JPH08125218A - Optical semiconductor device - Google Patents

Optical semiconductor device

Info

Publication number
JPH08125218A
JPH08125218A JP26251694A JP26251694A JPH08125218A JP H08125218 A JPH08125218 A JP H08125218A JP 26251694 A JP26251694 A JP 26251694A JP 26251694 A JP26251694 A JP 26251694A JP H08125218 A JPH08125218 A JP H08125218A
Authority
JP
Japan
Prior art keywords
light
emitting element
light emitting
light receiving
receiving element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP26251694A
Other languages
Japanese (ja)
Inventor
Shinichi Suzuki
慎一 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP26251694A priority Critical patent/JPH08125218A/en
Publication of JPH08125218A publication Critical patent/JPH08125218A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To obtain an optical semiconductor device where light from a light emitting element can be received by a photodetector by detachably mounting a forming body where the light emitting element, the photodetector, and a substrate are formed in one piece at a housing body. CONSTITUTION: Illumination light from a light emitting element 4 of a photo interrupter passes through a cavity part 9, is reflected by a reflection part 12, is radiated from a hole 10, passes through a groove part 8, and then enters a hole 11. Then, it is continuously reflected by a reflection part 13 again, passes through the cavity part 9, and is positively applied to a photodetector 5. Then, since a forming body 1 where the light-emitting element 4, the photodetector 5, and the substrate 3 are formed in one piece is detachably mounted to the housing body 2, the position of the light emitting element 4 for the reflection part 12 of the housing body 2 and the position of the photodetector 5 for the reflection part 13 can be freely adjusted. Therefore, the forming body 1 can be mounted to the housing body 2 at a position where light from the light emitting element 4 can be most efficiently received by the photodetector 5, thus achieving a long-term use and extremely reducing the troublesome operation such as position adjustment due to exchange.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光半導体装置に関し、
特に受光効率の良い構造を有する光半導体装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device,
In particular, the present invention relates to an optical semiconductor device having a structure with good light receiving efficiency.

【0002】[0002]

【従来の技術】従来、自動制御装置のセンサとして用い
られる光半導体装置は、特開昭63−240082号公
報に開示されている「ホトインタラプタ」がすでに知ら
れている。このホトインタラプタは、図6にその要部断
面図を示すように、一組の発光素子21および受光素子
22を、エポキシ樹脂等からなる透明樹脂23により封
止し、さらに、この透明樹脂23をエポキシ樹脂等から
なる不透光性樹脂24により覆った後に、透明樹脂23
および不透光性樹脂24を、発光素子21と受光素子2
2とを分断するように切欠いて断面視凹形状の溝部25
を形成したものである。不透光性樹脂24は、発光素子
21および受光素子22の上方において互いに向き合う
ような曲面部26、27を有しており、発光素子21か
らの光をこの曲面部26で一旦反射させて溝部25内を
通過させた後に曲面部27で受光素子22に向けて再度
反射させている。
2. Description of the Related Art Conventionally, as an optical semiconductor device used as a sensor for an automatic control device, a "photointerrupter" disclosed in Japanese Patent Laid-Open No. 63-240082 is already known. This photo interrupter has a set of a light emitting element 21 and a light receiving element 22 sealed with a transparent resin 23 made of epoxy resin or the like, as shown in FIG. After being covered with the non-translucent resin 24 made of epoxy resin or the like, the transparent resin 23
And the non-translucent resin 24 for the light emitting element 21 and the light receiving element 2
2 is cut away so as to divide the groove 2 from the groove portion 25 having a concave sectional view.
Is formed. The non-translucent resin 24 has curved surface portions 26 and 27 which face each other above the light emitting element 21 and the light receiving element 22, and the light from the light emitting element 21 is once reflected by the curved surface portion 26 to form a groove portion. After passing through 25, the curved surface 27 reflects the light again toward the light receiving element 22.

【0003】このような構成の光半導体装置では、発光
素子21からの受光素子22に向けて照射される光が、
溝部25内に侵入する物体(図示せず)により遮断され
て受光素子22の受光量が変化する、この受光量の変化
で物体の移動位置を認識している。このため、発光素子
21は常に受光素子22に向けて光を照射した状態で溝
部25に侵入する物体を待ちかまえている。このよう
に、常に発光状態に維持されている発光素子21は、そ
の寿命による交換の頻度が非常に多くなるので、その交
換の都度ホトインタラプタ自体の取付位置の調整をしな
ければならず、作業性は非常に悪くなる。このため、発
光素子21をその発光量が出来るだけ少ない状態で使用
して寿命時間を延ばし、交換の頻度を少なくするといっ
たことが望まれている。
In the optical semiconductor device having such a structure, the light emitted from the light emitting element 21 toward the light receiving element 22 is
The light receiving amount of the light receiving element 22 is changed by being blocked by an object (not shown) entering the groove portion 25, and the movement position of the object is recognized by the change of the light receiving amount. For this reason, the light emitting element 21 is always waiting for an object that enters the groove 25 while irradiating the light receiving element 22 with light. As described above, since the light emitting element 21 which is always kept in the light emitting state has a very high frequency of replacement due to its life, it is necessary to adjust the mounting position of the photo interrupter itself each time the replacement is performed. The sex becomes very bad. For this reason, it is desired to use the light emitting element 21 in a state where the amount of emitted light is as small as possible to extend the life time and reduce the frequency of replacement.

【0004】このように発光素子21をその発光量が少
ない状態で使用するに際しては、受光素子22への受光
量が必然的に少なくなるので、発光素子21からの光を
受光素子22においてより効率的に受光しなければなら
ない。
As described above, when the light emitting element 21 is used with a small amount of light emission, the amount of light received by the light receiving element 22 is inevitably small, so that the light from the light emitting element 21 is more efficiently received by the light receiving element 22. Have to receive light.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記従
来の構成を有する光半導体装置においては、透明樹脂2
3および不透光性樹脂24が一体的に成形されているの
で、これらの成形時に、発光素子21からの光を受光素
子22において効率よく受光させるための曲面部26に
対する発光素子21の位置ずれ、および/または曲面部
27に対する受光素子22の位置ずれが生じた際に、発
光素子21からの光を効率よく受光させるための曲面部
26に対する発光素子21の位置調整、曲面部27に対
する受光素子22の位置調整することが不可能であり、
受光素子22での受光率が低くなるのを防ぐために、発
光素子21の発光量を多くして受光素子22での受光量
を多くせざるを得ないため、寿命時間が短くなり、上記
のような交換の頻度が多くなるという問題を解決するに
は至らなかった。
However, in the optical semiconductor device having the above conventional structure, the transparent resin 2 is used.
3 and the opaque resin 24 are integrally molded, the positional deviation of the light emitting element 21 with respect to the curved surface portion 26 for allowing the light receiving element 22 to efficiently receive the light from the light emitting element 21 at the time of molding them. , And / or the light receiving element 22 is displaced relative to the curved surface portion 27, the position of the light emitting element 21 is adjusted with respect to the curved surface portion 26 so that the light from the light emitting element 21 can be efficiently received. It is impossible to adjust the position of 22,
In order to prevent the light receiving rate of the light receiving element 22 from decreasing, the light emitting amount of the light emitting element 21 must be increased to increase the light receiving amount of the light receiving element 22. We could not solve the problem of frequent frequent replacement.

【0006】本発明は、以上のような状況下において考
え出されたもので、発光素子からの光を効率的に受光素
子に受光させることの可能な光半導体装置を提供するこ
とを目的とする。
The present invention has been conceived under the above circumstances, and it is an object of the present invention to provide an optical semiconductor device in which light from a light emitting element can be efficiently received by a light receiving element. .

【0007】[0007]

【課題を解決するための手段】この課題を解決するため
に本発明は、基板と、該基板上に所定間隔離間させて設
けた発光素子および受光素子と、該基板を収納し且つ発
光素子からの光を連続的に反射させる反射部を有する収
納体と、を備えた光半導体装置であって、発光素子、受
光素子および基板を一体的に形成した形成体を、収納体
に着脱自在に取着していることを特徴とする光半導体装
置を提供するものである。
In order to solve this problem, the present invention is directed to a substrate, a light emitting element and a light receiving element provided on the substrate with a predetermined space therebetween, and a light emitting element that accommodates the substrate. And a container having a reflecting portion that continuously reflects the light of the above, wherein a formed body in which a light emitting element, a light receiving element, and a substrate are integrally formed is detachably attached to the container. The present invention provides an optical semiconductor device characterized by being worn.

【0008】また、本発明は、更に収納体の、発光素子
と受光素子との間に位置する部位に遮蔽部を設けたこと
を特徴とする上記の光半導体装置を提供するものであ
る。
Further, the present invention provides the above-mentioned optical semiconductor device, characterized in that a shielding portion is provided in a portion of the housing located between the light emitting element and the light receiving element.

【0009】[0009]

【発明の作用および効果】本発明によれば、発光素子、
受光素子および基板を一体的に形成した形成体を、収納
体に着脱自在に取着しているので、収納体の反射部に対
する発光素子および受光素子の位置を自在に調整するこ
とが可能であるため、形成体を発光素子からの光が最も
効率的に受光素子に受光される位置で収納体に取着し得
る。
According to the present invention, a light emitting device,
Since the formed body in which the light receiving element and the substrate are integrally formed is detachably attached to the housing, it is possible to freely adjust the positions of the light emitting element and the light receiving element with respect to the reflecting portion of the housing. Therefore, the formed body can be attached to the housing body at a position where the light from the light emitting element is most efficiently received by the light receiving element.

【0010】従って、本発明の光半導体装置によれば、
発光素子から照射される光を少量に抑えた状態で受光素
子での受光を可能にしたので、長時間継続使用が可能と
なり交換の頻度を極めて少なくし得るとともに、交換に
伴う位置調整等の面倒な作業を極力減らすことができ
る。また、発光素子の寿命にともなう交換を、光半導体
装置全体を取り替えること無く、形成体を取り替えるの
みで行うことができる。
Therefore, according to the optical semiconductor device of the present invention,
Since the light received by the light receiving element can be received while the light emitted from the light emitting element is suppressed to a small amount, it can be used continuously for a long time and the frequency of replacement can be extremely reduced, and the trouble of position adjustment etc. accompanying replacement It is possible to reduce the amount of work required. Further, the replacement of the light emitting element over the life of the light emitting element can be performed only by replacing the formed body without replacing the entire optical semiconductor device.

【0011】さらに、本発明の光半導体装置は、収納体
の、発光素子と受光素子との間に位置する部位に遮蔽部
を設けた場合には、発光素子から反射部に向かわずに直
接受光素子方向へ向かおうとする光を強制的に反射部へ
と誘導することができるので、受光素子においてより効
率的に受光することが可能となる。
Further, in the optical semiconductor device of the present invention, when a shielding portion is provided at a portion of the housing located between the light emitting element and the light receiving element, the light receiving element directly receives light without going to the reflecting portion. Since the light that is going to the element direction can be forcibly guided to the reflecting portion, it becomes possible to more efficiently receive the light in the light receiving element.

【0012】[0012]

【実施例】以下、本発明の一実施例を、光半導体装置と
してホトインタラプタを例にとり、図1乃至図5を参照
しつつ説明するが、本発明はこれに限定されることはな
い。図1は、ホトインタラプタを示す要部組立図であ
り、また、図2は、ホトインタラプタを示す一部切欠き
断面図である。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below by taking a photo interrupter as an optical semiconductor device with reference to FIGS. 1 to 5, but the present invention is not limited to this. FIG. 1 is a main part assembly view showing a photo interrupter, and FIG. 2 is a partially cutaway sectional view showing the photo interrupter.

【0013】このホトインタラプタは、エポキシ樹脂か
らなる透明状の形成体1と、この形成体1を収納するた
めのエポキシ樹脂からなる黒色状の収納体2とを備えて
なるものである。形成体1は、その内部にアルミナセラ
ミックからなる基板3を封止したものである。基板3
は、その表面上に、所定の配線パターン(図示せず)が
形成されており、この配線パターン上の所定位置に、発
光素子4、受光素子5および抵抗器6がそれぞれ搭載さ
れている。発光素子4は、光を発する素子であり、受光
素子5は発光素子4から照射される光を受光する素子で
ある。発光素子4の発光面および受光素子5の受光面
は、図中の上方向に向いた状態となっている。抵抗器6
は、発光素子4から照射される光の量(光量)を調整す
るためのものであり、基板3の配線パターン上に搭載さ
れている。また、基板3の端部には、複数本の外部接続
用のコネクタピン7が、上記配線パターンに電気的に接
続されており、これらコネクタピン7は、形成体1の端
面にまで届いている。
The photointerrupter comprises a transparent molded body 1 made of an epoxy resin and a black storage body 2 made of an epoxy resin for housing the molded body 1. The formed body 1 has a substrate 3 made of alumina ceramic sealed therein. Board 3
Has a predetermined wiring pattern (not shown) formed on its surface, and the light emitting element 4, the light receiving element 5, and the resistor 6 are mounted at predetermined positions on the wiring pattern. The light emitting element 4 is an element that emits light, and the light receiving element 5 is an element that receives the light emitted from the light emitting element 4. The light emitting surface of the light emitting element 4 and the light receiving surface of the light receiving element 5 are oriented in the upward direction in the drawing. Resistor 6
Is for adjusting the amount of light (light amount) emitted from the light emitting element 4, and is mounted on the wiring pattern of the substrate 3. In addition, a plurality of connector pins 7 for external connection are electrically connected to the wiring pattern at the end portion of the substrate 3, and these connector pins 7 reach the end surface of the formed body 1. .

【0014】収納体2は、中央に溝部8を有する断面視
凹形状のものであり、内部に空洞部9(この空洞部9が
光の経路となる)を有する中抜きの容器状となってい
る。また、溝部8に向きあう左右両側面には、略長方形
状の穴10、11がそれぞれ穿設されている。さらに、
この穴10、11に臨む空洞部9の内壁面は、それぞれ
傾斜形状となっている(この傾斜面が光の反射部となる
・以下内壁面を反射部12、13と称す)。
The housing 2 has a concave shape in cross section having a groove 8 in the center, and has a hollow container shape having a cavity 9 (the cavity 9 serves as a light path) inside. There is. Further, substantially rectangular holes 10 and 11 are formed on both left and right side surfaces facing the groove portion 8, respectively. further,
The inner wall surfaces of the cavity portion 9 facing the holes 10 and 11 are respectively inclined (the inclined surfaces serve as light reflecting portions; hereinafter, the inner wall surfaces are referred to as reflecting portions 12 and 13).

【0015】このような構造の収納体2は、上記形成体
1をその発光素子4等の搭載面が上方に向いた状態で嵌
着するようにして収納している。本実施例における上記
収納方法は、収納体2の下面に形成された凹部14を利
用する。この凹部14に面する左右両側面には、突起部
15が向かい合うように設けられている。形成体1は、
この突起部15を突き上げるようにして押し込み嵌着さ
れている。なお、形成体1は、収納部2に対する上下方
向が位置決めされているが、左右方向(図1中のA方
向)にはある程度の力を強制的に加えれば動く状態とな
っている。形成体1は、この状態を利用して左右方向に
動かし、発光素子4および受光素子5が空洞部9に対向
する最も良い位置にくるように微調整されている。
In the housing 2 having such a structure, the above-mentioned formed body 1 is housed so that the mounting surface of the light emitting element 4 and the like faces upward. The storage method in this embodiment utilizes the recess 14 formed on the lower surface of the storage body 2. Protrusions 15 are provided on both left and right side surfaces facing the recess 14 so as to face each other. The formed body 1 is
The protrusion 15 is pushed in so as to be pushed up. The formed body 1 is positioned in the up-down direction with respect to the storage portion 2, but is in a state of being moved in the left-right direction (direction A in FIG. 1) by forcibly applying a certain amount of force. Using this state, the forming body 1 is moved in the left-right direction, and is finely adjusted so that the light emitting element 4 and the light receiving element 5 are located at the best position facing the cavity 9.

【0016】このような構成のホトインタラプタにおい
て、発光素子4から照射される光は、空洞部9を通って
反射部12にて反射して穴10から放射され、さらに溝
部8を通過して穴11に入り込み、再度反射部13に連
続的に反射して空洞部9を通って受光素子5へ確実に受
光される(図2中において二点鎖線が典型的な光路であ
る)。
In the photo interrupter having such a structure, the light emitted from the light emitting element 4 passes through the cavity 9 and is reflected by the reflecting portion 12 to be radiated from the hole 10, and further passes through the groove portion 8 and the hole. 11 enters, is continuously reflected again by the reflecting portion 13, passes through the hollow portion 9, and is reliably received by the light receiving element 5 (the chain double-dashed line in FIG. 2 is a typical optical path).

【0017】従って、このホトインタラプタでは、発光
素子4、受光素子5および基板3を一体的に形成(ユニ
ット化)した形成体1を、収納体2に着脱自在に取着し
ているので、収納体2の反射部12に対する発光素子4
および反射部13に対する受光素子5の位置を自在に調
整することが可能であるため、形成体1を発光素子4か
らの光が最も効率的に受光素子5に受光される位置で収
納体2に取着し得る。
Therefore, in this photo interrupter, since the formed body 1 in which the light emitting element 4, the light receiving element 5 and the substrate 3 are integrally formed (unitized) is detachably attached to the storage body 2, it is stored. Light-emitting element 4 for reflecting portion 12 of body 2
Since the position of the light receiving element 5 with respect to the reflecting portion 13 can be freely adjusted, the forming body 1 is placed in the housing body 2 at a position where the light from the light emitting element 4 is most efficiently received by the light receiving element 5. Can be attached.

【0018】それ故に、このホトインタラプタは、発光
素子4から照射される光の量を少量に抑えた状態での受
光素子5の受光を可能にしたので、長時間継続使用が可
能となり交換の頻度を極めて少なくし得るとともに、交
換に伴う位置調整等の面倒な作業を極力減らすことがで
きる。また、発光素子4の寿命にともなう交換を、形成
体1を取り替えるのみで行うことができる。
Therefore, since this photo interrupter enables the light receiving element 5 to receive light while the amount of light emitted from the light emitting element 4 is suppressed to a small amount, it can be used continuously for a long time and the frequency of replacement is high. It is possible to extremely reduce the number of operations, and it is possible to reduce troublesome work such as position adjustment accompanying replacement as much as possible. In addition, the replacement of the light emitting element 4 over the life of the light emitting element 4 can be performed only by replacing the forming body 1.

【0019】本実施例においては、形成体1を突起部1
5で嵌着することにより収納体2に収納しているが、こ
れに限定するものでなく、形成体1を収納体2に着脱自
在に取着しているものであればよく、図3に示すよう
に、収納体2にネジ穴を穿設してこのネジ穴にボルトネ
ジ16等を螺着することにより形成体1を押圧する等、
機械的に取着してもよい。
In the present embodiment, the formed body 1 is replaced by the protrusion 1
Although it is accommodated in the storage body 2 by being fitted at 5, it is not limited to this, and it is sufficient if the formation body 1 is detachably attached to the storage body 2, as shown in FIG. As shown, the housing 2 is provided with a screw hole, and a bolt screw 16 or the like is screwed into the screw hole to press the forming body 1.
It may be attached mechanically.

【0020】また、図4に示すように、本実施例におけ
る形成体1を、その発光素子4と受光素子5との間に位
置する部位に断面視凹形状の切り欠き部17を設け、こ
の切り欠き部17を収納体2の溝部8にはめ込むように
して収納体1に取着すれば、発光素子4から直接受光素
子5に向かおうとする光を、収納体2の内側面18にて
反射して強制的に反射部12へと誘導することができる
ので、この内側面18が発光素子4と受光素子5との遮
蔽部の役目を果たすことになり、受光素子5へ向けてよ
り効率的に受光させることが可能となる(図4中の斜線
部が形成体)。
Further, as shown in FIG. 4, the formed body 1 in this embodiment is provided with a notch 17 having a concave sectional view in a portion located between the light emitting element 4 and the light receiving element 5. If the notch 17 is fitted into the groove 8 of the housing 2 and attached to the housing 1, the light that is going to go directly from the light emitting element 4 to the light receiving element 5 is transmitted to the inner surface 18 of the housing 2. Since the light can be reflected and forcibly guided to the reflecting portion 12, the inner side surface 18 serves as a shielding portion between the light emitting element 4 and the light receiving element 5, and the efficiency toward the light receiving element 5 is improved. It is possible to selectively receive the light (the shaded portion in FIG. 4 is the forming body).

【0021】さらに、本実施例においては、反射部12
が平面状となっているが、これに限定するものでなく、
曲面状のものでもよい。加えて、本実施例においては、
形成体1の発光素子4および受光素子5の上方に位置す
る部位を、図5に示すように、曲面状にすれば集光性が
より向上する。また、本実施例においては、形成体1を
略直方体状としているが、これに限定するものでない。
Further, in this embodiment, the reflecting portion 12
Is flat, but is not limited to this,
It may be curved. In addition, in this embodiment,
When the portion of the formed body 1 located above the light emitting element 4 and the light receiving element 5 is curved as shown in FIG. 5, the light collecting property is further improved. Further, in the present embodiment, the formed body 1 has a substantially rectangular parallelepiped shape, but the present invention is not limited to this.

【0022】さらに、本実施例においては、エポキシ樹
脂により形成体1および収納体2を形成しているが、こ
れに限定するものでない。
Further, in this embodiment, the forming body 1 and the containing body 2 are formed of epoxy resin, but the present invention is not limited to this.

【図面の簡単な説明】[Brief description of drawings]

【図1】本実施例のホトインタラプタを示す要部組立図
である。
FIG. 1 is an essential part assembly view showing a photo interrupter of the present embodiment.

【図2】本実施例のホトインタラプタを示す一部切欠き
断面図である。
FIG. 2 is a partially cutaway sectional view showing a photo interrupter of the present embodiment.

【図3】本実施例のホトインタラプタにおいて、形成体
をボルトネジ等により機械的に収納体に取着した状態を
説明するための説明図である。
FIG. 3 is an explanatory diagram for explaining a state in which the forming body is mechanically attached to the storage body by a bolt screw or the like in the photo interrupter of the present embodiment.

【図4】本発明のホトインタラプタにおいて、発光素子
と受光素子との間に遮蔽部を設けた状態を説明するため
の説明図である。
FIG. 4 is an explanatory diagram for explaining a state in which a shielding portion is provided between a light emitting element and a light receiving element in the photo interrupter of the present invention.

【図5】本発明のホトインタラプタにおいて、形成体の
発光素子および受光素子のそれぞれ上方に位置する部位
が曲面状となっているものを説明するための説明図であ
る。
FIG. 5 is an explanatory diagram for explaining a photointerrupter of the present invention in which the portions of the formed body located above the light emitting element and the light receiving element are curved.

【図6】従来の光半導体装置を示す要部断面図である。FIG. 6 is a cross-sectional view of essential parts showing a conventional optical semiconductor device.

【符号の説明】[Explanation of symbols]

1 形成体 2 収納体 3 基板 4 発光素子 5 受光素子 6 抵抗器 7 コネクタピン 8 溝部 9 空洞部 10 穴 11 穴 12 反射部 13 反射部 14 凹部 15 突起部 16 ボルトネジ 17 切り欠き部 1 Forming Body 2 Housing 3 Substrate 4 Light Emitting Element 5 Light Receiving Element 6 Resistor 7 Connector Pin 8 Groove 9 Groove 10 Hole 11 Hole 12 Reflector 13 Reflector 14 Recess 15 Protrusion 16 Bolt Screw 17 Notch

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 基板と、該基板上に所定間隔離間させて
設けた発光素子および受光素子と、該基板を収納し且つ
発光素子からの光を連続的に反射させる反射部を有する
収納体と、を備えた光半導体装置であって、 前記発光素子、前記受光素子および前記基板を一体的に
形成した形成体を、前記収納体に着脱自在に取着してい
ることを特徴とする光半導体装置。
1. A substrate, a light emitting element and a light receiving element provided on the substrate at a predetermined distance from each other, and an accommodation body having the substrate and having a reflecting portion for continuously reflecting light from the light emitting element. An optical semiconductor device comprising: a light emitting element, a light receiving element, and a substrate integrally formed with the formed body, which is detachably attached to the housing body. apparatus.
【請求項2】 前記収納体の、発光素子と受光素子との
間に位置する部位に遮蔽部を設けたことを特徴とする請
求項1に記載の光半導体装置。
2. The optical semiconductor device according to claim 1, wherein a shielding portion is provided in a portion of the housing body located between the light emitting element and the light receiving element.
JP26251694A 1994-10-26 1994-10-26 Optical semiconductor device Pending JPH08125218A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26251694A JPH08125218A (en) 1994-10-26 1994-10-26 Optical semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26251694A JPH08125218A (en) 1994-10-26 1994-10-26 Optical semiconductor device

Publications (1)

Publication Number Publication Date
JPH08125218A true JPH08125218A (en) 1996-05-17

Family

ID=17376895

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26251694A Pending JPH08125218A (en) 1994-10-26 1994-10-26 Optical semiconductor device

Country Status (1)

Country Link
JP (1) JPH08125218A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635852B2 (en) 2006-12-14 2009-12-22 Sharp Kabushiki Kaisha Optical coupler with first and second division connector portion
KR20100006905A (en) * 2008-07-10 2010-01-22 카오스 (주) Transmission type photo interrupter
TWI638175B (en) * 2015-03-26 2018-10-11 日商精工愛普生股份有限公司 Electronic component conveying device, electronic component inspection device, positioning device for electronic components, and positioning method of electronic component conveying device
CN112526627A (en) * 2019-08-29 2021-03-19 佳能株式会社 Optical sensor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7635852B2 (en) 2006-12-14 2009-12-22 Sharp Kabushiki Kaisha Optical coupler with first and second division connector portion
KR20100006905A (en) * 2008-07-10 2010-01-22 카오스 (주) Transmission type photo interrupter
TWI638175B (en) * 2015-03-26 2018-10-11 日商精工愛普生股份有限公司 Electronic component conveying device, electronic component inspection device, positioning device for electronic components, and positioning method of electronic component conveying device
CN112526627A (en) * 2019-08-29 2021-03-19 佳能株式会社 Optical sensor

Similar Documents

Publication Publication Date Title
US5130761A (en) Led array with reflector and printed circuit board
US6641287B2 (en) Reflective type light-emitting diode
US20070081313A1 (en) Surface mounting semiconductor device
JP2005322911A (en) Assembly containing optical components and assembly method therefor
KR20060050580A (en) Light-emitting module and lamp
WO2005060376B1 (en) Led lighting assembly
JP2006185918A (en) Led bulb
JPH07235207A (en) Back light
KR100326891B1 (en) Method of making optical module
JPH10321900A (en) Optical module
US5675143A (en) Proximity switch
JP3149401B2 (en) LED and lighting device using the same
JP2000022892A (en) Line light source and image input device
US7677776B2 (en) Lighting device for vehicle and door mirror device
JPH08125218A (en) Optical semiconductor device
JPH0418771A (en) Light emitting diode array device
JP2007059618A (en) Led light fixture
US5365534A (en) Injection laser and photosensor assembly
JPH1155456A (en) Image reader
US20040141699A1 (en) Optical module
CN108431490B (en) Lighting arrangement with accurate optical element positioning
JP3113392B2 (en) Complete contact image sensor
JP3058770B2 (en) Image sensor
JPS6459303A (en) Optical coupling part for optical waveguide and light receiving/emitting element
JP4086959B2 (en) Signal device with light emitting diode