JP7335085B2 - 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 - Google Patents

転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Download PDF

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Publication number
JP7335085B2
JP7335085B2 JP2019065394A JP2019065394A JP7335085B2 JP 7335085 B2 JP7335085 B2 JP 7335085B2 JP 2019065394 A JP2019065394 A JP 2019065394A JP 2019065394 A JP2019065394 A JP 2019065394A JP 7335085 B2 JP7335085 B2 JP 7335085B2
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Prior art keywords
substrate
transfer
chip
transfer substrate
chip component
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JP2019065394A
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Japanese (ja)
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JP2020167251A5 (https=
JP2020167251A (ja
Inventor
宏一 今井
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Toray Engineering Co Ltd
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Toray Engineering Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07202—Connecting or disconnecting of bump connectors using auxiliary members
    • H10W72/07204—Connecting or disconnecting of bump connectors using auxiliary members using temporary auxiliary members, e.g. sacrificial coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts

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  • Led Device Packages (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Wire Bonding (AREA)
JP2019065394A 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法 Active JP7335085B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2019065394A JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019065394A JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

Publications (3)

Publication Number Publication Date
JP2020167251A JP2020167251A (ja) 2020-10-08
JP2020167251A5 JP2020167251A5 (https=) 2022-02-07
JP7335085B2 true JP7335085B2 (ja) 2023-08-29

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JP2019065394A Active JP7335085B2 (ja) 2019-03-29 2019-03-29 転写基板ならびにこれを用いた実装方法および画像表示装置の製造方法

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JP (1) JP7335085B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113224220A (zh) * 2021-05-12 2021-08-06 东莞市凯格精机股份有限公司 一种芯片转移方法和芯片转移设备
WO2023063358A1 (ja) * 2021-10-14 2023-04-20 信越化学工業株式会社 レセプター基板、レセプター基板の製造方法、移載方法、ｌｅｄパネルの製造方法及びスタンパ
JP2023086244A (ja) * 2021-12-10 2023-06-22 三星電子株式会社 ディスプレイ装置、およびディスプレイ装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368282A (ja) 2001-06-05 2002-12-20 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2004273596A (ja) 2003-03-06 2004-09-30 Sony Corp 素子転写方法および表示装置
JP2004281630A (ja) 2003-03-14 2004-10-07 Sony Corp 素子転写方法、素子転写用基板および表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002368282A (ja) 2001-06-05 2002-12-20 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2004273596A (ja) 2003-03-06 2004-09-30 Sony Corp 素子転写方法および表示装置
JP2004281630A (ja) 2003-03-14 2004-10-07 Sony Corp 素子転写方法、素子転写用基板および表示装置

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