KR102570727B1 - Printed circuit board and package substrate - Google Patents

Abstract

A printed circuit board according to an embodiment includes an insulating substrate; an electrode disposed on the insulating substrate; a pad disposed on the insulating substrate and having through holes penetrating upper and lower surfaces therein; and an adhesive member disposed in the through hole of the pad, wherein the pad is disposed in a mounting area of the chip and surrounds the adhesive member.

Description

Printed circuit board, package substrate including the same {PRINTED CIRCUIT BOARD AND PACKAGE SUBSTRATE}

The present invention relates to a printed circuit board, and more particularly, a printed circuit board capable of applying an adhesive using a pad having a dam shape and mounting a chip using the applied adhesive, a package substrate including the same, and a manufacturing method thereof It is about.

Mobile terminals such as mobile phones, PDAs (Personal Digital Assistants), smartphones, communication equipment, and various media players, which are currently widely used, are equipped with various chips to function, and these chips form an integrated module on a printed circuit board (PCB). It is common to be composed of

Meanwhile, in general, when performing chip die bonding and flip chip bonding on a PCB, a pad is formed on a substrate, an adhesive is applied on the formed pad, and the applied adhesive is applied. The chip is attached by using.

However, conventionally, the adhesive is directly applied on a pad having a flat upper surface as described above, and thus, reliability problems of the attached chip occur depending on the viscosity or contact angle of the adhesive.

1 is a view showing a chip mounting substrate according to the prior art.

Referring to (a) of FIG. 1 , in general, a plurality of pads 2 are formed on a substrate 1, and an adhesive 3 is applied to each of the formed plurality of pads 2.

Then, the chip 4 is seated on the applied adhesive 3, and the chip 4 is attached to the substrate 1 by using the adhesive force of the adhesive 3.

However, as in FIG. 1 (a), when the same amount of adhesive is not applied on the plurality of pads 2, a difference in height between the left and right sides of the attached chip 4 occurs, and accordingly, the chip 4 This tilting phenomenon occurs.

In addition, as the chip 4 is attached at an angle as described above, wire bonding cannot be performed with the same pressure during wire bonding, and thus, there is a problem in that wire bonding force is lowered.

In addition, referring to FIG. 1 (b), even if the same amount of adhesive is applied on a plurality of pads 2, if more than an appropriate amount of adhesive is applied, the adhesive penetrates into the chip and the performance of the chip deteriorates. problem arises

In addition, according to the prior art, in the case of an adhesive having low viscosity, it is difficult to apply the adhesive in an accurate position during die bonding or flip chip bonding.

According to an embodiment of the present invention, an adhesive is applied to an opening exposing a central portion of a pad, so that the same adhesive can be applied to each pad while preventing overflow of the adhesive, a printed circuit board, and a package including the same A substrate and a manufacturing method thereof are provided.

The technical tasks to be achieved in the proposed embodiment are not limited to the technical tasks mentioned above, and other technical tasks not mentioned are clear to those skilled in the art from the description below to which the proposed embodiment belongs. will be understandable.

A printed circuit board according to an embodiment includes an insulating substrate; an electrode disposed on the insulating substrate; a pad disposed on the insulating substrate and having through holes penetrating upper and lower surfaces therein; and an adhesive member disposed in the through hole of the pad, wherein the pad is disposed in a mounting area of the chip and surrounds the adhesive member.

In addition, the pad has a single closed curve shape in which a through hole is formed.

In addition, the electrode is spaced apart from the pad by a predetermined distance, and the adhesive member includes any one of a conductive adhesive and a non-conductive adhesive.

Further, a connection pattern electrically connecting the electrode and the pad is included, and the adhesive member includes a conductive adhesive.

In addition, the electrode, the pad, and the connection pattern are integrally formed.

In addition, a plurality of pads are disposed on the insulating substrate to correspond to corner regions of the chip.

On the other hand, the package substrate according to the embodiment, the printed circuit board; and a chip attached to the printed circuit board, wherein the printed circuit board includes an insulating substrate, a first electrode disposed on the insulating substrate, and a through-hole disposed on the insulating substrate and penetrating upper and lower surfaces therein. It includes a first pad having a hole and an adhesive member disposed in the through hole of the first pad, wherein the first pad is disposed in a mounting area of the chip and has a shape of a single closed curve surrounding the adhesive member. have

In addition, the first electrode is spaced apart from the first pad by a predetermined distance, and the adhesive member includes any one of a conductive adhesive and a non-conductive adhesive.

In addition, the chip is attached on the printed circuit board so that the second electrode is directed upward, and further includes a connection member electrically connecting the second electrode and the first electrode.

The device may further include a connection pattern electrically connecting the first electrode and the first pad and integrally formed with the electrode and the pad, wherein the adhesive member includes a conductive adhesive.

Also, the chip is attached on the printed circuit board with the second electrode facing downward, and the second electrode of the chip is electrically connected to the first pad through the adhesive member.

In addition, a plurality of first pads are disposed on the insulating substrate to correspond to corner regions of the chip.

In addition, the chip includes a gas sensing module.

In addition, the gas sensing module includes a first substrate, a sensing unit disposed on the first substrate and including a sensing electrode, a heating electrode, and a sensing object, and a sensing unit electrically connected to the sensing unit. and an upper electrode pad, wherein the first substrate includes a plurality of air gaps formed around the sensing unit and spaced apart from each other at predetermined intervals.

In addition, a heat insulating part disposed between the first substrate and the sensing part is further included.

In addition, the plurality of air gaps include a first air gap formed adjacent to the periphery of the sensing unit and a second air gap formed adjacent to the periphery of the first air gap, wherein the first air gap and the second air gap are mutually predetermined. It is composed of a plurality of unit pores spaced apart from each other.

The sensing unit may include first and second sensing electrodes electrically connected to the upper electrode pad, heater electrodes electrically connected to the upper electrode pad, and sensing objects covering the first and second sensing electrodes. include

The device may further include a protective layer disposed on the first substrate and covering an area other than the sensing object, wherein the first and second air gaps pass through the protective layer.

In addition, a thermal blocking portion filled with a heat insulating material in the plurality of air gaps formed in the first substrate is further included.

The gas sensing module may further include a lower electrode pad disposed under the first substrate and a connection portion disposed within the first substrate and electrically connecting the upper electrode pad and the lower electrode pad.

In addition, the connecting portion is disposed outside the first substrate, so that a side surface thereof is exposed to the outside.

In addition, the first substrate includes a membrane including at least one of a silicon oxide layer and a silicon nitride layer, and the plurality of pores penetrate the membrane.

According to the embodiment according to the present invention, by applying the adhesive to the inside of the pad having a single closed curve shape, it is possible to prevent the adhesive from flowing out to the outside in advance, and it is possible to apply an accurate amount of the adhesive to the inside of the pad. can

In addition, according to an embodiment according to the present invention, a substrate applicable to both flip chip bonding and wire bonding methods can be provided by selectively applying a conductive adhesive or a non-conductive adhesive to the inside of a pad having a single closed curve shape.

In addition, according to the embodiment according to the present invention, by attaching the chip using the adhesive applied to the inside of the pad having a single closed curve shape, the adhesive can be applied to the exact position where the chip is attached, thereby improving reliability. can make it

1 is a view showing a chip mounting substrate according to the prior art.
2A is a diagram showing a cross-sectional structure of a printed circuit board according to a first embodiment of the present invention.
FIG. 2B is a view showing a modified example of the printed circuit board of FIG. 2A.
3 is a plan view of the printed circuit board of FIGS. 2A and 2B.
FIG. 4A is a cross-sectional view illustrating a manufacturing method of the printed circuit board of FIG. 2A in order of processes.
FIG. 4B is a cross-sectional view illustrating a manufacturing method of the printed circuit board of FIG. 2B in order of process.
5A is a diagram showing a cross-sectional structure of a printed circuit board according to a second embodiment of the present invention.
FIG. 5B is a view showing a modified example of the printed circuit board shown in FIG. 5A.
6 is a plan view of the printed circuit board of FIG. 5 .
FIG. 7A is a cross-sectional view illustrating a manufacturing method of the printed circuit board of FIG. 5A in order of processes.
FIG. 7B is a cross-sectional view illustrating a manufacturing method of the printed circuit board of FIG. 5B in order of processes.
8 is a modified example of a shape of a pad according to an embodiment of the present invention.
9 is a view showing a cross-sectional structure of a package substrate according to a first embodiment of the present invention.
10 is a plan view of the package substrate of FIG. 9 .
11A and 11B are diagrams illustrating a cross-sectional structure of a package substrate according to a second embodiment of the present invention.
12 is a plan view of the package substrate of FIGS. 11A and 11B.
13 and 14 are implementation examples of a package substrate according to an embodiment of the present invention.
15A is a diagram showing a cross-sectional structure of a sensing module according to a first embodiment of the present invention.
15B is a diagram illustrating a modified example of the sensing module shown in FIG. 15A.
16A is a plan view of the sensing module of FIG. 15A.
16B is a plan view of the sensing module of FIG. 15B.
17 is a plan view of an embodiment in which an air gap of the sensing module of FIG. 15A or 15B is increased.
18 is a view showing a cross-sectional structure of a sensing module according to a second embodiment of the present invention.
19 is a diagram showing a cross-sectional structure of a sensing module according to a third embodiment of the present invention.
20 is a diagram showing a cross-sectional structure of a sensing module according to a fourth embodiment of the present invention.
21 is a plan view of a sensing module according to a fifth embodiment of the present invention.
22 is a diagram showing impact characteristics of a sensing module according to an embodiment of the present invention.
23 is a graph showing temperature change of a sensing module according to an embodiment of the present invention.
24 to 27 are views showing the shape of the air gap 160 of the sensing module 100 according to an embodiment of the present invention.
28 is a view showing a cross-sectional structure of a sensing module according to a sixth embodiment of the present invention.
29 is a cross-sectional view showing a cross-sectional structure of a sensing module according to a seventh embodiment of the present invention.

Hereinafter, the configuration and operation according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference is given to the same components regardless of reference numerals, and redundant description thereof will be omitted. Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms are only used for the purpose of distinguishing one component from another.

Hereinafter, embodiments will be clearly revealed through the accompanying drawings and description of the embodiments. In the description of the embodiments, each layer (film), region, pattern or structure is formed "on" or "under" the substrate, each layer (film), region, pad or pattern. In the case of being described as, "on" and "under" include both "directly" or "indirectly" formed through another layer. In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of explanation. Also, the size of each component does not fully reflect the actual size. Hereinafter, embodiments will be described with reference to the accompanying drawings.

2A is a view showing a cross-sectional structure of a printed circuit board according to a first embodiment of the present invention, FIG. 2B is a view showing a modified example of the printed circuit board of FIG. 2A, and FIG. 3 is a view showing a printed circuit board of FIGS. 2A and 2B. FIG. 4A is a cross-sectional view showing the manufacturing method of the printed circuit board of FIG. 2A in process order, and FIG. 4B is a cross-sectional view showing the manufacturing method of the printed circuit board of FIG. 2B in process order.

Hereinafter, a printed circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 2 to 4 .

First, the printed circuit board according to the first embodiment shown in FIGS. 2 to 4 is a support substrate to which a chip is attached, and more specifically, a support substrate to which the chip is attached by a wire bonding method.

Referring to FIG. 2A , the printed circuit board 10 includes an insulating substrate 11 , an electrode 12 , a pad 13 and an adhesive member 14 .

The insulating substrate 11 may have a planar structure. At this time, the insulating substrate 11 may be a printed circuit board (PCB). Here, the insulating substrate 11 may be implemented as a single substrate, or alternatively, may be implemented as a multilayer substrate in which a plurality of substrates are successively stacked.

That is, the insulating substrate 11 is a support substrate of a device on which a single pattern is formed and a chip is mounted. More preferably, the chip may be a gas sensor chip, and thus the insulating substrate 11 may be a support substrate of a gas sensing device on which the gas sensor chip is mounted.

The insulating substrate 11 may refer to an insulating layer on which any one circuit pattern is formed among multilayer substrates having a plurality of stacked structures.

The insulating substrate 11 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnated substrate, and may include an epoxy-based insulating resin when a polymer resin is included. Alternatively, a polyimide-based resin may be included.

That is, the insulating substrate 11 is a board on which an electric circuit capable of changing wiring is organized, and may include a printed circuit board, a wiring board, and an insulating board made of an insulating material capable of forming a conductor pattern on the surface of the insulating board. there is.

The insulating substrate 11 may be rigid or flexible. For example, the insulating substrate 11 may include glass or plastic. In detail, the insulating substrate 11 includes chemically strengthened/semi-tempered glass such as soda lime glass or aluminosilicate glass, or polyimide (PI) or polyethylene terephthalate (PET). ), reinforced or soft plastics such as propylene glycol (PPG), polycarbonate (PC), or sapphire.

In addition, the insulating substrate 11 may include an optical isotropic film. For example, the insulating substrate 11 may include Cyclic Olefin Copolymer (COC), Cyclic Olefin Polymer (COP), polycarbonate (PC), or polymethyl methacrylate (PMMA). .

In addition, the insulating substrate 11 may partially have a curved surface and be bent. That is, the insulating substrate 11 may partially have a flat surface and partially have a curved surface and be bent. In detail, the end of the insulating substrate 11 may be bent while having a curved surface or may be bent or bent with a surface including a random curvature.

In addition, the insulating substrate 11 may be a flexible substrate having flexible characteristics. In addition, the insulating substrate 11 may be a curved or bent substrate. At this time, the insulating substrate 11 expresses the electric wiring connecting the circuit components in a wiring diagram based on the circuit design, and can reproduce the electric conductor on the insulator. In addition, it is possible to mount electrical components and form wires connecting them in a circuit manner, and to mechanically fix components other than the electrical connection function of the components.

An electrode 12 and a pad 13 are formed on the surface of the insulating substrate 11 . In addition, although not shown in the drawings, a plurality of circuit patterns (not shown) electrically connected to components such as the electrodes 12, pads 13, and other terminals are formed on the surface of the insulating substrate 11. This is arranged, and thus an electrical signal can be transmitted.

The electrode 12 and the pad 13 are electrically connected to a chip (described later) mounted on the insulating substrate 11 . Here, the chip may include electronic products such as devices. The element can be divided into an active element and a passive element. The active element is an element that actively uses a non-linear part, and the passive element means a device that does not use a non-linear characteristic even though both linear and non-linear characteristics exist.

In addition, the passive elements may include transistors, IC semiconductor chips, and the like, and the passive elements may include capacitors, resistors, and inductors. The passive element is mounted on a substrate together with a conventional semiconductor package in order to increase the signal processing speed of a semiconductor chip, which is an active element, or perform a filtering function.

Accordingly, the electrode 12 and the pad 13 perform the functions of a mounting unit in which the chip is mounted and a terminal unit electrically connected to the chip.

At this time, the printed circuit board 10 allows a chip to be mounted using a wire bonding method, and thus the electrode 12 and the pad 13 are separated from each other. In other words, the electrode 12 and the pad 13 are not electrically connected.

And, the pad 13 is a mounting pad that is disposed in an area where the chip is mounted so that the chip can be seated. At this time, the pad 13 is not electrically connected to the chip.

The electrode 12 is disposed on the insulating substrate 11 and spaced apart from the pad 13 by a predetermined distance, and is electrically connected to a chip attached to the pad 13 accordingly. The electrode 12 is a wire bonding part electrically connected to the chip through a coupling member such as a wire.

An adhesive member 14 is disposed inside the pad 13 . Preferably, the pad 13 has a single closed curve shape with an open central portion. Also, the adhesive member 14 is disposed at the center of the open pad 13 .

The pad 13 has a certain height, and the height of the pad 13 may be determined by the amount of application of the adhesive member 14 disposed in the central portion of the pad 13 . The pad 13 surrounds the periphery of the adhesive member 14 and serves as a dam to prevent the adhesive member 14 from overflowing to other areas.

That is, a gap (not shown) may be formed in a region vertically overlapping a chip disposed thereon in the insulating substrate 11 . The air gap is to prevent heat generated from the chip from affecting other components disposed on the insulating substrate 11 . However, when the pad 13 having the above structure does not exist, the adhesive member 14 may overflow, and accordingly, the gap of the insulating substrate 11 is blocked by the adhesive member 14. situation may arise.

However, in the present invention, the pad 13 having a single closed curve shape and functioning as a dam is formed, and the adhesive member 14 is formed inside the pad 13. Accordingly, the adhesive member 14 is blocked by the dam of the pad 13 and does not flow out, and accordingly, a situation in which the air gap of the insulating substrate 11 is blocked can be prevented in advance.

The pad 13 and the electrode 12 may be formed of a conductive material. Preferably, the electrode 12 may be formed of a conductive metal material. In addition, the pad 13 in the first embodiment may be formed of a conductive or non-conductive material, and preferably may be formed of a material capable of stably surrounding the adhesive member 14 . On the other hand, in the embodiment of the present invention, the pad 13 and the electrode 12 are formed of the same metal, so that the pad 13 and the electrode 12 can be formed at the same time in one process .

The pad 13 and the electrode 12 are at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) It can be formed of a metal material of. In addition, the pad 13 and the electrode 12 are made of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), zinc (Zn) with excellent bonding strength It may be formed of a paste or solder paste containing at least one metal material selected from among. In addition, a metal layer (not shown) may be disposed on the surface of the electrode 12, and the metal layer protects the surface of the electrode 12 while increasing the bonding force of the electrode 12. made of matter Preferably, the metal layer includes at least one metal selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It can be made of a metal material.

On the other hand, the electrode 12 and the pad 13 are manufactured using an additive process, a subtractive process, a modified semi-additive process (MSAP), and a semi-additive process (SAP), which are typical printed circuit board manufacturing processes. Additive Process) method, etc., and a detailed description is omitted here.

Referring to FIG. 3 , each of the pads 13 and the electrodes 12 may be disposed on the insulating substrate 11 in plural numbers spaced apart from each other by a predetermined interval.

Preferably, the pad 13 may include a first pad, a second pad, a third pad, and a fourth pad disposed on the insulating substrate 11 .

The pad 13 is disposed on a mounting region on the surface of the insulating substrate 11 where a chip is to be mounted. Preferably, the pads 13 may be respectively disposed at corner regions of the mounting region.

As shown in FIG. 3 , the pad 13 may have a ring shape of a single closed curve. That is, the pad 13 has an opening exposing the surface of the insulating substrate 11 in a central region.

An adhesive member 14 is disposed in the opening of the pad 13 (or inside the single closed curve). The adhesive member 14 has a weight corresponding to the height of the pad 13 and is applied within the pad 13 . Preferably, the adhesive member 14 may protrude from the upper surface of the pad 13 at a predetermined height. That is, the chip should be supported by the pad 13 and attached to the upper region of the pad 13 . However, when the adhesive member 14 has the same height as the pad 13 and is applied only to the inside of the pad 13, the chip cannot be stably attached to the pad 13. Therefore, in the present invention, the adhesive member 14 protrudes above the surface of the pad 13 with a certain height. In addition, the adhesive member 14 protruding above the surface moves onto the surface of the pad 13 in the process of attaching the chip, so that the chip can be stably attached to the pad 13, thereby increasing the adhesive force. improve

A plurality of electrodes 12 are disposed on the insulating substrate 11 . The number of electrodes 12 may be determined by the type or type of chips attached to the insulating substrate 11 . Preferably, the electrode 12 may be arranged in a 4-electrode structure, and thus may include a first electrode, a second electrode, a third electrode, and a fourth electrode.

Meanwhile, the adhesive member 14 in the first embodiment of the present invention may be a liquid adhesive. That is, the adhesive strength and components of the liquid adhesive are correct, but the viscosity is low, so it is very difficult to control the application position or application amount.

Accordingly, in the present invention, by forming the pad 13 of the dam structure as described above and applying the adhesive member 14 containing the liquid adhesive to the inside of the pad 13, the applied adhesive member 14 ) can be precisely controlled.

In addition, the adhesive member 14 in the first embodiment of the present invention may be a conductive adhesive, and may be a non-conductive adhesive differently. That is, the printed circuit board 10 is a board of the wire bonding method, and thus the pad 13 and the chip are not electrically connected to each other. Therefore, the adhesive member 14 applied to the pad 13 does not have to be electrically connected to the chip. Accordingly, the adhesive member 14 may use a non-conductive adhesive or, alternatively, a conductive adhesive. there is.

The conductive adhesive is largely divided into an anisotropic conductive adhesive and an isotropic conductive adhesive, and is basically conductive particles such as Ni, Au/polymer, or Ag, and thermosetting, thermoplastic, or It is composed of a blend type insulating resin that combines the characteristics of the two.

In addition, the non-conductive adhesive may be a polymer adhesive, and preferably may be a non-conductive polymer adhesive including a thermosetting resin, a thermoplastic resin, a filler, a curing agent, and a curing accelerator.

According to the embodiment according to the present invention, by applying the adhesive to the inside of the pad having a single closed curve shape, it is possible to prevent the adhesive from flowing out to the outside in advance, and it is possible to apply an accurate amount of the adhesive to the inside of the pad. can

In addition, according to an embodiment according to the present invention, a substrate applicable to both flip chip bonding and wire bonding methods can be provided by selectively applying a conductive adhesive or a non-conductive adhesive to the inside of a pad having a single closed curve shape.

In addition, according to the embodiment according to the present invention, by attaching the chip using the adhesive applied to the inside of the pad having a single closed curve shape, the adhesive can be applied to the exact position where the chip is attached, thereby improving reliability. can make it

In addition, in the embodiment according to the present invention, an end portion small enough to prevent the adhesive from flowing out during chip mounting may be provided. That is, in FIG. 2A , a through hole is formed at the center of the pad 13 to pass through upper and lower surfaces of the pad, and the adhesive member 14 is applied in the formed through hole.

Alternatively, as shown in FIG. 2B, a concave portion recessed to a certain depth in an inward direction may be formed in the central portion of the upper surface of the pad 13, and the adhesive may be applied to the formed concave portion.

In other words, the pad 13 may have a concave portion having a groove shape rather than a through hole as shown in FIG. 2A , and thus the adhesive member 14 may be applied in the concave portion.

In addition, if the shape can prevent the adhesive member from overflowing to the outside of the pad, changes and applications can be made by those skilled in the art without departing from the essential characteristics.

Hereinafter, a method of manufacturing the printed circuit board 10 shown in FIGS. 2 and 3 will be described with reference to FIG. 4 .

First, as shown in (A) of FIG. 4A, an insulating substrate 11 is prepared, and a metal layer 11A is formed on the prepared insulating substrate 11.

In this case, the metal layer 11A may be formed by electroless plating a metal including copper on the insulating substrate 11 .

The insulating substrate 11 may be a thermosetting or thermoplastic polymer substrate, a ceramic substrate, an organic-inorganic composite material substrate, or a glass fiber impregnated substrate, and may include an epoxy-based insulating resin when a polymer resin is included. Alternatively, a polyimide-based resin may be included.

Unlike forming the metal layer 11A by electroless plating on the surface of the insulating substrate 11, a general CCL (Copper Clad Laminate) may be used.

In this case, when the metal layer 11A is formed by electroless plating, roughness may be applied to the upper surface of the insulating substrate 11 so that the plating may proceed smoothly.

The electroless plating method may be performed in the order of a degreasing process, a soft corrosion process, a preliminary catalyst treatment process, a catalyst treatment process, an activation process, an electroless plating process, and an oxidation prevention process. In addition, the metal layer 11A may be formed by sputtering metal particles using plasma instead of plating.

At this time, a desmear process for removing smear from the surface of the insulating substrate 11 may be additionally performed before plating the metal layer 11A. The desmear process is performed to increase plating power for forming the metal layer 11A by imparting roughness to the surface of the insulating substrate 11 .

Next, as shown in (B) of FIG. 4A, the metal layer 11A is selectively removed to form a plurality of pads 13 and a plurality of electrodes 12 spaced apart from each other at regular intervals on the insulating substrate 11. ) to form At this time, since the pad 13 and the electrode 12 are formed using the same metal layer 11A, they may be simultaneously formed of the same material.

To this end, a dry film (not shown) is formed on the metal layer 11A to cover the formation positions of the pad 13 and the electrode 12 . The dry film has an opening in which a portion of the surface of the metal layer 11A to be removed is open.

At this time, in the process of removing the metal layer 11A for forming the pad 13 and the electrode 12, the central portion of the pad 13 is also removed, and the pad including the opening 13A ( 13) form.

At this time, as shown in the drawing, the depth of the opening 13A is the same as the height of the pad 13, and thus the opening 13A may be formed as a through hole.

At this time, the electrode 12 is disposed on the insulating substrate 11 and spaced apart from the pad 13 by a predetermined interval, and is electrically connected to a chip attached to the pad 13 accordingly. The electrode 12 is a wire bonding part electrically connected to the chip through a coupling member such as a wire.

Next, as shown in (C) of FIG. 4A, an adhesive member 14 is applied to the opening 13A of the pad 13. Preferably, the pad 13 has a single closed curve shape with an open central portion. Also, the adhesive member 14 is disposed at the center of the open pad 13 .

At this time, the pad 13 has a certain height, and the height of the pad 13 may be determined by the amount of application of the adhesive member 14 disposed in the central portion of the pad 13 . The pad 13 surrounds the periphery of the adhesive member 14 and serves as a dam to prevent the adhesive member 14 from overflowing to other areas.

The adhesive member 14 may be a liquid adhesive. That is, the adhesive strength and components of the liquid adhesive are correct, but the viscosity is low, so it is very difficult to control the application position or application amount.

Accordingly, in the present invention, by forming the pad 13 of the dam structure as described above and applying the adhesive member 14 containing the liquid adhesive to the inside of the pad 13, the applied adhesive member 14 ) can be precisely controlled.

In addition, the adhesive member 14 in the first embodiment of the present invention may be a conductive adhesive, and may be a non-conductive adhesive differently. That is, the printed circuit board 10 is a board of the wire bonding method, and thus the pad 13 and the chip are not electrically connected to each other. Therefore, the adhesive member 14 applied to the pad 13 does not have to be electrically connected to the chip. Accordingly, the adhesive member 14 may use a non-conductive adhesive or, alternatively, a conductive adhesive. there is.

Meanwhile, the printed circuit board 10 shown in FIG. 2B may be manufactured through the process shown in FIG. 4B.

First, as in (A) of FIG. 4B , an insulating substrate 11 is prepared, and a metal layer 11A is formed on the prepared insulating substrate 11 .

Next, as shown in (B) of FIG. 4B, the metal layer 11A is selectively removed to form a plurality of pads 13 and a plurality of electrodes 12 spaced apart from each other at regular intervals on the insulating substrate 11. ) to form

Next, as in (C) of FIG. 4B, a mask (not shown) for forming an opening 13A is disposed on the insulating substrate 11, the pad 13, and the electrode 12, A portion of the pad 13 is removed using the formed mask.

That is, the mask is disposed on the insulating substrate 11, the pad 13, and the electrode 12, and has an opening exposing a surface of the pad 13 to be removed. In this case, the depth of the opening 13A may be smaller than the height of the pad 13 . In other words, the opening 13A may have a groove shape as shown in (C) of FIG. 4B.

Here, when the opening 13A has a groove shape, the step (B) of FIG. 4A is a first step of forming the pad 13 and the electrode 12, and the opening 13A ) It can be divided into a second process of forming, and each can proceed.

Next, as shown in (D) of FIG. 4B, the adhesive member 14 is applied in the opening 13A of the pad 13.

5A is a view showing a cross-sectional structure of a printed circuit board according to a second embodiment of the present invention, FIG. 5B is a view showing a modified example of the printed circuit board shown in FIG. 5A, and FIG. 6 is a printed circuit diagram of FIG. 5 7a is a cross-sectional view showing the manufacturing method of the printed circuit board of FIG. 5a in process order, and FIG. 7b is a cross-sectional view showing the manufacturing method of the printed circuit board of FIG. 5b in process order.

Hereinafter, a printed circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 5 to 7 .

First, the printed circuit board according to the second embodiment shown in FIGS. 5 to 7 is a support substrate to which a chip is attached, and more specifically, a support substrate to which the chip is attached by flip chip bonding. The flip chip bonding method is a method in which electrodes of the chip and electrodes of the printed circuit board are directly connected without a separate connecting member, and specifically, a method in which the chip electrodes are directly attached on the electrodes of the printed circuit board.

Meanwhile, the printed circuit board 20 shown in FIG. 5A is different from the printed circuit board 10 shown in FIG. 2A only in the structure of the electrode, and the structure of other parts is the same. Accordingly, hereinafter, only the structure of the electrode of the printed circuit board 20 will be described.

In the printed circuit board 10 of FIG. 2A , electrodes 12 and pads 13 disposed on the insulating board 11 are electrically separated from each other. In other words, the electrode 12 and the pad 13 were spaced apart from each other by a predetermined distance.

However, in the printed circuit board 20 in the second embodiment shown in FIG. 5A, the electrodes 22 and the pads 23 are disposed on the insulating substrate 21. At this time, the electrodes 22 and the pads 23 ) are electrically connected to each other.

In other words, the printed circuit board 10 is disposed on the insulating substrate 21, disposed between the electrode 22 and the pad 23, and electrically connects the electrode 22 and the pad 23 to each other. It further includes a connection pattern 25 to do.

One end of the connection pattern 25 is connected to the electrode 22 , and the other end of the connection pattern 25 is connected to the pad 23 .

Like the electrodes 22 and the pads 23, the connection patterns 25 may be formed of a conductive metal material. Preferably, the connection pattern 25 is at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). It may be made of a metal material. In addition, the pad 13 and the electrode 12 are made of gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), zinc (Zn) with excellent bonding strength It may be formed of a paste or solder paste containing at least one metal material selected from among.

Meanwhile, in FIG. 5A, for convenience of description, the electrode 22, the connection pattern 25, and the pad 23 are shown as being separated from each other on the insulating substrate 21, but in reality, the electrode 22, the connection The pattern 25 and the pad 23 have an integrally formed structure. In other words, the electrode 22, the pad 23, and the connection pattern 25 are formed by etching one metal layer or plating the same metal material, and thus the electrode 22, the pad ( 23) and the connection pattern 25 have an integrated structure connected to each other.

At this time, the circuit pattern including the electrode 22, the pad 23, and the connection pattern 25 is a conventional printed circuit board manufacturing process, such as an additive process or a subtractive process. Process), MSAP (Modified Semi Additive Process) and SAP (Semi Additive Process) methods, etc., and detailed descriptions are omitted here.

Meanwhile, an adhesive member 24 is disposed in the opening of the pad 23 (or inside the single closed curve). The adhesive member 24 has a weight corresponding to the height of the pad 13 and is applied within the pad 23 . Preferably, the adhesive member 24 may protrude from the upper surface of the pad 23 at a predetermined height.

In addition, the adhesive member 24 in the second embodiment of the present invention is preferably a conductive adhesive. That is, the printed circuit board 20 is a substrate of a flip chip bonding method, and accordingly, the pad 23 and the chip must be electrically connected to each other. Therefore, the adhesive member 24 applied to the pad 23 must also be electrically connected to the chip, and accordingly, it is preferable to use a conductive adhesive as the adhesive member 24 .

The conductive adhesive is largely divided into an anisotropic conductive adhesive and an isotropic conductive adhesive, and is basically conductive particles such as Ni, Au/polymer, or Ag, and thermosetting, thermoplastic, or It is composed of a blend type insulating resin that combines the characteristics of the two. According to the embodiment according to the present invention, by applying the adhesive to the inside of the pad having a single closed curve shape, it is possible to prevent the adhesive from flowing out to the outside in advance, and it is possible to apply an accurate amount of the adhesive to the inside of the pad. can

In addition, according to an embodiment according to the present invention, a substrate applicable to both flip chip bonding and wire bonding methods can be provided by selectively applying a conductive adhesive or a non-conductive adhesive to the inside of a pad having a single closed curve shape.

In addition, according to the embodiment according to the present invention, by attaching the chip using the adhesive applied to the inside of the pad having a single closed curve shape, the adhesive can be applied to the exact position where the chip is attached, thereby improving reliability. can make it

In addition, as shown in FIG. 5B , a concave portion recessed to a certain depth in an inward direction may be formed in the central portion of the upper surface of the pad 23, and the adhesive may be applied to the formed concave portion. In other words, the pad 23 may have a concave portion having a groove shape rather than a through hole as shown in FIG. 5A , and thus the adhesive member 24 may be applied in the concave portion.

Hereinafter, a method of manufacturing the printed circuit board 20 shown in FIGS. 5 and 6 will be described with reference to FIG. 7 .

FIG. 7A shows a manufacturing method of the printed circuit board 20 shown in FIG. 5A in process order, and FIG. 7B shows a manufacturing method of the printed circuit board 20 shown in FIG. 5B in process order.

First, as shown in (A) of FIG. 7A, an insulating substrate 21 is prepared, and a metal layer 21A is formed on the prepared insulating substrate 21.

In this case, the metal layer 21A may be formed by electroless plating a metal including copper on the insulating substrate 21 .

Next, as shown in (B) of FIG. 7A, the metal layer 21A is selectively removed to form a plurality of pads 23 and a plurality of electrodes 22 spaced apart from each other at regular intervals on the insulating substrate 21. ), and a connection pattern 25 connecting each of the plurality of pads 23 and the plurality of electrodes 22 is formed.

In other words, as shown in (B) of FIG. 7A , a circuit pattern is formed on the insulating substrate 21 by selectively removing the metal layer disposed on the insulating substrate 21 . At this time, the circuit pattern may include the pad 23, the electrode 22, and the connection pattern 25 as described above.

At this time, in the process of removing the metal layer 21A for forming the pad 23 and the electrode 22, the central portion of the pad 23 is also removed, and the pad including the opening 23A ( 23) form.

At this time, as shown in the drawings, the depth of the opening 23A is the same as the height of the pad 23, and thus the opening 23A may be formed as a through hole.

In this case, although the depth of the opening 23A is shown as being the same as the height of the pad 23 in the drawings, the depth of the opening 23A may be smaller than the height of the pad 23 . In other words, the opening 23A may have a groove shape instead of a through hole as shown in (C) of FIG. 7A. Here, when the opening 23A has a groove shape, as shown in (B) and (C) of FIG. 7A, the first step of forming the pad 23 and the electrode 22; , the second process of forming the opening 23A may be performed as a separate process.

Next, as shown in (D) of FIG. 7A, an adhesive member 24 is applied in the opening 23A of the pad 23. Preferably, the pad 23 has a single closed curve shape with an open central portion. And, the adhesive member 24 is disposed at the central portion of the open pad 23 .

At this time, the pad 23 has a certain height, and the height of the pad 23 may be determined by the amount of application of the adhesive member 24 disposed in the central portion of the pad 23 . The pad 23 surrounds the adhesive member 24 and serves as a dam to prevent the adhesive member 24 from overflowing to other areas.

The adhesive member 24 may be a liquid adhesive. That is, the adhesive strength and components of the liquid adhesive are correct, but the viscosity is low, so it is very difficult to control the application position or application amount.

Accordingly, in the present invention, by forming the pad 23 of the dam structure as described above and applying the adhesive member 24 containing the liquid adhesive to the inside of the pad 23, the applied adhesive member 24 ) can be precisely controlled.

Meanwhile, the printed circuit board 10 shown in FIG. 5B may be manufactured through the process shown in FIG. 7B.

First, as in (A) of FIG. 7B, an insulating substrate 21 is prepared, and a metal layer 21A is formed on the prepared insulating substrate 21.

Next, as shown in (B) of FIG. 7B, the metal layer 21A is selectively removed to form a plurality of pads 23 and a plurality of electrodes 22 spaced apart from each other at regular intervals on the insulating substrate 21. ) to form

Next, as shown in (C) of FIG. 7B, a mask (not shown) for forming an opening 23A is disposed on the insulating substrate 21, the pad 23, and the electrode 22, A portion of the pad 23 is removed using the formed mask.

That is, the mask is disposed on the insulating substrate 21, the pad 23, and the electrode 22, and has an opening exposing a surface of the pad 23 to be removed. In this case, the depth of the opening 23A may be smaller than the height of the pad 23 . In other words, the opening 12A may have a groove shape as shown in (C) of FIG. 7B.

Here, when the opening 23A has a groove shape, the step (B) of FIG. 7A is the first step of forming the pad 23 and the electrode 22 as shown in FIG. 7B and , It can be divided into the second process of forming the opening 23A, respectively, and can proceed respectively.

Next, as shown in (D) of FIG. 7B, an adhesive member 24 is applied to the opening 23A of the pad 23.

8 is a modified example of a shape of a pad according to an embodiment of the present invention.

In FIGS. 2 to 7 , the pad is illustrated as having a single closed curve shape having a ring shape. However, this is only an example, and the pad may be formed as a single closed curve of another shape that functions as a dam, in addition to the ring shape.

In addition, the pad may be formed in a shape having a slight gap rather than the single closed curve in a structure in which the adhesive does not overflow from the inside of the pad to other places.

That is, as shown in (A) of FIG. 8 , the pad 23 may have a triangular shape. Alternatively, the pad 23 may have a square shape. Alternatively, the pad 23 may have a polygonal shape.

In addition to the shape shown in the drawings, the pad 23 can be deformed into various shapes such as an elliptical shape, a fan shape, and a star shape.

9 is a view showing a cross-sectional structure of a package substrate according to a first embodiment of the present invention, and FIG. 10 is a plan view of the package substrate of FIG. 9 .

Referring to FIG. 9 , the package substrate includes a printed circuit board 10 and a chip 30 disposed on the printed circuit board 10 .

At this time, since the printed circuit board 10 has already been described with reference to FIGS. 2 to 4 , a detailed description thereof will be omitted.

A chip 30 is attached to the printed circuit board 10 . At this time, as described above, the chip 30 may be any one of various electronic components, and may include any one of an active element and a passive element.

At this time, the chip 30 includes an electrode 40, and the electrode 40 of the chip 30 is disposed on the insulating substrate 11 to face upward. Preferably, the chip 30 may be attached on the insulating substrate 11 so that the electrode 40 faces upward.

Also, an adhesive member 14 is disposed within the pad 13 , and the chip 30 may be attached to the pad 23 by the adhesive force of the adhesive member 14 . While the adhesive member 14 is applied to the inside of the pad 23, a predetermined amount moves on the surface of the pad 23 as the chip 30 is seated thereon. Thus, the chip 30 can be stably attached to the pad 13 by the adhesive member 14 .

In addition, the pads 13 are disposed in regions where the four corner portions of the chip 30 are located, and accordingly, each corner region of the chip 30 is stably supported.

In addition, the connecting member 50 electrically connects the electrode 12 of the printed circuit board 10 and the electrode 40 of the chip 30 to each other. Preferably, the connecting member 50 has one end connected to the electrode 12 of the printed circuit board 10 and the other end connected to the electrode 40 of the chip 30 . The connection member 50 may use a general wire.

11A and 11B are views illustrating a cross-sectional structure of a package substrate according to a second embodiment of the present invention, and FIG. 12 is a plan view of the package substrate of FIGS. 11A and 11B.

Referring to FIG. 11A , the package substrate includes a printed circuit board 20 and a chip 30 disposed on the printed circuit board 20 .

At this time, since the printed circuit board 20 has already been described in FIGS. 5 to 7, a detailed description thereof will be omitted.

A chip 30 is attached to the printed circuit board 20 . At this time, as described above, the chip 30 may be any one of various electronic components, and may include any one of an active element and a passive element.

At this time, the chip 30 includes an electrode 40, and the electrode 40 of the chip 30 is disposed on the insulating substrate 21 to face downward. Preferably, the chip 30 may be attached on the insulating substrate 21 in a state in which the electrode 40 is disposed to face the upper surface of the insulating substrate 21 .

Also, an adhesive member 24 is disposed within the pad 23 , and the chip 30 may be attached to the pad 23 by the adhesive force of the adhesive member 24 . While the adhesive member 24 is applied to the inside of the pad 23, a predetermined amount moves on the surface of the pad 23 as the chip 30 is seated thereon. Thus, the chip 30 can be stably attached to the pad 23 by the adhesive member 24 .

In this case, the width of the opening formed in the pad 23 may be greater than that of the electrode 40 of the chip 30 . Accordingly, the electrode 40 of the chip 30 may be inserted into the opening of the pad 23 and, accordingly, may be embedded in the adhesive member 24 .

In addition, the pads 23 are respectively disposed in regions where the four corner portions of the chip 30 are located, and accordingly, each corner region of the chip 30 is stably supported.

In addition, the connection pattern 25 electrically connects the electrode 22 of the printed circuit board 20 and the electrode 40 of the chip 30 to each other. Preferably, the connection pattern 25 is disposed between the pad 23 and the electrode 22, and thus the electrode of the chip 30 buried in the pad 23 and the adhesive member 24 ( 40) and the electrode 22 of the printed circuit board 20 are electrically connected.

Also, the width of the connection pattern 25 may be smaller than that of the electrode 22 or the pad 23, and accordingly, the overall size of the printed circuit board may be reduced.

Also, referring to FIG. 11B , the package substrate according to the second embodiment of the present invention includes a printed circuit board 20 and a chip 30 disposed on the printed circuit board 20 .

In this case, the width of the opening formed in the pad 23 may be smaller than the width of the electrode 40 of the chip 30 . Accordingly, the electrode 40 of the chip 30 may be seated on the surface of the pad 23 without being inserted into the opening of the pad 23 .

In addition, although FIG. 11B shows that the adhesive member 24 is formed to cover only a part of the electrode 40 of the chip 30, the adhesive member 24 covers the entire electrode 40 differently. ) may be formed.

13 and 14 are implementation examples of a package substrate according to an embodiment of the present invention.

Referring to FIG. 13 , a plurality of chips 30 may be attached to the insulating substrate 11 . Preferably, the upper region of the insulating substrate 11 may be divided into a plurality of regions. In addition, a chip 30 may be attached to each of the regions.

To this end, pads, electrodes, and adhesive members as described above are disposed in each of the regions, and accordingly, the chip 30 may be electrically connected to the electrodes through the connecting members.

In the drawing, it is shown that the upper region of the insulating substrate 11 is divided into six regions, and six chips 30 are attached to the insulating substrate 11 accordingly, but this is only one embodiment. The number of distinct regions or the number of attached chips may decrease or increase.

Referring to FIG. 14 , a plurality of chips 30 may be attached to an insulating substrate 21 . Preferably, the upper region of the insulating substrate 21 may be divided into a plurality of regions. In addition, a chip 30 may be attached to each of the regions.

To this end, pads, electrodes, and adhesive members as described above are disposed in each of the regions, and accordingly, the chip 30 may be electrically connected to the electrodes through a connection pattern.

In the drawing, it is shown that the upper region of the insulating substrate 21 is divided into 6 regions, and six chips 30 are attached on the insulating substrate 21 accordingly, but this is only one embodiment. The number of distinct regions or the number of attached chips may decrease or increase.

Meanwhile, the chip 30 in the present invention may be a sensing module. Hereinafter, the sensing module attached to the printed circuit board 10 will be described in detail. The sensing module described below may be attached to the substrate by a flip chip bonding method, and may be attached to the substrate by a wire bonding method.

15A is a view showing a cross-sectional structure of a sensing module according to a first embodiment of the present invention, FIG. 15B is a view showing a modified example of the sensing module shown in FIG. 15A, and FIG. 16A is a plan view of the sensing module of FIG. 15A. 16B is a plan view of the sensing module of FIG. 15B, and FIG. 17 is a plan view of an embodiment in which the air gap of the sensing module of FIG. 15A or 15B is increased.

15A and 16A, the sensing module 100A includes a substrate 110, an intermediate layer 115, a first electrode pad 120, a second electrode pad 125, a metal layer 130, and a heater electrode 135. , a sensing electrode 140, a sensing object 145, a protective layer 150, and a connection portion 155.

The substrate 110 is a support substrate of the sensing module 100A on which electrode pads are formed. The substrate 110 forms an insulating plate and may be a ceramic substrate.

Preferably, the substrate 110 may be a ceramic substrate including alumina or silicon nitride (SiN).

A first electrode pad 120 is disposed on the substrate 110 .

The first electrode pad 120 is formed by additive process, subtractive process, MSAP (Modified Semi Additive Process), and SAP (Semi Additive Process) process, which are typical printed circuit board manufacturing processes. etc., and a detailed description thereof is omitted here.

A plurality of first electrode pads 120 are disposed on the substrate 110 at predetermined intervals.

Preferably, the first electrode pad 120 includes a first upper electrode pad 121, a second upper electrode pad 122, a third upper electrode pad 123, and a fourth upper electrode pad 124.

In addition, two upper electrode pads among the first to fourth upper electrode pads 121, 122, 123, and 124 are connected to the heater electrode 135, and the remaining two upper electrode pads are connected to the sensing electrode 140. do. In other words, the first upper electrode pad 121 and the second upper electrode pad 122 are sensing electrode pads connected to the sensing electrode 140, and the third upper electrode pad 123 and the fourth upper electrode pad ( 124 ) is a heater electrode pad connected to the heater electrode 135 .

In this case, the first to fourth upper electrode pads 121 , 122 , 123 , and 124 may be respectively disposed on four corner regions of the substrate 110 having a plate shape.

Meanwhile, a second electrode pad 125 is disposed below the substrate 110 .

In other words, the first electrode pad 120 is disposed on the upper surface of the substrate 110, and the second electrode pad 125 is disposed on the lower surface of the substrate 110.

The second electrode pad 125 is an attachment pad for attaching the sensing module 100A to the printed circuit boards 10 and 20 . To this end, the second electrode pad 125 may be formed of paste. In other words, the second electrode pad 125 is made of a metal material such as gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), or zinc (Zn). can be formed In addition, the second electrode pad 125 is made of metals such as gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn), which have excellent bonding strength. It may be formed of a paste containing a material or a solder paste.

A metal layer 130 is disposed on the surface of the second electrode pad 125 . The metal layer 130 is formed of a metal material capable of increasing bonding force of the second electrode pad 125 while protecting the surface of the second electrode pad 125 . Preferably, the metal layer 130 is made of a material containing a metal such as gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), or zinc (Zn). can be formed

Meanwhile, a plurality of second electrode pads 125 are disposed on the lower surface of the substrate 110 at predetermined intervals.

That is, the second electrode pad 125 may include first to fourth lower electrode pads (not shown).

And, the first lower electrode pad is electrically connected to the first upper electrode pad 121, the second lower electrode pad is electrically connected to the second upper electrode pad 122, and the third lower electrode pad is The third upper electrode pad 123 is electrically connected, and the fourth lower electrode pad is electrically connected to the fourth upper electrode pad 124 .

In addition, the metal layer 130 is disposed on surfaces of the first to fourth lower electrode pads, respectively.

The connecting portion 155 penetrates the substrate 110, has one end connected to the first electrode pad 120, and the other end connected to the second electrode pad 125.

In other words, the connection portion 155 is disposed penetrating the substrate 110 and thus electrically connects the first electrode pad 120 and the second electrode pad 125 to each other.

The connection part 155 may be formed by filling a through hole (not shown) penetrating the substrate 110 with a conductive material.

The through hole may be formed by any one of mechanical processing, laser processing, and chemical processing.

When the through hole is formed by machining, methods such as milling, drilling, and routing may be used, and when the through hole is formed by laser processing, a UV or CO ₂ laser method may be used. In the case of being formed by chemical processing, the substrate 110 can be opened using chemicals including aminosilane, ketones, and the like.

On the other hand, the laser processing is a cutting method that melts and evaporates a part of the material by concentrating optical energy on the surface to take a desired shape, and can easily process complex formations by computer programs, and other methods Even difficult composite materials can be machined.

In addition, the processing by the laser can cut a diameter of up to a minimum of 0.005 mm, and has the advantage of a wide range of processable thickness.

As the laser processing drill, it is preferable to use a YAG (Yttrium Aluminum Garnet) laser, a CO ₂ laser, or an ultraviolet (UV) laser. The YAG laser is a laser capable of processing both the copper foil layer and the insulating layer, and the CO ₂ laser is a laser capable of processing only the insulating layer.

When the through hole is formed, the inside of the through hole is filled with a conductive material to form the connection part 155 . The connection portion 155 is formed to electrically conduct the first electrode pad 120 and the second electrode pad 125 to each other. The metal material forming the connection portion 155 may be any one material selected from copper (Cu), silver (Ag), tin (Sn), gold (Au), nickel (Ni), and palladium (Pd), , The conductive material filling may use any one of electroless plating, electrolytic plating, screen printing, sputtering, evaporation, inkjetting, and dispensing, or a combination thereof.

A heater electrode 135 and a sensing electrode 140 connected to the first electrode pad 120 are respectively disposed on the substrate 110 .

The heater electrode 135 is a resistor disposed on the substrate 110 and generates heat, and is made of platinum (Pt), gold (Au), tungsten (W), palladium (Pd), silicon (Si), a silicon alloy or It may be formed of at least one of conductive metal oxides, and among the metals, it is preferably formed of platinum (Pt). Since the sensing module 100A operates at a high temperature (eg, 250 to 300° C.), a configuration for increasing the temperature is required, and accordingly, the heater electrode 135 generates Joule heat by an external power supply. (Joule Heat) is generated to increase the temperature of the sensing module 100A.

In this case, the sensing module 100A may be a gas sensing module that senses various types of gas, and the temperature at which the sensing module may exhibit optimum sensitivity is different according to the type of gas to be sensed.

Therefore, in the present invention, the temperature of the heater electrode 135 can be controlled according to the type of gas to be sensed, and accordingly, the sensing module 100A is raised to a specific temperature capable of exhibiting optimum sensitivity. At this time, the temperature generated by the heater electrode 135 may be adjusted according to the magnitude of the applied power. In addition, the temperature generated by the heater electrode 135 may be adjusted by changing the width or length of the heater electrode 135 .

Meanwhile, an intermediate layer 115 is disposed on the substrate 110 .

The intermediate layer 115 is formed of a material having low thermal conductivity, and thus prevents heat generated by the heater electrode 135 from being emitted to the outside. In other words, the intermediate layer 115 functions as a heat insulator preventing heat generated from the heater electrode 135 from being released to the outside.

To this end, the intermediate layer 115 may be disposed under the heater electrode 135 . Preferably, the intermediate layer 115 may be disposed in a sensing area (an area where the sensing object 145 goes up) among the upper areas of the substrate 110 .

And, the heater electrode 135 is disposed on the intermediate layer 115 disposed in the sensing area of the substrate 110 . That is, among the upper regions of the substrate 110, the region where the intermediate layer 115 is disposed may be a sensing region, and the region excluding the region where the intermediate layer 115 is disposed (in other words, the first electrode pad 120) The area where is disposed) may be a peripheral area.

At this time, the heater electrode 135 electrically connects the heater electrode disposed on the intermediate layer 115 and the first electrode pad 120 to each other. At this time, a thickness of a portion of the heater electrode 135 disposed on the intermediate layer 115 is smaller than a thickness of a portion connected to the first electrode pad 120 . That is, the heater electrode 135 has a different thickness between a portion disposed on the substrate 110 and a portion disposed on the intermediate layer 115 .

The thickness of the heater electrode 135 gradually becomes thinner toward the position where the detection object 145 is disposed, and accordingly, the heater electrode 135 of the part where the detection object 145 is disposed is a part disposed in another part. is set lower than the resistance of the heater electrode of

Accordingly, the heater electrode 135 disposed on the intermediate layer 115 heats the sensing object 145 by generating a higher temperature than heater electrodes of other parts.

Meanwhile, the intermediate layer 115 may be a layer formed of glass or oxide, and is preferably formed of a material having low thermal conductivity to prevent heat generated from the heater electrode 135 from being discharged to the outside. It can be.

Also, the sensing electrode 140 may include a first sensing electrode 141 and a second sensing electrode 142 spaced apart from each other at a predetermined interval. Preferably, the first sensing electrode 141 may be an electrode having a negative (-) characteristic, and the second sensing electrode 142 may be an electrode having a positive (+) characteristic.

The sensing object 145 may be formed of a metal oxide on the sensing electrode 140, and accordingly, a gas may be adsorbed and a resistance change of the metal oxide may occur. Also, the sensing electrode 140 measures a change in resistance caused by the gas adsorbed to the sensing object 145 .

The sensing electrode 140 may be formed of gold (Au) or platinum (Pt).

Also, the sensing electrode 140 may be disposed on the intermediate layer 115 like the heater electrode 135 .

To this end, the intermediate layer 115 may be disposed under the sensing electrode 140 as well as the heater electrode 135 .

And, the sensing electrode 140 is disposed on the intermediate layer 115 disposed in the sensing area of the substrate 110 .

At this time, the sensing electrode 140 is electrically connected to the first electrode pad 120 and senses gas vaporized by the heater electrode 135 at a portion disposed on the intermediate layer 115 .

That is, a portion of the sensing electrode 140 disposed on the intermediate layer 115 is covered by the sensing object 145, and accordingly, gas vaporized by the heater electrode 135 is sensed.

Meanwhile, the sensing object 145 may include at least one of metal oxide, gold nanoparticles, graphene, carbon nanotube, fullerene, and molybdenum disulfide (MoS2). For example, the metal oxide is two of tungsten oxide (WOx), tin oxide (SnOx), zinc oxide (ZnOx), indium oxide (InOx), titanium oxide (TiOx), gallium oxide (GaOx), and cobalt oxide (CoOx). More than one may be combined in a certain ratio, but is not limited thereto. In another embodiment, the metal oxide is at least one metal of platinum (Pt), gold (Au), tungsten (W), rhodium (Rh) and palladium (Pd) or aluminum oxide (Al ₂ O ₃ ), such as A metal oxide may be further included as an auxiliary particle. In this case, the metal oxide may be nanoparticles having an average diameter of 1 nm to 500 nm. In addition, the metal oxide may be a thin film having a columnar structure formed of nanocolumns. The contact force of the nanoparticles with the sensing electrode 140 can be greatly improved, so that a change in electrical resistance caused by a gas in contact with the sensing object 145 can be checked more sensitively. In addition, since the nanoparticles have a large surface area and a large electrical change due to external influence, the operating temperature of the sensing module 100A can be greatly reduced.

A protective layer 150 is formed on the substrate 110 .

The protective layer 150 is formed to cover the first electrode pad 120 , the heater electrode 135 , and the sensing electrode 140 disposed on the substrate 110 .

Preferably, the protective layer 150 is a region other than the sensing object 145 disposed on the sensing electrode 140, that is, a portion of the sensing electrode 140 not covered by the sensing object 145, It is formed to cover the heater electrode 135 , the first electrode pad 120 and the upper surface of the substrate 110 .

At this time, the protective layer 150 may be a layer formed of glass or oxide, and is preferably made of a material having low thermal conductivity to prevent heat generated from the heater electrode 135 from being discharged to the outside. can be formed

As described above, the sensing module 100A according to the present invention provides a sensing module in which a through electrode connected to the sensing electrode and the heater electrode is formed on a ceramic substrate, thereby eliminating a process such as wire bonding, thereby eliminating the sensing module and the sensing device. It is possible to achieve miniaturization or slimming of, and accordingly, it is possible to provide a sensing device that can be applied to various products.

Meanwhile, an air gap 160 is formed in the substrate 110 . The air gap 160 is disposed surrounding the sensing region.

Preferably, the air gap 160 is formed penetrating from the upper surface of the protective layer 150 to the lower surface of the substrate 110 . Also, the air gap 160 is disposed to surround the sensing area and prevents heat transfer between the sensing area and the peripheral area.

Here, the sensing area may be an area where the intermediate layer 115 is disposed. Thus, the void 160 is disposed in the peripheral area of the intermediate layer 115 . At this time, when the void 160 is formed over the entire area of the substrate 110 and the protective layer 150, the connection strength between the sensing area including the intermediate layer 115 and the peripheral area is weakened. can

Accordingly, the air gap 160 may include a plurality of unit air gaps disposed surrounding the circumferential area spaced apart from the intermediate layer 115 by a predetermined distance. In addition, a portion between the plurality of unit pores of the substrate 110 is not removed and remains to support the connection between the sensing area and the peripheral area, so as to improve the strength of the connection portion.

The plurality of unit pores may have a “c” shape, as shown in FIG. 16A, and may have a symmetrical shape with respect to the upper and lower center lines of the intermediate layer 115 and may be disposed respectively.

The void 160 is formed not only passing through the substrate 110 shown in FIG. 16A, but also passing through the protective layer 150 disposed on the substrate 110 together with the substrate 110. Accordingly, a heat blocking region is formed from the protective layer 150 region to the substrate 110 region by the air gap 160 .

The gap 160 may be formed by opening the substrate 110 and the protective layer 150 by any one of mechanical processing, laser processing, and chemical processing.

As described above, according to the embodiment according to the present invention, by forming a plurality of air gaps around the sensing object, it is possible to block external heat transferred to the sensing object, and accordingly, as the external heat is transferred to the sensing object, It is possible to improve the operation reliability of the sensor by removing the gas detection error phenomenon that appears.

In addition, according to the practice according to the present invention, the heat of the sensing object is not emitted to the outside by the gap, so that the sensing object can always maintain a high temperature, and the power consumption for maintaining the sensing object at a constant temperature is reduced. can be minimized.

Meanwhile, as shown in FIGS. 15B and 16B , the sensing module 100B includes a substrate 110, an intermediate layer 115, a first electrode pad 120, a second electrode pad 125, and a metal layer 130. , a heater electrode 135, a sensing electrode 140, a sensing object 145, a protective layer 150, and a connection portion 155A.

The gas sensing module 100B shown in FIGS. 15B and 16B has the same configuration as the gas sensing module 100A shown in FIGS. 15A and 16A except for the first electrode pad 120 and the connection portion 155A. Accordingly, detailed descriptions of components other than the first electrode pad 120 and the connecting portion 155A will be omitted.

The connecting portion 155A penetrates the substrate 110, has one end connected to the first electrode pad 120, and the other end connected to the second electrode pad 125.

In other words, the connection portion 155A is disposed penetrating the substrate 110 and thus electrically connects the first electrode pad 120 and the second electrode pad 125 to each other.

The connection portion 155A may be formed by filling a through hole (not shown) penetrating the substrate 110 with a metal material.

In this case, the through hole may be formed in an outer portion of the substrate 110 . In other words, each of the through holes may be formed in a corner region of the substrate 110 . Thus, the through hole is formed outside the substrate 110 and exposed to the outside of the substrate 110 .

Accordingly, the connection portion 155A is formed on the outer portion of the substrate 110 and may be preferably disposed at a corner area of the substrate 110 . Accordingly, a portion of the connection portion 155A is exposed to the outside of the substrate 110 . At this time, the exposed part is a side surface other than the top or bottom surface of the connection part 155A.

In addition, the first electrode pad 120 includes a first upper electrode pad 121A, a second upper electrode pad 122A, a third upper electrode pad 123A, and a fourth upper electrode pad 124A.

In addition, two upper electrode pads among the first to fourth upper electrode pads 121A, 122A, 123A, and 124A are connected to the heater electrode 135, and the remaining two upper electrode pads are connected to the sensing electrode 140. do. In other words, the first upper electrode pad 121A and the second upper electrode pad 122A are sensing electrode pads connected to the sensing electrode 140, and the third upper electrode pad 123A and the fourth upper electrode pad ( 124A) is a heater electrode pad connected to the heater electrode 135 .

In this case, the first to fourth upper electrode pads 121A, 122A, 123A, and 124A may be respectively disposed at four corner regions of the substrate 110 having a plate shape. That is, the first to fourth upper electrode pads 121A, 122A, 123A, and 124A are disposed outside the upper region of the substrate 110 . Accordingly, side surfaces of the first to fourth upper electrode pads 121A, 122A, 123A, and 124A may be exposed to the outside of the substrate 110 .

As described above, by disposing the through electrode such as the connection portion 155A on the outer portion of the substrate so that a part of the through electrode is exposed to the outside, the area ratio of the entire through electrode can be reduced, thereby configuring the through electrode. It is possible to reduce the amount of conductive material or conductive paste used.

Meanwhile, as shown in FIG. 17 , the air gap 160 may be formed in plurality.

In other words, FIG. 17 is a plan view of one stretched embodiment of the void 160 shown in FIG. 16A or 16B.

Hereinafter, the sensing module 100 may mean any one of the sensing module 100A shown in FIG. 15A and the sensing module 100B shown in FIG. 15B.

Referring to FIG. 17, the void 160 is spaced apart from the intermediate layer 115 by a predetermined distance and is disposed in a peripheral area of the intermediate layer 115. A second air gap 162 spaced apart from the first air gap 161 and disposed in the peripheral area of the second air gap 161, and a second air gap 162 spaced apart from the second air gap 162 by a predetermined distance and disposed in the peripheral area of the second air gap 162. 3 voids 163.

The first air gap 161 is disposed surrounding the middle layer 115 and includes a plurality of first unit air gaps spaced apart from each other by a predetermined interval. The substrate 110 or the protective layer 150 remains between the plurality of first unit pores, thereby increasing the connection strength between the sensing area and the peripheral area.

The second air gap 162 is formed at a position spaced apart from the first air gap 161 by a predetermined distance, and thus is disposed surrounding the first air gap 161 . Also, like the first air gap 161, the second air gap 162 is composed of a plurality of second unit air spaces spaced apart from each other by a predetermined interval.

The third air gap 163 is formed at a position spaced apart from the second air gap 162 by a predetermined distance, and thus is disposed surrounding the second air gap 162 . In addition, the third air gap 163 is composed of a plurality of third unit air spaces spaced apart from each other by a predetermined distance, similarly to the first and second air gaps 161 and 162 .

As described above, according to the embodiment according to the present invention, by forming a plurality of air gaps spaced apart at predetermined intervals around the sensing object, impact energy generated from the outside is transmitted to the inside to prevent cracks from occurring, and accordingly, the sensing module The breakage problem can be solved.

Meanwhile, the sensing module may have a membrane structure or a bridge structure rather than an integral substrate structure as shown in FIG. 15A or 15B, and a plurality of pores 160 as described in FIG. 17 may be provided in the membrane structure or the bridge structure. can be formed

18 is a view showing a cross-sectional structure of a sensing module according to a second embodiment of the present invention.

18 has a general one-layer membrane structure, and is characterized in that an air gap 260 is formed in the substrate.

Referring to FIG. 18 , the sensing module 200 includes a substrate 210 , an electrode pad 220 , a heater electrode 235 , a sensing electrode 240 and a sensing object 245 .

The substrate 210 has a structure in which an insulating plate 211, a first silicon oxide thin film 212, a silicon nitride thin film 213, and a second silicon oxide thin film 213 are sequentially stacked.

The insulating plate 211 may use a silicon substrate used in a general semiconductor process, aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), quartz, gallium-nitrogen (GaN) or gallium-arsenic ( A substrate doped with GaAs) may also be used.

Meanwhile, the lower region of the insulating plate 211 corresponding to the region where the heater electrode 235 and the sensing electrode 240 are disposed is etched and removed.

At this time, in etching the insulating plate 211, a dry etching process using a photoresist pattern may be used.

The first silicon oxide thin film 212 , the silicon nitride thin film 213 , and the second silicon oxide thin film 214 form a membrane and are sequentially stacked on the insulating plate 211 .

The membrane serves as an etch stop layer when the lower region of the insulating plate 211 is etched, and also serves as a support for the sensing electrode 240 or the heater electrode 235 . In addition, the membrane is to prevent deformation of the element due to heat generation when the heater electrode 235 is heated, and is formed of a silicon oxide thin film or a silicon nitride thin film, or has a laminated structure of a silicon oxide thin film and a silicon nitride thin film. can be formed

In this figure, a case is shown in which the membrane is formed in a laminated structure of a first silicon oxide thin film 212, a silicon nitride thin film 213, and a second silicon oxide thin film 214. In this way, the membrane is oxidized with compressive stress. It is preferable to form a silicon thin film and a silicon nitride thin film having a tensile stress in a structure as shown in FIG. 18 . Of course, the membrane may be made of only one of these thin films.

The membrane may be formed using methods such as thermal oxidation, sputtering, or chemical vapor deposition.

An electrode pad 220 is disposed on the second silicon oxide thin film 214 . As described above, the electrode pad 220 may be composed of a plurality of electrode pads, preferably four electrode pads.

In addition, a heater electrode 235 and a sensing electrode 240 are respectively disposed on the second silicon oxide thin film 214 .

A sensing object 245 is disposed on the second silicon oxide thin film 214 while covering the sensing electrode 240 .

In addition, an air gap 260 is formed around the sensing object 245 in the substrate 210 to surround the sensing object 245 .

Preferably, the lower region of the insulating plate 211 is removed by etching as described above, and thus the gap 260 is formed by the first silicon oxide thin film 212, the silicon nitride thin film 213 and the second silicon nitride thin film 213. It is formed to penetrate the silicon oxide thin film 214 and is connected to the lower region of the removed insulating plate 211 .

The air gap 260 may include a plurality of air gaps as described above, and each of the plurality of air gaps may be composed of a plurality of unit air gaps spaced apart at predetermined intervals.

The sensing module 200 as described above is a one-layer sensing module, and preferably has a structure in which the sensing electrode 240 and the heater electrode 235 are respectively disposed on the same layer.

19 is a diagram showing a cross-sectional structure of a sensing module according to a third embodiment of the present invention.

19 has a general two-layer membrane structure, and is characterized in that an air gap 360 is formed in the substrate.

Referring to FIG. 19 , the sensing module 300 includes a substrate 310, a protective layer 315, an electrode pad 320, a heater electrode 335, a sensing electrode 340, and a sensing object 345.

The substrate 310 has a structure in which an insulating plate 311, a first silicon oxide thin film 312, a silicon nitride thin film 313, and a second silicon oxide thin film 313 are sequentially stacked.

The insulating plate 311 may use a silicon substrate used in a general semiconductor process, aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), quartz, gallium-nitrogen (GaN) or gallium-arsenic ( A substrate doped with GaAs) may also be used.

Meanwhile, the lower region of the insulating plate 211 corresponding to the region where the heater electrode 335 and the sensing electrode 340 are disposed is etched and removed.

At this time, in etching the insulating plate 311, a dry etching process using a photoresist pattern may be used.

The first silicon oxide thin film 312 , the silicon nitride thin film 313 , and the second silicon oxide thin film 314 form a membrane and are sequentially stacked on the insulating plate 311 .

The membrane serves as an etch stop layer when the lower region of the insulating plate 311 is etched, and also serves as a support for the sensing electrode 340 or the heater electrode 335 . In addition, the membrane is to prevent deformation of the element due to heat generation when the heater electrode 335 is heated, and is formed of a silicon oxide thin film or a silicon nitride thin film, or has a laminated structure of a silicon oxide thin film and a silicon nitride thin film. can be formed

The membrane may be formed using methods such as thermal oxidation, sputtering, or chemical vapor deposition.

An electrode pad 320 is disposed on the second silicon oxide thin film 314 .

As described above, the electrode pad 220 may include a plurality of electrode pads. At this time, the electrode pad 320 disposed on the second silicon oxide thin film 314 is an electrode pad connected to the heater electrode 335 .

In addition, heater electrodes 335 are respectively disposed on the second silicon oxide thin film 314 .

A protective layer 315 is disposed on the second silicon oxide thin film 314 to cover the heater electrode 335 .

A sensing electrode 340 and an electrode pad 320 electrically connected to the sensing electrode 340 are disposed on the protective layer 315 .

A sensing object 335 is disposed on the protective layer 315 while covering the sensing electrode 340 .

In addition, a gap 360 is formed around the sensing object 345 in the substrate 310 and the protective layer 315 to surround the sensing object 345 .

Preferably, the lower region of the insulating plate 311 is removed by etching as described above, and thus the void 360 is formed by the passivation layer 315, the first silicon oxide thin film 312, and silicon nitride. It is formed to pass through the thin film 313 and the second silicon oxide thin film 314 and is connected to the lower region of the removed insulating plate 311 .

The air gap 360 may include a plurality of air gaps as described above, and each of the plurality of air gaps may be composed of a plurality of unit air gaps spaced apart at predetermined intervals.

The sensing module 300 as described above is a sensing module having a two-layer structure. Preferably, the heater electrode 335 is disposed on the first layer and the sensing electrode 340 is disposed on the second layer above the first layer. have a structure

As described above, the membrane structure can serve as a support for the substrate, and in the 2-layer structure as shown in FIG.

20 is a diagram showing a cross-sectional structure of a sensing module according to a fourth embodiment of the present invention.

20 has a general bridge structure and is characterized in that an air gap 460 is formed in the substrate.

Referring to FIG. 20 , the sensing module 400 includes a substrate 410, an electrode pad 420, a heater electrode 435, a sensing electrode 440, a protective layer 415, a bridge part 470, and a sensing object ( 445).

The substrate 410 has a structure in which an insulating plate 411 , a first silicon oxide thin film 412 , a silicon nitride thin film 413 , and a second silicon oxide thin film 413 are sequentially stacked.

The insulating plate 411 may use a silicon substrate used in a general semiconductor process, and aluminum oxide (Al2O3), magnesium oxide (MgO), quartz, gallium-nitrogen (GaN) or gallium-arsenic (GaAs) may be used. A doped substrate may also be used.

Meanwhile, the upper region of the insulating plate 411 corresponding to the region where the heater electrode 435 and the sensing electrode 440 are disposed is etched and removed.

At this time, in etching the insulating plate 411, a dry etching process using a photoresist pattern may be used.

The first silicon oxide thin film 412 , the silicon nitride thin film 413 , and the second silicon oxide thin film 414 form a membrane and are sequentially stacked on the insulating plate 411 .

The membrane serves as a support for the sensing electrode 440 or the heater electrode 435. In addition, the membrane is to prevent deformation of the element due to heat generation when the heater electrode 435 is heated, and is formed of a silicon oxide thin film or a silicon nitride thin film, or has a laminated structure of a silicon oxide thin film and a silicon nitride thin film. can be formed

An electrode pad 420 is disposed on the second silicon oxide thin film 414 . As described above, the electrode pad 420 may be composed of a plurality of electrode pads, preferably four electrode pads.

In addition, a heater electrode 435 and a sensing electrode 440 are respectively disposed on the second silicon oxide thin film 414 .

A protective layer 415 is formed on the second silicon oxide thin film 414 to cover the heater electrode 435 .

A sensing object 445 is disposed on the second silicon oxide thin film 414 while covering the protective layer 415 and the sensing electrode 440 .

In addition, an air gap 460 disposed around the sensing object 445 is formed in the substrate 410 while surrounding the sensing object 445 .

Preferably, the upper region of the insulating plate 411 is removed by etching as described above, and thus the gap 460 is formed by the first silicon oxide thin film 412, the silicon nitride thin film 413 and the second silicon nitride thin film 413. It is formed to penetrate the silicon oxide thin film 414 and is connected to the upper region of the removed insulating plate 411 .

The air gap 460 may include a plurality of air gaps as described above, and each of the plurality of air gaps may be composed of a plurality of unit air gaps spaced apart at predetermined intervals.

In addition, a bridge part 470 including a bridge for floating an area where the sensing object 445 is formed is formed on the substrate 410 . Accordingly, the air gap 460 is preferably disposed between the bridge part 470 and the sensing object 445 .

The sensing module 400 as described above is a sensing module having a bridge structure, and an air gap is formed in the substrate as described above so that the temperature in the sensing region can be maintained constant.

21 is a plan view of a sensing module according to a fifth embodiment of the present invention.

In FIG. 16A , a plurality of first electrode pads 120 are disposed on the upper surface of the substrate 110, and it can be confirmed that the plurality of first electrode pads 120 are formed in four pieces.

Referring to FIG. 21, a plurality of first electrode pads 520 are disposed on a substrate 510, and unlike FIG. 2A, the plurality of first electrode pads 520 include first upper electrode pads 521, A second upper electrode pad 522 and a third upper electrode pad 523 are included.

In addition, the first upper electrode pad 521 is commonly connected to the first sensing electrode 541 and the heater electrode 535, and the second upper electrode pad 522 is connected to the second sensing electrode 542, The third upper electrode pad 523 is connected to the heater electrode 535 . That is, in FIG. 16A, the sensing electrode 140 and the heater electrode 135 are individually connected to the electrode pad, but according to FIG. 21, one electrode pad is used as a common electrode pad for the sensing electrode and the heater electrode.

Accordingly, according to FIG. 21 , the number of electrode pads disposed on the substrate may be reduced from 4 electrode pads to 3 electrode pads.

22 is a diagram showing impact characteristics of a sensing module according to an embodiment of the present invention.

Referring to (a) of FIG. 22, in the sensing module, only one air gap 160 is formed around the intermediate layer 115, and referring to (b) of FIG. 22, a plurality of air gaps around the intermediate layer 115. They are spaced apart from each other by a predetermined interval.

Referring to the structure shown in (a) of FIG. 22 , a generally brittle ceramic substrate may be damaged due to internal cracks caused by external impact. At this time, as a crack occurs in a portion of the first electrode pad 120, the crack propagates to the entire upper region of the substrate 110, and thus the possibility of damage to the ceramic substrate increases.

However, looking at the structure of the sensing module of the present invention according to (b) of FIG. 22, the substrate 110 has a bridge structure in which a plurality of air gaps spaced apart from each other are formed, so that the energy according to the impact generated from the outside can cancel out.

In other words, in the structure of the sensing module according to the present invention, although the brittleness of the ceramic substrate is the same, the line width of the ceramic substrate between the plurality of pores (substrate area disposed between the plurality of pores) is relatively small compared to the length, so that the external impact The impact energy generated and propagated is dissipated/dissipated by the up/down/left/right movement of the beam, such as a single beam or a double beam (both fixed beams), and cracks propagate internally accordingly. It is possible to reduce the probability of breakage of the ceramic substrate.

23 is a graph showing temperature change of a sensing module according to an embodiment of the present invention.

23 (a) shows a change in measured temperature over time of a sensing module according to the prior art, and (b) shows a change in measured temperature over time of a sensing module according to the present invention.

Conventionally, since the above-described air gap 160 is not formed in the substrate 110, the temperature of the sensing area is greatly influenced by the external temperature, and accordingly, the change in the measured temperature over time is large. Therefore, in the prior art, in order to keep the temperature of the sensing unit on the substrate constant, power had to be continuously supplied to the heater electrode, resulting in increased power consumption.

However, according to the present invention, since the air gap 160 is formed in the substrate 110, the temperature of the sensing region can be maintained constant without being affected by the external temperature, and thus, compared to the prior art It can be seen that the amount of change in the measured temperature with time is minute. Therefore, in the present invention, the temperature of the substrate can be kept constant by the air gap 160, and thus power supplied to the heater electrode can be reduced, thereby dramatically reducing power consumption.

24 to 27 are views showing the shape of the air gap 160 of the sensing module 100 according to an embodiment of the present invention.

24 to 26 show the shape of the vertical cross section of the void 160, and FIG. 27 shows the shape of the horizontal cross section of the void 160.

The shape of the void 160 may be determined by a method of forming the void 160 . The void 160 may be formed by an etching process, or alternatively, it may be formed by a mechanical process such as sand blasting or laser processing.

Referring to FIG. 24 , the gap 160 may be formed by wet etching.

Therefore, as shown in (a) of FIG. 24, the void 160 may have a shape in which the width gradually increases from the top to the bottom as the lower portion of the substrate 110 is overetched. As shown in (b) of (b), as the top of the substrate 110 is overetched, the width may gradually increase from the bottom to the top.

Referring to FIG. 25 , the gap 160 may be formed by dry etching.

Accordingly, the void 160 may have a shape in which the width gradually decreases from top to bottom according to general dry etching, as shown in (a) of FIG. 25, and as shown in (b), from top to bottom. It may have a shape in which the width gradually increases.

Also, deep reactive-ion etching (DRIE) may be used as the dry etching, and thus the void 160 may have a curved shape.

That is, the void 160 may have a concave curved shape toward the inside of the substrate, as shown in (c) of FIG. 25, or a convex curved shape toward the outside of the substrate, as shown in (d), As shown in , (e), it may have a curved shape in which the width gradually decreases toward the bottom while being concave in the inward direction.

Also, referring to FIG. 26 , the air gap 160 may be formed by machining.

That is, as shown in (a) of FIG. 26 , the void 160 may be formed by sand blasting, and thus may have a shape having an irregular width change from top to bottom. In addition, as shown in (b) of FIG. 26, the void 160 may be formed by laser processing, and thus may have a shape having an irregular width change from top to bottom.

Meanwhile, the void 160 may have various horizontal cross sections.

That is, as shown in (a) of FIG. 27 , the air gap 160 may include circular donut-shaped unit air spaces surrounding the sensing object 145 .

In addition, as shown in (b) of FIG. 27, the air gap 160 surrounds the sensing object 145 and may include a plurality of unit air gaps having a circular inner shape and a quadrangular outer shape. .

In addition, as shown in (c) of FIG. 27 , the air gap 160 may include a plurality of unit pores having a triangular shape surrounding the sensing object 145 .

In addition, as shown in (d) of FIG. 27 , the air gap 160 surrounds the sensing object 145 and may include a plurality of unit air gaps having a straight rectangular shape.

28 is a view showing a cross-sectional structure of a sensing module according to a sixth embodiment of the present invention.

Referring to FIG. 28 , the sensing module 600 includes a substrate 610, an intermediate layer 615, a first electrode pad 620, a second electrode pad 625, a metal layer 630, a heater electrode 635, a sensing It includes an electrode 640, a sensing object 645, a protective layer 650, and a connection part 655.

Here, the structure of other parts of the sensing module 600 except for the air gap is the same as that of the sensing module 100 described in FIGS. 15 to 17, so a description thereof will be omitted.

Meanwhile, a gap 660 is formed in the substrate 610 . The air gap 660 is disposed surrounding the sensing region.

Preferably, the air gap 660 is formed in the protective layer 650 and the substrate 610 , and at this time, it is formed while penetrating the protective layer 65 and not penetrating the substrate 610 .

That is, the void 160 in the first embodiment of the present invention has a hole shape, but the void 660 in the sixth embodiment has a non-penetrating groove shape.

29 is a cross-sectional view showing a cross-sectional structure of a sensing module according to a seventh embodiment of the present invention.

Referring to FIG. 29 , the sensing module 700 includes a substrate 710, an intermediate layer 715, a first electrode pad 720, a second electrode pad 725, a metal layer 730, a heater electrode 735, a sensing It includes an electrode 740, a sensing object 745, a protective layer 750, and a connection part 755.

Here, since the sensing module 700 has the same structure as the sensing module 100 described with reference to FIGS. 15 to 17, the structure of other parts except for the air gap is omitted.

Meanwhile, an air gap is formed in the substrate 710, and the air gap forms a thermal blocking portion 760 filled with a heat insulating material for blocking heat.

In this case, the heat blocking part 760 may have a penetrating shape as shown in FIGS. 15 to 17 , and may have a non-penetrating shape as shown in FIG. 28 .

In addition, the heat insulating material filled in the voids may include internal vacuum-type ceramic particles and organic materials. At this time, since the heat does not pass through the vacuum portion of the hollow part of the ceramic particle and must pass through the particle interface and the particle cover portion, the heat conduction coefficient is relatively low. blocking effect).

Features, structures, effects, etc. described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, and effects illustrated in each embodiment can be combined or modified with respect to other embodiments by those skilled in the art in the field to which the embodiments belong. Therefore, contents related to these combinations and modifications should be construed as being included in the scope of the embodiments.

Although the above has been described centering on the embodiment, this is only an example and does not limit the embodiment, and those skilled in the art in the field to which the embodiment belongs may find various things not exemplified above to the extent that they do not deviate from the essential characteristics of the embodiment. It will be appreciated that variations and applications of branches are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set forth in the appended claims.

10, 20: printed circuit board
11, 21: insulating substrate
12, 22: electrode
13, 23: pad
14, 24: adhesive member
30: chip

Claims (22)

insulating substrate;
a pad disposed on the insulating substrate and having an accommodating portion; and
An adhesive member disposed within the receiving portion of the pad,
The receiving portion is a recess concave from the upper surface of the pad toward the lower surface of the pad,
The bottom surface of the receiving part is located higher than the upper surface of the insulating substrate and the lower surface of the pad,
The adhesive member does not contact the insulating substrate,
printed circuit board. According to claim 1,
The pad is disposed at a position corresponding to the chip mounting area.
printed circuit board. According to claim 1,
Disposed on the insulating substrate and further comprising an electrode spaced apart from the pad at a predetermined interval,
The adhesive member,
Containing any one of a conductive adhesive and a non-conductive adhesive
printed circuit board. According to claim 3,
Further comprising a connection pattern electrically connecting between the electrode and the pad,
The adhesive member is
with conductive adhesive
printed circuit board. According to claim 4,
The electrode, the pad, and the connection pattern,
integrally formed
printed circuit board. According to claim 2,
the pad,
A plurality of plates are disposed on the insulating substrate to correspond to the corner region of the chip mounting region.
printed circuit board. printed circuit board; and
Including a chip attached to the printed circuit board,
The printed circuit board,
an insulating substrate;
a first electrode disposed on the insulating substrate;
a first pad disposed on the insulating substrate and having an accommodating portion;
An adhesive member disposed in the accommodating portion of the first pad,
The first pad,
disposed in the mounting area of the chip;
The receiving portion is a recess concave from the upper surface of the pad toward the lower surface of the pad,
The bottom surface of the receiving part is located higher than the upper surface of the insulating substrate and the lower surface of the pad,
The adhesive member does not come into contact with the insulating substrate.
package substrate. According to claim 7,
The first electrode is
It is spaced apart from the first pad at a predetermined interval,
The adhesive member,
Containing any one of a conductive adhesive and a non-conductive adhesive
package substrate. According to claim 8,
the chip,
It is attached on the printed circuit board so that the second electrode faces upward,
Further comprising a connecting member electrically connecting the second electrode and the first electrode
package substrate. According to claim 7,
A connection pattern electrically connected between the first electrode and the first pad and integrally formed with the first electrode and the pad,
The adhesive member,
with conductive adhesive
package substrate. According to claim 10,
the chip,
It is attached on the printed circuit board so that the second electrode faces downward,
The second electrode of the chip,
Electrically connected to the first pad through the adhesive member
package substrate. According to claim 7,
The first pad,
A plurality of pieces are disposed on the insulating substrate to correspond to the corner region of the chip.
package substrate. According to claim 7,
the chip,
Including a gas sensing module
package substrate. According to claim 13,
The gas sensing module,
a first substrate;
a sensing unit disposed on the first substrate and including a sensing electrode, a heating electrode, and a sensing object;
And an upper electrode pad disposed on the first substrate electrically connected to the sensing unit,
The first substrate,
Formed around the sensing unit and including a plurality of air gaps spaced apart from each other at predetermined intervals
package substrate. According to claim 14,
Further comprising a heat insulating part disposed between the first substrate and the sensing part
package substrate. 15. The method of claim 14,
The plurality of voids,
A first air gap formed adjacent to the periphery of the sensing unit;
And a second void formed adjacent to the periphery of the first void,
The first void and the second void are
Composed of a plurality of unit pores spaced apart from each other by a predetermined distance
package substrate. According to claim 14,
the sensor,
first and second sensing electrodes electrically connected to the upper electrode pad;
A heater electrode electrically connected to the upper electrode pad;
Including a sensing material covering the first and second sensing electrodes
package substrate. According to claim 17,
It is disposed on the first substrate and further includes a protective layer covering an area other than the sensing object,
The first and second gaps pass through the protective layer.
package substrate. According to claim 18,
Further comprising a thermal blocking portion filled with a heat insulating material in the plurality of pores formed in the first substrate
package substrate. According to claim 14,
The gas sensing module,
a lower electrode pad disposed under the first substrate;
Disposed in the first substrate, further comprising a connection portion electrically connecting the upper electrode pad and the lower electrode pad.
package substrate. 21. The method of claim 20,
The connection part is disposed on the outside of the first substrate, and the side surface is exposed to the outside.
package substrate. 15. The method of claim 14,
The first substrate,
A membrane including at least one of a silicon oxide film and a silicon nitride film,
The plurality of voids,
penetrating the membrane
package substrate.

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