JP7374663B2 - optical sensor - Google Patents

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JP7374663B2
JP7374663B2 JP2019156386A JP2019156386A JP7374663B2 JP 7374663 B2 JP7374663 B2 JP 7374663B2 JP 2019156386 A JP2019156386 A JP 2019156386A JP 2019156386 A JP2019156386 A JP 2019156386A JP 7374663 B2 JP7374663 B2 JP 7374663B2
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light
emitting element
light emitting
receiving element
light receiving
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JP2021034674A (en
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俊輔 田中
哲一 杉山
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Canon Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • G01V8/12Detecting, e.g. by using light barriers using one transmitter and one receiver
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02Details
    • H01L31/0232Optical elements or arrangements associated with the device
    • H01L31/02325Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device

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  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Geophysics And Detection Of Objects (AREA)

Description

本発明は、発光素子と受光素子を用いて検出物の検出を行う光学式センサに関する。 The present invention relates to an optical sensor that detects an object using a light emitting element and a light receiving element.

従来の光学式センサとしての透過型のフォトインタラプタは、LEDなどの発光素子とフォトトランジスタなどの受光素子を用いて、前記発光素子と前記受光素子の間を検出物が通過する時に光を遮ることを検知し、検出物の検出を行う。 A transmission-type photointerrupter as a conventional optical sensor uses a light-emitting element such as an LED and a light-receiving element such as a phototransistor to block light when an object to be detected passes between the light-emitting element and the light-receiving element. Detects the detected object.

特許文献1に開示された透過型のフォトインタラプタは、基板の同一面上に面実装タイプの発光素子と受光素子を実装し、それらの素子が実装された基板に、内部に反射面を有する筐体を組み付けたものである。そして、発光素子から垂直方向に出射された光は、筐体の反射面で2回反射され、垂直方向から受光素子に入射される構成となっている。 The transmissive photointerrupter disclosed in Patent Document 1 has a surface-mounted light emitting element and a light receiving element mounted on the same surface of a substrate, and a casing having a reflective surface inside the substrate on which these elements are mounted. The body is assembled. The light emitted from the light emitting element in the vertical direction is reflected twice by the reflective surface of the housing, and then enters the light receiving element from the vertical direction.

このような光学式センサにおいて、発光素子と受光素子を実装した基板に、後から組み付ける筐体を、前述の内部に反射面を設けた筐体から、透明樹脂でできたライトガイドに置き換える構成も実現できる。この場合、発光素子から垂直方向に出射された光は、ライトガイドに導かれ内面反射によって、垂直方向から受光素子に入射される。 In such optical sensors, the casing that is later assembled onto the board on which the light-emitting element and light-receiving element are mounted can be replaced with a light guide made of transparent resin instead of the casing with a reflective surface provided inside. realizable. In this case, the light emitted from the light emitting element in the vertical direction is guided by the light guide and enters the light receiving element from the vertical direction through internal reflection.

特開平11-274550号公報Japanese Patent Application Publication No. 11-274550

しかしながら、発光素子と受光素子を実装した基板に、内部に反射面を設けた筐体を後から組み付ける場合、発光素子からの光を受光素子に導くために、反射面を適切な位置に位置決めする必要がある。そのため、発光素子と受光素子の間において、基板と筐体との間に隙間ができてしまう。この場合、発光素子からの光が、反射面で反射されて受光素子に間接的に入射される以外に、前述の隙間から受光素子へ直接入射されてしまう。すなわち、受光素子が、前述の隙間から直接入射される光の影響を受けてしまい、検出物の有無を正しく検出できないという課題があった。 However, when a casing with a reflective surface inside is later assembled to a board on which a light emitting element and a light receiving element are mounted, the reflective surface must be positioned at an appropriate position in order to guide the light from the light emitting element to the light receiving element. There is a need. Therefore, a gap is created between the substrate and the casing between the light emitting element and the light receiving element. In this case, the light from the light-emitting element is not only reflected by the reflective surface and indirectly incident on the light-receiving element, but also directly enters the light-receiving element through the above-mentioned gap. That is, the light-receiving element is affected by the light that is directly incident through the above-mentioned gap, and there is a problem that the presence or absence of an object cannot be accurately detected.

また、後付の筐体を透明樹脂でできたライトガイドに置き換えた場合は、ライトガイドは透明樹脂であるため、前述の隙間の有無に関係なく、発光素子からの光が受光素子へ直接入射されてしまい、検出物の有無を正しく検出できないという課題があった。 In addition, if the retrofitted housing is replaced with a light guide made of transparent resin, the light guide is made of transparent resin, so the light from the light emitting element will directly enter the light receiving element regardless of the presence or absence of the gap mentioned above. Therefore, there was a problem that the presence or absence of an object could not be detected correctly.

そこで、本発明の目的は、発光素子から受光素子へ直接入射される光の影響を受けず、検出物の検出を正しく行うことが可能であり、安価で簡易な構成の光学式センサを提供することである。 SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical sensor that is inexpensive and has a simple configuration, which is capable of correctly detecting an object without being affected by light directly incident from a light emitting element to a light receiving element. That's true.

上記目的を達成するため本発明の代表的な構成は、光を出射する発光素子と、検出物が通過する空間を介して前記発光素子からの光を受光する受光素子と、複数の電子回路素子と、を備え、前記発光素子からの光を前記空間にて検出物が遮ることにより前記検出物の検出を行う光学式センサであって、前記発光素子、複数の前記電子回路素子、前記受光素子は、基板の同一面上に実装され、複数の前記電子回路素子は、前記基板の実装面において、前記発光素子と前記受光素子の間に配置されており、前記発光素子の発光源の中心と前記受光素子の受光領域の中心を繋ぐ線に対して交差する方向において、複数の前記電子回路素子はそれぞれ異なる位置に配置されていることを特徴とする。 A typical configuration of the present invention for achieving the above object includes a light emitting element that emits light, a light receiving element that receives light from the light emitting element through a space through which a detection object passes, and a plurality of electronic circuits. An optical sensor that detects the object by blocking light from the light emitting element in the space, the light emitting element, the plurality of electronic circuit elements, and the light receiving element. The elements are mounted on the same surface of the substrate, and the plurality of electronic circuit elements are arranged between the light emitting element and the light receiving element on the mounting surface of the substrate , and the electronic circuit elements are arranged at the center of the light emission source of the light emitting element. The plurality of electronic circuit elements are arranged at different positions in a direction intersecting a line connecting the centers of the light-receiving areas of the light-receiving elements.

本発明によれば、発光素子から受光素子へ直接入射される光の影響を受けず、検出物の検出を正しく行うことができ、安価で簡易な構成の光学式センサを提供することができる。 According to the present invention, it is possible to accurately detect an object without being affected by light directly incident from a light emitting element to a light receiving element, and it is possible to provide an optical sensor that is inexpensive and has a simple configuration.

(a)は実施例1における光学式センサの斜視図、(b)は実施例1における光学式センサの上面図(a) is a perspective view of the optical sensor in Example 1, (b) is a top view of the optical sensor in Example 1 (a)は比較例における光学式センサの断面図、(b)は実施例1における光学式センサの断面図(a) is a cross-sectional view of an optical sensor in a comparative example, (b) is a cross-sectional view of an optical sensor in Example 1 実施例1における光学式センサの等価回路を示す回路図Circuit diagram showing an equivalent circuit of the optical sensor in Example 1 実施例1における光学式センサの出力特性を示す図A diagram showing the output characteristics of the optical sensor in Example 1 (a)は実施例2における光学式センサの斜視図、(b)は実施例2における光学式センサの上面図(a) is a perspective view of the optical sensor in Example 2, (b) is a top view of the optical sensor in Example 2 実施例2における光学式センサの部品レイアウトを示す図A diagram showing a component layout of an optical sensor in Example 2 実施例3における光学式センサの断面図Cross-sectional view of the optical sensor in Example 3

以下、図面を参照して、本発明の好適な実施の形態を例示的に詳しく説明する。ただし、以下の実施形態に記載されている構成部品の寸法、材質、形状、それらの相対配置などは、本発明が適用される装置の構成や各種条件により適宜変更されるべきものであり、本発明の範囲をそれらのみに限定する趣旨のものではない。 Hereinafter, preferred embodiments of the present invention will be described in detail by way of example with reference to the drawings. However, the dimensions, materials, shapes, and relative arrangements of the components described in the following embodiments should be changed as appropriate depending on the configuration of the device to which the present invention is applied and various conditions, and the It is not intended to limit the scope of the invention only to these.

〔実施例1〕
本発明の実施例1に係る光学式センサについて図1を用いて説明する。図1(a)は実施例1における光学式センサの斜視図、図1(b)は実施例1における光学式センサの上面図である。
[Example 1]
An optical sensor according to Example 1 of the present invention will be explained using FIG. 1. FIG. 1(a) is a perspective view of the optical sensor in Example 1, and FIG. 1(b) is a top view of the optical sensor in Example 1.

実施例1に係る光学式センサ100は、光を出射する発光素子101と、検出物が通過する空間110を介して前記発光素子101からの光を受光する受光素子103と、電子回路素子102とを備えている。光学式センサ100は、前記発光素子101からの光を前記空間110にて検出物が遮ることにより受光素子103が受光する光量が変化して前記検出物の検出を行う。 The optical sensor 100 according to the first embodiment includes a light emitting element 101 that emits light, a light receiving element 103 that receives light from the light emitting element 101 through a space 110 through which an object to be detected passes, and an electronic circuit element 102. It is equipped with The optical sensor 100 detects the object by changing the amount of light received by the light receiving element 103 when the object blocks the light from the light emitting element 101 in the space 110.

発光素子101は、光を出射する発光源101aを有している。ここでは発光素子101として、面実装タイプのLEDを用いている。発光素子101は、基板104に対して垂直方向に向けて光を出射する光軸垂直型のLEDである。また受光素子103は、光を受光する受光領域103aを有している。ここでは受光素子103として、フォトトランジスタ(Ptr)を用いている。受光素子103は、基板104に対して垂直方向の光を受光する光軸垂直型のフォトトランジスタである。 The light emitting element 101 has a light emitting source 101a that emits light. Here, a surface mount type LED is used as the light emitting element 101. The light emitting element 101 is an optical axis vertical type LED that emits light in a direction perpendicular to the substrate 104. Further, the light receiving element 103 has a light receiving area 103a that receives light. Here, a phototransistor (Ptr) is used as the light receiving element 103. The light receiving element 103 is an optical-axis vertical phototransistor that receives light in a direction perpendicular to the substrate 104 .

基板104には、透過型のフォトインタラプタをなす発光素子101と受光素子103以外にも、電子回路素子102や、CPU121やメモリ122が同一面上に実装される。電子回路素子102は、基板104の実装面において、発光素子101と受光素子103の間に配置されている。光学式センサであるフォトインタラプタを構成する発光素子101と受光素子103は、前述の電子回路素子102などの他の部品と同時に基板104にリフロー実装される。すなわち、電子回路素子102は、リフロー実装可能な素子(部品)であり、基板104の所定位置に素子を実装する自動マウント装置(不図示)によって、発光素子101と受光素子103とともに基板104の同一面上に実装される。 On the substrate 104, in addition to the light emitting element 101 and the light receiving element 103 forming a transmissive photointerrupter, an electronic circuit element 102, a CPU 121, and a memory 122 are mounted on the same surface. The electronic circuit element 102 is arranged between the light emitting element 101 and the light receiving element 103 on the mounting surface of the substrate 104. A light emitting element 101 and a light receiving element 103 that constitute a photointerrupter, which is an optical sensor, are reflow mounted on a substrate 104 at the same time as other components such as the electronic circuit element 102 described above. That is, the electronic circuit element 102 is an element (component) that can be reflow mounted, and is mounted on the same substrate 104 along with the light emitting element 101 and the light receiving element 103 by an automatic mounting device (not shown) that mounts the element at a predetermined position on the substrate 104. mounted on the surface.

電子回路素子102は、基板104の実装面において、発光素子101と受光素子103の間に配置されている。電子回路素子102は、発光素子101の発光源101aの中心と受光素子103の受光領域103aの中心を繋ぐ線DL上に配置されている。ここでは、電子回路素子102は、基板104に実装された発光素子101及び受光素子103とは電子的に接続されていないチップ抵抗を用いている。さらに電子回路素子102は、発光素子101に用いるLEDと同等サイズのチップ抵抗を用いている。 The electronic circuit element 102 is arranged between the light emitting element 101 and the light receiving element 103 on the mounting surface of the substrate 104. The electronic circuit element 102 is arranged on a line DL connecting the center of the light emitting source 101a of the light emitting element 101 and the center of the light receiving area 103a of the light receiving element 103. Here, the electronic circuit element 102 uses a chip resistor that is not electronically connected to the light emitting element 101 and the light receiving element 103 mounted on the substrate 104. Further, the electronic circuit element 102 uses a chip resistor of the same size as the LED used in the light emitting element 101.

光学式センサ100は、導光部材としてのライトガイド105を備えている。ライトガイド105は、発光素子101、電子回路素子102、受光素子103がリフロー実装された基板104に対して、後付けで取り付けられる。ライトガイド105は、透明のアクリル樹脂で作られており、斜面部の内面反射により発光素子101から垂直方向に出射された光を受光素子103の垂直方向へと導く。具体的には、ライトガイド105は、第1の導光部105aと、第2の導光部105bと、第1の導光部105aと第2の導光部105bとを連結する連結部105cとが一体形成されたものである。第1の導光部105aは、空間110を通過する方向へ発光素子101から出射された光を導く。第2の導光部105bは、空間110を介して第1の導光部105aに対向して設けられ、空間110を通過した光を受光素子103に導く。連結部105cは基板104の実装面側が空洞になっている。電子回路素子102は、基板104の実装面において、発光素子101と受光素子103の間であって、基板104のライトガイド105の連結部105cに対応する位置に配置されている。 The optical sensor 100 includes a light guide 105 as a light guiding member. The light guide 105 is attached afterward to the substrate 104 on which the light emitting element 101, the electronic circuit element 102, and the light receiving element 103 are reflow mounted. The light guide 105 is made of transparent acrylic resin, and guides the light vertically emitted from the light emitting element 101 by internal reflection of the sloped part to the vertical direction of the light receiving element 103 . Specifically, the light guide 105 includes a first light guide section 105a, a second light guide section 105b, and a connecting section 105c that connects the first light guide section 105a and the second light guide section 105b. are integrally formed. The first light guiding section 105a guides the light emitted from the light emitting element 101 in a direction passing through the space 110. The second light guide section 105b is provided to face the first light guide section 105a via the space 110, and guides the light that has passed through the space 110 to the light receiving element 103. The connecting portion 105c is hollow on the mounting surface side of the substrate 104. The electronic circuit element 102 is disposed on the mounting surface of the substrate 104 between the light emitting element 101 and the light receiving element 103 at a position corresponding to the connecting portion 105c of the light guide 105 of the substrate 104.

空間110は、対向して設けられた第1の導光部105aと第2の導光部105bとの間にあり、発光素子101から垂直方向に出射された光が受光素子103へ導かれる光路上にある。この空間110に検出物があると光路が遮られるため、発光素子101から垂直方向に出射された光が受光素子103に届かなくなる。これにより、受光素子103が受光する光量が変化して、検出物が検出される。 The space 110 is located between the first light guide section 105a and the second light guide section 105b, which are provided facing each other, and allows light emitted from the light emitting element 101 in the vertical direction to be guided to the light receiving element 103. It's on the street. If there is an object to be detected in this space 110, the optical path is blocked, so that the light emitted from the light emitting element 101 in the vertical direction does not reach the light receiving element 103. As a result, the amount of light received by the light receiving element 103 changes, and the object is detected.

図2は光学式センサの断面図を示す。図2(a)は比較例の光学式センサの断面図であり、発光素子と受光素子の間に電子回路素子が無い構成を示す。図2(b)は実施例1の光学式センサの断面図であり、発光素子と受光素子の間に電子回路素子が有る構成を示す。図において、実線で示す矢印は発光素子101から垂直方向に出射された光が受光素子103へ導かれる光路を示す。破線で示す矢印は発光素子101から水平方向に出射された光が受光素子103へ向かう光路を示す。 FIG. 2 shows a cross-sectional view of the optical sensor. FIG. 2(a) is a cross-sectional view of an optical sensor of a comparative example, showing a configuration in which there is no electronic circuit element between the light emitting element and the light receiving element. FIG. 2(b) is a cross-sectional view of the optical sensor of Example 1, showing a configuration in which an electronic circuit element is provided between a light emitting element and a light receiving element. In the figure, a solid arrow indicates an optical path along which light emitted vertically from the light emitting element 101 is guided to the light receiving element 103. An arrow shown by a broken line indicates an optical path of light emitted from the light emitting element 101 in the horizontal direction toward the light receiving element 103.

発光素子101である光軸垂直型のLEDの場合、出射された光の大部分が垂直方向に出射されるものの、垂直方向以外にも光が出射される。また受光素子103である光軸垂直型のフォトトランジスタは、垂直方向から入射される光に対する感度が高いものの、垂直方向以外から入射される光にも感度がある。 In the case of the light-emitting element 101, which is an optical-axis vertical LED, most of the emitted light is emitted in the vertical direction, but light is also emitted in directions other than the vertical direction. Further, although the optical axis vertical phototransistor that is the light receiving element 103 has high sensitivity to light incident from a vertical direction, it is also sensitive to light incident from a direction other than the vertical direction.

図2(a)に破線矢印で示す通り、基板104の実装面において、発光素子101と受光素子103の間に電子回路素子が無い場合は、発光素子101から水平方向に出射された光は、空間110の検出物の有無に関係なく、受光素子103へ入射される。 As shown by the broken line arrow in FIG. 2A, if there is no electronic circuit element between the light emitting element 101 and the light receiving element 103 on the mounting surface of the board 104, the light emitted from the light emitting element 101 in the horizontal direction is The light is incident on the light receiving element 103 regardless of the presence or absence of a detection object in the space 110.

図2(b)に破線矢印で示す通り、基板104の実装面において、発光素子101と受光素子103の間に電子回路素子102が有る場合は、発光素子101から水平方向に出射された光は、電子回路素子102に遮られ、受光素子103へは入射されない。 As shown by the broken line arrow in FIG. 2(b), when the electronic circuit element 102 is located between the light emitting element 101 and the light receiving element 103 on the mounting surface of the board 104, the light emitted from the light emitting element 101 in the horizontal direction is , is blocked by the electronic circuit element 102 and does not enter the light receiving element 103.

図3、図4を用いて、本実施例における光学式センサの等価回路及び出力特性について説明する。図3は実施例1における光学式センサの等価回路を示す回路図である。図4は実施例1における光学式センサの出力特性を示す図である。 The equivalent circuit and output characteristics of the optical sensor in this example will be explained using FIGS. 3 and 4. FIG. 3 is a circuit diagram showing an equivalent circuit of the optical sensor in Example 1. FIG. 4 is a diagram showing the output characteristics of the optical sensor in Example 1.

図3に示すように、発光素子101はLEDであり、アノードは電流制限抵抗111を介してDC電源に、カソードはGNDに接続される。受光素子103はフォトトランジスタ(Ptr)であり、コレクタはプルアップ抵抗112を介して電源に、エミッタはGNDに接続される。 As shown in FIG. 3, the light emitting element 101 is an LED, and its anode is connected to a DC power source via a current limiting resistor 111, and its cathode is connected to GND. The light receiving element 103 is a phototransistor (Ptr), and its collector is connected to a power supply via a pull-up resistor 112, and its emitter is connected to GND.

電圧出力部113は受光素子103であるフォトトランジスタのコレクタに接続されており、フォトトランジスタのコレクタ端子とGNDの間の電圧を示す。電圧出力部113は受光素子103であるフォトトランジスタがオンしている状態、フォトトランジスタに光が入射している状態では出力Lとなる。一方、電圧出力部113は受光素子103であるフォトトランジスタがオフしている状態、フォトトランジスタに光が入射していない状態では出力Hとなる。 The voltage output section 113 is connected to the collector of the phototransistor which is the light receiving element 103, and indicates the voltage between the collector terminal of the phototransistor and GND. The voltage output section 113 outputs L when the phototransistor, which is the light receiving element 103, is on and when light is incident on the phototransistor. On the other hand, the voltage output section 113 outputs H when the phototransistor, which is the light receiving element 103, is off and no light is incident on the phototransistor.

図4に示す横軸は発光素子101に流れる電流(mA)を示す。発光素子101の発光光量は流れる電流に比例する。図4に示す縦軸は電圧出力部113の電圧(V)を示す。ここでは、実験時、DC入力電圧は3.3V、LEDは定格50mA品を使用した。なお、実験時、LEDは40mAで使用した。 The horizontal axis shown in FIG. 4 represents the current (mA) flowing through the light emitting element 101. The amount of light emitted by the light emitting element 101 is proportional to the flowing current. The vertical axis shown in FIG. 4 represents the voltage (V) of the voltage output section 113. Here, during the experiment, the DC input voltage was 3.3V, and the LED was rated at 50mA. Note that during the experiment, the LED was used at 40 mA.

図4において、実線で示すデータは、光学式センサの空間110に検出物が「無」、発光素子101と受光素子103の間に電子回路素子102が「有」の状態を示す。破線データは、光学式センサの空間110に検出物が「有」、発光素子101と受光素子103の間に電子回路素子102が「無」の状態を示す。点線データは、光学式センサの空間110に検出物が「有」、発光素子101と受光素子103の間に電子回路素子102が「無」の状態を示す。 In FIG. 4, data indicated by a solid line indicates that there is no detected object in the space 110 of the optical sensor, and that the electronic circuit element 102 is present between the light emitting element 101 and the light receiving element 103. The broken line data indicates a state in which a detection object is “present” in the space 110 of the optical sensor and an electronic circuit element 102 is “absent” between the light emitting element 101 and the light receiving element 103. The dotted line data indicates a state in which a detection object is "present" in the space 110 of the optical sensor, and an electronic circuit element 102 is "absent" between the light emitting element 101 and the light receiving element 103.

光学式センサは、空間110に検出物が有る場合は、発光素子101からの光が検出物に遮られるため、受光素子103は光が入射していない状態となり、出力Hとなる。一方、空間110に検出物が無い場合は、発光素子101からの光が検出物に遮られることがないため、受光素子103は光が入射している状態となり、出力Lになる。光学式センサは、発光素子101の発光光量に依存せずに、検出物の有無に応じた出力を出す必要がある。 In the optical sensor, when there is an object to be detected in the space 110, the light from the light emitting element 101 is blocked by the object, so the light receiving element 103 is in a state where no light is incident, and outputs H. On the other hand, when there is no detection object in the space 110, the light from the light emitting element 101 is not blocked by the detection object, so the light receiving element 103 enters a state where light is incident, and the output is L. The optical sensor needs to output an output depending on the presence or absence of a detection object, without depending on the amount of light emitted by the light emitting element 101.

実線で示すデータは、発光素子101からの光のうち、発光素子101から水平方向に出射された光は、発光素子101と受光素子103の間の電子回路素子102に遮られる(図2参照)。そのため、受光素子103が受光する光の光量は、発光素子101であるLEDに流れる電流、即ち、発光素子の発光光量に依存せずに、出力Lとなっている。そのため、光学式センサは、検出物の無を判別することができる。 The data shown by the solid line indicates that among the light emitted from the light emitting element 101, the light emitted from the light emitting element 101 in the horizontal direction is blocked by the electronic circuit element 102 between the light emitting element 101 and the light receiving element 103 (see FIG. 2). . Therefore, the amount of light received by the light-receiving element 103 is the output L, independent of the current flowing through the LED, which is the light-emitting element 101, that is, the amount of light emitted from the light-emitting element. Therefore, the optical sensor can determine whether there is an object to be detected.

破線で示すデータは、発光素子101からの光が、ライトガイド105の内面反射によって反射されて受光素子103に間接的に入射される以外に、発光素子101から水平方向に出射された光が受光素子103に直接入射されてしまう。そのため、受光素子103が受光する光の光量は、発光素子101に流れる電流、即ち、発光素子101の発光光量に依存して、出力H、出力Lが変化する。そのため、光学式センサは、発光素子から受光素子へ直接入射される光の影響を受けてしまい、検出物の有無を判別することができない。 The data indicated by the broken line indicates that in addition to the light emitted from the light emitting element 101 being reflected by the internal reflection of the light guide 105 and indirectly incident on the light receiving element 103, the light emitted from the light emitting element 101 in the horizontal direction is received. The light is directly incident on the element 103. Therefore, the amount of light received by the light receiving element 103 changes depending on the current flowing through the light emitting element 101, that is, the amount of light emitted from the light emitting element 101, and the output H and the output L change. Therefore, the optical sensor is affected by the light that directly enters the light-receiving element from the light-emitting element, and cannot determine the presence or absence of a detected object.

点線で示すデータは、発光素子101からの光のうち、発光素子101から水平方向に出射された光は、発光素子101と受光素子103の間の電子回路素子102に遮られる(図2参照)。そのため、受光素子103が受光する光の光量は、発光素子101であるLEDに流れる電流、即ち、発光素子の発光光量に依存せずに、出力Hとなっている。そのため、光学式センサは、検出物の有を判別することができる。 The data indicated by the dotted line indicates that among the light emitted from the light emitting element 101, the light emitted from the light emitting element 101 in the horizontal direction is blocked by the electronic circuit element 102 between the light emitting element 101 and the light receiving element 103 (see FIG. 2). . Therefore, the amount of light received by the light-receiving element 103 is an output H regardless of the current flowing through the LED, which is the light-emitting element 101, that is, the amount of light emitted from the light-emitting element. Therefore, the optical sensor can determine the presence of a detection object.

電圧出力部113の電圧は通常ロジックICに接続され、ロジックIC内部のリファレンス電圧と比較して出力H、出力Lの2値に判別される。例えば、3.3V入力で動作するロジックICは、2.6V以上を出力H、0.6V以下を出力Lとして認識し、0.6V~2.6Vは出力H、出力Lを正しく認識できない。 The voltage of the voltage output section 113 is normally connected to a logic IC, and compared with a reference voltage inside the logic IC, it is determined to have two values, an output H and an output L. For example, a logic IC that operates with an input of 3.3V recognizes 2.6V or more as an output H and 0.6V or less as an output L, and cannot correctly recognize an output H or an output L between 0.6V and 2.6V.

発光素子101の発光光量は周囲温度条件や累積点灯時間によって変化する。発光素子101の発光光量は、他にも、発光素子101の発光効率のばらつき、光軸のばらつき、受光素子103の感度のばらつき、クリアモールドであるライトガイドの内面反射のばらつき等がある。そのため、発光素子101の発光光量に依存せずに、検出物の有無に応じた出力を出す必要がある。 The amount of light emitted by the light emitting element 101 changes depending on ambient temperature conditions and cumulative lighting time. The amount of light emitted by the light emitting element 101 also includes variations in the luminous efficiency of the light emitting element 101, variations in the optical axis, variations in the sensitivity of the light receiving element 103, and variations in internal reflection of the light guide, which is a clear mold. Therefore, it is necessary to output an output depending on the presence or absence of the detected object, without depending on the amount of light emitted by the light emitting element 101.

しかし、前述したように、光学式センサにおいて、発光素子101から受光素子103へ直接入射される光が有ると、空間110の検出物の有無を正しく判別することができない(図4に破線で示すデータ参照)。 However, as described above, in the optical sensor, if there is light that is directly incident from the light emitting element 101 to the light receiving element 103, it is not possible to correctly determine the presence or absence of a detected object in the space 110 (as shown by the broken line in FIG. 4). (see data).

そこで、発光素子101と受光素子103の間に電子回路素子102を配置し、発光素子101から受光素子103へ直接入射される光を電子回路素子102によって遮ることが有効であることが分かる。 Therefore, it can be seen that it is effective to arrange the electronic circuit element 102 between the light emitting element 101 and the light receiving element 103 and to block the light that is directly incident on the light receiving element 103 from the light emitting element 101 with the electronic circuit element 102.

本実施例のように、電子回路素子102をチップ抵抗で構成すれば、基板104に自動機である自動マウント装置によって、発光素子101、受光素子103を実装する際に電子回路素子102を同時に実装し、そのままリフロー炉に通すことが可能である。また、汎用のチップ抵抗は安価に入手可能であり、様々なサイズを選択可能という利点がある。そのため、基板の実装面(同一面)において発光素子と受光素子の間に電子回路素子を配置することで、発光素子から受光素子へ直接入射される光の影響を受けず、検出物の検出を正しく行うことができ、安価で簡易な構成の光学式センサを提供することができる。 If the electronic circuit element 102 is composed of a chip resistor as in this embodiment, the electronic circuit element 102 is mounted at the same time when the light emitting element 101 and the light receiving element 103 are mounted on the substrate 104 using an automatic mounting device. However, it is possible to pass it through a reflow oven as it is. Further, general-purpose chip resistors have the advantage that they are available at low cost and can be selected from a variety of sizes. Therefore, by placing an electronic circuit element between the light-emitting element and the light-receiving element on the mounting surface (same surface) of the board, it is possible to detect the object without being affected by the light that enters directly from the light-emitting element to the light-receiving element. It is possible to provide an optical sensor that can be carried out correctly and has an inexpensive and simple configuration.

また、基板にライトガイドを後から組み付ける構成において、発光素子から受光素子へ水平方向に直接入射される光を防止するための機構を導光部材であるライトガイドに設ける必要がないため、ライトガイドを安価で簡易な構成にすることができる。 In addition, in a configuration in which the light guide is assembled to the board later, there is no need to provide the light guide, which is the light guide member, with a mechanism to prevent light from directly entering the light emitting element in the horizontal direction from the light emitting element to the light receiving element. can be made into an inexpensive and simple configuration.

なお、本実施例では、電子回路素子102として、基板の同一面上に実装されるチップ抵抗を例示したが、これに限定されるものではない。発光素子や受光素子に電子的に接続されないチップセラコン、チップビーズ、コネクタ、コイル、チップジャンパなどの電子回路素子や、電子回路素子以外でも耐熱性の部品など、自動マウント装置で実装可能であり、リフロー炉に通せる部品で光を遮る部品であれば良い。 In this embodiment, a chip resistor mounted on the same surface of a substrate is illustrated as the electronic circuit element 102, but the present invention is not limited to this. Electronic circuit elements such as chip ceramic capacitors, chip beads, connectors, coils, and chip jumpers that are not electronically connected to light emitting elements or light receiving elements, as well as heat-resistant parts other than electronic circuit elements, can be mounted using automatic mounting equipment. Any part that can be passed through a reflow oven and blocks light is fine.

また、発光素子101と受光素子103の間に配置する電子回路素子102は、前記基板の実装面において前記発光素子と前記受光素子の間の一部を遮る構成であれば効果は得られる。しかし、前記電子回路素子102は、発光素子101もしくは受光素子103の高さよりも厚い部材を選択することが好ましい。 Further, the effect can be obtained if the electronic circuit element 102 disposed between the light emitting element 101 and the light receiving element 103 is configured to block a part of the space between the light emitting element and the light receiving element on the mounting surface of the board. However, it is preferable to select a member for the electronic circuit element 102 that is thicker than the height of the light emitting element 101 or the light receiving element 103.

また基板に後付けされる導光部材として透明樹脂からなるライトガイドを採用した場合も、発光素子から受光素子へ水平方向に直接入射する光を防止するための機構をライトガイドに設ける必要がない。そのため、光学式センサを安価で簡易な構成で提供することができる。 Further, even when a light guide made of transparent resin is used as a light guiding member that is attached to the substrate later, there is no need to provide the light guide with a mechanism for preventing light from directly entering the light receiving element in the horizontal direction from the light emitting element. Therefore, the optical sensor can be provided with an inexpensive and simple configuration.

〔実施例2〕
図5、図6を用いて、本発明の実施例2に係る光学式センサについて説明する。実施例2において、実施例1と同様の構成のものに関しては説明を省略する。図5(a)は実施例2における光学式センサの斜視図、図5(b)は実施例2における光学式センサの上面図である。図6は実施例2における光学式センサの部品レイアウト及び配線パターンを示す図である。
[Example 2]
An optical sensor according to a second embodiment of the present invention will be described using FIGS. 5 and 6. In the second embodiment, descriptions of components similar to those in the first embodiment will be omitted. 5(a) is a perspective view of the optical sensor in Example 2, and FIG. 5(b) is a top view of the optical sensor in Example 2. FIG. 6 is a diagram showing a component layout and wiring pattern of an optical sensor in Example 2.

実施例2における光学式センサの等価回路図は、実施例1で図3も用いて説明した内容と同じなので省略する。 The equivalent circuit diagram of the optical sensor in Example 2 is the same as that explained in Example 1 using FIG. 3, so it will be omitted.

実施例2では、発光素子101と受光素子103の間に配置する電子回路素子は、発光素子101もしくは受光素子103を駆動する駆動回路を構成する部品の一部である。具体的には、発光素子101の電流制限抵抗111と、受光素子103のプルアップ抵抗112が、発光素子101と受光素子103の間に配置する電子回路素子を兼ねている。図5、図6に示すように、基板104には、発光素子101、電流制限抵抗111、プルアップ抵抗112、受光素子103以外にも、CPU121やメモリ122が同一面に実装される。電子回路素子である電流制限抵抗111及びプルアップ抵抗112は、基板104の実装面(同一面)において、発光素子101と受光素子103の間に配置されている。実施例2においては、電流制限抵抗111及びプルアップ抵抗112が、発光素子101から受光素子103へ直接入射する光を遮る電子回路素子として機能する。 In the second embodiment, the electronic circuit element disposed between the light emitting element 101 and the light receiving element 103 is a part of a component constituting a drive circuit that drives the light emitting element 101 or the light receiving element 103. Specifically, the current limiting resistor 111 of the light emitting element 101 and the pull-up resistor 112 of the light receiving element 103 also serve as electronic circuit elements disposed between the light emitting element 101 and the light receiving element 103. As shown in FIGS. 5 and 6, in addition to the light emitting element 101, current limiting resistor 111, pull-up resistor 112, and light receiving element 103, a CPU 121 and a memory 122 are mounted on the same surface of the substrate 104. A current limiting resistor 111 and a pull-up resistor 112, which are electronic circuit elements, are arranged between the light emitting element 101 and the light receiving element 103 on the mounting surface (same surface) of the substrate 104. In the second embodiment, the current limiting resistor 111 and the pull-up resistor 112 function as electronic circuit elements that block light directly entering the light receiving element 103 from the light emitting element 101.

また実施例2では、発光素子101と受光素子103の間に配置する電子回路素子を複数有している。複数の電子回路素子である電流制限抵抗111とプルアップ抵抗112は、発光素子101と受光素子103の間において異なる位置に配置されている。具体的には、電流制限抵抗111とプルアップ抵抗112は、図6の上下方向に位置をずらして実装されている。電流制限抵抗111とプルアップ抵抗112は、発光素子101の発光源101aの中心と受光素子103の受光領域103aの中心を繋ぐ線DLに対して交差する方向において、異なる位置に配置されている。ここでは電流制限抵抗111とプルアップ抵抗112を前記繋ぐ線DLに対して交差する位置に配置した構成を例示したが、これに限定されるものではない。複数の電子回路素子を、発光素子101の発光源101aの中心と受光素子103の受光領域103aの中心を繋ぐ線DLに対して交差する方向において、異なる位置に配置する場合、発光素子と受光素子の間において少なくとも1つの電子回路素子を前記繋ぐ線上に配置すればよい。また、本実施例で用いる電流制限抵抗111、プルアップ抵抗112は、発光素子101及び受光素子103よりサイズが小さい部品を用いている。電流制限抵抗111、プルアップ抵抗112の位置をずらして基板104の同一面上に実装することで、発光素子101から水平方向に出射された光が、受光素子103に水平方向から入射する光路を遮る構成になっている。 Further, in the second embodiment, a plurality of electronic circuit elements are provided between the light emitting element 101 and the light receiving element 103. The current limiting resistor 111 and the pull-up resistor 112, which are a plurality of electronic circuit elements, are arranged at different positions between the light emitting element 101 and the light receiving element 103. Specifically, the current limiting resistor 111 and the pull-up resistor 112 are mounted with their positions shifted in the vertical direction in FIG. The current limiting resistor 111 and the pull-up resistor 112 are arranged at different positions in a direction intersecting the line DL connecting the center of the light emitting source 101a of the light emitting element 101 and the center of the light receiving area 103a of the light receiving element 103. Although a configuration in which the current limiting resistor 111 and the pull-up resistor 112 are arranged at a position intersecting the connecting line DL is illustrated here, the present invention is not limited to this. When a plurality of electronic circuit elements are arranged at different positions in a direction intersecting the line DL connecting the center of the light emitting source 101a of the light emitting element 101 and the center of the light receiving area 103a of the light receiving element 103, the light emitting element and the light receiving element At least one electronic circuit element may be placed on the connecting line between the two. Furthermore, the current limiting resistor 111 and pull-up resistor 112 used in this embodiment are components smaller in size than the light emitting element 101 and the light receiving element 103. By shifting the positions of the current limiting resistor 111 and the pull-up resistor 112 and mounting them on the same surface of the substrate 104, the optical path of the light emitted horizontally from the light emitting element 101 and entering the light receiving element 103 from the horizontal direction can be changed. It is configured to block it.

以上説明した通り、発光素子101と受光素子103を駆動する駆動回路を構成する部品である電流制限抵抗111とプルアップ抵抗112を、発光素子101と受光素子103の間に配置する電子回路素子を兼ねる構成とする。これにより、電子回路素子を追加することによるコストアップを無くすことができる。 As explained above, the current limiting resistor 111 and the pull-up resistor 112, which are components of the drive circuit that drives the light emitting element 101 and the light receiving element 103, are arranged as electronic circuit elements between the light emitting element 101 and the light receiving element 103. It is configured to serve as both. This eliminates the cost increase caused by adding electronic circuit elements.

また、複数の電子回路素子である電流制限抵抗111、プルアップ抵抗112の位置をずらして基板104の同一面上に実装する。これにより、電流制限抵抗111、プルアップ抵抗112に発光素子101及び受光素子103よりサイズが小さい部品を採用した場合でも、発光素子101と受光素子103の間に配置する電子回路素子として機能させることができる。 Further, the positions of the current limiting resistor 111 and the pull-up resistor 112, which are a plurality of electronic circuit elements, are shifted and mounted on the same surface of the substrate 104. As a result, even if parts smaller in size than the light emitting element 101 and the light receiving element 103 are used for the current limiting resistor 111 and the pull up resistor 112, they can function as electronic circuit elements disposed between the light emitting element 101 and the light receiving element 103. I can do it.

〔実施例3〕
図7を用いて、本発明の実施例3に係る光学式センサについて説明する。実施例3において、実施例1、2と同様の構成のものに関しては説明を省略する。図7は本実施例における光学式センサの断面図である。
[Example 3]
An optical sensor according to Example 3 of the present invention will be described using FIG. 7. In the third embodiment, descriptions of components similar to those in the first and second embodiments will be omitted. FIG. 7 is a sectional view of the optical sensor in this example.

実施例3における光学式センサは、基板に後付けされる導光部材であるライトガイドの代わりに、反射面109a,109bを備える黒色の筐体108を備えている。以下、詳しく説明する。 The optical sensor in Example 3 includes a black casing 108 that includes reflective surfaces 109a and 109b instead of a light guide that is a light guide member that is retrofitted to the board. This will be explained in detail below.

実施例3では、基板104の同一面上に、発光素子101、電子回路素子102、受光素子103を先に実装し、後から筐体108を基板104に取り付ける。黒色の筐体108は、第1の反射面109aを有する第1の中空部108aと、第2の反射面109bを有する第2の中空部108bと、第1の中空部108aと第2の中空部108bとを連結する連結部108cとが一体形成されたものである。第1の中空部108aは、発光素子101から出射された光を反射する第1の反射面109aと、第1の反射面109aで反射された光を空間110に向けて通過させる第1のスリット108dとを有する。第2の中空部108bは、空間110を介して第1の中空部108aに対向して設けられている。第2の中空部108bは、空間110を通過した光を受け入れる第2のスリット108eと、第2のスリット108eを通過した光を受光素子103に向けて反射させる第2の反射面109bとを有する。 In the third embodiment, the light emitting element 101, the electronic circuit element 102, and the light receiving element 103 are first mounted on the same surface of the substrate 104, and the casing 108 is attached to the substrate 104 later. The black casing 108 includes a first hollow part 108a having a first reflective surface 109a, a second hollow part 108b having a second reflective surface 109b, and a first hollow part 108a and a second hollow part 108b. A connecting portion 108c that connects the portion 108b is integrally formed. The first hollow portion 108a includes a first reflective surface 109a that reflects the light emitted from the light emitting element 101, and a first slit that allows the light reflected by the first reflective surface 109a to pass toward the space 110. 108d. The second hollow part 108b is provided opposite to the first hollow part 108a with a space 110 in between. The second hollow portion 108b has a second slit 108e that receives the light that has passed through the space 110, and a second reflective surface 109b that reflects the light that has passed through the second slit 108e toward the light receiving element 103. .

基板104に対して反射面109a,109bを備えた筐体108を後から組み付ける場合、発光素子101からの光を受光素子103に導くために、反射面109a,109bを適切な位置に位置決めする必要がある。そのため、基板104に対して筐体108を後付けする場合、図7に示す通り、筐体108の連結部108cと基板104の間に隙間が生じる。隙間が生じないように組み付けるためには、筐体108の形状を工夫する必要があり容易でない。筐体108の連結部108cと基板104との間に隙間が有ると、図7の点線で示すように、発光素子101から水平方向に出射された光が、前述の隙間を通って受光素子103へ直接入射される経路ができる。 When the housing 108 equipped with the reflective surfaces 109a and 109b is later assembled to the substrate 104, it is necessary to position the reflective surfaces 109a and 109b at appropriate positions in order to guide the light from the light emitting element 101 to the light receiving element 103. There is. Therefore, when the casing 108 is retrofitted to the board 104, a gap is created between the connecting portion 108c of the casing 108 and the board 104, as shown in FIG. In order to assemble without creating a gap, the shape of the housing 108 needs to be devised, which is not easy. If there is a gap between the connecting portion 108c of the housing 108 and the substrate 104, the light emitted from the light emitting element 101 in the horizontal direction passes through the gap and reaches the light receiving element 103, as shown by the dotted line in FIG. This creates a path for direct input to the

前記した通り、光学式センサにおいて、発光素子101から受光素子103へ直接入射される光が有ると、空間110の検出物の有無を正しく判別することができない。 As described above, in the optical sensor, if there is light that is directly incident on the light receiving element 103 from the light emitting element 101, the presence or absence of a detection object in the space 110 cannot be correctly determined.

そこで、実施例3における光学式センサは、基板104の実装面(同一面)において、電子回路素子102を、発光素子101と受光素子103の間に実装する。これにより、電子回路素子102により発光素子101から受光素子103へ直接入射される光の経路を遮蔽することができる。 Therefore, in the optical sensor according to the third embodiment, the electronic circuit element 102 is mounted between the light emitting element 101 and the light receiving element 103 on the mounting surface (same surface) of the substrate 104. Thereby, the electronic circuit element 102 can block the path of light that is directly incident on the light receiving element 103 from the light emitting element 101.

以上説明した通り、基板の同一面上に発光素子、受光素子を実装した後に、後付けで筐体を組み付ける構成において、電子回路素子を発光素子と受光素子の間に実装する。これにより、基板と筐体の連結部の間に隙間が生じた場合でも迷光の影響を受けない光学式センサを安価で簡易な構成で実現することができる。 As described above, in the configuration in which the casing is assembled afterward after the light emitting element and the light receiving element are mounted on the same surface of the board, the electronic circuit element is mounted between the light emitting element and the light receiving element. Thereby, an optical sensor that is not affected by stray light even if a gap occurs between the connecting portion of the board and the housing can be realized with an inexpensive and simple configuration.

また、発光素子から受光素子へ水平方向に直接入射する光を防止するための機構を筐体に設ける必要がないため、筐体を安価で簡易な構成にすることができる。 Further, since there is no need to provide the housing with a mechanism for preventing light from directly entering the light-receiving element in the horizontal direction from the light-emitting element, the housing can be constructed at low cost and simple.

100 …光学式センサ
101 …発光素子
101a …発光源
102 …電子回路素子
103 …受光素子
103a …受光領域
104 …基板
105 …ライトガイド
105a …第1の導光部
105b …第2の導光部
105c …連結部
108 …筐体
108a …第1の中空部
108b …第2の中空部
108c …連結部
108d …第1のスリット
108e …第2のスリット
109a …第1の反射面
109b …第2の反射面
110 …空間
111 …電流制限抵抗
112 …プルアップ抵抗
100...Optical sensor 101...Light emitting element 101a...Light emitting source 102...Electronic circuit element 103...Light receiving element 103a...Light receiving area 104...Substrate 105...Light guide 105a...First light guide section 105b...Second light guide section 105c ...Connection part 108 ...Casing 108a ...First hollow part 108b ...Second hollow part 108c ...Connection part 108d ...First slit 108e ...Second slit 109a ...First reflective surface 109b ...Second reflection Surface 110...Space 111...Current limiting resistor 112...Pull-up resistor

Claims (6)

光を出射する発光素子と、
検出物が通過する空間を介して前記発光素子からの光を受光する受光素子と、
複数の電子回路素子と、
を備え、前記発光素子からの光を前記空間にて検出物が遮ることにより前記検出物の検出を行う光学式センサであって、
前記発光素子、複数の前記電子回路素子、前記受光素子は、基板の同一面上に実装され、複数の前記電子回路素子は、前記基板の実装面において、前記発光素子と前記受光素子の間に配置されており、
前記発光素子の発光源の中心と前記受光素子の受光領域の中心を繋ぐ線に対して交差する方向において、複数の前記電子回路素子はそれぞれ異なる位置に配置されていることを特徴とする光学式センサ。
a light emitting element that emits light;
a light receiving element that receives light from the light emitting element through a space through which the detection object passes;
multiple electronic circuit elements;
An optical sensor that detects the object by blocking the light from the light emitting element in the space,
The light-emitting element, the plurality of electronic circuit elements, and the light-receiving element are mounted on the same surface of the substrate, and the plurality of electronic circuit elements are arranged between the light-emitting element and the light-receiving element on the mounting surface of the substrate. It is located
The plurality of electronic circuit elements are arranged at different positions in a direction intersecting a line connecting the center of the light emitting source of the light emitting element and the center of the light receiving area of the light receiving element. sensor.
前記空間を通過する方向へ前記発光素子から出射された光を導く第1の導光部と、
前記空間を介して前記第1の導光部に対向して設けられ前記空間を通過した光を前記受光素子に導く第2の導光部と、
前記第1の導光部と前記第2の導光部とを連結する連結部とが一体形成された導光部材と、
を備え、
前記電子回路素子は、前記発光素子と前記受光素子の間であって、前記連結部に対応する位置に配置されていることを特徴とする請求項に記載の光学式センサ。
a first light guiding portion that guides the light emitted from the light emitting element in a direction passing through the space;
a second light guide section that is provided opposite to the first light guide section through the space and guides the light that has passed through the space to the light receiving element;
a light guide member integrally formed with a connecting part that connects the first light guide part and the second light guide part;
Equipped with
The optical sensor according to claim 1 , wherein the electronic circuit element is disposed between the light emitting element and the light receiving element at a position corresponding to the connecting part.
前記発光素子から出射された光を反射する第1の反射面と前記第1の反射面で反射された光を前記空間に向けて通過させる第1のスリットとを有する第1の中空部と、
前記空間を介して前記第1の中空部に対向して設けられ前記空間を通過した光を受け入れる第2のスリットと前記第2のスリットを通過した光を前記受光素子に向けて反射させる第2の反射面とを有する第2の中空部と、
前記第1の中空部と前記第2の中空部とを連結する連結部とが一体形成された黒色の筐体と、
を備え、
前記電子回路素子は、前記発光素子と前記受光素子の間であって、前記基板と前記筐体の連結部との間に配置されていることを特徴とする請求項に記載の光学式センサ。
a first hollow portion having a first reflective surface that reflects light emitted from the light emitting element and a first slit that allows the light reflected by the first reflective surface to pass toward the space;
a second slit that is provided opposite to the first hollow part through the space and receives light that has passed through the space; and a second slit that reflects the light that has passed through the second slit toward the light receiving element. a second hollow portion having a reflective surface;
a black casing in which a connecting part connecting the first hollow part and the second hollow part is integrally formed;
Equipped with
The optical sensor according to claim 1 , wherein the electronic circuit element is disposed between the light emitting element and the light receiving element, and between the substrate and the connecting part of the casing. .
前記発光素子は光を出射する発光源を有し、
前記受光素子は光を受光する受光領域を有し、
前記電子回路素子は、前記発光素子の発光源の中心と前記受光素子の受光領域の中心を繋ぐ線上に配置されていることを特徴とする請求項1乃至のいずれか1項に記載の光学式センサ。
The light emitting element has a light emitting source that emits light,
The light receiving element has a light receiving area that receives light,
4. The optical system according to claim 1, wherein the electronic circuit element is arranged on a line connecting a center of a light emitting source of the light emitting element and a center of a light receiving area of the light receiving element. formula sensor.
前記電子回路素子は、リフロー実装可能な素子であり、発光素子もしくは受光素子を駆動する駆動回路を構成する部品の一部であることを特徴とする請求項に記載の光学式センサ。 5. The optical sensor according to claim 4 , wherein the electronic circuit element is a reflow-mountable element and is part of a component constituting a drive circuit that drives a light emitting element or a light receiving element. 前記発光素子は面実装タイプのLEDであり、前記受光素子は面実装タイプのフォトトランジスタであることを特徴とする請求項1乃至のいずれか1項に記載の光学式センサ。 6. The optical sensor according to claim 1, wherein the light emitting element is a surface mount type LED, and the light receiving element is a surface mount type phototransistor.
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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017093808A (en) 2015-11-24 2017-06-01 セイコーエプソン株式会社 Portable biological information measurement device

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04171869A (en) * 1990-11-05 1992-06-19 Toshiba Corp Object detector
JPH0799339A (en) * 1993-04-30 1995-04-11 Sharp Corp Optically coupled device
JPH08125218A (en) * 1994-10-26 1996-05-17 Rohm Co Ltd Optical semiconductor device
JPH09181339A (en) * 1995-12-21 1997-07-11 Matsushita Electron Corp Photoelectric conversion device
JP4165670B2 (en) 1998-03-19 2008-10-15 シチズン電子株式会社 Surface mount type photointerrupter and method of manufacturing the same
DE10121185B4 (en) * 2001-04-30 2013-04-25 Sick Ag Optical sensor
TWI373149B (en) * 2005-03-24 2012-09-21 Rohm Co Ltd Surface mount type photo interrupter and method for manufacturing the same
JP2006269777A (en) * 2005-03-24 2006-10-05 Rohm Co Ltd Plate mounting photointerrupter and manufacturing method thereof
JP2007027621A (en) * 2005-07-21 2007-02-01 Rohm Co Ltd Surface-mounted photo interruptor and its manufacturing method
JP2007059657A (en) * 2005-08-25 2007-03-08 Citizen Electronics Co Ltd Photo interrupter
JP2007109851A (en) * 2005-10-13 2007-04-26 Citizen Electronics Co Ltd Photo interrupter
JP2008135683A (en) * 2006-10-24 2008-06-12 Sharp Corp Photo coupler and its manufacturing method, and electronic device using photo coupler
KR100995913B1 (en) * 2008-02-29 2010-11-22 광전자 주식회사 Photo interrupter and manufacturing method thereof
DE102008029467A1 (en) * 2008-06-20 2009-12-24 Osram Opto Semiconductors Gmbh Semiconductor device, use of a semiconductor device as a proximity sensor and method for detecting objects
KR20100006905A (en) * 2008-07-10 2010-01-22 카오스 (주) Transmission type photo interrupter
JP6236130B2 (en) * 2011-08-08 2017-11-22 ローム株式会社 Photo interrupter and mounting structure of photo interrupter
JP6077528B2 (en) * 2012-04-25 2017-02-08 京セラ株式会社 Light emitting / receiving element module and sensor device using the same
JP6180173B2 (en) 2012-05-31 2017-08-16 キヤノン株式会社 Substrate and image forming apparatus
TWM448798U (en) * 2012-08-10 2013-03-11 Meicer Semiconductor Inc Optical device package module
JP2014192308A (en) * 2013-03-27 2014-10-06 Stanley Electric Co Ltd Photointerrupter manufacturing method
CN105789197B (en) * 2014-12-25 2019-03-15 日月光半导体制造股份有限公司 Optical module, its manufacturing method and the electronic device with optical module
US20160307881A1 (en) * 2015-04-20 2016-10-20 Advanced Semiconductor Engineering, Inc. Optical sensor module and method for manufacturing the same
US10671009B2 (en) 2017-02-13 2020-06-02 Canon Kabushiki Kaisha Printed circuit board mounting piezoelectric transformer
JP7173782B2 (en) 2018-08-08 2022-11-16 キヤノン株式会社 Substrate sheet and imposition method

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017093808A (en) 2015-11-24 2017-06-01 セイコーエプソン株式会社 Portable biological information measurement device

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