JP7355598B2 - フォトマスク、電子デバイスの製造方法、および、フォトマスクの製造方法 - Google Patents
フォトマスク、電子デバイスの製造方法、および、フォトマスクの製造方法 Download PDFInfo
- Publication number
- JP7355598B2 JP7355598B2 JP2019192029A JP2019192029A JP7355598B2 JP 7355598 B2 JP7355598 B2 JP 7355598B2 JP 2019192029 A JP2019192029 A JP 2019192029A JP 2019192029 A JP2019192029 A JP 2019192029A JP 7355598 B2 JP7355598 B2 JP 7355598B2
- Authority
- JP
- Japan
- Prior art keywords
- photomask
- transmission control
- transfer
- exposure
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/32—Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2059—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam
- G03F7/2063—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a scanning corpuscular radiation beam, e.g. an electron beam for the production of exposure masks or reticles
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018198733 | 2018-10-22 | ||
JP2018198733 | 2018-10-22 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020067661A JP2020067661A (ja) | 2020-04-30 |
JP2020067661A5 JP2020067661A5 (zh) | 2022-08-29 |
JP7355598B2 true JP7355598B2 (ja) | 2023-10-03 |
Family
ID=70310460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019192029A Active JP7355598B2 (ja) | 2018-10-22 | 2019-10-21 | フォトマスク、電子デバイスの製造方法、および、フォトマスクの製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7355598B2 (zh) |
KR (1) | KR102371333B1 (zh) |
CN (1) | CN111077725B (zh) |
TW (2) | TWI821625B (zh) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008122698A (ja) | 2006-11-13 | 2008-05-29 | Dainippon Printing Co Ltd | プロキシミティ露光用階調マスク |
WO2014111983A1 (ja) | 2013-01-21 | 2014-07-24 | パナソニック株式会社 | フォトマスク及びそれを用いたパターン形成方法 |
JP2014191323A (ja) | 2013-03-28 | 2014-10-06 | Toppan Printing Co Ltd | プロキシミティ露光用フォトマスクおよびそれを用いるパターン露光方法 |
JP2017062462A (ja) | 2015-09-26 | 2017-03-30 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク、及び表示装置の製造方法 |
JP2018077266A (ja) | 2016-11-07 | 2018-05-17 | Hoya株式会社 | フォトマスク、近接露光用フォトマスクの製造方法、及び、表示装置の製造方法 |
JP2018116088A (ja) | 2017-01-16 | 2018-07-26 | Hoya株式会社 | フォトマスクの製造方法、及び表示装置の製造方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308741A (en) * | 1992-07-31 | 1994-05-03 | Motorola, Inc. | Lithographic method using double exposure techniques, mask position shifting and light phase shifting |
JPH11271958A (ja) * | 1998-02-06 | 1999-10-08 | Internatl Business Mach Corp <Ibm> | 高解像フォトマスクおよびその製造方法 |
KR100553069B1 (ko) * | 1999-11-08 | 2006-02-15 | 마츠시타 덴끼 산교 가부시키가이샤 | 포토마스크 및 포토마스크의 작성방법 |
US6905899B2 (en) * | 2003-09-23 | 2005-06-14 | Macronix International Co., Ltd. | Methods for forming a photoresist pattern using an anti-optical proximity effect |
JP4697960B2 (ja) * | 2004-12-21 | 2011-06-08 | 大日本印刷株式会社 | パターンニング方法とこれに用いられる近接露光用の原版マスク |
JP5897498B2 (ja) * | 2012-04-27 | 2016-03-30 | 富士フイルム株式会社 | 光学材料用永久膜の製造方法、有機el表示装置の製造方法および液晶表示装置の製造方法 |
JP6089604B2 (ja) | 2012-11-06 | 2017-03-08 | 大日本印刷株式会社 | 位相シフトマスクの製造方法 |
JP6522277B2 (ja) * | 2013-11-19 | 2019-05-29 | Hoya株式会社 | フォトマスク、フォトマスクの製造方法、パターン転写方法及び表示装置の製造方法 |
JP6557638B2 (ja) | 2016-07-06 | 2019-08-07 | 株式会社エスケーエレクトロニクス | ハーフトーンマスクおよびハーフトーンマスクブランクス |
US10394114B2 (en) * | 2016-08-25 | 2019-08-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chromeless phase shift mask structure and process |
-
2019
- 2019-10-09 TW TW110100153A patent/TWI821625B/zh active
- 2019-10-09 TW TW108136565A patent/TWI787548B/zh active
- 2019-10-15 KR KR1020190127658A patent/KR102371333B1/ko active IP Right Grant
- 2019-10-18 CN CN201910993158.6A patent/CN111077725B/zh active Active
- 2019-10-21 JP JP2019192029A patent/JP7355598B2/ja active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008122698A (ja) | 2006-11-13 | 2008-05-29 | Dainippon Printing Co Ltd | プロキシミティ露光用階調マスク |
WO2014111983A1 (ja) | 2013-01-21 | 2014-07-24 | パナソニック株式会社 | フォトマスク及びそれを用いたパターン形成方法 |
JP2014191323A (ja) | 2013-03-28 | 2014-10-06 | Toppan Printing Co Ltd | プロキシミティ露光用フォトマスクおよびそれを用いるパターン露光方法 |
JP2017062462A (ja) | 2015-09-26 | 2017-03-30 | Hoya株式会社 | フォトマスクの製造方法、フォトマスク、及び表示装置の製造方法 |
JP2018077266A (ja) | 2016-11-07 | 2018-05-17 | Hoya株式会社 | フォトマスク、近接露光用フォトマスクの製造方法、及び、表示装置の製造方法 |
JP2018116088A (ja) | 2017-01-16 | 2018-07-26 | Hoya株式会社 | フォトマスクの製造方法、及び表示装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20200045408A (ko) | 2020-05-04 |
TW202132904A (zh) | 2021-09-01 |
TWI787548B (zh) | 2022-12-21 |
TWI821625B (zh) | 2023-11-11 |
JP2020067661A (ja) | 2020-04-30 |
CN111077725B (zh) | 2023-10-27 |
TW202024775A (zh) | 2020-07-01 |
CN111077725A (zh) | 2020-04-28 |
KR102371333B1 (ko) | 2022-03-04 |
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