JP6236130B2 - Photo interrupter and mounting structure of photo interrupter - Google Patents

Description

  The present invention relates to a photo interrupter and a photo interrupter mounting structure.

  Conventionally, a transmissive photo interrupter is known. Such a photo interrupter is described in Patent Document 1, for example. The photo interrupter described in the document includes an insulating substrate, a light emitting element, a light receiving element, two transparent sealing bodies, and an opaque cap body. The light emitting element and the light receiving element are disposed on an insulating substrate. One of the two transparent sealing bodies covers the light emitting element, and the other of the two transparent sealing bodies covers the light receiving element. The opaque cap body covers each transparent sealing body.

  In such a photo interrupter, the opaque cap body is formed by resin molding. Since the cap body formed by resin molding is relatively thick, it is a factor that hinders downsizing of the photo interrupter.

JP 2006-303183 A

  The present invention has been conceived under the circumstances described above, and its main object is to provide a photo interrupter that can be miniaturized.

  According to the first aspect of the present invention, a base material, a light emitting element arranged on the base material, a light receiving element arranged on the base material, and a translucent light receiving side resin portion covering the light receiving element A light-transmitting light-emitting side resin portion that covers the light-emitting element, and a light-shielding film that covers the light-receiving side resin portion and the light-emitting side resin portion, and the light-emitting side resin portion is the light-receiving side resin portion The light receiving side resin portion has a light incident surface exposed from the light shielding film, and the light emitting side resin portion has a light emitting surface exposed from the light shielding film. A photo interrupter is provided in which both the light incident surface and the light emitting surface face the gap.

  Preferably, the light shielding film has a thickness of 0.01 to 100 μm.

  Preferably, the light-shielding film has a base material covering portion that covers the base material and faces the gap, and the light emitting surface and the light incident surface are both in the thickness direction of the base material. It is spaced apart from the substrate covering portion.

  Preferably, the light-receiving side resin portion includes a light-receiving side base portion that covers the light-receiving element, and the light-receiving side base portion is in contact with the base material.

  Preferably, the light receiving side resin portion includes a light receiving side protruding portion protruding from the light receiving side base portion on a side where the light emitting side resin portion is located, and the light receiving side protruding portion is in contact with the base material.

Preferably, in the second direction orthogonal to both the first direction and the thickness direction of the base material, the dimension of the light receiving side protrusion is larger than the dimension of the light receiving element.

  Preferably, the light receiving side protruding portion has a light receiving side protruding portion side surface facing a side where the light emitting side resin portion is located.

  Preferably, the side surface of the light receiving side projecting portion is inclined with respect to the thickness direction of the base material so as to go to a side opposite to the side where the light emitting side resin portion is located as the distance from the base material increases.

  Preferably, the light receiving side resin portion includes a light receiving side raised portion that protrudes from the light receiving side base portion on a side where the light emitting side resin portion is positioned, and the light receiving side raised portion constitutes the light incident surface. The light receiving side protruding portion has a light receiving side communication surface connected to the side surface of the light receiving side protruding portion and the light receiving side base portion, and the light receiving side raised portion protrudes from the light receiving side communication surface.

  Preferably, the light receiving side resin portion includes a light receiving side raised portion that protrudes from the light receiving side base portion on a side where the light emitting side resin portion is located, and the light receiving side raised portion constitutes the light incident surface. .

  Preferably, the light receiving side base portion has a light receiving side base side surface facing a side where the light emitting side resin portion is positioned, and at least a part of the light receiving side base portion side surface is separated from the base material more than the light incident surface. Located on the side.

  Preferably, the light incident surface has a first incident portion facing the side where the light emitting side resin portion is located, and a second incident portion disposed at a position closer to the light emitting side resin portion than the first incident portion. And the second incident portion faces a direction different from the direction of the first incident portion.

  Preferably, the second incident portion faces the same direction as the direction from the base material toward the light-receiving side resin portion in the thickness direction of the base material.

  Preferably, the second incident portion is inclined with respect to the thickness direction of the base material so as to go to a side opposite to the side where the light emitting side resin portion is located as the distance from the base material increases.

  Preferably, the light emitting side resin portion includes a light emitting side base portion that covers the light emitting element, and the light emitting side base portion is in contact with the base material.

  Preferably, the light emitting side resin portion includes a light emitting side protruding portion protruding from the light emitting side base portion on a side where the light receiving side resin portion is located, and the light emitting side protruding portion is in contact with the base material.

  Preferably, the light emitting side resin portion includes a light emitting side raised portion that protrudes from the light emitting side base portion on a side where the light receiving side resin portion is located, and the light emitting side raised portion constitutes the light emitting surface. Yes.

  Preferably, the light emitting surface has a first emitting part facing the side where the light receiving side resin part is located, and a second emitting part arranged closer to the light receiving side resin part than the first emitting part. The second emission part faces in a direction different from the direction in which the first emission part faces.

  Preferably, the light shielding film is black or gray.

  Preferably, the light shielding film includes a first layer in contact with at least one of the light receiving side resin portion and the light emitting side resin portion, and a second layer laminated on the first layer, and the first layer Is made of metal, and the second layer is made of an oxide of the metal.

Preferably, a light-transmitting undercoat layer is further provided between the light shielding film and at least one of the light receiving side resin portion and the light emitting side resin portion.

  Preferably, the light emission side resin part includes a light emission side base part in contact with the base material, and the light emission side base part has a first light emission side base outer surface.

  Preferably, the light emitting surface is positioned between the first light emitting side base outer surface and the light incident surface, and the undercoat layer covers the first light emitting side base outer surface.

  Preferably, the undercoat layer covers all regions of the light emitting side resin portion other than the light emitting surface and a region in contact with the base material.

  Preferably, the outer surface of the first light emission side base portion includes a first light emission side inclined portion and a second light emission side inclined portion that are inclined with respect to the thickness direction of the base material, and the first light emission side inclined portion. Is located on the side farther from the base material than the second light emission side inclined portion, and is located between the second light emission side inclined portion and the light emitting surface in a plan view of the base material. The angle formed between the first light emitting side inclined portion and the thickness direction is larger than the angle formed between the second light emitting side inclined portion and the thickness direction.

  Preferably, the outer surface of the first light emitting side base portion has a light emitting side connecting portion connected to the first light emitting side inclined portion and the second light emitting side inclined portion, and the light emitting side connecting portion is inclined to the first light emitting side inclined portion. The angle formed between the light emitting side connecting portion and the thickness direction is smaller than the angle formed between the second light emitting side inclined portion and the thickness direction.

  Preferably, the light-emitting side base has a second light-emitting side base outer surface, and the second light-emitting side base outer surface has a first direction and a thickness direction of the base material in a plan view of the base material. Located on the second direction side orthogonal to any direction, the second light emitting side base outer surface is inclined with respect to the thickness direction of the substrate.

  Preferably, the light emitting side base includes a first light emitting side top surface, a second light emitting side top surface, and a light emitting side connection surface, and the first light emitting side top surface and the second light emitting side top surface. Each facing the side opposite to the side where the substrate is located, and the light emitting side connecting surface connects the first light emitting side top surface and the second light emitting side top surface, and the first light emitting side top surface The surface and the second light emitting side top surface are separated in a second direction orthogonal to both the first direction and the thickness direction, and the minimum dimension of the light emitting side connection surface in the first direction is: It is smaller than both the dimension in the first direction of the first light emission side top surface and the dimension in the first direction of the second light emission side top surface.

  Preferably, the first light emitting side base outer surface is inclined with respect to the thickness direction of the base so as to be closer to the light receiving side resin portion as the distance from the base is increased, and the first light emitting side base outer surface is The substrate is located between the first light emitting side top surface and the second light emitting side top surface when viewed in the thickness direction of the substrate.

  Preferably, the light receiving side base includes a first light receiving side top surface, a second light receiving side top surface, and a light receiving side connection surface, and the first light receiving side top surface and the second light receiving side top surface. Each facing the side opposite to the side where the substrate is located, and the light receiving side connecting surface connects the first light receiving side top surface and the second light receiving side top surface, and the first light receiving side top surface The surface and the second light receiving side top surface are separated in a second direction orthogonal to both the first direction and the thickness direction, and the minimum dimension of the light receiving side connection surface in the first direction is: It is smaller than both the dimension in the first direction of the first light receiving side top surface and the dimension in the first direction of the second light receiving side top surface.

Preferably, the light receiving side resin portion includes a light receiving side base portion, the light receiving side base portion has a first light receiving side base outer surface, and the first light receiving side base outer surface is separated from the base material as the light emitting side is separated. The first light-receiving side base outer surface is inclined with respect to the thickness direction of the base material so as to approach the resin portion, and the first light-receiving side top surface and the first light-receiving side top surface in the thickness direction view of the base material 2 Located between the light receiving side top surfaces.

  Preferably, the first light receiving side top surface, the second light receiving side top surface, the first light emitting side top surface, and the second light emitting side top surface are all located on the same plane.

  Preferably, the light receiving side resin portion includes a light receiving side base portion in contact with the base material, and the light receiving side base portion has a first light receiving side base outer surface.

  Preferably, the light incident surface is located between the first light receiving side base outer surface and the light emitting surface, and the undercoat layer covers the first light receiving side base outer surface.

  Preferably, the undercoat layer covers all regions of the light receiving side resin portion other than the light incident surface and a region in contact with the base material.

  Preferably, the outer surface of the first light receiving side base portion includes a first light receiving side inclined portion and a second light receiving side inclined portion which are inclined with respect to the thickness direction of the base material, and the first light receiving side inclined portion is provided. Is positioned farther from the substrate than the second light-receiving side inclined portion, and is positioned between the second light-receiving side inclined portion and the light incident surface in a plan view of the substrate. The angle formed between the first light receiving side inclined portion and the thickness direction is larger than the angle formed between the second light receiving side inclined portion and the thickness direction.

  Preferably, the outer surface of the first light receiving side base portion includes a light receiving side connecting portion connected to the first light receiving side inclined portion and the second light receiving side inclined portion, and the light receiving side connecting portion is inclined to the first light receiving side inclined portion. The angle formed between the light receiving side connecting portion and the thickness direction is smaller than the angle formed between the second light receiving side inclined portion and the thickness direction.

  Preferably, the light-receiving side base portion has a second light-receiving side base outer surface, and the second light-receiving side base outer surface is formed between the first direction and the thickness direction of the base material in a plan view of the base material. Located on the second direction side orthogonal to any direction, the second light receiving side base outer surface is inclined with respect to the thickness direction of the substrate.

  Preferably, the base material includes a substrate having a main surface and a back surface, a main surface electrode formed on the main surface, and a back electrode formed on the back surface.

  Preferably, the main surface electrode has a light receiving side die pad on which the light receiving element is disposed, and the light incident surface is disposed at a position overlapping the light receiving side die pad in the thickness direction of the base material. Yes.

  Preferably, the base material includes a communication electrode connected to the main surface electrode and the back surface electrode.

  Preferably, the connection electrode penetrates the substrate.

  Preferably, the substrate has a rectangular shape, and the substrate is formed with a corner groove positioned at a corner of the substrate in the thickness direction of the base material, and the communication electrode is formed in the corner groove. Is formed.

  According to a second aspect of the present invention, there is provided a photo interrupter provided by the first aspect of the present invention, a mounting substrate, and a solder layer interposed between the mounting substrate and the photo interrupter. An interrupter mounting structure is provided.

  According to a third aspect of the present invention, using a surface treatment technique, the step of disposing a light emitting element and a light receiving element on a base material, the step of forming a translucent translucent resin body on the base material, Forming a light-shielding film that covers the light-transmitting resin body, and in the step of forming the light-transmitting resin body, the light-emitting side resin portion that covers the light-emitting element, and the light-emitting side resin that covers the light-receiving element A light-receiving-side resin portion that is spaced apart from the portion through a gap, and forming a light-emitting surface that is exposed from the light-shielding film and faces the gap on the light-emitting-side resin portion; and the light-receiving-side resin portion And a step of forming a light incident surface exposed from the light shielding film and facing the gap.

  Preferably, any one of painting, printing, vapor deposition, ion plating, sputtering, and plating is used as the surface treatment technique.

  Preferably, in the step of forming the light shielding film, the light shielding film is formed in a region sandwiched between the light emitting side resin portion and the light receiving side resin portion of the base material.

  Preferably, in the step of forming the light receiving side resin portion, a light receiving side base portion that covers the light receiving element and a light receiving side raised portion that protrudes from the light receiving side base portion are formed on the base material, and the light incident surface In the step of forming, after the step of forming the light shielding film, a part of the light shielding film and a part of the light receiving side raised portion are removed.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

It is sectional drawing which shows the mounting structure of the photo interrupter of 1st Embodiment of this invention. It is a perspective view which shows the photo interrupter of 1st Embodiment of this invention. It is a top view which shows the photo interrupter of 1st Embodiment of this invention. FIG. 4 is a plan view showing a part of the configuration of the photo interrupter shown in FIG. 3 in a transparent manner. FIG. 5 is a plan view in which a light receiving side resin portion, a light emitting side resin portion, a light shielding film, and a light transmitting resin portion are omitted from FIG. 4. It is a front view which shows the photo interrupter of 1st Embodiment of this invention. FIG. 7 is a left side view of the photo interrupter shown in FIG. 6. FIG. 7 is a right side view of the photo interrupter shown in FIG. 6. It is sectional drawing which follows the IX-IX line of FIG. 3, FIG. It is sectional drawing which follows the XX line of FIG. 3, FIG. It is sectional drawing which follows the XI-XI line of FIG. 3, FIG. It is sectional drawing which follows the XII-XII line | wire of FIG. 3, FIG. FIG. 7 is a bottom view of the photo interrupter shown in FIG. 6. It is a partial expanded sectional view which expands and shows a part of photo interrupter of 1st Embodiment of this invention. It is a top view which shows 1 process of the manufacturing process of the photo interrupter of 1st Embodiment of this invention. It is sectional drawing which follows the XVI-XVI line | wire of FIG. FIG. 16 is a plan view illustrating a process following the process in FIG. 15. It is sectional drawing which follows the XVIII-XVIII line of FIG. FIG. 18 is a plan view illustrating a process following the process in FIG. 17. It is sectional drawing which follows the XX-XX line of FIG. FIG. 20 is a plan view illustrating a process following the process in FIG. 19. It is sectional drawing which follows the XXII-XXII line | wire of FIG. It is sectional drawing which shows the formation method of a light-projection surface and a light-incidence surface. FIG. 22 is a plan view illustrating a process following the process in FIG. 21. It is sectional drawing which follows the XXV-XXV line | wire of FIG. It is a top view (partial composition perspective view) which shows the photo interrupter of the 1st modification of 1st Embodiment of this invention. FIG. 27 is a plan view in which a light receiving side resin portion, a light emitting side resin portion, a light shielding film, and a light transmitting resin portion are omitted from FIG. 26. FIG. 27 is a bottom view of the photo interrupter shown in FIG. 26. It is sectional drawing which shows the photo interrupter of the 2nd modification of 1st Embodiment of this invention. It is a partial expanded sectional view which expands and shows a part at the time of combining the structure of the 2nd modification of 1st Embodiment of this invention, and the structure of the 1st modification of 1st Embodiment of this invention. It is a top view (partial composition see-through) which shows the photo interrupter of the 3rd modification of 1st Embodiment of this invention. It is sectional drawing which shows the photo interrupter of the 4th modification of 1st Embodiment of this invention. It is sectional drawing which shows the photo interrupter of the 5th modification of 1st Embodiment of this invention. It is sectional drawing which follows the XXXIV-XXXIV line | wire of FIG. It is sectional drawing which follows the XXXV-XXXV line | wire of FIG. It is a perspective view which shows the photo interrupter of 2nd Embodiment of this invention. It is a front view which shows the photo interrupter of 2nd Embodiment of this invention. It is a top view which shows the photo interrupter of 2nd Embodiment of this invention. It is sectional drawing which follows the XXXIX-XXXIX line | wire of FIG. It is a partial expanded sectional view which expands and shows a part of FIG. It is a perspective view which shows the photo interrupter of the 1st modification of 2nd Embodiment of this invention. It is a front view which shows the photo interrupter of the 1st modification of 2nd Embodiment of this invention. It is a top view which shows the photo interrupter of the 1st modification of 2nd Embodiment of this invention. It is a perspective view which shows the photo interrupter of 3rd Embodiment of this invention. It is a front view which shows the photo interrupter of 3rd Embodiment of this invention. It is a top view which shows the photo interrupter of 3rd Embodiment of this invention. FIG. 46 is a left side view of the photo interrupter shown in FIG. 45. FIG. 46 is a right side view of the photo interrupter shown in FIG. 45. It is sectional drawing which shows the mounting state of the photo interrupter of 3rd Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings.

<First Embodiment>
1st Embodiment of this invention is described using FIGS.

FIG. 1 is a cross-sectional view showing a photo interrupter mounting structure of the present embodiment.

  A photointerrupter mounting structure 800 shown in FIG. 1 includes a photointerrupter 100, a mounting substrate 871, and a solder layer 872.

  The mounting board 871 is, for example, a printed wiring board. The mounting substrate 871 includes, for example, an insulating substrate and a pattern electrode (not shown) formed on the insulating substrate. The photo interrupter 100 is mounted on a mounting substrate 871. A solder layer 872 is interposed between the photo interrupter 100 and the mounting substrate 871. The solder layer 872 joins the photo interrupter 100 and the mounting substrate 871.

  FIG. 2 is a perspective view showing the photo interrupter of the present embodiment. FIG. 3 is a plan view showing the photo interrupter of the present embodiment. FIG. 4 is a plan view showing a part of the configuration of the photo interrupter shown in FIG. FIG. 5 is a plan view in which the light receiving side resin portion, the light emitting side resin portion, the light shielding film, and the light transmitting resin portion are omitted from FIG. FIG. 6 is a front view showing the photo interrupter of the present embodiment. FIG. 7 is a left side view of the photo interrupter shown in FIG. FIG. 8 is a right side view of the photo interrupter shown in FIG. 9 is a cross-sectional view taken along line IX-IX in FIGS. FIG. 10 is a cross-sectional view taken along line XX in FIGS. 3 and 4. 11 is a cross-sectional view taken along line XI-XI in FIGS. 3 and 4. 12 is a cross-sectional view taken along line XII-XII in FIGS. 3 and 4. FIG. 13 is a bottom view of the photointerrupter shown in FIG. FIG. 1 shows a cross section of the photo interrupter along the line II in FIGS.

  The photo interrupter 100 shown in these drawings includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin portion 3, a light emitting side resin portion 4, and a light transmitting resin portion 51 (FIGS. 3 and 4). The light shielding film 6 and a plurality of (two) wires 79 are provided. In FIGS. 2 to 4 and FIGS. 6 to 8, the portion exposed from the light shielding film 6 is shown by hatching. In FIG. 9, the hatching attached to the light-receiving side raised portion 34 (described later) indicates that it is exposed from the light shielding film 6, and the hatching attached to the base material 1 indicates a cross section. . Similarly, in FIG. 10, the hatching attached to the light emitting side raised portion 44 (described later) indicates that it is exposed from the light shielding film 6, and the hatching attached to the substrate 1 is a cross section. Show. The hatching attached | subjected to FIG. 11, FIG. 12 has shown that it is a cross section.

  The photo interrupter 100 is a transmissive photo interrupter. That is, the photo interrupter 100 detects whether or not the shielding member 811 (see FIG. 1) exists between the light receiving side resin portion 3 and the light emitting side resin portion 4.

  As shown in FIGS. 1, 3 to 5, and the like, the base material 1 includes a substrate 11, a main surface electrode 12, a back surface electrode 13, and a connection electrode 14.

  The substrate 11 is made of an insulating material. Such an insulating material is, for example, resin or ceramic. Examples of the resin include glass epoxy resin, bismaleimide-triazine resin, and polyphenylene ether (PPE) resin. Examples of the ceramic include alumina or aluminum nitride. The substrate 11 has a main surface 111, a back surface 112, and four side surfaces 113. The main surface 111 and the back surface 112 face opposite to each other. The main surface 111 faces the direction Z1 which is one of the thickness directions Z of the substrate 1. The back surface 112 faces the direction Z2 opposite to the direction Z1. Each side surface 113 faces one of the directions orthogonal to the direction Z (in this embodiment, the direction X or the direction Y). The four side surfaces 113 face different directions. Each side surface 113 is connected to the main surface 111 and the back surface 112. Two adjacent ones of the four side surfaces 113 are connected to each other. The main surface 111, the back surface 112, and the four side surfaces 113 are all flat. The directions X, Y, and Z are orthogonal to each other.

  Main surface electrode 12 is formed on main surface 111. As shown in FIG. 5, the main surface electrode 12 includes a light receiving side die pad 121, a light receiving side wire bonding pad 122, a light emitting side die pad 124, and a light emitting side wire bonding pad 125.

  The light receiving side die pad 121 and the light receiving side wire bonding pad 122 are located on the direction X2 side of the main surface 111. The area of the light receiving side die pad 121 in plan view is larger than the area of the light receiving side wire bonding pad 122 in plan view. The light receiving side die pad 121 and the light receiving side wire bonding pad 122 are separated from each other in the direction Y.

  The light emitting side die pad 124 and the light emitting side wire bonding pad 125 are located on the direction X1 side of the main surface 111. The area of the light emitting side die pad 124 in plan view is larger than the area of the light emitting side wire bonding pad 125 in plan view. The light emitting side die pad 124 and the light emitting side wire bonding pad 125 are separated from each other in the direction Y.

  The substrate 1 may include a resist layer (not shown) formed on the main surface electrode 12.

  As shown in FIG. 13, the back electrode 13 is formed on the back surface 112. The back electrode 13 has a plurality of (four in the present embodiment) mounting pads 131. In the present embodiment, each mounting pad 131 has a rectangular shape. As shown in FIG. 1, a solder layer 872 is interposed between the mounting pad 131 and the mounting substrate 871 in a state where the photo interrupter 100 is mounted on the mounting substrate 871. The solder layer 872 is in direct contact with the mounting pad 131 and the mounting substrate 871.

  Each of the connection electrodes 14 shown in FIGS. 4 to 6 and 13 is connected to both the main surface electrode 12 and the back surface electrode 13. Each connection electrode 14 makes the main surface electrode 12 and the back surface electrode 13 conductive. Specifically, each connection electrode 14 is one of four pads (light-receiving side die pad 121, light-receiving side wire bonding pad 122, light-emitting side die pad 124, and light-emitting side wire bonding pad 125) of the main surface electrode 12. One and any one of the four mounting pads 131 are electrically connected. In the present embodiment, each connection electrode 14 penetrates the substrate 11 from the main surface 111 to the back surface 112. As shown in FIGS. 5 and 13, each connection electrode 14 overlaps both the main surface electrode 12 and the back surface electrode 13 in the XY plan view.

  The light emitting element 21 shown in FIGS. 1, 4 to 6, 8, 10, and 12 is an LED chip. The light emitting element 21 emits infrared light, for example. The light emitting element 21 is disposed on the substrate 1. As shown in FIG. 5, specifically, the light emitting element 21 is disposed on the light emitting side die pad 124. The light emitting element 21 is electrically connected to the light emitting side die pad 124 via a conductive adhesive layer (not shown). One of the two wires 79 is bonded to the light emitting element 21 and the light emitting side wire bonding pad 125. Thereby, the light emitting element 21 and the light emitting side wire bonding pad 125 are electrically connected.

  The light receiving element 22 shown in FIGS. 1, 4 to 7, 9, and 11 converts the received light into an electrical signal corresponding to the amount of the light. In the present embodiment, the light receiving element 22 converts the received infrared light into an electrical signal corresponding to the amount of the infrared light. The light receiving element 22 is a phototransistor or a photodiode. The light receiving element 22 is disposed on the substrate 1. As shown in FIG. 5, specifically, the light receiving element 22 is disposed on the light receiving side die pad 121. The light receiving element 22 is electrically connected to the light receiving side die pad 121 via a conductive adhesive layer (not shown). The area of the light receiving element 22 in the XY plan view is often larger than the area of the light emitting element 21 in the plan view. As shown in FIG. 5, the light receiving element 22 has a light receiving surface 221. In the present embodiment, the light receiving surface 221 has a rectangular shape. The light receiving surface 221 is not limited to a rectangular shape, and may have a shape in which one corner of the rectangle is missing. One of the two wires 79 is bonded to the light receiving element 22 and the light receiving side wire bonding pad 122. Thereby, the light receiving element 22 and the light receiving side wire bonding pad 122 are electrically connected.

  As shown in FIG. 1, the light receiving side resin portion 3 covers the light receiving element 22. The light-receiving side resin part 3 is in direct contact with the substrate 1. Specifically, the light-receiving side resin portion 3 is disposed on the main surface 111 of the substrate 11. The light-receiving side resin part 3 is transparent and has translucency. In the present embodiment, the light receiving side resin portion 3 transmits light in a wavelength region from visible light to infrared light. The light-receiving side resin portion 3 is made of, for example, an epoxy resin or an acrylic resin. The light receiving side resin portion 3 has a light incident surface 38.

  As shown in FIG. 1, the light emitting side resin portion 4 covers the light emitting element 21. The light emitting side resin part 4 is in direct contact with the substrate 1. Specifically, the light emitting side resin portion 4 is disposed on the main surface 111 of the substrate 11. The light emission side resin part 4 is transparent and has translucency. In the present embodiment, the light emitting side resin portion 4 transmits light in a wavelength region from visible light to infrared light. The light emitting side resin portion 4 is made of, for example, an epoxy resin. The light emitting side resin portion 4 has a light emitting surface 48.

  As shown in FIG. 1, the light-receiving side resin portion 3 and the light-emitting side resin portion 4 are separated from each other through a gap 59. That is, the gap 59 is sandwiched between the light receiving side resin portion 3 and the light emitting side resin portion 4. The direction in which the light-receiving side resin part 3 and the light-emitting side resin part 4 are separated from each other coincides with the direction (in the present embodiment, the direction X) included in the plane in which the substrate 1 spreads. Hereinafter, the light receiving side resin portion 3 and the light emitting side resin portion 4 will be described in detail.

  First, the light receiving side resin portion 3 will be described. The light-receiving side resin part 3 includes a light-receiving side base 31 (see FIGS. 1 to 4, 6, 7, 9, and 11) and a light-receiving side protrusion 32 (FIGS. 1 to 4, 6, and 9). Reference) and a light receiving side raised portion 34 (see FIGS. 1 to 4, 6, and 9).

  The light receiving side base 31 is in contact with the base material 1 and covers the light receiving element 22. A part of the light receiving side base 31 overlaps the light receiving element 22 in the XY plan view. As shown well in FIGS. 2 and 3, the light receiving side base 31 has a light receiving side base side surface 311 and light receiving side base outer surfaces 313, 314, 315, 316 and 317. The light receiving side base side surface 311 and the light receiving side base outer surface 313, 314, 315, 316, 317 are all flat.

  The light receiving side base side surface 311 faces the side where the light emitting side resin portion 4 is located (direction X1 side). The light receiving side base outer surface 313 faces the side opposite to the position of the light emitting side resin portion 4 (direction X2 side). Each light-receiving side base outer surface 314 faces one side in the direction Y. Each light receiving side base outer surface 315 is connected to the light receiving side base outer surface 313 and the light receiving side base outer surface 314. The light receiving side base outer surfaces 313, 314, and 315 are all in contact with the substrate 1. Each light receiving side base outer surface 313, 314, 315 is substantially upright with respect to the substrate 1. In other words, each light receiving side base outer surface 313, 314, 315 is slightly inclined with respect to the direction Z, but hardly inclined with respect to the direction Z. Each light receiving side base outer surface 313, 314, 315 is slightly inclined with respect to the direction Z because the mold for forming the light receiving side resin portion 3 ′ (described later) can be easily removed from the light receiving side resin portion 3 ′. It is to do.

  The light receiving side base outer surface 316 is connected to the light receiving side base outer surface 313. The light-receiving-side base outer surface 316 is inclined with respect to the light-receiving-side base outer surface 313 so as to approach the light-emitting side resin portion 4 as the distance from the base material 1 increases. Since the light receiving side base outer surface 316 is inclined with respect to the light receiving side base outer surface 313 in this manner, the light incident on the light receiving side resin portion 3 from the light incident surface 38 is reflected by the light receiving side base outer surface 316. It becomes easy to proceed toward the light receiving element 22. As clearly shown in FIG. 4, the light receiving side base outer surface 316 overlaps the light receiving element 22 in the XY plan view. Each light receiving side base outer surface 317 is connected to any of the light receiving side base outer surfaces 314, 315, and 316.

  The light receiving side protruding portion 32 protrudes from the light receiving side base portion 31 on the side where the light emitting side resin portion 4 is located (direction X1 side). The light receiving side protrusion 32 is in contact with the substrate 1. In the present embodiment, in the direction Y, the size of the light receiving side protrusion 32 is larger than the size of the light receiving element 22. Furthermore, as shown in FIG. 9, the light receiving side protrusion 32 overlaps the entire light receiving element 22 in the direction X (YZ plan view).

  As shown in FIGS. 3, 6, and 9, the light receiving side protrusion 32 includes a light receiving side protrusion side surface 321, two light receiving side protrusion outer surfaces 322, and a light receiving side communication surface 326. . The light receiving side protruding portion side surface 321, the two light receiving side protruding portion outer surfaces 322, and the light receiving side connecting surface 326 are all flat.

  As shown in FIG. 6, the light receiving side protruding portion side surface 321 faces the side where the light emitting side resin portion 4 is located (direction X1 side). The light receiving side protruding portion side surface 321 contacts the base material 1. The light receiving side protruding portion side surface 321 is inclined with respect to the thickness direction Z of the base material 1 so as to go to the side opposite to the side where the light emitting side resin portion 4 is located (direction X2 side) as it is away from the base material 1. ing. The inclination angle of the light receiving side protrusion side surface 321 with respect to the thickness direction Z is preferably larger than the inclination angle of the light receiving side base outer surface 313 with respect to the thickness direction Z. The inclination angle of the light receiving side protruding portion side surface 321 with respect to the thickness direction Z is preferably larger than 0 degree and not larger than 30 degrees.

  As shown in FIGS. 3 and 9, each light receiving side protrusion outer surface 322 faces in the direction Y1 or the direction Y2. In this embodiment, each light receiving side protrusion outer surface 322 is flush with the light receiving side base outer surface 314. The light receiving side protrusion outer surface 322 is not necessarily flush with the light receiving side base outer surface 314. The light receiving side protrusion outer surface 322 may be located closer to the center of the base material 1 than the light receiving side base outer surface 314 in the XY plan view.

  The light receiving side communication surface 326 shown in FIGS. 3, 6, and 9 faces the direction Z1. The light receiving side communication surface 326 is connected to the light receiving side protrusion side surface 321 and the light receiving side base 31. Specifically, the light receiving side connecting surface 326 is connected to the light receiving side protruding portion side surface 321, the light receiving side protruding portion outer surface 322, and the light receiving side base portion side surface 311.

  The light receiving side raised portion 34 shown in FIGS. 1, 3, 6, and 9 protrudes from the light receiving side base portion 31 on the side where the light emitting side resin portion 4 is located (direction X1 side). In the present embodiment, the light receiving side raised portion 34 is disposed at a position separated from the base material 1. In the present embodiment, the light receiving side raised portion 34 further protrudes from the light receiving side communication surface 326.

  As shown in FIGS. 1, 6, and 9, the light receiving side raised portion 34 constitutes the above-described light incident surface 38. In the present embodiment, the light incident surface 38 includes a first incident portion 381 and a second incident portion 382. The first incident portion 381 and the second incident portion 382 are preferably flat. However, the first incident portion 381 and the second incident portion 382 are not flat and may have a slight uneven surface. The first incident part 381 faces the side where the light emitting side resin part 4 is located (direction X1 side). The second incident part 382 faces in a direction different from the direction in which the first incident part 381 faces. In the present embodiment, the second incident portion 382 faces the direction (direction Z1) from the base material 1 toward the light-receiving side resin portion 3 in the thickness direction Z of the base material 1.

  Next, the light emission side resin part 4 will be described. In this embodiment, the light emission side resin part 4 is a shape symmetrical about the light reception side resin part 3 with respect to the YZ plane. However, the light emitting side resin portion 4 may not have a symmetrical shape with respect to the light receiving side resin portion 3 with respect to the YZ plane.

  The light emitting side resin portion 4 includes a light emitting side base portion 41 (see FIGS. 1 to 4, 6, 8, 10, and 12) and a light emitting side protrusion 42 (FIGS. 1 to 4, 6, and 10). Reference) and a light emitting side raised portion 44 (see FIGS. 1 to 4, 6, and 10).

  The light emitting side base 41 is in contact with the base material 1 and covers the light emitting element 21. A part of the light emission side base 41 overlaps the light emitting element 21 in the XY plan view. 2 and 3, the light emission side base 41 includes a light emission side base side surface 411 and light emission side base outer surfaces 413, 414, 415, 416 and 417. The light emission side base side surface 411 and the light emission side base outer surface 413, 414, 415, 416, 417 are all flat.

  The light emitting side base portion side surface 411 faces the side where the light receiving side resin portion 3 is located (direction X2 side). The light emitting side base side surface 411 is opposed to the light receiving side base side surface 311 with the gap 59 and a light shielding film 6 described later interposed therebetween. The light emitting side base outer surface 413 faces the side opposite to the position of the light receiving side resin portion 3 (direction X1 side). Each light emitting side base outer surface 414 faces one side in the direction Y. Each light emitting side base outer surface 415 is connected to the light emitting side base outer surface 413 and the light emitting side base outer surface 414. The light emitting side base outer surfaces 413, 414, and 415 are all in contact with the substrate 1. Each light emitting side base outer surface 413, 414, 415 is substantially upright with respect to the substrate 1. That is, each light emitting side base outer surface 413, 414, 415 is slightly inclined with respect to the direction Z, but hardly inclined with respect to the direction Z. The reason why each light emitting side base outer surface 413, 414, 415 is slightly inclined with respect to the direction Z is that the mold for forming the light emitting side resin portion 4 ′ (described later) can be easily removed from the light emitting side resin portion 4 ′. It is to do.

  The light emission side base outer surface 416 is connected to the light emission side base outer surface 413. The light emitting side base outer surface 416 is inclined with respect to the light emitting side base outer surface 413 so as to approach the light receiving side resin portion 3 as the distance from the base material 1 increases. Since the light emitting side base outer surface 416 is inclined with respect to the light emitting side base outer surface 413 in this manner, the light emitted from the light emitting element 21 is reflected by the light emitting side base outer surface 416 and then travels toward the light emitting surface 48. Easier to proceed. As clearly shown in FIG. 4, the light emitting side base outer surface 416 overlaps the light emitting element 21 in the XY plan view. Each light emitting side base outer surface 417 is connected to any of the light emitting side base outer surfaces 414, 415, 416.

  The light emitting side protruding portion 42 protrudes from the light emitting side base portion 41 on the side where the light receiving side resin portion 3 is located (direction X2 side). The light emitting side protrusion 42 is in contact with the base material 1. In the present embodiment, the light emitting side protrusion 42 overlaps the entire light emitting element 21 in the direction X (YZ plan view).

  As shown well in FIGS. 3, 6, and 10, the light emission side protrusion 42 has a light emission side protrusion side surface 421, two light emission side protrusion outer surfaces 422, and a light emission side communication surface 426. . The light emitting side protruding portion side 421, the two light emitting side protruding portion outer surfaces 422, and the light emitting side connecting surface 426 are all flat.

  As shown in FIG. 6, the light emitting side protruding portion side surface 421 faces the side where the light receiving side resin portion 3 is located (direction X2 side). The light emitting side protruding portion side surface 421 faces the light receiving side protruding portion side surface 321 with the gap 59 and a light shielding film 6 described later interposed therebetween. The light emitting side protruding portion side surface 421 contacts the substrate 1. The light emitting side protruding portion side surface 421 is inclined with respect to the thickness direction Z of the base material 1 so as to go to the side opposite to the side where the light receiving side resin portion 3 is located (direction X1 side) as it is away from the base material 1. ing. The inclination angle of the light emission side protrusion side surface 421 with respect to the thickness direction Z is preferably larger than the inclination angle of the light emission side base outer surface 413 with respect to the thickness direction Z. The inclination angle of the light emitting side protruding portion side surface 421 with respect to the thickness direction Z is preferably larger than 0 degree and not larger than 30 degrees.

  As shown in FIGS. 3 and 10, each light emitting side protrusion outer surface 422 faces in the direction Y1 or the direction Y2. In the present embodiment, each light emitting side protrusion outer surface 422 is flush with the light emitting side base outer surface 414. The light emitting side protruding portion outer surface 422 is not necessarily flush with the light emitting side base outer surface 414. The light emitting side protrusion outer surface 422 may be located closer to the center of the base material 1 than the light emitting side base outer surface 414 in the XY plan view.

  The light emitting side communication surface 426 shown in FIGS. 3, 6, and 10 faces the direction Z1. The light emitting side communication surface 426 is connected to the light emitting side protruding portion side surface 421 and the light emitting side base portion 41. Specifically, the light emitting side communication surface 426 is connected to the light emitting side protruding portion side surface 421, the light emitting side protruding portion outer surface 422, and the light emitting side base portion side surface 411.

  The light emitting side raised portion 44 shown in FIGS. 1, 3, 6, and 10 protrudes from the light emitting side base portion 41 on the side where the light receiving side resin portion 3 is located (direction X <b> 2 side). In the present embodiment, the light emitting side raised portion 44 is disposed at a position separated from the base material 1. In the present embodiment, the light emitting side raised portion 44 further protrudes from the light emitting side communication surface 426.

  As shown in FIG. 1, the light emitting side raised portion 44 constitutes the light emitting surface 48 described above. The light emitting surface 48 faces the light incident surface 38 with a gap 59 therebetween. The light emitting surface 48 and the light incident surface 38 are preferably opposed to each other, but the present invention is not limited to this, and the light emitting surface 48 and the light incident surface 38 do not have to overlap each other in the direction X. In the present embodiment, the light emission surface 48 includes a first emission part 481 and a second emission part 482. The first emission part 481 and the second emission part 482 are preferably flat. However, the first emission part 481 and the second emission part 482 are not flat and may have a slight uneven surface. The first emitting portion 481 faces the side where the light receiving side resin portion 3 is located (direction X2 side). The second emission part 482 faces in a direction different from the direction in which the first emission part 481 faces. In the present embodiment, the second emitting portion 482 faces the direction (direction Z1) from the base material 1 toward the light emitting side resin portion 4 in the thickness direction Z of the base material 1.

  Each translucent resin portion 51 shown in FIGS. 3 and 4 is connected to the light-receiving side resin portion 3 or the light-emitting side resin portion 4. As shown in FIG. 14, each translucent resin portion 51 has an end surface 511 that is flush with the side surface 113.

As clearly shown in FIG. 1, the light shielding film 6 covers the light receiving side resin portion 3 and the light emitting side resin portion 4. In the present embodiment, the light shielding film 6 further covers the base material 1 and the translucent resin portion 51 (see FIG. 14). As shown in FIGS. 1, 11, and 12, the light shielding film 6 reaches the edge of the main surface 111 of the substrate 11 (the boundary between the main surface 111 and the side surface 113). The light shielding film 6 transmits neither visible light nor infrared light. Such a light shielding film 6 is, for example, black or gray. The light shielding film 6 is made of, for example, a black resist, an epoxy resin, a metal oxide (Fe ₂ O ₃ , Cr ₂ O ₃ ), or a metal (an alloy of Al and Ti, Ag, Au, Pd, Ni). In addition, the light shielding film 6 may be made of C or SiO ₂ . From the light shielding film 6,
Both the light emitting surface 48 and the light incident surface 38 are exposed. In the present embodiment, the light shielding film 6 has a thickness of 0.01 to 100 μm. Further, in the present embodiment, all the light shielding films 6 have a thickness of 0.01 to 100 μm.

  As shown in FIGS. 1 to 4 and FIGS. 6 to 12, the light shielding film 6 includes a light receiving side covering portion 61, a light emitting side covering portion 62, and a base material covering portion 63.

  The light receiving side covering portion 61 covers the light receiving side resin portion 3. Specifically, the light-receiving side covering 61 covers the light-receiving-side base 31, the light-receiving-side protruding portion 32, and (a part of) the light-receiving-side raised portion 34. The light incident surface 38 is exposed from the light receiving side covering portion 61. More specifically, the light receiving side covering 61 includes a light receiving side base side surface 311, a light receiving side base outer surface 313 to 317, a light receiving side protruding portion side surface 321, a light receiving side protruding portion outer surface 322, and a light receiving side communication surface 326. And covering. In the present embodiment, all of the light-receiving side covering portions 61 have a thickness of 0.01 to 100 μm.

  The light emitting side covering portion 62 covers the light emitting side resin portion 4. Specifically, the light emitting side covering portion 62 covers the light emitting side base portion 41, the light emitting side protruding portion 42, and the light emitting side raised portion 44 (a part thereof). The light emitting surface 48 is exposed from the light emitting side covering portion 62. More specifically, the light emitting side covering portion 62 includes a light emitting side base side surface 411, a light emitting side base outer surface 413 to 417, a light emitting side protruding portion side surface 421, a light emitting side protruding portion outer surface 422, and a light emitting side connecting surface 426. And covering. In this embodiment, all the light emission side coating | coated parts 62 are 0.01-100 micrometers in thickness.

  A portion of the light emitting side covering portion 62 that covers the light emitting side protruding portion side surface 421 faces the light receiving side protruding portion side surface 321 of the light receiving side covering portion 61. As described above, the light emitting side protruding portion side surface 421 faces the light receiving side protruding portion side surface 321 with the gap 59 and the light shielding film 6 interposed therebetween. Therefore, the portion covering the light emitting side protruding portion side surface 421 faces the light receiving side protruding portion side surface 321 of the light receiving side covering portion 61 with the gap 59 interposed therebetween.

  The substrate covering portion 63 has a portion that covers the substrate 1 and faces the gap 59. As shown in FIG. 1, the light emitting surface 48 and the light incident surface 38 are both separated from the substrate covering portion 63 in the thickness direction Z of the substrate 1. It is preferable that the light emitting surface 48 and the base material covering portion 63 are spaced apart to some extent because the shielding member 811 can be positioned more reliably between the light emitting surface 48 and the light incident surface 38. Similarly, it is preferable that the light incident surface 38 and the base material covering portion 63 are separated to some extent, because the shielding member 811 can be positioned more reliably between the light emitting surface 48 and the light incident surface 38. . In this embodiment, all the base material coating | coated parts 63 are 0.01-100 micrometers in thickness. The base material covering portion 63 has a surface facing in the same direction as the direction in which the main surface 111 of the substrate 11 faces. The light emitting element 21 has a top surface that faces the same direction as the main surface 111 of the substrate 11 faces. The surface of the base material covering portion 63 is closer to the main surface 111 of the substrate 11 than the top surface of the light emitting element 21.

  Next, a method for using the photo interrupter 100 will be described.

  As shown in FIG. 1, when the photo interrupter 100 is in operation, infrared light L <b> 11 is emitted from the light emitting element 21. The infrared light L <b> 11 emitted from the light emitting element 21 is reflected by the light emitting side base outer surfaces 413 to 417 in the light emitting side resin portion 4 and then travels to the light emitting surface 48. The infrared light L11 is emitted from the light emitting surface 48 to the gap 59. When there is no shielding member 811 between the light emitting surface 48 and the light incident surface 38, the infrared light L 11 emitted from the light emitting surface 48 passes through the gap 59 and reaches the light incident surface 38. The infrared light L11 incident on the light receiving side resin portion 3 from the light incident surface 38 is reflected by the light receiving side base outer surfaces 313 to 317 in the light receiving side resin portion 3, and then received by the light receiving element 22. The light receiving element 22 generates an electromotive force according to the amount of received light and outputs a signal. When the output value exceeds a certain threshold value, a detection circuit (not shown) outside the photo interrupter 100 determines that there is no shielding member 811 between the light emitting surface 48 and the light incident surface 38. The On the other hand, when the shielding member 811 is between the light emitting surface 48 and the light incident surface 38, the shielding member 811 blocks the progress of the infrared light L <b> 11 emitted from the light emitting surface 48 to the light incident surface 38. Therefore, in this case, the infrared light L11 does not reach the light incident surface 38. At this time, the light receiving element 22 does not receive the infrared light L11 derived from the light emitting element 21, and the output value of the light receiving element 22 does not exceed the threshold value. In this case, the detection circuit determines that there is a shielding member 811 between the light emitting surface 48 and the light incident surface 38. The photo interrupter 100 is used in this way, and information on whether or not there is a shielding member 811 between the light emitting surface 48 and the light incident surface 38 can be obtained.

  Next, a method for manufacturing the photo interrupter 100 will be described. In the following description, the same or similar components as those described above are denoted by the same reference numerals as those described above, and description thereof will be omitted as appropriate.

  First, as shown in FIGS. 15 and 16, a substrate 1 'is prepared. The base material 1 ′ includes a substrate, a main surface electrode, a plurality of connecting electrodes, and a back surface electrode. Substrate 1 'will later become substrate 1 described above. Next, as shown in the figure, a plurality of light emitting elements 21 and a plurality of light receiving elements 22 are arranged on the substrate 1 ′. Next, as shown in the figure, wires 79 are bonded to any one of the plurality of light emitting elements 21 and the main surface electrode of the substrate 1 ′. Similarly, a wire 79 is bonded to any one of the plurality of light receiving elements 22 and the main surface electrode of the substrate 1 ′.

  Next, as shown in FIGS. 17 and 18, a translucent resin body 89 is formed. The translucent resin body 89 is formed through a molding process using a mold. Specifically, in the step of forming the translucent resin body 89, the light receiving side resin portion 3 'and the light emitting side resin portion 4' are formed. The light receiving side resin portion 3 ′ covers the light receiving element 22. In the step of forming the light receiving side resin portion 3 ′, the above-described light receiving side base portion 31 and the light receiving side raised portion 34 ′ protruding from the light receiving side base portion 31 are formed. Similarly, in the step of forming the light emitting side resin portion 4 ′, the light emitting side base portion 41 and the light emitting side raised portion 44 ′ that protrudes from the light emitting side base portion 41 are formed. The light receiving side resin portion 3 ′ and the light emitting side resin portion 4 ′ are preferably formed at the same time.

  A flow path through which the resin material flows is formed between a mold (not shown) for forming the translucent resin body 89 and the base material 1 ′. As the resin material flows through the flow path, the light-receiving side resin portion 3 ′ and the light-emitting side resin portion 4 ′ are filled with the resin material. In addition, what the resin material with which the said flow path was filled hardened | cured becomes the translucent resin part 51 '(refer FIG. 17).

  Next, as shown in FIGS. 19 and 20, a light shielding film 6 'is formed. In the step of forming the light shielding film 6 ', a surface treatment technique is used. Examples of the surface treatment technique include painting, printing, vapor deposition, ion plating, sputtering, and plating. Spin coating may be performed after applying a coating material for forming the light shielding film 6 ′ to the translucent resin body 89. The base material 1 ′ and the translucent resin body 89 (that is, the light receiving side resin portion 3 ′ and the light emitting side resin portion 4 ′) are covered with the light shielding film 6 ′. Further, the light shielding film 6 ′ is also formed in a region of the substrate 1 ′ sandwiched between the light receiving side resin portion 3 ′ and the light emitting side resin portion 4 ′. The light shielding film 6 ′ formed in the region between the light receiving side resin portion 3 ′ and the light emitting side resin portion 4 ′ of the base material 1 ′ later becomes the base material covering portion 63.

  Next, as shown in FIGS. 21 and 22, a light incident surface 38 and a light emitting surface 48 are formed. In order to form the light incident surface 38 and the light emitting surface 48, for example, a part of the translucent resin body 89 and a part of the light shielding film 6 'are removed together. Specifically, a part of the light shielding film 6 ′ and a part of the light receiving side raised portion 34 ′ are removed in a lump. Thereby, a part of the light-receiving side resin portion 3 is exposed from the light shielding film 6 ′. The portion exposed from the light shielding film 6 ′ of the light receiving side resin portion 3 is the light incident surface 38 described above. Similarly, a part of the light shielding film 6 ′ and a part of the light emitting side raised portion 44 ′ are removed together. Thereby, a part of the light emitting side resin portion 4 is exposed from the light shielding film 6 ′. The portion exposed from the light shielding film 6 ′ of the light emitting side resin portion 4 is the light emitting surface 48 described above.

  For example, a dicing blade 886 is used to remove a part of the translucent resin body 89 and a part of the light shielding film 6 ′ at a time. In the present embodiment, by gradually scraping the light receiving side raised portion 34 ′ from the upper portion to the lower portion of the light receiving side raised portion 34 ′ in FIG. A part of the light shielding film 6 ′ is removed at once. Similarly, by gradually scraping the light emitting side raised portion 44 ′ from the upper portion to the lower portion in the light emitting side raised portion 44 ′ of FIG. Remove part of 'and all at once. In order to remove a part of the translucent resin body 89 and a part of the light shielding film 6 ′ at once, a laser may be used.

  Unlike the method shown in FIG. 22, the light shielding film 6 ′ and the light incident surface 38 and the light emitting surface 48 may be formed as follows. As shown in FIG. 23, when forming the light shielding film 6 ′, the jig 887 is brought into contact with the portion that should become the light emitting surface 48 and the portion that should become the light incident surface 38 in the translucent resin body 89. Let In the translucent resin body 89, the light shielding film 6 'is not formed in the portion where the jig 887 is in contact with the light shielding film 6'. In this manner, the light incident surface 38 and the light emitting surface 48 can be formed simultaneously with the formation of the light shielding film 6 '.

  Unlike the methods shown in FIGS. 22 and 23, the light shielding film 6 'and the light incident surface 38 and the light emitting surface 48 may be formed by printing using a photomask.

  Next, as shown in FIGS. 24 and 25, the substrate 1 ′, the translucent resin portion 51 ′, and the light shielding film 6 ′ are collectively collected along the cut surface 791 and a dicing blade (not shown). ). Thereby, a plurality of photo interrupters 100 shown in FIG. 1 and the like are manufactured. The substrate 1 ′ is cut along the cut surface 791, whereby the above-described side surface 113 is formed on the substrate 11. The translucent resin portion 51 ′ is cut along the cut surface 791, thereby forming the end surface 511 described above.

  Next, the effect of this embodiment is demonstrated.

  In the present embodiment, the light shielding film 6 ′ is formed using a surface treatment technique. As a result, a light shielding film 6 that covers the light receiving side resin portion 3 and the light emitting side resin portion 4 is formed in the photo interrupter 100. Since the light shielding film 6 is formed by using a surface treatment technique, the light shielding film 6 is formed considerably thinner than the opaque cap body formed by resin molding described in the description of the prior art. The reason why the light shielding film 6 has a thickness of 0.01 to 100 μm is that the light shielding film 6 ′ is formed by using a surface treatment technique. If the light shielding film 6 can be formed thin, the volume occupied by the light shielding film 6 can be reduced. Since the volume occupied by the light shielding film 6 can be reduced, the photo interrupter 100 can be reduced in size.

  In a conventional configuration in which a transparent resin (primary mold resin) is formed on a substrate by molding and a light shielding resin (secondary mold resin) is formed on the transparent resin by molding, the adhesive force between the substrate and the secondary mold resin is weak. Therefore, the secondary mold resin may fall off from the substrate or the primary mold resin. On the other hand, in this embodiment, since the light shielding film 6 ′ is formed by surface treatment on the transparent resin (the light receiving side resin portion 3 ′ and the light emitting side resin portion 4 ′), it corresponds to the conventional secondary mold resin. It can suppress that a part (light shielding film 6) falls off. Therefore, the yield can be improved. In the conventional configuration, the substrate is made of, for example, glass epoxy resin, the primary mold resin is made of epoxy resin, and the secondary mold resin is made of PPS (polyphenylene sulfide) or LCP (liquid crystal polymer).

  In the present embodiment, the light shielding film 6 includes a base material covering portion 63 that covers the base material 1 and faces the gap 59. The light emitting surface 48 and the light incident surface 38 are both separated from the substrate covering portion 63 in the thickness direction Z of the substrate 1. Since the light shielding film 6 is thin as described above, the substrate covering portion 63 is also thin. Therefore, according to the configuration of the present embodiment, the distance in the direction Z between the light incident surface 38 and the substrate 1 is reduced while ensuring a large distance in the direction Z between the light incident surface 38 and the substrate covering portion 63. Can do. That is, the dimension of the photo interrupter 100 in the direction Z can be reduced while securing the insertion allowance of the shielding member 811. Similarly, the distance in the direction Z between the light emitting surface 48 and the substrate 1 can be reduced while ensuring a large distance in the direction Z between the light emitting surface 48 and the substrate covering portion 63. That is, the dimension of the photo interrupter 100 in the direction Z can be reduced while securing the insertion allowance of the shielding member 811.

  If the insertion allowance of the shielding member 811 can be secured, the shielding member 811 can more reliably prevent the infrared light L11 emitted from the light emitting surface 48 from entering the light incident surface 38. Thereby, when there is the shielding member 811 between the light emitting surface 48 and the light incident surface 38, it is possible to suppress unnecessary infrared light L11 from entering the light receiving element 22 via the light incident surface 38. Thereby, the detection accuracy by the photo interrupter 100 can be improved.

  In the present embodiment, the light receiving side resin portion 3 includes a light receiving side protruding portion 32 protruding from the light receiving side base portion 31 on the side where the light emitting side resin portion 4 is located. The light receiving side protrusion 32 is in contact with the substrate 1. According to such a configuration, the light receiving element 22 can be covered with the light receiving side base 31 or the light receiving side protrusion 32. Therefore, the light receiving element 22 can be disposed at a position closer to the light emitting side resin portion 4. Therefore, the space where the light receiving element 22 should be arranged on the direction X2 side of the substrate 1 can be reduced. Thereby, the edge part by the side of the direction X2 of the base material 1 can be brought closer to the light emission side resin part 4. FIG. As a result, the dimension of the substrate 1 in the direction X can be reduced, and the photo interrupter 100 can be downsized.

  In the present embodiment, the light-receiving side protruding portion side surface 321 is inclined with respect to the thickness direction Z of the base material 1 so as to go to the side opposite to the side where the light-emitting side resin portion 4 is positioned as it is away from the base material 1. ing. According to such a configuration, by adopting a configuration in which the light receiving element 22 is covered with the light receiving side base portion 31 or the light receiving side protruding portion 32, the base portion of the light receiving side protruding portion 32 protrudes inward, and the light receiving side protruding portion 32 and the light emitting side are projected. Even if the space between the protrusions 42 is narrowed, the distance between the light emitting side resin part 4 and the portion on the light receiving side protrusion side surface 321 on the direction Z1 side can be ensured. It is preferable that the distance between the light receiving side protruding portion side surface 321 and the light emitting side resin portion 4 can be ensured in that the photo interrupter 100 can detect the presence or absence of the shielding member 811 having a relatively large dimension in the direction X.

  In the present embodiment, in the step of forming the light incident surface 38, a part of the light shielding film 6 'and a part of the light receiving side raised portion 34' are removed. Such a method is easy to perform because it does not remove only the light-shielding film 6 '. Similarly, in the step of forming the light emitting surface 48, a part of the light shielding film 6 'and a part of the light emitting side raised portion 44' are removed. Such a method is easy to perform because it does not remove only the light-shielding film 6 '.

<First Modification>
Next, a first modification of the present embodiment will be described with reference to FIGS.

  FIG. 26 is a plan view (partially see through) showing a photo interrupter of a first modification of the present embodiment. FIG. 27 is a plan view in which the light receiving side resin portion, the light emitting side resin portion, the light shielding film, and the light transmitting resin portion are omitted from FIG. FIG. 28 is a bottom view of the photo interrupter shown in FIG.

  The photo interrupter 101 shown in these drawings includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin part 3, a light emitting side resin part 4, a light transmitting resin part 51, and a light shielding film 6. And a plurality of wires 79. Except for the base material 1 and the translucent resin portion 51, each configuration of the light emitting element 21, the light receiving element 22, the light receiving side resin portion 3, the light emitting side resin portion 4, the light shielding film 6, and the plurality of wires 79 in the photo interrupter 101 is as follows. Since it is the same as that of the above-mentioned photo interrupter 100, description is abbreviate | omitted.

  The base material 1 includes a substrate 11, a main surface electrode 12, a back surface electrode 13, and a connection electrode 14.

  A plurality of corner grooves 118 are formed in the substrate 11. Each corner groove 118 is located at a corner of the substrate 11 in the XY plan view. The corner groove 118 is located between the two side surfaces 113.

  As shown in FIGS. 26 and 27, the main surface electrode 12 further includes a plurality of connection wiring portions 126 and a plurality of quarter-annular portions 127. Each quarter ring portion 127 is formed in the vicinity of a portion of main surface 111 that is connected to corner groove 118. Each connection wiring portion 126 has a belt-like shape, and includes one of a plurality of quarter-annular portions 127 and four pads of the main surface electrode 12 (light-receiving side die pad 121, light-receiving side wire bonding pad 122, light-emitting side die pad 124). , And one of the light emitting side wire bonding pads 125). Each connection wiring portion 126 extends from the light-receiving side resin portion 3 or the light-emitting side resin portion 4 in the XY plan view.

  As shown in FIG. 28, the back electrode 13 further includes a plurality of connection wiring portions 136 and a plurality of quarter-annular portions 137. Each quarter-annular portion 137 is formed in the vicinity of the portion of the back surface 112 that is connected to the corner groove 118. Each connection wiring part 136 has a strip shape and is connected to one of the plurality of quarter-annular parts 137 and one of the four mounting pads 131.

  In this modification, each connection electrode 14 does not penetrate the substrate 11. Each connection electrode 14 is formed in any one of the plurality of corner grooves 118. Each connecting electrode 14 is connected to one of the plurality of quarter-annular portions 127 and one of the plurality of quarter-annular portions 137.

  Each translucent resin portion 51 covers the connection wiring portion 126 and the quarter-annular portion 127. Also in this modification, each translucent resin part 51 is covered with the light shielding film 6.

  According to this modification, the photo interrupter 101 can be downsized for the same reason as described for the photo interrupter 100.

  In this modification, the light shielding film 6 includes a base material covering portion 63 that covers the base material 1 and faces the gap 59. The light emitting surface 48 and the light incident surface 38 are both separated from the substrate covering portion 63 in the thickness direction Z of the substrate 1. According to such a configuration, the size of the photo interrupter 101 in the direction Z can be reduced for the same reason as described for the photo interrupter 100.

  In the present modification, the light receiving side resin portion 3 includes a light receiving side protruding portion 32 protruding from the light receiving side base portion 31 on the side where the light emitting side resin portion 4 is located. The light receiving side protrusion 32 is in contact with the substrate 1. According to such a configuration, the photo interrupter 101 can be reduced in size for the same reason as described for the photo interrupter 100.

  In the present modification, the light-receiving side protruding portion side surface 321 is inclined with respect to the thickness direction Z of the base material 1 so as to go to the side opposite to the side where the light-emitting side resin portion 4 is located as the distance from the base material 1 increases. ing. According to such a configuration, by adopting a configuration in which the light receiving element 22 is covered with the light receiving side base portion 31 or the light receiving side protruding portion 32, the base portion of the light receiving side protruding portion 32 protrudes inward, and the light receiving side protruding portion 32 and the light emitting side are projected. Even if the space between the protrusions 42 is narrowed, the distance between the light emitting side resin part 4 and the portion on the light receiving side protrusion side surface 321 on the direction Z1 side can be ensured. It is preferable that the distance between the light-receiving side protruding portion side surface 321 and the light-emitting side resin portion 4 can be secured in that the photointerrupter 101 can detect the presence or absence of the shielding member 811 having a relatively large dimension in the direction X.

  In this modification, in the step of forming the light incident surface 38, a part of the light shielding film 6 'and a part of the light receiving side raised portion 34' are removed. Such a method is easy to perform because it does not remove only the light-shielding film 6 '. Similarly, in the step of forming the light emitting surface 48, a part of the light shielding film 6 'and a part of the light emitting side raised portion 44' are removed. Such a method is easy to perform because it does not remove only the light-shielding film 6 '.

<Second Modification>
Next, a second modification of the present embodiment will be described using FIG.

  FIG. 29 is a cross-sectional view showing a photo interrupter of a second modified example of the present embodiment.

  The photo interrupter 102 shown in the figure includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin part 3, a light emitting side resin part 4, a light transmitting resin part 51, a light shielding film 6, A plurality of wires 79. Except for the light shielding film 6, each configuration of the substrate 1, the light emitting element 21, the light receiving element 22, the light receiving side resin part 3, the light emitting side resin part 4, the light transmitting resin part 51, and the plurality of wires 79 in the photo interrupter 102 is Since it is the same as that of the above-mentioned photo interrupter 100, description is abbreviate | omitted.

  Unlike the photo interrupter 100, the light shielding film 6 in this modification has a two-layer structure. The light shielding film 6 is the same as the photo interrupter 100 except that it has a two-layer structure.

  The light shielding film 6 includes a first layer 68 and a second layer 69. The first layer 68 is in direct contact with the light receiving side resin part 3 and the light emitting side resin part 4. The first layer 68 is made of metal. Examples of such a metal include aluminum, silver, gold, copper, chromium, and tin. In the present embodiment, the first layer 68 is aluminum. The second layer 69 is laminated on the first layer 68. A first layer 68 is interposed between the second layer 69 and the light-receiving side resin part 3 or the light-emitting side resin part 4. The second layer 69 is made of an oxide of the metal constituting the first layer 68. In order to form such a light-shielding film 6, a metal layer is formed on the light-receiving side resin portion 3 and the light-emitting side resin portion 4 by using, for example, vapor deposition. Next, the surface of the metal layer is oxidized. In this way, the light shielding film 6 having the first layer 68 and the second layer 69 can be formed. The second layer 69 is not made of an oxide of the metal constituting the first layer 68 but may be made of, for example, an insulating resin.

  According to such a configuration, the light emitted from the light emitting element 21 passes through the light emitting side base side surface 411, the light emitting side base outer surface 413, 414, 415, 416, 417, etc. Even when the light reaches the light shielding film 6, the light reaching the light shielding film 6 is reflected by the first layer 68 made of metal. And the light reflected in the 1st layer 68 can be advanced to the light emission side resin part 4. FIG. Therefore, more light emitted from the light emitting element 21 can reach the light emitting surface 48 without causing the light reaching the light shielding film 6 to be absorbed much by the light shielding film 6. If more light emitted from the light emitting element 21 can reach the light emitting surface 48, malfunction of the photo interrupter 102 can be suppressed.

  Similarly, light incident on the light receiving side resin portion 3 from the light incident surface 38 passes through the light receiving side base side surface 311, the light receiving side base outer surface 313, 314, 315, 316, 317, etc. and is shielded from the light receiving side resin portion 3. Even when the light reaches the film 6, the light reaching the light shielding film 6 is reflected by the first layer 68 made of metal. Then, the light reflected by the first layer 68 can be advanced to the light receiving side resin portion 3. Therefore, more light incident on the light incident surface 38 can reach the light receiving element 22 without causing the light reaching the light shielding film 6 to be absorbed much by the light shielding film 6. If more light incident on the light incident surface 38 can reach the light receiving element 22, malfunction of the photo interrupter 102 can be suppressed.

  Note that the configuration of this modification may be applied to the photo interrupter 101 according to the first modification.

  FIG. 30 is a partially enlarged cross-sectional view showing a part of the second modified example of the present embodiment in combination with the structure of the first modified example of the present embodiment. As shown in the figure, the quarter-annular part 127 is covered with a translucent resin part 51. The light shielding film 6 covers the translucent resin portion 51. The translucent resin portion 51 is interposed between the first layer 68 and the quarter-annular portion 127. In such a configuration, since the insulating translucent resin portion 51 is interposed between the first layer 68 made of metal and the quarter-annular portion 127, the first layer 68 and the quarter-annular portion 127 are Not conducting. Accordingly, a certain quarter-annular portion 127 and a quarter-annular portion 127 other than the quarter-annular portion 127 are prevented from conducting via the first layer 68.

<Third Modification>
Next, a third modification of the present embodiment will be described using FIG.

  FIG. 31 is a plan view (partially see through) showing a photo interrupter of a third modified example of the present embodiment.

  The photo interrupter 103 shown in the figure has the above-mentioned photo interrupter in that the center C1 of the light receiving surface 221 of the light receiving element 22 is located at a position shifted from the line segment 861 connecting the light emitting surface 48 and the light incident surface 38. Different from the interrupter 100. Even with such a configuration, the same effects as described above can be obtained.

  Note that the configuration of this modification may be applied to the above-described photointerrupter 101 and photointerrupter 102.

<Fourth Modification>
Next, a fourth modification of the present embodiment will be described using FIG.

  FIG. 32 is a cross-sectional view showing a photo interrupter of a fourth modified example of the present embodiment.

  The photo interrupter 104 shown in the figure is different from the photo interrupter 100 in the direction in which the second incident portion 382 faces. In the present modification, the thickness direction Z of the base material 1 is such that the second incident portion 382 is directed to the opposite side (direction X2 side) to the side where the light-emitting side resin portion 4 is located as the distance from the base material 1 increases. It is inclined with respect to. Similarly, the second emitting portion 482 is inclined with respect to the thickness direction Z of the base material 1 so as to go to the opposite side (direction X1 side) to the side where the light receiving side resin portion 3 is located as it is away from the base material 1. doing. Even with such a configuration, the same effects as described above can be obtained.

  The configuration of this modification may be applied to the above-described photo interrupter 101, photo interrupter 102, or photo interrupter 103.

<Fifth Modification>
Next, a fifth modification of the present embodiment will be described with reference to FIGS.

FIG. 33 is a cross-sectional view showing a photo interrupter of a fifth modification example of the present embodiment. 34 is a cross-sectional view taken along line XXXIV-XXXIV in FIG. FIG. 35 is a sectional view taken along line XXXV-XXXV in FIG.

  The photo interrupter 105 shown in the figure includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin part 3, a light emitting side resin part 4, a light transmitting resin part 51, a light shielding film 6, A plurality of wires 79. Except for the light-receiving side resin part 3 and the light-emitting side resin part 4, each configuration of the substrate 1, the light-emitting element 21, the light-receiving element 22, the light-transmitting resin part 51, the light-shielding film 6, and the plurality of wires 79 in the photo interrupter 105 is as follows. Since it is the same as that of the above-mentioned photo interrupter 100, description is abbreviate | omitted.

  In the light-receiving-side resin portion 3, the configuration of the photo-interrupter 100 except that at least a part of the light-receiving-side base side surface 311 has a portion located on the side farther from the base material 1 than the light incident surface 38. It is the same. According to such a configuration, when removing a part of the light receiving side raised portion 34 ′ and a part of the light shielding film 6 ′ to form the light incident surface 38, a portion where the light receiving side raised portion 34 ′ should be removed is determined. Can be reduced. Thereby, the time required to remove the light receiving side raised portion 34 'can be shortened.

  Similarly, in the light emitting side resin portion 4, except that at least a part of the light emitting side base side surface 411 has a portion located on the side farther from the base material 1 than the light emitting surface 48, the photointerrupter 100. The configuration is the same as in FIG. According to such a configuration, when removing a part of the light emitting side raised portion 44 ′ and a part of the light shielding film 6 ′ to form the light emitting surface 48, a portion where the light emitting side raised portion 44 ′ should be removed is formed. Can be reduced. Thereby, the time required for removing the light emitting side raised portion 44 ′ can be shortened.

Second Embodiment
Next, a second embodiment of the present invention will be described with reference to FIGS.

  FIG. 36 is a perspective view showing a photo interrupter according to the second embodiment of the present invention. FIG. 37 is a front view showing a photo interrupter according to the second embodiment of the present invention. FIG. 38 is a plan view showing a photo interrupter according to the second embodiment of the present invention. FIG. 39 is a sectional view taken along line XXXIX-XXXIX in FIG. 36 to 38, the portion exposed from the light shielding film 6 is shown by hatching. The hatching attached | subjected to FIG. 39 has shown that it is a cross section.

  The photo interrupter 200 shown in these drawings includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin part 3, a light emitting side resin part 4, and a light transmitting resin part 51 (illustrated in the present embodiment). 26), a light shielding film 6, an undercoat layer 76, and a plurality of wires 79 (not shown in this embodiment, see FIG. 5 and the like). The photo interrupter 200 is different from the photo interrupter 101 in that it includes an undercoat layer 76. The photo interrupter 200 is different from the photo interrupter 101 in the configuration of the light receiving side base outer surface 316 in the light receiving side resin portion 3 and the configuration of the light emitting side base outer surface 416 in the light emitting side resin portion 4. Except for the light-receiving side resin portion 3, the light-emitting side resin portion 4, and the undercoat layer 76, each configuration of the base material 1, the light-emitting element 21, the light-receiving element 22, the light-transmitting resin portion 51, and the plurality of wires 79 in the photointerrupter 200. Since this is the same as the above-described photointerrupter 101, description thereof is omitted. In addition, as the light shielding film 6, what was demonstrated in the photo interrupter 102 is used. That is, the light shielding film 6 in the photo interrupter 200 includes the first layer 68 and the second layer 69.

  The light receiving side resin portion 3 includes a light receiving side base portion 31, a light receiving side protruding portion 32, and a light receiving side raised portion 34. The light receiving side protruding portion 32 and the light receiving side raised portion 34 are the same as those described with respect to the photo interrupter 100, and thus description thereof is omitted.

  Also in the present embodiment, the light receiving side base 31 has a light receiving side base side surface 311 and light receiving side base outer surfaces 313, 314, 315, 316, 317. Except for the light receiving side base outer surface 316, each configuration of the light receiving side base side surface 311 and the light receiving side base outer surface 313, 314, 315, 317 is the same as that described for the photo interrupter 101 (that is, the photo interrupter 100). Is omitted.

  The light receiving side base outer surface 316 shown in FIGS. 38 and 39 is the first light receiving side base outer surface. As shown in FIG. 39, the light incident surface 38 is located between the light receiving side base outer surface 316 and the light emitting surface 48. The light receiving side base outer surface 316 includes a first light receiving side inclined portion 351, a second light receiving side inclined portion 352, and a light receiving side connecting portion 353.

  Each of the first light receiving side inclined portion 351 and the second light receiving side inclined portion 352 is inclined with respect to the thickness direction Z of the substrate 1. The first light receiving side inclined portion 351 is located on the side farther from the base material 1 than the second light receiving side inclined portion 352. That is, in the thickness direction Z of the substrate 1, the second light receiving side inclined portion 352 is located between the first light receiving side inclined portion 351 and the substrate 1. As shown in FIG. 38, the first light receiving side inclined portion 351 is located between the second light receiving side inclined portion 352 and the light incident surface 38 in a plan view of the substrate 1. An angle θ11 formed by the first light receiving side inclined portion 351 and the thickness direction Z is larger than an angle θ12 formed by the second light receiving side inclined portion 352 and the thickness direction Z. Preferably, the angle θ11 formed by the first light receiving side inclined portion 351 and the thickness direction Z is 40 degrees or more and 50 degrees or less. Preferably, the angle θ12 formed by the second light receiving side inclined portion 352 and the thickness direction Z is not less than 35 degrees and not more than 45 degrees. The magnitudes of the angles θ11 and θ12 are determined by performing a simulation before manufacturing the photo interrupter 200.

  The light receiving side connecting portion 353 is located between the first light receiving side inclined portion 351 and the second light receiving side inclined portion 352. The light receiving side connecting portion 353 is connected to the first light receiving side inclined portion 351 and the second light receiving side inclined portion 352. The angle θ13 formed by the light receiving side connecting portion 353 and the base material 1 in the thickness direction Z is smaller than the angle θ12 formed by the second light receiving side inclined portion 352 and the thickness direction Z. Preferably, the angle θ13 formed by the light receiving side connecting portion 353 and the thickness direction Z of the base material 1 is greater than 0 degree and equal to or less than 10 degrees. That is, the light-receiving side connecting portion 353 is slightly inclined with respect to the thickness direction Z of the base material 1, but is hardly inclined with respect to the thickness direction Z. The light receiving side connecting portion 353 is slightly inclined with respect to the thickness direction Z of the substrate 1 because the mold for forming the light receiving side resin portion 3 ′ can be easily removed from the light receiving side resin portion 3 ′. It is to do.

  The light emitting side resin portion 4 includes a light emitting side base portion 41, a light emitting side protruding portion 42, and a light emitting side raised portion 44. The light emitting side protruding portion 42 and the light emitting side raised portion 44 are the same as those described with respect to the photo interrupter 101 (that is, the photo interrupter 100), and thus description thereof is omitted.

  Also in the present embodiment, the light emission side base 41 includes a light emission side base side surface 411 and light emission side base outer surfaces 413, 414, 415, 416, and 417. Except for the light emitting side base outer surface 416, each configuration of the light emitting side base side surface 411 and the light emitting side base outer surface 413, 414, 415, 417 is the same as that described for the photo interrupter 101 (that is, the photo interrupter 100). Is omitted.

  The light emission side base outer surface 416 shown in FIGS. 38 and 39 is a first light emission side base outer surface. A light exit surface 48 is located between the light emitting side base outer surface 416 and the light incident surface 38. The light emitting side base outer surface 416 includes a first light emitting side inclined portion 451, a second light emitting side inclined portion 452, and a light emitting side connecting portion 453.

  The first light emission side inclined portion 451 and the second light emission side inclined portion 452 are each inclined with respect to the thickness direction Z of the substrate 1. The first light emission side inclined portion 451 is located on the side farther from the base material 1 than the second light emission side inclined portion 452. That is, in the thickness direction Z of the base material 1, the second light emitting side inclined portion 452 is located between the first light emitting side inclined portion 451 and the base material 1. The first light emission side inclined portion 451 is located between the second light emission side inclined portion 452 and the light emitting surface 48 in a plan view of the substrate 1. The angle θ21 formed by the first light emitting side inclined portion 451 and the thickness direction Z is larger than the angle θ22 formed by the second light emitting side inclined portion 452 and the thickness direction Z. Preferably, the angle θ21 formed by the first light emitting side inclined portion 451 and the thickness direction Z is 40 degrees or more and 50 degrees or less. Preferably, the angle θ22 formed by the second light emitting side inclined portion 452 and the thickness direction Z is not less than 35 degrees and not more than 45 degrees. The magnitudes of the angles θ21 and θ22 are determined by performing a simulation before manufacturing the photo interrupter 200.

  The light emitting side communication part 453 is located between the first light emitting side inclined part 451 and the second light emitting side inclined part 452. The light emission side communication part 453 is connected to the first light emission side inclined part 451 and the second light emission side inclined part 452. The angle θ23 formed by the light emitting side connecting portion 453 and the thickness direction Z of the substrate 1 is smaller than the angle θ22 formed by the second light emitting side inclined portion 452 and the thickness direction Z. Preferably, the angle θ23 formed by the light emitting side connecting portion 453 and the thickness direction Z of the substrate 1 is greater than 0 degree and equal to or less than 10 degrees. That is, the light-emitting side connecting portion 453 is slightly inclined with respect to the direction Z although it is slightly inclined with respect to the thickness direction Z of the base material 1. The light emitting side connecting portion 453 is slightly inclined with respect to the thickness direction Z of the base material 1 because the mold for forming the light emitting side resin portion 4 ′ can be easily removed from the light emitting side resin portion 4 ′. It is to do.

  The undercoat layer 76 is interposed between at least one of the light receiving side resin portion 3 and the light emitting side resin portion 4 and the light shielding film 6. The undercoat layer 76 may be interposed only between either the light receiving side resin portion 3 and the light shielding film 6 and between the light emitting side resin portion 4 and the light shielding film 6. In the present embodiment, the undercoat layer 76 is interposed between any of the light receiving side resin portion 3 and the light shielding film 6 and between the light emitting side resin portion 4 and the light shielding film 6. Specifically, the undercoat layer 76 is interposed between the light receiving side base outer surface 316 and the light shielding film 6. The undercoat layer 76 is in contact with the light receiving side base outer surface 316 and the light shielding film 6. In the present embodiment, the undercoat layer 76 covers the light receiving side base outer surface 316. In the present embodiment, the undercoat layer 76 further covers all regions of the light receiving side resin portion 3 other than the light incident surface 38 and the region in contact with the base material 1. On the other hand, the undercoat layer 76 is interposed between the light emitting side base outer surface 416 and the light shielding film 6. The undercoat layer 76 is in contact with the light emitting side base outer surface 416 and the light shielding film 6. In the present embodiment, the undercoat layer 76 covers the light emitting side base outer surface 416. In the present embodiment, the undercoat layer 76 further covers all regions of the light emitting side resin portion 4 other than the light emitting surface 48 and the region in contact with the substrate 1. The undercoat layer 76 covers the substrate 1. The thickness of the undercoat layer 76 is, for example, 3 μm to 30 μm.

  The undercoat layer 76 is translucent. That is, the undercoat layer 76 is made of a material that transmits light. Preferably, the undercoat layer 76 is made of a transparent resin. Examples of the transparent resin constituting the undercoat layer 76 include silicon-based resin, polyester, and acrylic urethane. The undercoat layer 76 is formed by using a surface treatment technique before forming the light shielding film 6 '. Examples of the surface treatment technique used for forming the undercoat layer 76 include dip coating, spin coating, and spraying of the material constituting the undercoat layer 76.

  The first layer 68 and the second layer 69 in the light shielding film 6 are each made of the material described with respect to the photo interrupter 102. The undercoat layer 76 is interposed between at least one of the light receiving side resin portion 3 and the light emitting side resin portion 4 and the first layer 68. The undercoat layer 76 is in direct contact with at least one of the light receiving side resin portion 3 and the light emitting side resin portion 4 and the first layer 68.

  Next, the effect of this embodiment is demonstrated.

  40 is a partial enlarged cross-sectional view schematically showing a part of FIG. 39 in an enlarged manner. The surface of the light emitting side resin portion 4 (in this embodiment, the boundary between the light emitting side resin portion 4 and the undercoat layer 76) is often an uneven surface. On the other hand, the undercoat layer 76 is formed by a surface treatment technique. Therefore, the surface of the undercoat layer 76 (in this embodiment, the boundary between the undercoat layer 76 and the light shielding film 6) is often flatter than the surface of the light emitting side resin portion 4.

  In the present embodiment, the photo interrupter 200 includes a translucent undercoat layer 76. The undercoat layer 76 is interposed between the light shielding film 6 and at least one of the light receiving side resin portion 3 and the light emitting side resin portion 4. Here, a case where the undercoat layer 76 is interposed between the light shielding film 6 and the light emitting side resin portion 4 is considered. When the undercoat layer 76 is interposed between the light shielding film 6 and the light emitting side resin portion 4, since the undercoat layer 76 is translucent, the infrared light L 11 is emitted from the light emitting side resin portion 4 and the undercoat layer. Then, the light passes through the boundary with 76 and enters the undercoat layer 76. Therefore, according to the photo interrupter 200, it can suppress that the infrared light L11 reflects in the surface of the light emission side resin part 4 which is an uneven surface.

  The infrared light L11 incident on the undercoat layer 76 is reflected at the boundary between the undercoat layer 76 and the light shielding film 6. The infrared light L11 reflected at the boundary between the undercoat layer 76 and the light shielding film 6 passes through the boundary between the undercoat layer 76 and the light emitting side resin portion 4 and enters the light emitting side resin portion 4 again. Thus, according to the photo interrupter 200, the infrared light L11 can be reflected on the surface of the undercoat layer 76 that is flatter.

  As described above, according to the photo interrupter 200, since the infrared light L11 can be reflected on a flatter surface, the irregular reflection of the infrared light L11 can be suppressed. Thereby, the infrared light L11 can be advanced in a desired direction.

  In the above description, the case where the undercoat layer 76 is interposed between the light shielding film 6 and the light emitting side resin portion 4 has been described. However, the undercoat layer 76 is interposed between the light shielding film 6 and the light receiving side resin portion 3. Even in this case, the same effect can be expected.

  In the present embodiment, the light emitting side resin portion 4 includes a light emitting side base portion 41 that is in contact with the base material 1. The light emission side base 41 has a light emission side base outer surface 416. The light reflecting surface 48 is located between the light emitting side base outer surface 416 and the light incident surface 38. The undercoat layer 76 covers the light emitting side base outer surface 416. According to such a configuration, the undercoat that covers the light shielding film 6 and the light emitting side base outer surface 416 while suppressing the irregular reflection of the infrared light L11 emitted from the light emitting element 21 on the surface of the light emitting side base outer surface 416. The infrared light L11 can be reflected at the boundary with the layer 76. Thereby, the infrared light L <b> 11 emitted from the light emitting element 21 can be more reliably advanced to the light emitting surface 48. As a result, the light receiving element 22 can receive more infrared light L11 from the light emitting element 21. Thereby, the presence or absence of the shielding member 811 can be determined more accurately.

  In the present embodiment, the light receiving side resin portion 3 includes a light receiving side base portion 31 in contact with the base material 1. The light receiving side base 31 has a light receiving side base outer surface 316. The light incident surface 38 is located between the light receiving side base outer surface 316 and the light emitting surface 48. The undercoat layer 76 covers the light receiving side base outer surface 316. According to such a configuration, at the boundary between the light shielding film 6 and the undercoat layer 76 covering the light receiving side base outer surface 316 while suppressing the irregular reflection of the infrared light L11 on the surface of the light receiving side base outer surface 316. Infrared light L11 can be reflected. Thereby, the infrared light L <b> 11 incident on the light incident surface 38 after being emitted from the light emitting element 21 can be more reliably advanced to the light receiving element 22. As a result, the light receiving element 22 can receive more infrared light L11 from the light emitting element 21. Thereby, the presence or absence of the shielding member 811 can be determined more accurately.

  In the present embodiment, the light emitting side base outer surface 416 includes a first light emitting side inclined portion 451 and a second light emitting side inclined portion 452 that are each inclined with respect to the thickness direction Z of the substrate 1. The first light emitting side inclined portion 451 is located on the side farther from the base material 1 than the second light emitting side inclined portion 452, and in the plan view of the base material 1, the second light emitting side inclined portion 452 and the light emitting surface. 48. The angle θ21 formed by the first light emitting side inclined portion 451 and the thickness direction Z is larger than the angle θ22 formed by the second light emitting side inclined portion 452 and the thickness direction Z. According to such a configuration, the inclination angle with respect to the thickness direction Z of each region of the light emitting side base outer surface 416 is caused to travel more infrared light L11 from the light emitting element 21 toward the light emitting side base outer surface 416 to the light incident surface 38. For the angle. As a result, the light receiving element 22 can receive more infrared light L11 from the light emitting element 21. Thereby, the presence or absence of the shielding member 811 can be determined more accurately.

  In the present embodiment, the light emitting side base outer surface 416 includes a light emitting side connecting portion 453 connected to the first light emitting side inclined portion 451 and the second light emitting side inclined portion 452. The light emitting side communication part 453 is located between the first light emitting side inclined part 451 and the second light emitting side inclined part 452. The angle θ23 formed by the light emitting side connecting portion 453 and the thickness direction Z is smaller than the angle θ22 formed by the second light emitting side inclined portion 452 and the thickness direction Z. According to such a configuration, the dimension of the light emitting side base outer surface 416 in the direction X can be reduced.

  In the present embodiment, the light receiving side base outer surface 316 includes a first light receiving side inclined portion 351 and a second light receiving side inclined portion 352 that are inclined with respect to the thickness direction Z of the substrate 1. The first light receiving side inclined portion 351 is located farther from the base material 1 than the second light receiving side inclined portion 352, and the second light receiving side inclined portion 352 and the light incident surface in a plan view of the base material 1. 38. An angle θ11 formed by the first light receiving side inclined portion 351 and the thickness direction Z is larger than an angle θ12 formed by the second light receiving side inclined portion 352 and the thickness direction Z. With such a configuration, the inclination angle of each region of the light receiving side base outer surface 316 with respect to the thickness direction Z is incident on the light receiving side resin portion 3 from the light incident surface 38, and the infrared light travels toward the light receiving side base outer surface 316. L11 can be set to an angle for causing the light receiving element 22 to advance more. As a result, the light receiving element 22 can receive more infrared light L11 from the light emitting element 21. Thereby, the presence or absence of the shielding member 811 can be determined more accurately.

  In the present embodiment, the light receiving side base outer surface 316 has a light receiving side connecting portion 353 connected to the first light receiving side inclined portion 351 and the second light receiving side inclined portion 352. The light receiving side connecting portion 353 is located between the first light receiving side inclined portion 351 and the second light receiving side inclined portion 352. The angle θ13 formed by the light receiving side connecting portion 353 and the thickness direction Z is smaller than the angle θ12 formed by the second light receiving side inclined portion 352 and the thickness direction Z. According to such a structure, the dimension in the direction X of the light emission side base outer surface 316 can be made small.

  According to the present embodiment, the same advantages as described with respect to the photo interrupters 100, 101, 102 are obtained.

<First Modification>
Next, a first modification of the second embodiment of the present invention will be described with reference to FIGS.

  FIG. 41 is a perspective view showing a photo interrupter of a first modification of the second embodiment of the present invention. FIG. 42 is a front view showing a photo interrupter of a first modification example of the second embodiment of the present invention. FIG. 43 is a plan view showing a photointerrupter according to a first modification of the second embodiment of the present invention.

  In the present modification, the light receiving side base outer surface 314 has an inclined surface 314a. The inclined surface 314a has a direction X that is a direction in which the light receiving side resin portion 3 and the light emitting side resin portion 4 are separated from the light receiving element 22 in a plan view of the base material 1, and a thickness direction Z of the base material 1. It is located on the direction Y side orthogonal to any direction. The inclined surface 314 a is inclined with respect to the thickness direction Z of the substrate 1. Specifically, the inclined surface 314a is inclined with respect to the thickness direction Z of the base material 1 so as to approach the light incident surface 38 in plan view of the base material 1 as the distance from the base material 1 increases.

  In the present modification, the light emitting side base outer surface 414 has an inclined surface 414a. The inclined surface 414a is formed between a direction X in which the light receiving side resin portion 3 and the light emitting side resin portion 4 are separated from the light emitting element 21 in a plan view of the base material 1, and a thickness direction Z of the base material 1. It is located on the direction Y side orthogonal to any direction. The inclined surface 414 a is inclined with respect to the thickness direction Z of the substrate 1. Specifically, the inclined surface 414a is inclined with respect to the thickness direction Z of the base material 1 so as to approach the light emitting surface 48 in plan view of the base material 1 as the distance from the base material 1 increases.

  Except for the above points, the photo interrupter 201 is the same as the photo interrupter 200.

  According to this modified example, the inclined surface 414a allows more infrared light L11 from the light emitting element 21 to be directed from the light emitting surface 48 to the light incident surface 38. Further, the inclined surface 314a can cause more infrared light L11 incident on the light incident surface 38 to be directed toward the light receiving element 22. By these, the presence or absence of the shielding member 811 can be determined more accurately.

<Third Embodiment>
Next, a third embodiment of the present invention will be described with reference to FIGS.

  FIG. 44 is a perspective view showing a photointerrupter according to the third embodiment of the present invention. FIG. 45 is a front view showing a photointerrupter according to the third embodiment of the present invention. FIG. 46 is a plan view showing a photo interrupter according to the third embodiment of the present invention. FIG. 47 is a left side view of the photointerrupter shown in FIG. FIG. 48 is a right side view of the photo interrupter shown in FIG. 44 to 48, the portions exposed from the light shielding film 6 are shown by hatching.

  The photo interrupter 300 shown in these drawings includes a base material 1, a light emitting element 21, a light receiving element 22, a light receiving side resin portion 3, a light emitting side resin portion 4, and a light transmitting resin portion 51 (illustrated in the present embodiment). 26), a light shielding film 6, an undercoat layer 76, and a plurality of wires 79 (not shown in this embodiment, see FIG. 5 and the like). The photo interrupter 300 differs from the photo interrupter 200 in the shapes of the light receiving side resin portion 3 and the light emitting side resin portion 4. Except for the light-receiving side resin part 3 and the light-emitting side resin part 4, in the photo interrupter 300, the substrate 1, the light-emitting element 21, the light-receiving element 22, the light-transmitting resin part 51, the light-shielding film 6, the undercoat layer 76, and a plurality of wires Since the respective components 79 are the same as those in the photo interrupter 200, description thereof is omitted.

The light receiving side resin portion 3 includes a light receiving side base portion 31, a light receiving side protruding portion 32, and a light receiving side raised portion 34. The light receiving side protruding portion 32 and the light receiving side raised portion 34 are the same as those of the photo interrupter 200, and thus description thereof is omitted.

  Also in the present embodiment, the light receiving side base 31 includes a light receiving side base side surface 311, a light receiving side base outer surface 313, 314, 315, 316, a first light receiving side top surface 318a, a second light receiving side top surface 318b, And a light receiving side connection surface 318c. Since the light receiving side base side surface 311 and the light receiving side base outer surface 313, 314, 315, 316 in the light receiving side base 31 are substantially the same as the configuration in the photo interrupter 200, the description thereof is omitted.

  The first light receiving side top surface 318a and the second light receiving side top surface 318b face the side opposite to the side on which the substrate 1 is located (direction Z1). The first light receiving side top surface 318 a and the second light receiving side top surface 318 b are located on the side farthest from the substrate 1 in the light receiving side resin portion 3. The first light receiving side top surface 318a and the second light receiving side top surface 318b are separated in the direction Y. As shown in FIG. 46, the light receiving side base outer surface 316 is interposed between the first light receiving side top surface 318a and the second light receiving side top surface 318b in the thickness direction Z view of the base material 1 (plan view of the base material 1). (The first light receiving side base outer surface) is located. The first light receiving side top surface 318a and the second light receiving side top surface 318b are flat. The first light receiving side top surface 318a and the second light receiving side top surface 318b are located on the same plane.

  The first light receiving side top surface 318 a and the second light receiving side top surface 318 b are connected to the light receiving side base outer surfaces 311, 313, and 314, respectively.

  The light receiving side connection surface 318c connects the first light receiving side top surface 318a and the second light receiving side top surface 318b. The light receiving side connection surface 318 c is connected to the light receiving side base outer surface 316. The light receiving side connection surface 318 c is located between the light receiving side base outer surface 316 and the light incident surface 38 in the direction Z. The light receiving side connection surface 318c is flat. In the present embodiment, the light receiving side connection surface 318c is located on the same plane as the first light receiving side top surface 318a and the second light receiving side top surface 318b.

  The minimum dimension L33 in the direction X of the light receiving side connection surface 318c is smaller than both the dimension L31 in the direction X of the first light receiving side top surface 318a and the dimension L32 in the direction X of the second light receiving side top surface 318b.

  Also in the present embodiment, the light emitting side base 41 includes a light emitting side base side 411, a light emitting side base outer surface 413, 414, 415, 416, a first light emitting side top surface 418a, a second light emitting side top surface 418b, And a light emitting side connection surface 418c. Since the light emission side base side surface 411 and the light emission side base outer surface 413, 414, 415, 416 in the light emission side base 41 are substantially the same as the configuration in the photo interrupter 200, description thereof is omitted.

  The 1st light emission side top surface 418a and the 2nd light emission side top surface 418b have faced the opposite side (direction Z1) to the side where the base material 1 is located. The first light-emitting side top surface 418 a and the second light-emitting side top surface 418 b are located on the side farthest from the substrate 1 in the light-emitting side resin portion 4. The first light emitting side top surface 418a and the second light emitting side top surface 418b are separated in the direction Y. As shown in FIG. 46, the light emitting side base outer surface 416 between the first light emitting side top surface 418a and the second light emitting side top surface 418b in the thickness direction Z view of the base material 1 (planar view of the base material 1). (First light emission side base outer surface) is located. The first light emission side top surface 418a and the second light emission side top surface 418b are flat. The first light emission side top surface 418a and the second light emission side top surface 418b are located on the same plane. The first light emitting side top surface 418a and the second light emitting side top surface 418b are located on the same plane as the first light receiving side top surface 318a and the second light receiving side top surface 318b.

The first light emitting side top surface 418a and the second light emitting side top surface 418b are connected to the light emitting side base outer surfaces 411, 413, and 414, respectively.

  The light emission side connection surface 418c connects the first light emission side top surface 418a and the second light emission side top surface 418b. The light emission side connection surface 418c is connected to the light emission side base outer surface 416. The light emitting side connection surface 418c is located between the light emitting side base outer surface 416 and the light emitting surface 48 as viewed in the direction Z. The light emitting side connection surface 418c is flat. In the present embodiment, the light emission side connection surface 418c is located on the same plane as the first light emission side top surface 418a and the second light emission side top surface 418b.

  The minimum dimension L43 in the direction X of the light emitting side connection surface 418c is smaller than both the dimension L41 in the direction X of the first light emitting side top surface 418a and the dimension L42 in the direction X of the second light emitting side top surface 418b.

  As shown in FIG. 49, the photo interrupter 300 is arranged on the mounting substrate 871 and then arranged in the recess of the component 875. In the present embodiment, the mounting substrate 871 is a flexible substrate. When the photo interrupter 300 is disposed in the recess of the component 875, the first light receiving side top surface 318a, the second light receiving side top surface 318b, the first light emitting side top surface 418a, and the second light emitting side top surface 418b are Pressed against face 876 of part 875. Thereby, the photo interrupter 300 is fixed to the component 875.

  Next, the effect of this embodiment is demonstrated.

  According to the present embodiment, in addition to the same functions and effects as those of the photo interrupter 200, the following functions and effects are achieved.

  In the present embodiment, the first light receiving side top surface 318a and the second light receiving side top surface 318b each face the side opposite to the side on which the substrate 1 is located. The light receiving side connection surface 318c connects the first light receiving side top surface 318a and the second light receiving side top surface 318b. The first light receiving side top surface 318a and the second light receiving side top surface 318b are separated in the direction Y. The minimum dimension L33 in the direction X of the light receiving side connection surface 318c is smaller than both the dimension L31 in the direction X of the first light receiving side top surface 318a and the dimension L32 in the direction X of the second light receiving side top surface 318b. According to such a structure, the intensity | strength of the part by the side of direction Z1 among the light reception side resin parts 3 can be improved. Thus, when the first light receiving side top surface 318a and the second light receiving side top surface 318b are pressed against the surface 876, the first light receiving side top surface 318a and the second light receiving side top surface of the light receiving side resin portion 3 are pressed. It can prevent that the part which comprises 318b is damaged.

  In the present embodiment, the light receiving side base outer surface 316 is inclined with respect to the thickness direction Z of the base material 1 so as to approach the light emitting side resin part 4 as the distance from the base material 1 increases. The light receiving side base outer surface 316 is located between the first light receiving side top surface 318a and the second light receiving side top surface 318b in the thickness direction Z view of the substrate 1. According to such a configuration, the first light receiving side top surface 318a and the second light receiving side top surface 318b of the light receiving side resin portion 3 are made while more infrared light L11 from the light emitting element 21 reaches the light receiving element 22. Can be prevented from being damaged.

  In the present embodiment, each of the first light emission side top surface 418a and the second light emission side top surface 418b faces the side opposite to the side where the substrate 1 is located. The light emission side connection surface 418c connects the first light emission side top surface 418a and the second light emission side top surface 418b. The first light emitting side top surface 418a and the second light emitting side top surface 418b are separated in the direction Y. The minimum dimension L43 in the direction X of the light emitting side connection surface 418c is smaller than both the dimension L41 in the direction X of the first light emitting side top surface 418a and the dimension L42 in the direction X of the second light emitting side top surface 418b. According to such a structure, the intensity | strength of the part by the side of direction Z1 among the light emission side resin parts 4 can be improved. Thereby, when the 1st light emission side top surface 418a and the 2nd light emission side top surface 418b are pressed on the surface 876, among the light emitting resin parts 4, the 1st light emission side top surface 418a and the 2nd light emission side top surface It can prevent that the part which comprises 418b breaks.

  In the present embodiment, the light-emitting side base outer surface 416 is inclined with respect to the thickness direction Z of the base material 1 so as to approach the light-receiving side resin part 3 as the distance from the base material 1 increases. The light emitting side base outer surface 416 is located between the first light emitting side top surface 418a and the second light emitting side top surface 418b in the thickness direction Z view of the substrate 1. According to such a configuration, the first light emitting side top surface 418a and the second light emitting side top surface 418b of the light emitting side resin portion 4 are made while more infrared light L11 from the light emitting element 21 reaches the light receiving element 22. Can be prevented from being damaged.

  In the present embodiment, the first light receiving side top surface 318a, the second light receiving side top surface 318b, the first light emitting side top surface 418a, and the second light emitting side top surface 418b are all located on the same plane. According to such a configuration, when the surface 876 of the component 875 is flat, the first light receiving side top surface 318a, the second light receiving side top surface 318b, the first light emitting side top surface 418a, and the second light emitting side top surface. Any of 418b can be easily brought into contact with the surface 875. Thereby, the photo interrupter 300 can be reliably fixed to the component 375.

  The present invention is not limited to the embodiment described above. The specific configuration of each part of the present invention can be changed in various ways. For example, the light-receiving side resin portion 3 may not include the light-receiving side raised portion 34. In this case, the light receiving side base side surface 311 constitutes a light incident surface. The light emitting side resin portion 4 may not include the light emitting side raised portion 44. In this case, the light emission side base side surface 411 constitutes a light emission surface. The configuration in which the light-receiving side resin portion 3 does not include the light-receiving side raised portion 34 and the configuration in which the light-emitting side resin portion 4 does not include the light-emitting side raised portion 44 are cured to form the light emitting surface 48, for example. It may be adopted when the tool 887 (see FIG. 23) is used.

800 Mounting structure 100, 101, 102, 103, 104, 105, 200, 201, 300 Photo interrupter 1, 1 'Base material 11 Substrate 111 Main surface 112 Back surface 113 Side surface 118 Corner groove 12 Main surface electrode 121 Light receiving side die pad 122 Light receiving Side wire bonding pad 124 Light emitting side die pad 125 Light emitting side wire bonding pad 126 Connection wiring portion 127 Quadrant ring portion 13 Back electrode 131 Mounting pad 136 Connection wiring portion 137 Quad ring shape portion 14 Contact electrode 21 Light emitting element 22 Light receiving element 221 Light receiving surface 3 3 'light receiving side resin part 31 light receiving side base part 311 light receiving side base part side face 313, 314, 315, 316, 317 light receiving side base outer surface 318a first light receiving side top face 318b second light receiving side top face 318c light receiving side connection face 32 light receiving side Protruding part 321 Light receiving side protruding part side surface 32 2 Light-receiving-side protruding portion outer surface 326 Light-receiving-side connecting surfaces 34, 34 'Light-receiving-side raised portion 351 First light-receiving-side inclined portion 352 Second light-receiving-side inclined portion 353 Light-receiving-side connecting portion 38 Light incident surface 381 First incident portion 382 Second Incident portion 4, 4 'Light emitting side resin portion 41 Light emitting side base portion 411 Light emitting side base side surface 413, 414, 415, 416, 417 Light emitting side base outer surface 418a First light emitting side top surface 418b Second light emitting side top surface 418c Light emitting side connection Surface 42 Light-emitting side protruding portion 421 Light-emitting side protruding portion side surface 422 Light-emitting side protruding portion outer surface 426 Light-emitting side connecting surface 44, 44 ′ Light-emitting side raised portion 451 First light-emitting side inclined portion 452 Second light-emitting side inclined portion 453 Light-emitting side connecting portion 48 Light exit surface 481 First exit portion 482 Second exit portion 51, 51 ′ Translucent resin portion 511 End surface 59 Cavity 6, 6 ′ Light shielding film 61 Light receiving side covering portion 62 Light emitting side covering portion 63 Base material covering portion 68 First 1st layer 69 2nd layer 76 Undercoat layer 79 Wire 791 Cut surface 811 Shield member 861 Line segment 871 Mounting substrate 872 Solder layer 875 Component 876 Surface 886 Dicing blade 887 Jig 89 Translucent resin body C1 Center L11 Infrared light X, X1, X2, Y, Y1, Y2, Z, Z1, Z2 Direction θ11, θ12, θ13, θ21, θ22, θ23 Angle

Claims (31)

A substrate;
A light emitting device disposed on the substrate;
A light receiving element disposed on the substrate;
A light-transmitting light-receiving side resin portion covering the light-receiving element;
A light-transmitting light-emitting side resin portion covering the light-emitting element;
A light shielding film that covers at least the light receiving element and the light emitting element while preventing the light receiving element and the light emitting element from facing each other.
The light emitting element and the light receiving element overlap in the thickness direction of the base material,
The light emitting side resin portion is in a first direction with respect to the light receiving side resin portion, and is spaced apart from the plane where the light receiving element and the light emitting element overlap through a gap,
In the light shielding film, a portion formed in close contact with the light receiving side resin portion and a portion formed in close contact with the light emitting side resin portion are separated from each other through the gap in the first direction.
The light-receiving side resin portion has a light incident surface exposed from the light-shielding film, and the light-emitting side resin portion is exposed from the light-shielding film and has a thickness greater than that of the light-emitting element in the base material. A light exit surface arranged at a position far from the light entrance surface and the light exit surface both face the gap,
The light emitted from the light emitting element is emitted from the light emitting surface toward the light receiving side resin portion ,
The light incident surface includes a first incident part facing the side where the light emitting side resin part is located, and a second incident part disposed closer to the light emitting side resin part than the first incident part. And the second incident part faces a direction different from a direction of the first incident part . 2. The photointerrupter according to claim 1 , wherein the second incident portion faces the same direction as a direction from the base material toward the light receiving side resin portion in a thickness direction of the base material. The second incident portion, to face the side opposite to the side on which the position of the light emitting side resin section with increasing distance from the substrate is inclined with respect to the thickness direction of the substrate, according to claim 1 Photo interrupter. The photo interrupter according to claim 1, wherein the light shielding film has a thickness of 0.01 to 100 μm. The light-shielding film has a substrate covering portion that covers the substrate and faces the gap,
5. The photointerrupter according to claim 1 , wherein each of the light emitting surface and the light incident surface is separated from the base material covering portion in the thickness direction of the base material. . The light receiving side resin section includes a light-receiving side base covering the light receiving element, the light receiving side base is in contact with the substrate, the photo-interrupter according to any one of claims 1 to 5. The light receiving side resin section includes a light-receiving-side protrusion protruding from the light-receiving side base on the side position of the light emitting side resin section, the light receiving side projection is in contact with the substrate, according to claim 6 Photo-interrupter. 8. The photo according to claim 7 , wherein a dimension of the light receiving side protruding portion is larger than a dimension of the light receiving element in a second direction orthogonal to both the first direction and the thickness direction of the base material. Interruptor. The photo interrupter according to claim 8 , wherein the light receiving side protruding portion has a light receiving side protruding portion side surface facing a side where the light emitting side resin portion is located. The light receiving side projection side surface, said to face the side opposite to the side on which the position of the light emitting side resin section with increasing distance from the substrate is inclined with respect to the thickness direction of the substrate, to claim 9 The described photo interrupter. The light receiving side resin portion includes a light receiving side raised portion that protrudes from the light receiving side base portion on the side where the light emitting side resin portion is located,
The light-receiving side raised portion constitutes the light incident surface,
The light receiving side protruding portion has a light receiving side connecting surface connected to the light receiving side protruding portion side surface and the light receiving side base portion,
The photo interrupter according to claim 9 or 10 , wherein the light receiving side raised portion is raised from the light receiving side communication surface. The light receiving side resin portion includes a light receiving side raised portion that protrudes from the light receiving side base portion on the side where the light emitting side resin portion is located,
The photo interrupter according to any one of claims 6 to 10 , wherein the light receiving side raised portion constitutes the light incident surface. The light receiving side base has a light receiving side base side facing the side where the light emitting side resin part is located,
The photo interrupter according to any one of claims 6 to 12 , wherein at least a part of the side surface of the light receiving side base portion is located on a side farther from the base material than the light incident surface. The photointerrupter according to any one of claims 1 to 13 , wherein the light emitting side resin portion includes a light emitting side base portion that covers the light emitting element, and the light emitting side base portion is in contact with the base material. The light emitting side resin part includes a light-emitting-side protrusion protruding from the light-emitting side base on the side position of the light receiving side resin section, the light-emitting-side protruding portion is in contact with the substrate, according to claim 14 Photo-interrupter. The light emitting side resin portion includes a light emitting side raised portion that protrudes from the light emitting side base portion on the side where the light receiving side resin portion is located,
The photo interrupter according to claim 14 or 15 , wherein the light emitting side raised portion constitutes the light emitting surface. The light emitting surface includes a first emitting portion facing the side where the light receiving side resin portion is located, and a second emitting portion disposed closer to the light receiving side resin portion than the first emitting portion. The photo interrupter according to any one of claims 1 to 16 , wherein the second emission part faces in a direction different from a direction in which the first emission part faces. The light shielding film is a black or gray, photo interrupter as claimed in any one of claims 1 to 17. The light shielding film includes a first layer in contact with at least one of the light receiving side resin portion and the light emitting side resin portion, and a second layer laminated on the first layer, wherein the first layer is a metal more it becomes, and the second layer consists of an oxide of the metal, the photo-interrupter according to any one of claims 1 to 17. A substrate;
A light emitting device disposed on the substrate;
A light receiving element disposed on the substrate;
A light-transmitting light-receiving side resin portion covering the light-receiving element;
A light-transmitting light-emitting side resin portion covering the light-emitting element;
A light shielding film that covers at least the light receiving element and the light emitting element while preventing the light receiving element and the light emitting element from facing each other.
The light emitting element and the light receiving element overlap in the thickness direction of the base material,
The light emitting side resin portion is in a first direction with respect to the light receiving side resin portion, and is spaced apart from the plane where the light receiving element and the light emitting element overlap through a gap,
In the light shielding film, a portion formed in close contact with the light receiving side resin portion and a portion formed in close contact with the light emitting side resin portion are separated from each other through the gap in the first direction.
The light-receiving side resin portion has a light incident surface exposed from the light-shielding film, and the light-emitting side resin portion is exposed from the light-shielding film and has a thickness greater than that of the light-emitting element in the base material. A light exit surface arranged at a position far from the light entrance surface and the light exit surface both face the gap,
The light emitted from the light emitting element is emitted from the light emitting surface toward the light receiving side resin portion,
A light-transmitting undercoat layer interposed between the light-shielding film and at least one of the light-receiving side resin portion and the light-emitting side resin portion;
The light emitting side resin part includes a light emitting side base part in contact with the base material,
The light emitting side base has a first light emitting side base outer surface,
The light emitting side base has a first light emitting side top surface, a second light emitting side top surface, and a light emitting side connection surface,
Each of the first light emission side top surface and the second light emission side top surface faces the side opposite to the side where the substrate is located,
The light emitting side connection surface connects the first light emitting side top surface and the second light emitting side top surface,
The first light emitting side top surface and the second light emitting side top surface are separated in a second direction orthogonal to both the first direction and the thickness direction,
  The minimum dimension of the light emitting side connection surface in the first direction is greater than both the dimension of the first light emitting side top surface in the first direction and the dimension of the second light emitting side top surface in the first direction. Small photo interrupter. The first light emission side base outer surface is inclined with respect to the thickness direction of the base material so as to approach the light receiving side resin part as the distance from the base material increases.
21. The photointerrupter according to claim 20 , wherein the outer surface of the first light emitting side base portion is located between the first light emitting side top surface and the second light emitting side top surface when viewed in the thickness direction of the base material. The light receiving side resin portion includes a light receiving side base portion that covers the light receiving element, and the light receiving side base portion includes a first light receiving side top surface, a second light receiving side top surface, and a light receiving side connection surface,
Each of the first light receiving side top surface and the second light receiving side top surface faces the side opposite to the side on which the substrate is located,
The light receiving side connection surface connects the first light receiving side top surface and the second light receiving side top surface,
The first light receiving side top surface and the second light receiving side top surface are spaced apart in a second direction orthogonal to both the first direction and the thickness direction,
The minimum dimension of the light receiving side connection surface in the first direction is greater than both the dimension of the first light receiving side top surface in the first direction and the dimension of the second light receiving side top surface in the first direction. The photointerrupter according to claim 20 or 21, which is small. Before Symbol receiving side base includes a first light-receiving side base outer surface,
The outer surface of the first light receiving side base portion is inclined with respect to the thickness direction of the base material so as to approach the light emitting side resin portion as the distance from the base material increases.
23. The photointerrupter according to claim 22 , wherein the first light receiving side base outer surface is located between the first light receiving side top surface and the second light receiving side top surface when viewed in the thickness direction of the base material. The first light receiving side top surface, the second light-receiving-side top surface, the first light emitting side top surface, and the second light emitting side top surface are all positioned on the same plane, according to claim 22 or claim 23 The photo interrupter described in 1. A substrate;
A light emitting device disposed on the substrate;
A light receiving element disposed on the substrate;
A light-transmitting light-receiving side resin portion covering the light-receiving element;
A light-transmitting light-emitting side resin portion covering the light-emitting element;
A light shielding film that covers at least the light receiving element and the light emitting element while preventing the light receiving element and the light emitting element from facing each other.
The light emitting element and the light receiving element overlap in the thickness direction of the base material,
The light emitting side resin portion is in a first direction with respect to the light receiving side resin portion, and is spaced apart from the plane where the light receiving element and the light emitting element overlap through a gap,
In the light shielding film, a portion formed in close contact with the light receiving side resin portion and a portion formed in close contact with the light emitting side resin portion are separated from each other through the gap in the first direction.
The light-receiving side resin portion has a light incident surface exposed from the light-shielding film, and the light-emitting side resin portion is exposed from the light-shielding film and has a thickness greater than that of the light-emitting element in the base material. A light exit surface arranged at a position far from the light entrance surface and the light exit surface both face the gap,
The light emitted from the light emitting element is emitted from the light emitting surface toward the light receiving side resin portion,
The light emitting surface includes a first emitting portion facing the side where the light receiving side resin portion is located, and a second emitting portion disposed closer to the light receiving side resin portion than the first emitting portion. And the second emission part faces a direction different from a direction of the first emission part. The substrate is a substrate having a main surface and a back surface, the principal surface electrode formed on the main surface, including a backside electrode formed on the back surface, to any one of claims 1 to 25 The described photo interrupter. The main surface electrode has a light receiving side die pad on which the light receiving element is disposed, and the light incident surface is disposed at a position overlapping the light receiving side die pad in the thickness direction of the base material. Item 27. The photo interrupter according to Item 26 . 28. The photointerrupter according to claim 26 or claim 27 , wherein the base material includes a connection electrode connected to the main surface electrode and the back surface electrode. The photointerrupter according to claim 28 , wherein the communication electrode penetrates the substrate. The substrate has a rectangular shape, and the substrate has corner grooves positioned at corners of the substrate as viewed in the thickness direction of the base material, and the connection electrodes are formed in the corner grooves. The photo interrupter according to claim 28 . A photo interrupter according to any of claims 1 to 30 ,
A mounting board;
A mounting structure for a photo interrupter, comprising: a solder layer interposed between the mounting substrate and the photo interrupter.

Images