JP7296825B2 - 載置装置の制御方法、載置装置および検査装置 - Google Patents
載置装置の制御方法、載置装置および検査装置 Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
本発明の実施形態に係る基板検査装置について説明する。本発明の実施形態に係る基板検査装置は、複数セルを搭載し、複数セルの各々が独立して同時に基板である半導体ウエハ(以下「ウエハ」という。)を検査することが可能な装置である。なお、基板検査装置は、これに限定されず、例えば1枚のウエハを検査する装置であってもよい。
即ち、駆動制御部120は、RB補正の上にピッチ誤差補正を適用した関係式に基づいて、駆動角度θとなる直線移動量X4を求める。そして、駆動制御部120は、まず、移動体67が直線移動量X4/2移動するように駆動モータ64を駆動する。その後、駆動制御部120は、移動体67が更に直線移動量X4/2で移動するように駆動モータ64を駆動する。これにより、移動体67を直線移動量X4で移動させる。
10 基板検査装置
16 テスタ側カメラ
18 搬送ステージ(載置装置)
50 チャックトップ(載置台)
52 ボトムプレート(支持台)
60 回転駆動機構
61 ブラケット
62 シャフト(第2運動変換機構)
63 ブラケット
64 駆動モータ
65 カップリング
66 ボールネジ(第1運動変換機構)
67 移動体(第1運動変換機構)
68 カムフォロア(第2運動変換機構)
100 制御部
110 補正部
111 RB補正部
112 ピッチ誤差補正部
120 駆動制御部
Claims (10)
- 被検査体を載置する載置台と、
前記載置台を正逆回転可能に支持する支持台と、
駆動モータの回転運動を移動体の直線運動に変換する第1運動変換機構、前記移動体の直線運動を前記載置台の回転運動に変換する第2運動変換機構を有し、前記載置台を回転させる回転駆動機構と、
前記回転駆動機構を制御する制御部と、を備える載置装置の制御方法であって、
前記移動体の直線移動量に対する前記載置台の駆動角度の補正値を算出する第1補正ステップと、
所定のピッチ毎の誤差に基づいて補正値を求める第2補正ステップと、
前記第1補正ステップ及び前記第2補正ステップで求めた補正値に基づいて、前記載置台を回転駆動させる駆動ステップと、
を有する、載置装置の制御方法。 - 前記第1補正ステップは、
前記移動体の直線移動量と前記載置台の駆動角度との関係式における係数を補正する、
請求項1に記載の載置装置の制御方法。 - 前記第2補正ステップは、
アライメント範囲内において、所定のピッチ毎の誤差に基づいて、補正値を求める、
請求項1または請求項2に記載の載置装置の制御方法。 - 前記駆動ステップは、
前記載置台の駆動角度に基づいて、精補正か粗補正かを判定する、
請求項1乃至請求項3のいずれか1項に記載の載置装置の制御方法。 - 前記駆動ステップは、
精補正と判定した場合、前記駆動モータの回転方向が第1方向となるときに位置合わせを終了する、
請求項1乃至請求項4のいずれか1項に記載の載置装置の制御方法。 - 前記駆動ステップは、
前記駆動モータの回転方向が前記第1方向と異なる第2方向となる場合、
駆動角度を超えて前記駆動モータの回転方向を前記第2方向で駆動するステップと、
前記駆動モータの回転方向を前記第1方向で駆動するステップと、を有する、
請求項5に記載の載置装置の制御方法。 - 前記駆動モータの回転方向を前記第1方向に駆動させる際、複数のステップで駆動する、
請求項5または請求項6に記載の載置装置の制御方法。 - 前記第2運動変換機構は、前記移動体に設けられたカムフォロアと、前記載置台に設けられたシャフトと、を有し、
前記駆動モータの前記第1方向は、前記カムフォロアと前記シャフトとが押し付けあう方向に前記移動体を移動させる、
請求項5乃至請求項7のいずれか1項に記載の載置装置の制御方法。 - 被検査体を載置する載置台と、
前記載置台を正逆回転可能に支持する支持台と、
駆動モータの回転運動を移動体の直線運動に変換する第1運動変換機構、前記移動体の直線運動を前記載置台の回転運動に変換する第2運動変換機構を有し、前記載置台を回転させる回転駆動機構と、
前記回転駆動機構を制御する制御部と、を備え、
前記制御部は、
前記移動体の直線移動量に対する前記載置台の駆動角度の補正値を算出する第1補正ステップと、
所定のピッチ毎の誤差に基づいて、補正値を求める第2補正ステップと、
前記第1補正ステップ及び前記第2補正ステップで求めた補正値に基づいて、前記載置台を回転駆動させる駆動ステップと、を実行する、
載置装置。 - 請求項9に記載の載置装置を備える、検査装置。
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JP2019154025A JP7296825B2 (ja) | 2019-08-26 | 2019-08-26 | 載置装置の制御方法、載置装置および検査装置 |
US16/997,144 US11226368B2 (en) | 2019-08-26 | 2020-08-19 | Placement apparatus control method, placement apparatus, and inspection apparatus |
KR1020200103835A KR102459602B1 (ko) | 2019-08-26 | 2020-08-19 | 적재 장치의 제어 방법, 적재 장치 및 검사 장치 |
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JP7296825B2 true JP7296825B2 (ja) | 2023-06-23 |
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Citations (1)
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JP2000286312A (ja) | 1999-01-29 | 2000-10-13 | Tokyo Electron Ltd | 回転駆動機構及び被検査体の載置機構 |
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US4775281A (en) * | 1986-12-02 | 1988-10-04 | Teradyne, Inc. | Apparatus and method for loading and unloading wafers |
JP2860691B2 (ja) * | 1990-03-19 | 1999-02-24 | 東京エレクトロン株式会社 | 検査装置 |
US5658115A (en) * | 1991-09-05 | 1997-08-19 | Hitachi, Ltd. | Transfer apparatus |
US5404894A (en) * | 1992-05-20 | 1995-04-11 | Tokyo Electron Kabushiki Kaisha | Conveyor apparatus |
JP3116261B2 (ja) * | 1994-05-17 | 2000-12-11 | 東京エレクトロン株式会社 | プローブ装置 |
JP2000195921A (ja) * | 1998-12-25 | 2000-07-14 | Tokyo Electron Ltd | 搬送装置 |
JP4971416B2 (ja) * | 1999-01-29 | 2012-07-11 | 東京エレクトロン株式会社 | 被検査体の載置機構 |
KR100428781B1 (ko) * | 2001-04-16 | 2004-04-27 | 삼성전자주식회사 | 웨이퍼 이송 장치 및 그 이송 방법 |
JP4833512B2 (ja) * | 2003-06-24 | 2011-12-07 | 東京エレクトロン株式会社 | 被処理体処理装置、被処理体処理方法及び被処理体搬送方法 |
JP2007187567A (ja) * | 2006-01-13 | 2007-07-26 | Tokyo Electron Ltd | ウェハ型温度センサ、ウェハ型温度センサの製造方法、および温度測定方法 |
GB2486486A (en) * | 2010-12-17 | 2012-06-20 | Uhv Design Ltd | Work piece transfer mechanism with a linear stroke |
JP6376557B2 (ja) * | 2014-06-12 | 2018-08-22 | シンフォニアテクノロジー株式会社 | 密閉容器及び搬送システム |
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JP2000286312A (ja) | 1999-01-29 | 2000-10-13 | Tokyo Electron Ltd | 回転駆動機構及び被検査体の載置機構 |
US6634245B1 (en) | 1999-01-29 | 2003-10-21 | Tokyo Electron Limited | Drivingly rotatable mechanism of specimen loading table and specimen loading mechanism |
KR100600234B1 (ko) | 1999-01-29 | 2006-07-13 | 동경 엘렉트론 주식회사 | 피 검사체의 탑재 기구 및 집적 회로의 검사 장치 |
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KR102459602B1 (ko) | 2022-10-28 |
JP2021034594A (ja) | 2021-03-01 |
US20210063477A1 (en) | 2021-03-04 |
KR20210024968A (ko) | 2021-03-08 |
US11226368B2 (en) | 2022-01-18 |
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