JP7378850B2 - 窒化物系多波長発光ダイオードシステム及びその制御方法 - Google Patents
窒化物系多波長発光ダイオードシステム及びその制御方法 Download PDFInfo
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- JP7378850B2 JP7378850B2 JP2022130634A JP2022130634A JP7378850B2 JP 7378850 B2 JP7378850 B2 JP 7378850B2 JP 2022130634 A JP2022130634 A JP 2022130634A JP 2022130634 A JP2022130634 A JP 2022130634A JP 7378850 B2 JP7378850 B2 JP 7378850B2
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- 150000004767 nitrides Chemical class 0.000 title claims description 36
- 238000000034 method Methods 0.000 title claims description 12
- 238000002347 injection Methods 0.000 claims description 82
- 239000007924 injection Substances 0.000 claims description 82
- 239000004065 semiconductor Substances 0.000 claims description 32
- 229910052738 indium Inorganic materials 0.000 claims description 17
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 14
- 239000013078 crystal Substances 0.000 claims description 6
- 230000007423 decrease Effects 0.000 claims description 6
- 239000000969 carrier Substances 0.000 description 16
- 239000000758 substrate Substances 0.000 description 10
- 238000005401 electroluminescence Methods 0.000 description 8
- 238000001228 spectrum Methods 0.000 description 5
- 239000003086 colorant Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000295 emission spectrum Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004904 shortening Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 1
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 230000004807 localization Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/32—Pulse-control circuits
- H05B45/325—Pulse-width modulation [PWM]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/20—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the material in which the electroluminescent material is embedded
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/20—Controlling the colour of the light
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
- H05B45/30—Driver circuits
- H05B45/32—Pulse-control circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
Description
実施例1では、注入電流のデューティ比の調節によって互いに異なる波長の光を放出することを実験した。
実施例2では、本発明の一実施例による発光ダイオードに注入電流の強度を1mA、及びパルス幅を0.1μsから1μsに変更し、デューティ比を1%から100%まで増加させた場合について説明する。
実施例3では、注入電流のデューティ比だけでなく、パルス幅の調節によっても発光ダイオードから放出される光の波長変化が可能であることを実験した。
実施例4では、実施例1、実施例2、実施例3で実験したように、互いに異なるデューティ比、パルス幅、電流強度の条件を有する注入電流を発光ダイオードに印加した場合、発光する色を観測した。
100:窒化物系多波長発光ダイオード
110:第1半導体層
120:第2半導体層
130:活性層
200:制御部
Claims (8)
- n型にドーピングされた第1半導体層、p型にドーピングされた第2半導体層、前記第1半導体層と前記第2半導体層との間に配置され、InGaNに基づく量子井戸構造の活性層であって、結晶成長面による位置毎のインジウム(In)の組成に差を有する前記活性層を含む窒化物系多波長発光ダイオード;及び
前記活性層内のインジウムの組成の差により形成された互いに異なる大きさのエネルギーのバンドギャップを充填しながら波長の変化を発生させるように、前記窒化物系多波長発光ダイオードに注入電流の強度を同一に制御しながら前記注入電流のパルス幅及びデューティ比のうち少なくとも一方を調節して印加する制御部を含む、発光ダイオードシステム。 - 前記窒化物系多波長発光ダイオードが放出する光の波長は、前記注入電流のパルス幅が増加するにつれ低くなることを特徴とする、請求項1に記載の発光ダイオードシステム。
- 前記窒化物系多波長発光ダイオードが放出する光の波長は、前記注入電流のデューティ比が増加するにつれ低くなることを特徴とする、請求項1に記載の発光ダイオードシステム。
- 前記制御部は、前記窒化物系多波長発光ダイオードが2以上の波長の光を放出するように互いに異なるパルス幅及びデューティ比を有する2以上の注入電流を印加する、請求項1に記載の発光ダイオードシステム。
- n型にドーピングされた第1半導体層、p型にドーピングされた第2半導体層、前記第1半導体層と前記第2半導体層との間に配置され、InGaNに基づく量子井戸構造の活性層であって、結晶成長面による位置毎のインジウム(In)の組成に差を有する前記活性層を含む窒化物系多波長発光ダイオードに前記活性層内のインジウムの組成の差により形成された互いに異なる大きさのエネルギーのバンドギャップを充填しながら波長の変化を発生させるように、注入電流の強度を同一に制御しながら前記注入電流のパルス幅及びデューティ比のうち少なくとも一方を調節して印加するステップを含む、発光ダイオードシステムの制御方法。
- 前記窒化物系多波長発光ダイオードが放出する光の波長は、前記注入電流のパルス幅が増加するにつれ低くなることを特徴とする、請求項5に記載の発光ダイオードシステムの制御方法。
- 前記窒化物系多波長発光ダイオードが放出する光の波長は、前記注入電流のデューティ比が増加するにつれ低くなることを特徴とする、請求項5に記載の発光ダイオードシステムの制御方法。
- 前記印加するステップは、
前記窒化物系多波長発光ダイオードが2以上の波長の光を放出するように互いに異なるパルス幅及びデューティ比を有する2以上の注入電流を印加するステップを含む、請求項5に記載の発光ダイオードシステムの制御方法。
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KR1020210190381A KR20230100464A (ko) | 2021-12-28 | 2021-12-28 | 질화물계 다파장 발광 다이오드 시스템 및 그 제어방법 |
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Citations (1)
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JP2013175679A (ja) | 2012-02-27 | 2013-09-05 | Mitsubishi Chemicals Corp | 発光装置 |
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JPH05198844A (ja) * | 1992-01-23 | 1993-08-06 | Eastman Kodak Japan Kk | 発光装置 |
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JP2013175679A (ja) | 2012-02-27 | 2013-09-05 | Mitsubishi Chemicals Corp | 発光装置 |
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KR20230100464A (ko) | 2023-07-05 |
US20230209676A1 (en) | 2023-06-29 |
JP2023098574A (ja) | 2023-07-10 |
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