23 as a seed layer, electrolytic plating is performed to form a via electrode layer, which becomes the first electrode layer, in the via hole, and another electrode layer on the surface of the first insulating layer opposite to the supporting substrate. A wiring layer is formed. As a result, as shown in FIG. 5(d), an adhesion layer 23 having a predetermined pattern, a first electrode layer 21a which is a via electrode layer, and an in-plane wiring layer 21b are formed. Furthermore, by repeating the formation of the insulating layer and the electrode layer and further forming the connection part, as shown in FIG. A wiring board 2 having a portion 24 is formed. Through the above steps, the wiring board 10 with a support substrate can be obtained.

FIGS. 6(a) to 6(e) are process diagrams showing other examples of the method of manufacturing a wiring board with a support substrate according to the present disclosure, and show an example of manufacturing the wiring board with a support substrate 10 shown in FIG. 2. There is. First, as shown in FIG. 6(a), a release layer 3 is formed on a support substrate 1. Next, as shown in FIG. 6(b), a first electrode layer 21a having a pattern serving as a land portion is formed on the peeling layer 3. Next, as shown in FIG. 6(c), an adhesive layer 23 is formed on the entire surface of the peeling layer 3 on which the first electrode layer 21a is disposed. Next, as shown in FIG. 6(d), a first insulating layer 22a having a predetermined pattern is formed on the adhesive layer 23. Furthermore, by repeating the formation of the insulating layer and the electrode layer, and further forming the connection part, as shown in FIG. A wiring board 2 having a portion 24 is formed. Through the above steps, the wiring board 10 with a support substrate can be obtained.

The method for forming each member of the wiring board can be appropriately selected from the forming methods described in the section of each member in "1. Wiring board" above.

B. Wiring Board The wiring board of the present disclosure has an electrode layer and an insulating layer containing resin, and has a coreless structure without a support substrate, wherein the wiring board has one of the front and back surfaces. is a smooth surface that was in contact with the support substrate, the electrode layer has a first electrode layer located closest to the smooth surface, and the insulating layer has a first electrode layer located closest to the smooth surface. and a first insulating layer disposed on a side surface of the first electrode layer, at least in a region on the supporting substrate side between the side surface of the first electrode layer and the first insulating layer, It is characterized in that an adhesive layer is provided.

The wiring board of the present disclosure will be explained using figures. 1(b) and (c) and FIG. 2(b) and (c) are schematic cross-sectional views showing an example of the wiring board of the present disclosure. The wiring board 2 shown in FIGS. 1(b) and (c) and FIGS. 2(b) and (c) has an electrode layer 21 and an insulating layer 22 containing resin, and is a coreless circuit board without a support substrate. This is a structured wiring board. The wiring board 2 has a smooth surface S on one side, which is the surface that was in contact with the support substrate when forming the wiring board, and the electrode layer 21 located closest to the smooth surface S is the first electrode. When the layer 21a is the first insulating layer 22a, and the insulating layer 22 located closest to the smooth surface S and disposed on the side surface of the first electrode layer is the first insulating layer 22a, the side surface of the first electrode layer 21a and the first insulating layer 22a are the first insulating layer 22a. An adhesion layer 23 is arranged between the two.

According to the present disclosure, the same effects as those described in the above section "A. Wiring board with support board" can be achieved. That is, since the adhesive layer is disposed between the side surface of the first electrode layer and the first insulating layer, the side surface of the first electrode layer is not peeled off from the first insulating layer when the wiring board is peeled off from the support substrate. can be restrained from doing so.

In the wiring board of the present disclosure, if a gap is created between the side surface of the electrode layer located at or near the peeled surface and the insulating layer, when a treatment liquid is used in a subsequent process, the treatment liquid will be applied to the gap between the peeled surfaces and the insulating layer. The problem arises that the electrode layer is corroded by seepage into the electrode layer. On the other hand, the wiring board of the present disclosure can suppress the occurrence of the above-mentioned gaps, so that a wiring board with high electrical reliability can be obtained.

Furthermore, since it is possible to suppress the side surface of the first electrode layer from peeling off from the first insulating layer when the wiring board is peeled off from the support substrate, the wiring board of the present disclosure has a smooth surface on the side that was on the support substrate side. This makes it possible to suppress the possibility of problems occurring when other members are mounted on the smooth surface side.

1. Smooth Surface The wiring board has a smooth surface on one of the front and back surfaces. In the wiring board of the present disclosure, the smooth surface is usually formed by disposing at least two layers of members constituting the wiring board flush. For example, as shown in FIG. 1(b), the smooth surface S may be configured such that the adhesive layer 23 and the first insulating layer 22a are disposed flush with each other. Further, as shown in FIG. 1(c) and FIG. 2(c), for example, the smooth surface S is configured such that the first electrode layer 21a, the adhesive layer 23, and the first insulating layer 22a are arranged flush with each other. Good too. For example, as shown in FIG. 2(b), the smooth surface S may be configured such that the first electrode layer 21a and the adhesive layer 23 are disposed flush with each other.

2. Components of Wiring Board The members of the wiring board of the present disclosure can be the same as those explained in the above section "A. Wiring board with support board 1. Wiring board", so the description here will be omitted. do. Further, the wiring board of the present disclosure may have the following configuration on the smooth surface side.

(1) Protective plating layer For example, as shown in FIG. 7, the wiring board 2 may have a protective plating layer 25 disposed on the smooth surface S side of the first electrode layer 21a. The protective plating layer has a function of protecting the first electrode layer. Further, the protective plating layer functions as a connecting portion for connecting the first electrode layer to an element mounted on the smooth surface side of the wiring board. The protective plating layer is usually arranged so as to protrude from the smooth surface S.

The plating layer used for the protective plating layer is not particularly limited, but is preferably a metal plating layer containing at least one of gold, nickel, palladium, and silver, and more preferably a gold plating layer. The protective plating layer may be formed by electrolytic plating or electroless plating.

(2) Solder Portion The wiring board of the present disclosure may have a solder portion disposed on the smooth surface side of the first electrode layer. The solder portion may be placed directly on the first electrode layer, or may be placed directly on the above-mentioned protective plating layer. The solder part is the same as that explained in the section "A. Wiring board with support board 1. Wiring board (4) Other parts (ii) Solder part", so the explanation here will be omitted. .

3. Others The wiring board of the present disclosure can be obtained, for example, by peeling off the wiring board from the wiring board with a support substrate described in the above section "A. Wiring board with support substrate". As for the method for peeling off the wiring board, a method known as a peeling method used in a general method for manufacturing a coreless board can be used.

In addition, if the wiring board peeled off from the wiring board with support substrate has a structure in which an adhesive layer is disposed on the peeled surface, for example, as shown in FIG. 1(c) and FIG. 2(c), if necessary, The adhesive layer on the peeled surface may be removed. As a method for removing the adhesive layer, a method known as a general method for removing metal layers and inorganic oxide layers can be used.

C. Wiring board laminate with element The wiring board laminate with element of the present disclosure includes the wiring board with support substrate described in "A. Wiring board with support board" above, and the side of the wiring board with support board opposite to the support substrate. The device is characterized by having an element mounted on the surface of the device.

An element-equipped wiring board laminate according to the present disclosure will be described with reference to the drawings. FIG. 8 is a schematic cross-sectional view showing an example of an element-equipped wiring board laminate according to the present disclosure. A wiring board laminate 100 with an element shown in FIG. 8 includes a wiring board 10 with a support substrate and an element 20 mounted on the wiring board 2 of the wiring board 10 with a support substrate.

According to the present disclosure, by having the above-mentioned wiring board with a support substrate, when the wiring board on which an element is mounted is peeled off from the support substrate, the side surface of the first electrode layer on the peeled surface or in the vicinity of the peeled surface is the first electrode layer. Peeling from the insulating layer can be suppressed.

1. Wiring Board with Support Board The wiring board with support board can be the same as that explained in the above section "A. Wiring board with support board", so the explanation here will be omitted.

2. Element The element in the present disclosure is a member mounted on a wiring board. The element may be an active element, a passive element, or a mechanical element. Moreover, it is preferable that the element is a semiconductor element. Examples of elements include transistors, integrated circuits (for example, LSI), MEMS (Micro Electro Mechanical Systems), relays, light emitting elements (for example, LEDs, OLEDs), sensors, resistors, capacitors, inductors, piezoelectric elements, and batteries. .

3. Others In the wiring board laminate with an element of the present disclosure, by peeling off the support substrate from the wiring board laminate with an element, it is possible to obtain a wiring board with an element having an element mounted on the wiring board. Applications of wiring boards with elements are not particularly limited, but include, for example, display devices, information processing terminals (e.g. personal computers, tablets, smartphones), car supplies (e.g. car interior parts, car exterior parts), printed wiring boards, Examples include electromagnetic shielding materials, antennas, power semiconductors, and noise filters.

D. Wiring board with element The wiring board with element of the present disclosure is characterized by having the wiring board described in the above section "B. Wiring board" and an element mounted on the wiring board.

A wiring board with an element according to the present disclosure will be described with reference to the drawings. FIG. 9 is a schematic cross-sectional view showing an example of an element-attached wiring board according to the present disclosure. A wiring board with an element 200 shown in FIG. 9 includes a wiring board 2 and an element 20 mounted on the wiring board 2.

According to the present disclosure, by having the wiring board described above, for example, when an element is mounted on the side opposite to the smooth side of the wiring board, the smooth side of the wiring board with the element can be mounted on another member. It can be stably placed facing the Further, for example, when an element is mounted on the smooth surface side of a wiring board, the element can be mounted on the wiring board while suppressing inclination of the element.

The wiring board used in the present disclosure is the same as that described in the section "B. Wiring board" above, so the description here will be omitted. In addition, the applications of the element and the wiring board with element used in the present disclosure can be the same as those explained in the above section "C. Wiring board laminate with element 3. Others", so here The explanation will be omitted.

Note that the present disclosure is not limited to the above embodiments. The above-mentioned embodiments are illustrative, and any embodiment that has substantially the same configuration as the technical idea stated in the claims of the present disclosure and provides similar effects is the present invention. within the technical scope of the disclosure.

[Example 1]
A wiring board 10 with a support substrate was manufactured by the procedure shown in FIGS. 5(a) to 5(e). Non-alkali glass was used for the support substrate 1, and a polyimide resin film was formed as the release layer 3 (FIG. 5(a)). An acrylic resin film was formed thereon as the first insulating layer 21a, and processed by photolithography so that predetermined via holes could be formed (FIG. 5(b)). A Ti layer as an adhesion layer 23 and a Cu layer as a seed layer (not shown) were formed thereon by sputtering (FIG. 5(c)). A positive resist was applied thereon and processed using the same photolithography method to obtain a predetermined wiring shape. A Cu-plated wiring was formed in the resist-removed portion by a plating method, and the resist was removed to obtain Cu-plated wiring as a via electrode layer (first electrode layer) 21a and an in-plane wiring layer 21b. The unnecessary portions of the seed layer and adhesion layer were removed (FIG. 5(d)). Through the above steps, the first insulating layer 22a, adhesive layer 23, via electrode layer (first electrode layer) 21a, and in-plane electrode layer 21b were formed on the support substrate. A wiring board 2 was obtained by repeatedly forming an insulating layer and a wiring layer by photolithography in the same manner as described above. By the above procedure, a wiring board with a support substrate 10 was obtained (FIG. 5(e)).

A laser was irradiated from the support substrate side of the wiring board with support substrate to remove the release layer. A carrier tape was attached to the opposite side of the peeled surface of the wiring board, and the wiring board was peeled off using a method conforming to a 90° peel test to obtain a wiring board with a coreless structure (coreless board). When the obtained coreless substrate was treated with an electroless plating solution, no plating solution was found to seep into the vicinity of the electrodes.

[Comparative example]
A wiring board 10' with a support substrate was manufactured by the procedure shown in FIGS. 10(a) to 10(e). A non-alkali glass was used for the support substrate 1, and a polyimide resin film was formed as the release layer 3. A Cu layer as a metal seed layer 4 was formed thereon by sputtering (FIG. 10(a)). A positive resist was applied thereon, processed by photolithography to obtain a predetermined pad shape, and a first electrode layer 21a was formed by plating (FIG. 10(b)). Next, an acrylic resin film was formed as the first insulating layer 22a, and processed by photolithography so that predetermined via holes could be formed (FIG. 10(c)). Next, a Cu layer as a seed layer was formed by sputtering. A positive resist was applied thereon and processed using the same photolithography method to obtain a predetermined wiring shape. A Cu plating wiring was formed in the resist-removed portion by a plating method, and the resist was removed. Unnecessary portions of the seed layer were removed. As a result, Cu-plated wiring was obtained as the first electrode layer 21a (FIG. 10(d)). A wiring board 2 was obtained by repeatedly forming an insulating layer and a wiring layer by photolithography in the same manner as described above. By the above procedure, a wiring board with support substrate 10' was obtained (FIG. 10(e)).

A laser was irradiated from the support substrate side of the wiring board with support substrate to remove the peeling layer 3 (Fig. 10(f). A carrier tape was pasted on the side opposite to the peeled side of the wiring board 2, and it conformed to the 90° peel test. Wiring board 2 was peeled off using the same method to obtain a coreless board (Fig. 10(g)). After removing the seed layer on the peeled surface of the obtained coreless board, it was treated with an electroless plating solution, resulting in no plating near the electrodes. Seepage of liquid was observed.

[Example 2]
A wiring board with a support substrate was obtained in the same manner as in Example 1, except that a polyimide resin film was formed as the insulating layer including the first insulating layer, and a Cr layer was formed as the adhesive layer. Further, in the same manner as in Example 1, the wiring board was peeled off from the support substrate to obtain a coreless board. When the obtained coreless substrate was treated with an electroless plating solution, no plating solution was found to seep into the vicinity of the electrodes.

1... Support substrate 2... Wiring board 3... Peeling layer 10... Wiring board with support substrate 20... Elements 21, 21b, 21c... Electrode layer 21a... First electrode layer 22, 22b, 22c... Insulating layer 22a... First insulating layer 23, 23a, 23b... Adhesive layer 100... Wiring board laminate with element 200... Wiring board with element S... Smooth surface

Claims (14)

A support substrate, and a wiring board disposed on one side of the support substrate and having an electrode layer and an insulating layer containing resin, and the wiring board is peeled from the support substrate and has a coreless structure. A wiring board with a supporting board used as a wiring board,
The electrode layer has a first electrode layer located closest to the support substrate,
The insulating layer has a first insulating layer disposed closest to the support substrate and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
The first insulating layer has a via hole, and the first electrode layer is a via electrode layer disposed inside the via hole, or the first electrode layer is disposed on the support substrate side of the via hole. It is a land part,
A wiring board with a support substrate, wherein the adhesive layer is made of an inorganic oxide . A support substrate, and a wiring board disposed on one side of the support substrate and having an electrode layer and an insulating layer containing resin, and the wiring board is peeled from the support substrate and has a coreless structure. A wiring board with a supporting board used as a wiring board,
The electrode layer has a first electrode layer located closest to the support substrate,
The insulating layer has a first insulating layer disposed closest to the support substrate and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
The first insulating layer has a via hole, and the first electrode layer is a via electrode layer disposed inside the via hole, or the first electrode layer is disposed on the support substrate side of the via hole. It is a land part,
A wiring board with a support substrate, wherein the adhesive layer has no conductivity. A support substrate, and a wiring board disposed on one side of the support substrate and having an electrode layer and an insulating layer containing resin, and the wiring board is peeled from the support substrate and has a coreless structure. A wiring board with a supporting board used as a wiring board,
The electrode layer has a first electrode layer located closest to the support substrate,
The insulating layer has a first insulating layer disposed closest to the support substrate and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
the first insulating layer has a via hole, the first electrode layer is a via electrode layer disposed inside the via hole,
A seed layer is disposed between a side surface of the first electrode layer and the adhesive layer,
A wiring board with a support substrate, wherein the adhesive layer is made of Ti. The wiring board with a support substrate according to claim 3 , wherein the first electrode layer is a plating layer. 3. The wiring board with support substrate according to claim 2 , wherein the adhesive layer is made of an inorganic oxide. The wiring board with a support substrate according to any one of claims 1 to 5 , wherein the adhesive layer is formed in the entire area between the side surface of the first electrode layer and the first insulating layer. A wiring board having a coreless structure having an electrode layer and an insulating layer containing resin and having no support substrate,
The wiring board has a smooth surface with one of the front and back surfaces in contact with the support board,
The electrode layer has a first electrode layer located closest to the smooth surface,
The insulating layer has a first insulating layer disposed closest to the smooth surface and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
The first insulating layer has a via hole, and the first electrode layer is a via electrode layer disposed inside the via hole, or the first electrode layer is disposed on the support substrate side of the via hole. It is a land part,
A wiring board , wherein the adhesive layer is made of an inorganic oxide . A wiring board having a coreless structure having an electrode layer and an insulating layer containing resin and having no support substrate,
The wiring board has a smooth surface with one of the front and back surfaces in contact with the support board,
The electrode layer has a first electrode layer located closest to the smooth surface,
The insulating layer has a first insulating layer disposed closest to the smooth surface and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
The first insulating layer has a via hole, and the first electrode layer is a via electrode layer disposed inside the via hole, or the first electrode layer is disposed on the support substrate side of the via hole. It is a land part,
A wiring board in which the adhesive layer has no conductivity. A wiring board having a coreless structure having an electrode layer and an insulating layer containing resin and having no support substrate,
The wiring board has a smooth surface with one of the front and back surfaces in contact with the support board,
The electrode layer has a first electrode layer located closest to the smooth surface,
The insulating layer has a first insulating layer disposed closest to the smooth surface and on a side surface of the first electrode layer,
an adhesion layer is disposed at least in the support substrate side region between the side surface of the first electrode layer and the first insulating layer;
the first insulating layer has a via hole, the first electrode layer is a via electrode layer disposed inside the via hole,
A seed layer is disposed between a side surface of the first electrode layer and the adhesive layer,
A wiring board, wherein the adhesive layer is made of Ti. The wiring board according to claim 9 , wherein the first electrode layer is a plating layer. 9. The wiring board according to claim 8 , wherein the adhesive layer is made of an inorganic oxide. The wiring board according to any one of claims 7 to 11 , wherein the adhesive layer is formed in the entire area between the side surface of the first electrode layer and the first insulating layer. A wiring board with a support substrate according to any one of claims 1 to 6, and an element mounted on a surface of the wiring board with a support substrate opposite to the support substrate. Wiring board laminate. A wiring board with an element, comprising the wiring board according to any one of claims 7 to 12, and an element mounted on the wiring board.

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