JP7364826B1 - 光検出装置および電子機器 - Google Patents

光検出装置および電子機器 Download PDF

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Publication number
JP7364826B1
JP7364826B1 JP2023535881A JP2023535881A JP7364826B1 JP 7364826 B1 JP7364826 B1 JP 7364826B1 JP 2023535881 A JP2023535881 A JP 2023535881A JP 2023535881 A JP2023535881 A JP 2023535881A JP 7364826 B1 JP7364826 B1 JP 7364826B1
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transistor
pixel
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semiconductor region
semiconductor
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Japanese (ja)
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JPWO2023157819A1 (https=
JPWO2023157819A5 (https=
Inventor
和弘 米田
央 大長
寛 福永
悠介 大竹
表徳 遠藤
圭一 中澤
秀俊 大石
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Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H10F39/8027—Geometry of the photosensitive area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033—Photosensitive area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/807—Pixel isolation structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
JP2023535881A 2022-02-15 2023-02-14 光検出装置および電子機器 Active JP7364826B1 (ja)

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JP2023172956A JP7589310B2 (ja) 2022-02-15 2023-10-04 光検出装置および電子機器

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US202263310267P 2022-02-15 2022-02-15
US63/310267 2022-02-15
PCT/JP2023/004902 WO2023157819A1 (ja) 2022-02-15 2023-02-14 光検出装置および電子機器

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JP7364826B1 true JP7364826B1 (ja) 2023-10-18
JPWO2023157819A5 JPWO2023157819A5 (https=) 2024-01-24

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US (1) US20250133845A1 (https=)
EP (1) EP4481827A4 (https=)
JP (2) JP7364826B1 (https=)
KR (1) KR20240148835A (https=)
CN (1) CN118302861A (https=)
TW (1) TWI882374B (https=)
WO (1) WO2023157819A1 (https=)

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WO2025204812A1 (ja) * 2024-03-29 2025-10-02 ソニーセミコンダクタソリューションズ株式会社 光検出装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142188A (ja) * 2010-01-06 2011-07-21 Nikon Corp 固体撮像素子
WO2012117931A1 (ja) * 2011-03-02 2012-09-07 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法及び電子機器
JP2016039315A (ja) * 2014-08-08 2016-03-22 株式会社東芝 固体撮像素子
WO2019220810A1 (ja) * 2018-05-16 2019-11-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および固体撮像装置
WO2021215290A1 (ja) * 2020-04-20 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5564874B2 (ja) 2009-09-25 2014-08-06 ソニー株式会社 固体撮像装置、及び電子機器
JPWO2012160802A1 (ja) * 2011-05-24 2014-07-31 パナソニック株式会社 固体撮像装置
JP2015153772A (ja) * 2014-02-10 2015-08-24 株式会社東芝 固体撮像装置
JP7117110B2 (ja) 2018-01-31 2022-08-12 ソニーグループ株式会社 光電変換素子および撮像装置
JP2019145544A (ja) * 2018-02-16 2019-08-29 ソニーセミコンダクタソリューションズ株式会社 撮像素子
TWI834644B (zh) 2018-05-18 2024-03-11 日商索尼半導體解決方案公司 攝像元件及電子機器
CN109166873B (zh) * 2018-08-31 2021-05-25 上海华力微电子有限公司 一种像素结构及其制造方法
US12136639B2 (en) 2018-11-06 2024-11-05 Sony Semiconductor Solutions Corporation Imaging element and electronic equipment
CN113614932B (zh) * 2019-03-28 2024-01-09 松下知识产权经营株式会社 光检测器
US11450700B2 (en) 2020-07-29 2022-09-20 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor image sensor pixel isolation structure for reducing crosstalk

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011142188A (ja) * 2010-01-06 2011-07-21 Nikon Corp 固体撮像素子
WO2012117931A1 (ja) * 2011-03-02 2012-09-07 ソニー株式会社 固体撮像装置、固体撮像装置の製造方法及び電子機器
JP2016039315A (ja) * 2014-08-08 2016-03-22 株式会社東芝 固体撮像素子
WO2019220810A1 (ja) * 2018-05-16 2019-11-21 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および固体撮像装置
WO2021215290A1 (ja) * 2020-04-20 2021-10-28 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子

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JPWO2023157819A1 (https=) 2023-08-24
EP4481827A1 (en) 2024-12-25
JP2023179619A (ja) 2023-12-19
TW202433950A (zh) 2024-08-16
CN118302861A (zh) 2024-07-05
EP4481827A4 (en) 2025-10-08
WO2023157819A1 (ja) 2023-08-24
TWI882374B (zh) 2025-05-01
KR20240148835A (ko) 2024-10-11
JP7589310B2 (ja) 2024-11-25
US20250133845A1 (en) 2025-04-24

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