JP7329913B2 - プラズマ成膜方法 - Google Patents
プラズマ成膜方法 Download PDFInfo
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- JP7329913B2 JP7329913B2 JP2018194965A JP2018194965A JP7329913B2 JP 7329913 B2 JP7329913 B2 JP 7329913B2 JP 2018194965 A JP2018194965 A JP 2018194965A JP 2018194965 A JP2018194965 A JP 2018194965A JP 7329913 B2 JP7329913 B2 JP 7329913B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32357—Generation remote from the workpiece, e.g. down-stream
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
- H01J37/32788—Means for moving the material to be treated for extracting the material from the process chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/225—Oblique incidence of vaporised material on substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3435—Applying energy to the substrate during sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/357—Microwaves, e.g. electron cyclotron resonance enhanced sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/354—Introduction of auxiliary energy into the plasma
- C23C14/358—Inductive energy
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
- C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3266—Magnetic control means
- H01J37/32678—Electron cyclotron resonance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32733—Means for moving the material to be treated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20214—Rotation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24571—Measurements of non-electric or non-magnetic variables
- H01J2237/24585—Other variables, e.g. energy, mass, velocity, time, temperature
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3323—Problems associated with coating uniformity
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Description
2 真空チャンバ(真空容器)
2a ガス導入口
3 基板ホルダ(基板支持部)
3a 保持部
3b 連結部
4 基板
4a 膜形成面
5 回転軸
6 プラズマ
7 第1駆動部
7a 第1動作軸
7b 補助動作軸
7c 可動ベース板
7d 同期用ベルト
7e ガイドポール
7f 固定板
8 第2駆動部
8a 第2動作軸
8b 補助動作軸
8c 可動板
8d 同期用ベルト
8e 支持板
8f 固定板
8g 連結シャフト
9 第3駆動部
9a 第3動作軸
9b 固定板
10 プラズマ発生部
11 上下方向(第1方向)
12 水平方向(第2方向)
13 ターゲット
14 RF電力
15 コイル
16 マイクロ波
17 プロセスガス
18 変換機構部
19a 第1ベローズ部
19b 第2ベローズ部
20a 第1可動部(可動部)
20b 第2可動部
21 膜
Claims (4)
- プラズマを照射して成膜処理を行うプラズマ成膜方法であって、
(a)真空容器内に設けられた回転可能な基板支持部により基板を支持する工程と、
(b)前記(a)工程の後、前記基板支持部を回転させた状態で前記基板支持部の回転軸に対する前記プラズマの照射角度が鋭角を成すように、前記基板に対して前記プラズマを照射して前記基板に成膜を行う工程と、
(c)前記(b)工程の後、前記真空容器内から前記基板を取り出し、前記基板に形成された膜の膜厚分布を測定する工程と、
(d)前記(c)工程の後、前記膜厚分布の測定結果に基づいて、前記回転軸と平行な第1方向と直交する第2方向もしくは前記第1方向と前記第2方向とに前記基板支持部を移動させる工程と、
(e)前記(d)工程の後、前記基板支持部を回転させた状態で前記基板支持部の前記回転軸に対する前記プラズマの照射角度が鋭角を成すように、前記真空容器内から取り出し膜厚分布を測定した前記基板に対して前記プラズマを照射して前記基板に成膜を行い、製品として前記基板を製造する工程と、
を有する、プラズマ成膜方法。 - 請求項1に記載のプラズマ成膜方法において、
前記(d)工程で、前記基板支持部を前記第2方向もしくは前記第1方向と前記第2方向とに移動させて、ターゲットと前記基板の膜形成面の中心との距離、または前記ターゲットの中心と前記基板の前記膜形成面の中心とのずれ量のうちの少なくとも何れかを調整する、プラズマ成膜方法。 - 請求項2に記載のプラズマ成膜方法において、
前記(d)工程で、前記ターゲットと前記基板の前記膜形成面の中心との前記距離を変えずに、前記ターゲットの中心と前記基板の中心との前記ずれ量が、前記(b)工程での成膜時の前記ずれ量より大きくまたは小さくなるように前記基板支持部を移動させる、プラズマ成膜方法。 - 請求項3に記載のプラズマ成膜方法において、
前記(b)工程および前記(e)工程では、前記プラズマを前記基板の膜形成面の全面に照射する、プラズマ成膜方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018194965A JP7329913B2 (ja) | 2018-10-16 | 2018-10-16 | プラズマ成膜方法 |
TW108132655A TWI714254B (zh) | 2018-10-16 | 2019-09-10 | 電漿成膜裝置及電漿成膜方法 |
KR1020217010867A KR20210075091A (ko) | 2018-10-16 | 2019-09-17 | 플라즈마 성막장치 및 플라즈마 성막방법 |
CN201980066804.2A CN112955580B (zh) | 2018-10-16 | 2019-09-17 | 等离子体成膜装置以及等离子体成膜方法 |
EP19872443.7A EP3868918A4 (en) | 2018-10-16 | 2019-09-17 | PLASMA FILM FORMING APPARATUS AND PLASMA FILM FORMING METHOD |
PCT/JP2019/036408 WO2020080016A1 (ja) | 2018-10-16 | 2019-09-17 | プラズマ成膜装置およびプラズマ成膜方法 |
US17/285,558 US20220076932A1 (en) | 2018-10-16 | 2019-09-17 | Plasma film forming apparatus and plasma film forming method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018194965A JP7329913B2 (ja) | 2018-10-16 | 2018-10-16 | プラズマ成膜方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020063471A JP2020063471A (ja) | 2020-04-23 |
JP7329913B2 true JP7329913B2 (ja) | 2023-08-21 |
Family
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JP2018194965A Active JP7329913B2 (ja) | 2018-10-16 | 2018-10-16 | プラズマ成膜方法 |
Country Status (7)
Country | Link |
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US (1) | US20220076932A1 (ja) |
EP (1) | EP3868918A4 (ja) |
JP (1) | JP7329913B2 (ja) |
KR (1) | KR20210075091A (ja) |
CN (1) | CN112955580B (ja) |
TW (1) | TWI714254B (ja) |
WO (1) | WO2020080016A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP6937974B1 (ja) * | 2021-03-10 | 2021-09-22 | 株式会社荏原製作所 | めっき装置、およびめっき方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003247065A (ja) | 2002-02-20 | 2003-09-05 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜形成装置 |
JP2005281726A (ja) | 2004-03-26 | 2005-10-13 | Ntt Afty Corp | プラズマ成膜方法及びその装置 |
JP2005320601A (ja) | 2004-05-11 | 2005-11-17 | Cyg Gijutsu Kenkyusho Kk | スパッタ装置 |
JP2007538158A (ja) | 2004-05-19 | 2007-12-27 | サブ−ワン テクノロジー, インコーポレイテッド | プラズマフローを内部通路コーティングのために指向させる装置 |
JP2008159646A (ja) | 2006-12-21 | 2008-07-10 | Univ Of Tokyo | 基板回転装置 |
JP2010539674A (ja) | 2007-09-18 | 2010-12-16 | ビーコ・インスツルメンツ・インコーポレーテッド | エネルギー粒子ビームを使用した基板の表面処理方法及び装置 |
WO2015137364A1 (ja) | 2014-03-14 | 2015-09-17 | 独立行政法人産業技術総合研究所 | プラズマ処理装置 |
WO2015163461A1 (ja) | 2014-04-25 | 2015-10-29 | 須賀 唯知 | 基板接合装置および基板接合方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55104057A (en) * | 1979-02-02 | 1980-08-09 | Hitachi Ltd | Ion implantation device |
US4533449A (en) * | 1984-04-16 | 1985-08-06 | The Perkin-Elmer Corporation | Rapid surface figuring by selective deposition |
US5334302A (en) * | 1991-11-15 | 1994-08-02 | Tokyo Electron Limited | Magnetron sputtering apparatus and sputtering gun for use in the same |
JPH0610143A (ja) * | 1992-06-25 | 1994-01-18 | Hitachi Ltd | 磁気浮上プロセス装置 |
US5911856A (en) * | 1993-09-03 | 1999-06-15 | Canon Kabushiki Kaisha | Method for forming thin film |
JP2002203790A (ja) * | 2000-12-27 | 2002-07-19 | Furukawa Electric Co Ltd:The | プラズマ処理装置 |
US9206500B2 (en) * | 2003-08-11 | 2015-12-08 | Boris Druz | Method and apparatus for surface processing of a substrate using an energetic particle beam |
US20070116888A1 (en) * | 2005-11-18 | 2007-05-24 | Tokyo Electron Limited | Method and system for performing different deposition processes within a single chamber |
JP2011105996A (ja) * | 2009-11-18 | 2011-06-02 | Toyota Motor Corp | スパッタ装置及びスパッタ法 |
JP5440414B2 (ja) * | 2010-06-22 | 2014-03-12 | 株式会社島津製作所 | プラズマcvd成膜装置 |
JP2015067856A (ja) * | 2013-09-27 | 2015-04-13 | シーゲイト テクノロジー エルエルシー | マグネトロンスパッタ装置 |
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2018
- 2018-10-16 JP JP2018194965A patent/JP7329913B2/ja active Active
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2019
- 2019-09-10 TW TW108132655A patent/TWI714254B/zh active
- 2019-09-17 KR KR1020217010867A patent/KR20210075091A/ko unknown
- 2019-09-17 US US17/285,558 patent/US20220076932A1/en active Pending
- 2019-09-17 CN CN201980066804.2A patent/CN112955580B/zh active Active
- 2019-09-17 WO PCT/JP2019/036408 patent/WO2020080016A1/ja unknown
- 2019-09-17 EP EP19872443.7A patent/EP3868918A4/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003247065A (ja) | 2002-02-20 | 2003-09-05 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜形成装置 |
JP2005281726A (ja) | 2004-03-26 | 2005-10-13 | Ntt Afty Corp | プラズマ成膜方法及びその装置 |
JP2005320601A (ja) | 2004-05-11 | 2005-11-17 | Cyg Gijutsu Kenkyusho Kk | スパッタ装置 |
JP2007538158A (ja) | 2004-05-19 | 2007-12-27 | サブ−ワン テクノロジー, インコーポレイテッド | プラズマフローを内部通路コーティングのために指向させる装置 |
JP2008159646A (ja) | 2006-12-21 | 2008-07-10 | Univ Of Tokyo | 基板回転装置 |
JP2010539674A (ja) | 2007-09-18 | 2010-12-16 | ビーコ・インスツルメンツ・インコーポレーテッド | エネルギー粒子ビームを使用した基板の表面処理方法及び装置 |
WO2015137364A1 (ja) | 2014-03-14 | 2015-09-17 | 独立行政法人産業技術総合研究所 | プラズマ処理装置 |
WO2015163461A1 (ja) | 2014-04-25 | 2015-10-29 | 須賀 唯知 | 基板接合装置および基板接合方法 |
Also Published As
Publication number | Publication date |
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EP3868918A4 (en) | 2022-07-20 |
CN112955580A (zh) | 2021-06-11 |
KR20210075091A (ko) | 2021-06-22 |
JP2020063471A (ja) | 2020-04-23 |
EP3868918A1 (en) | 2021-08-25 |
CN112955580B (zh) | 2023-10-24 |
US20220076932A1 (en) | 2022-03-10 |
WO2020080016A1 (ja) | 2020-04-23 |
TWI714254B (zh) | 2020-12-21 |
TW202020199A (zh) | 2020-06-01 |
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