JP7357180B1 - 窒化ホウ素粒子及び放熱シート - Google Patents

窒化ホウ素粒子及び放熱シート Download PDF

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Publication number
JP7357180B1
JP7357180B1 JP2023535456A JP2023535456A JP7357180B1 JP 7357180 B1 JP7357180 B1 JP 7357180B1 JP 2023535456 A JP2023535456 A JP 2023535456A JP 2023535456 A JP2023535456 A JP 2023535456A JP 7357180 B1 JP7357180 B1 JP 7357180B1
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boron nitride
nitride particles
particles
less
boron
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Japanese (ja)
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JPWO2023127729A5 (https=
JPWO2023127729A1 (https=
Inventor
祐輔 佐々木
建治 宮田
道治 中嶋
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Denka Co Ltd
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Denka Co Ltd
Denki Kagaku Kogyo KK
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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023535456A 2021-12-27 2022-12-23 窒化ホウ素粒子及び放熱シート Active JP7357180B1 (ja)

Applications Claiming Priority (3)

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JP2021213165 2021-12-27
JP2021213165 2021-12-27
PCT/JP2022/047651 WO2023127729A1 (ja) 2021-12-27 2022-12-23 窒化ホウ素粒子及び放熱シート

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JPWO2023127729A1 JPWO2023127729A1 (https=) 2023-07-06
JP7357180B1 true JP7357180B1 (ja) 2023-10-05
JPWO2023127729A5 JPWO2023127729A5 (https=) 2023-11-29

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025137036A (ja) * 2024-03-08 2025-09-19 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168813A (ja) * 2016-03-09 2017-09-21 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シート、およびその製造方法
JP2018020932A (ja) * 2016-08-03 2018-02-08 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及び樹脂組成物とその用途
WO2018139643A1 (ja) * 2017-01-30 2018-08-02 積水化学工業株式会社 樹脂材料及び積層体
JP2018188350A (ja) * 2017-04-28 2018-11-29 積水化学工業株式会社 窒化ホウ素粒子の凝集体及び熱硬化性材料
WO2020004600A1 (ja) * 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020158758A1 (ja) * 2019-01-29 2020-08-06 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
WO2020175377A1 (ja) * 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス
JP2021091579A (ja) * 2019-12-11 2021-06-17 デンカ株式会社 複合粒子を含有する粉体及びその製造方法、並びに、該粉体を含有する樹脂組成物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017168813A (ja) * 2016-03-09 2017-09-21 東洋インキＳｃホールディングス株式会社 熱伝導性絶縁シート、およびその製造方法
JP2018020932A (ja) * 2016-08-03 2018-02-08 デンカ株式会社 六方晶窒化ホウ素一次粒子凝集体及び樹脂組成物とその用途
WO2018139643A1 (ja) * 2017-01-30 2018-08-02 積水化学工業株式会社 樹脂材料及び積層体
JP2018188350A (ja) * 2017-04-28 2018-11-29 積水化学工業株式会社 窒化ホウ素粒子の凝集体及び熱硬化性材料
WO2020004600A1 (ja) * 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
WO2020158758A1 (ja) * 2019-01-29 2020-08-06 デンカ株式会社 窒化ホウ素粉末及び樹脂組成物
WO2020175377A1 (ja) * 2019-02-27 2020-09-03 三菱ケミカル株式会社 窒化ホウ素凝集粉末、放熱シート及び半導体デバイス
JP2021091579A (ja) * 2019-12-11 2021-06-17 デンカ株式会社 複合粒子を含有する粉体及びその製造方法、並びに、該粉体を含有する樹脂組成物

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JPWO2023127729A1 (https=) 2023-07-06

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