JP7345663B2 - めっき装置およびめっき方法 - Google Patents

めっき装置およびめっき方法 Download PDF

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Publication number
JP7345663B2
JP7345663B2 JP2022536229A JP2022536229A JP7345663B2 JP 7345663 B2 JP7345663 B2 JP 7345663B2 JP 2022536229 A JP2022536229 A JP 2022536229A JP 2022536229 A JP2022536229 A JP 2022536229A JP 7345663 B2 JP7345663 B2 JP 7345663B2
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JP
Japan
Prior art keywords
plating
plated
nozzle
electrode
tip
Prior art date
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Active
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JP2022536229A
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English (en)
Japanese (ja)
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JPWO2022014316A5 (ja
JPWO2022014316A1 (enExample
Inventor
洋平 竹本
一誓 大谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2022014316A1 publication Critical patent/JPWO2022014316A1/ja
Publication of JPWO2022014316A5 publication Critical patent/JPWO2022014316A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C25D5/06—Brush or pad plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2022536229A 2020-07-14 2021-06-29 めっき装置およびめっき方法 Active JP7345663B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020120768 2020-07-14
JP2020120768 2020-07-14
PCT/JP2021/024554 WO2022014316A1 (ja) 2020-07-14 2021-06-29 めっき電極、めっき装置およびめっき方法

Publications (3)

Publication Number Publication Date
JPWO2022014316A1 JPWO2022014316A1 (enExample) 2022-01-20
JPWO2022014316A5 JPWO2022014316A5 (ja) 2022-11-16
JP7345663B2 true JP7345663B2 (ja) 2023-09-15

Family

ID=79555413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536229A Active JP7345663B2 (ja) 2020-07-14 2021-06-29 めっき装置およびめっき方法

Country Status (2)

Country Link
JP (1) JP7345663B2 (enExample)
WO (1) WO2022014316A1 (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108315773A (zh) 2018-01-25 2018-07-24 郑州大学 一种精密3d打印金属微模具的方法及装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4921220B1 (enExample) * 1970-12-23 1974-05-30
JPS506419B1 (enExample) * 1970-12-25 1975-03-13
JPS5224022U (enExample) * 1975-08-07 1977-02-19
JPS5628210Y2 (enExample) * 1977-04-14 1981-07-04
JPS57171689A (en) * 1981-04-13 1982-10-22 Tokio Osaki Plating device
DE3312905C2 (de) * 1983-04-11 1986-03-27 Battelle-Institut E.V., 6000 Frankfurt Vorrichtung zur galvanischen Innenbeschichtung von Hohlteilen
JPS61103475U (enExample) * 1984-12-14 1986-07-01
JPH0635680B2 (ja) * 1988-11-04 1994-05-11 川崎製鉄株式会社 金属材表面の局部電解処理装置
JP3291103B2 (ja) * 1993-12-22 2002-06-10 住友特殊金属株式会社 連続表面処理装置
CN107142505B (zh) * 2015-04-29 2018-11-23 江苏理工学院 一种零件内孔修复用电刷镀装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108315773A (zh) 2018-01-25 2018-07-24 郑州大学 一种精密3d打印金属微模具的方法及装置

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JPWO2022014316A1 (enExample) 2022-01-20
WO2022014316A1 (ja) 2022-01-20

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