JP7371613B2 - 電子部品の封止体 - Google Patents

電子部品の封止体 Download PDF

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Publication number
JP7371613B2
JP7371613B2 JP2020218278A JP2020218278A JP7371613B2 JP 7371613 B2 JP7371613 B2 JP 7371613B2 JP 2020218278 A JP2020218278 A JP 2020218278A JP 2020218278 A JP2020218278 A JP 2020218278A JP 7371613 B2 JP7371613 B2 JP 7371613B2
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JP
Japan
Prior art keywords
electronic component
resin
electromagnetic shielding
resins
filler
Prior art date
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Active
Application number
JP2020218278A
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English (en)
Japanese (ja)
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JP2021055113A5 (enExample
JP2021055113A (ja
Inventor
亮 浜崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyobo MC Corp
Original Assignee
Toyobo MC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2019101328A external-priority patent/JP7236326B2/ja
Application filed by Toyobo MC Corp filed Critical Toyobo MC Corp
Priority to JP2020218278A priority Critical patent/JP7371613B2/ja
Publication of JP2021055113A publication Critical patent/JP2021055113A/ja
Publication of JP2021055113A5 publication Critical patent/JP2021055113A5/ja
Application granted granted Critical
Publication of JP7371613B2 publication Critical patent/JP7371613B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2020218278A 2019-05-30 2020-12-28 電子部品の封止体 Active JP7371613B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020218278A JP7371613B2 (ja) 2019-05-30 2020-12-28 電子部品の封止体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019101328A JP7236326B2 (ja) 2019-05-30 2019-05-30 電子部品の封止体、及び電子部品の封止体の製造方法
JP2020218278A JP7371613B2 (ja) 2019-05-30 2020-12-28 電子部品の封止体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2019101328A Division JP7236326B2 (ja) 2019-05-30 2019-05-30 電子部品の封止体、及び電子部品の封止体の製造方法

Publications (3)

Publication Number Publication Date
JP2021055113A JP2021055113A (ja) 2021-04-08
JP2021055113A5 JP2021055113A5 (enExample) 2022-05-13
JP7371613B2 true JP7371613B2 (ja) 2023-10-31

Family

ID=88509956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020218278A Active JP7371613B2 (ja) 2019-05-30 2020-12-28 電子部品の封止体

Country Status (1)

Country Link
JP (1) JP7371613B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4611497A1 (en) 2022-10-26 2025-09-03 JX Advanced Metals Corporation Metal resin composite electromagnetic shielding material
WO2025188340A1 (en) * 2024-03-08 2025-09-12 Microchip Technology Incorporated Shielding particles coated with electrical insulation

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237352A (ja) 2000-02-25 2001-08-31 Sony Corp 半導体パッケージ、発熱部品及びその放熱構造
JP2002324877A (ja) 2001-04-25 2002-11-08 Mitsui Chemicals Inc 半導体素子
JP2002363382A (ja) 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2006160560A (ja) 2004-12-07 2006-06-22 Nitto Denko Corp 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置
JP2007287937A (ja) 2006-04-17 2007-11-01 Kyocera Chemical Corp 樹脂封止型半導体装置及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001237352A (ja) 2000-02-25 2001-08-31 Sony Corp 半導体パッケージ、発熱部品及びその放熱構造
JP2002324877A (ja) 2001-04-25 2002-11-08 Mitsui Chemicals Inc 半導体素子
JP2002363382A (ja) 2001-06-08 2002-12-18 Sony Corp 半導体封止用樹脂組成物およびそれを用いた半導体装置
JP2006160560A (ja) 2004-12-07 2006-06-22 Nitto Denko Corp 球状焼結フェライト粒子およびそれを用いた半導体封止用樹脂組成物ならびにそれを用いて得られる半導体装置
JP2007287937A (ja) 2006-04-17 2007-11-01 Kyocera Chemical Corp 樹脂封止型半導体装置及びその製造方法

Also Published As

Publication number Publication date
JP2021055113A (ja) 2021-04-08

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