JP7318174B2 - 封入構造、封入方法、電界発光装置及び表示装置 - Google Patents
封入構造、封入方法、電界発光装置及び表示装置 Download PDFInfo
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- 238000005538 encapsulation Methods 0.000 title claims description 98
- 238000000034 method Methods 0.000 title claims description 66
- 238000005401 electroluminescence Methods 0.000 title 1
- 239000012528 membrane Substances 0.000 claims description 125
- 239000000203 mixture Substances 0.000 claims description 58
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 42
- 239000007789 gas Substances 0.000 claims description 26
- 230000008569 process Effects 0.000 claims description 25
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 20
- 229910004205 SiNX Inorganic materials 0.000 claims description 18
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 16
- 229910000069 nitrogen hydride Inorganic materials 0.000 claims description 14
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims description 14
- 238000007788 roughening Methods 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 230000003746 surface roughness Effects 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 229910021529 ammonia Inorganic materials 0.000 claims description 7
- 229910052990 silicon hydride Inorganic materials 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims 1
- 239000010408 film Substances 0.000 description 30
- 239000000758 substrate Substances 0.000 description 21
- 238000010586 diagram Methods 0.000 description 13
- 229920002120 photoresistant polymer Polymers 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 6
- 238000000059 patterning Methods 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 230000002596 correlated effect Effects 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000007641 inkjet printing Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000009527 percussion Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/115—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers comprising active inorganic nanostructures, e.g. luminescent quantum dots
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Chemical Vapour Deposition (AREA)
- Formation Of Insulating Films (AREA)
Description
Claims (18)
- 封入方法であって、
封入すべき構造を覆う無機膜層を形成するステップを含み、
前記無機膜層は少なくとも二つの副膜層を含み、
前記少なくとも二つの副膜層において、前記封入すべき構造からより遠い副膜層の緻密度は、前記封入すべき構造により近い副膜層の緻密度より大きく、
前記封入方法は、前記少なくとも二つの副膜層の各々の表面を粗面化するステップを更に含む、封入方法。 - 前記封入すべき構造を覆う無機膜層を形成するステップは、
プラズマ混合物を使用して前記封入すべき構造上に前記少なくとも二つの副膜層の各々を順次形成するステップを含み、
前記封入すべき構造からより遠い副膜層を形成するプラズマ混合物中のガスの量は、前記封入すべき構造により近い副膜層を形成するプラズマ混合物中のガスの量より多い請求項1に記載の封入方法。 - 前記少なくとも二つの副膜層の各々を形成するプラズマ混合物中のガスの量は、前記少なくとも二つの副膜層の形成順に従って勾配をもって増加する請求項2に記載の封入方法。
- 前記少なくとも二つの副膜層の各々を形成するプラズマ混合物中のガスの量は、前記少なくとも二つの副膜層の形成順に従って勾配xをもって増加し、
x=5%*Aであり、Aは、前記少なくとも二つの副膜層のうち前記封入すべき構造に最も近い副膜層を形成するプラズマ混合物中のガスの量である請求項3に記載の封入方法。 - 前記プラズマ混合物は、水素化ケイ素、アンモニア及び水素の混合物を含む請求項2に記載の封入方法。
- 前記ガスは、水素である請求項2に記載の封入方法。
- 前記少なくとも二つの副膜層のうち前記封入すべき構造に最も近い副膜層を形成するプラズマ混合物において、水素化ケイ素、アンモニア及び水素の比率は、[0.90,1.10]:[0.78,0.98]:[8.20,8.40]の範囲内である請求項5に記載の封入方法。
- 前記少なくとも二つの副膜層の各々の表面を粗面化するステップは、
プラズマで前記少なくとも二つの副膜層の各々の表面に衝撃を与えるステップを含む請求項1に記載の封入方法。 - 前記プラズマはアルゴンプラズマである請求項8に記載の封入方法。
- 封入構造であって、
封入すべき構造を覆う無機膜層を含み、
前記無機膜層は少なくとも二つの副膜層を含み、
前記少なくとも二つの副膜層の各々の表面は、凹凸のある微細構造を有し、
前記少なくとも二つの副膜層において、前記封入すべき構造からより遠い副膜層の緻密度は、前記封入すべき構造により近い副膜層の緻密度より大きい封入構造。 - 前記無機膜層は、SiNx又はSiONで作られている請求項10に記載の封入構造。
- SiNxは、PECVD工程により、SiH4、NH3及びH2から製造される請求項11に記載の封入構造。
- SiH4、NH3及びH2の体積比は、[0.90,1.10]:[0.78,0.98]:[8.20,8.40]の範囲内である請求項12に記載の封入構造。
- SiONは、PECVD工程により、SiH4、NH3、H2及びN2Oから製造される請求項11に記載の封入構造。
- 前記少なくとも二つの副膜層の各々の緻密度は、前記封入すべき構造に最も近い副膜層から前記封入すべき構造から最も遠い副膜層へ勾配をもって増加する請求項10に記載の封入構造。
- 前記少なくとも二つの副膜層の各々の表面の粗さは、0.04μm~0.06μmの範囲内である請求項10に記載の封入構造。
- 請求項10~16のいずれか一項に記載の封入構造を含む電界発光装置。
- 請求項17に記載の電界発光装置を含む表示装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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CN201711354185.6A CN109935717B (zh) | 2017-12-15 | 2017-12-15 | 封装结构及封装方法、电致发光器件、显示装置 |
CN201711354185.6 | 2017-12-15 | ||
PCT/CN2018/120045 WO2019114648A1 (en) | 2017-12-15 | 2018-12-10 | Encapsulation structure, encapsulating method, electroluminescent apparatus, and display apparatus |
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JP2021507500A JP2021507500A (ja) | 2021-02-22 |
JP7318174B2 true JP7318174B2 (ja) | 2023-08-01 |
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Country Status (6)
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US (1) | US11302890B2 (ja) |
EP (1) | EP3724936A4 (ja) |
JP (1) | JP7318174B2 (ja) |
KR (1) | KR20190084114A (ja) |
CN (1) | CN109935717B (ja) |
WO (1) | WO2019114648A1 (ja) |
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CN111050258A (zh) * | 2019-12-31 | 2020-04-21 | 歌尔股份有限公司 | 防尘结构、麦克风封装结构以及电子设备 |
US20220293884A1 (en) * | 2021-03-15 | 2022-09-15 | SDK New Materials, Inc. | Encapsulated Electronic Device with Improved Protective Barrier Layer and Method of Manufacture Thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110143079A1 (en) | 2009-12-15 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Substrate section for flexible display device, method of manufacturing substrate section, and method of manufacturing organic light emitting display device including substrate |
JP2012174891A (ja) | 2011-02-22 | 2012-09-10 | Tokyo Electron Ltd | パターン形成方法及び半導体装置の製造方法 |
JP2014241313A (ja) | 2013-06-11 | 2014-12-25 | シチズンホールディングス株式会社 | Led装置 |
US8957583B2 (en) | 2011-03-21 | 2015-02-17 | Samsung Display Co., Ltd. | Method of fabricating organic light-emitting display and organic light-emitting display fabricated by the method |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4479249B2 (ja) * | 2004-01-20 | 2010-06-09 | 凸版印刷株式会社 | 有機el素子の製造方法 |
KR101279914B1 (ko) | 2004-06-25 | 2013-07-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 밀봉 필름의 차수 성능 개선 방법 및 장치 |
US7993700B2 (en) | 2007-03-01 | 2011-08-09 | Applied Materials, Inc. | Silicon nitride passivation for a solar cell |
FR2949775B1 (fr) * | 2009-09-10 | 2013-08-09 | Saint Gobain Performance Plast | Substrat de protection pour dispositif collecteur ou emetteur de rayonnement |
KR20120060664A (ko) * | 2010-12-02 | 2012-06-12 | 삼성전자주식회사 | 표시 장치 및 표시 장치 제조 방법 |
KR20120106453A (ko) | 2011-03-18 | 2012-09-26 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN104157790B (zh) | 2014-06-30 | 2017-03-15 | 上海天马有机发光显示技术有限公司 | 一种有机发光薄膜封装结构,其器件、装置及制造方法 |
KR102313361B1 (ko) | 2014-11-17 | 2021-10-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법 |
KR102454152B1 (ko) | 2015-10-23 | 2022-10-13 | 삼성디스플레이 주식회사 | 표시 장치 |
KR102201296B1 (ko) | 2015-10-29 | 2021-01-08 | 엘지디스플레이 주식회사 | 플렉서블 유기발광다이오드 표시장치 및 그 제조 방법 |
KR102512274B1 (ko) * | 2016-08-12 | 2023-03-22 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
CN106410062A (zh) * | 2016-11-07 | 2017-02-15 | 武汉华星光电技术有限公司 | 一种封装层及封装器件 |
CN106654046B (zh) * | 2016-12-20 | 2018-08-14 | 武汉华星光电技术有限公司 | Oled显示面板及其制作方法 |
CN107068904A (zh) * | 2017-04-18 | 2017-08-18 | 京东方科技集团股份有限公司 | 无机封装薄膜、oled封装薄膜的制作方法及相应装置 |
CN107338424B (zh) | 2017-08-07 | 2020-03-03 | 苏州阿特斯阳光电力科技有限公司 | 一种pecvd镀膜的气体控制方法以及设备 |
-
2017
- 2017-12-15 CN CN201711354185.6A patent/CN109935717B/zh active Active
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2018
- 2018-12-10 KR KR1020197017608A patent/KR20190084114A/ko not_active IP Right Cessation
- 2018-12-10 EP EP18889442.2A patent/EP3724936A4/en active Pending
- 2018-12-10 US US16/346,959 patent/US11302890B2/en active Active
- 2018-12-10 WO PCT/CN2018/120045 patent/WO2019114648A1/en unknown
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110143079A1 (en) | 2009-12-15 | 2011-06-16 | Samsung Mobile Display Co., Ltd. | Substrate section for flexible display device, method of manufacturing substrate section, and method of manufacturing organic light emitting display device including substrate |
JP2012174891A (ja) | 2011-02-22 | 2012-09-10 | Tokyo Electron Ltd | パターン形成方法及び半導体装置の製造方法 |
US8957583B2 (en) | 2011-03-21 | 2015-02-17 | Samsung Display Co., Ltd. | Method of fabricating organic light-emitting display and organic light-emitting display fabricated by the method |
JP2014241313A (ja) | 2013-06-11 | 2014-12-25 | シチズンホールディングス株式会社 | Led装置 |
Also Published As
Publication number | Publication date |
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KR20190084114A (ko) | 2019-07-15 |
US11302890B2 (en) | 2022-04-12 |
EP3724936A4 (en) | 2021-08-25 |
CN109935717A (zh) | 2019-06-25 |
EP3724936A1 (en) | 2020-10-21 |
WO2019114648A1 (en) | 2019-06-20 |
JP2021507500A (ja) | 2021-02-22 |
US20210280821A1 (en) | 2021-09-09 |
CN109935717B (zh) | 2021-05-25 |
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