JP7290705B2 - ウエハ型センサの充電およびオートティーチングのための制御プログラム、コンテナおよび半導体素子製造設備 - Google Patents
ウエハ型センサの充電およびオートティーチングのための制御プログラム、コンテナおよび半導体素子製造設備 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims description 50
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- 238000012545 processing Methods 0.000 claims description 32
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 235000012431 wafers Nutrition 0.000 description 110
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- 238000001646 magnetic resonance method Methods 0.000 description 6
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- 238000010438 heat treatment Methods 0.000 description 3
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- 230000000694 effects Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
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- 238000004380 ashing Methods 0.000 description 1
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- 238000009529 body temperature measurement Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
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- 230000002950 deficient Effects 0.000 description 1
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- 238000005137 deposition process Methods 0.000 description 1
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
- H02J50/12—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32715—Workpiece holder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32899—Multiple chambers, e.g. cluster tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/90—Circuit arrangements or systems for wireless supply or distribution of electric power involving detection or optimisation of position, e.g. alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/00032—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by data exchange
- H02J7/00034—Charger exchanging data with an electronic device, i.e. telephone, whose internal battery is under charge
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0047—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries with monitoring or indicating devices or circuits
- H02J7/0048—Detection of remaining charge capacity or state of charge [SOC]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J13/00—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network
- H02J13/00006—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network characterised by information or instructions transport means between the monitoring, controlling or managing units and monitored, controlled or operated power network element or electrical equipment
- H02J13/00022—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network characterised by information or instructions transport means between the monitoring, controlling or managing units and monitored, controlled or operated power network element or electrical equipment using wireless data transmission
- H02J13/00026—Circuit arrangements for providing remote indication of network conditions, e.g. an instantaneous record of the open or closed condition of each circuitbreaker in the network; Circuit arrangements for providing remote control of switching means in a power distribution network, e.g. switching in and out of current consumers by using a pulse code signal carried by the network characterised by information or instructions transport means between the monitoring, controlling or managing units and monitored, controlled or operated power network element or electrical equipment using wireless data transmission involving a local wireless network, e.g. Wi-Fi, ZigBee or Bluetooth
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J7/00—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
- H02J7/0042—Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Computer Networks & Wireless Communication (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
110 基板処理装置
120 ウエハ型センサ
130 制御装置
140 保管装置
150 充電装置
210 ハウジング
220 基板支持ユニット
221 ベース
222 静電チャック
223 リングアセンブリ
223a フォーカスリング
223b エッジリング
224 加熱部材
225 冷却部材
230 プラズマ生成ユニット
231 上部電源
232 下部電源
240 シャワーヘッドユニット
250 上部モジュール
251 アンテナユニット
260 チャック部材
270 消耗性部品
310 センシングモジュール
320 第1通信モジュール
330 保存モジュール
340 電源モジュール
350 第1制御モジュール
710 カバー部材
720 第1スロット
730 第2スロット
740 ドア部材
750 コネクタ
760 電力送信モジュール
770 第2通信モジュール
780 第2制御モジュール
810 コンテナ搬送装置
820 ロードポートモジュール
820a 第1ロードポート
820b 第2ロードポート
820c 第3ロードポート
821 電源供給モジュール
822 スイッチングモジュール
823 電力変換モジュール
824 電源出力端子
840 ラック
900 半導体素子製造設備
910 インデックスモジュール
911 第1搬送ロボット
920 ロードロックチャンバ
930 トランスファーチャンバ
931 第2搬送ロボット
940 工程チャンバ
950 コンテナ
Claims (4)
- バッテリ充電装置を備えるロードポートモジュールであって、
前記バッテリ充電装置を用いてウエハ型センサを充電させ、
前記バッテリ充電装置は、
第1電力を供給する電源供給モジュールと、
前記ロードポートモジュールの内部に設けられ、前記第1電力を第2電力に変換する電力変換モジュールと、
前記ロードポートモジュールの上部に設けられ、コンテナのコネクタと接続される電源出力端子とを含む、ロードポートモジュール。 - フロントエンドモジュールモジュール(FEM)に設けられるロードポートモジュールと、
前記ロードポートモジュールに隣接して設けられ、前記ロードポートモジュール上のコンテナに搭載された基板を搬送する第1搬送ロボットを備えるインデックスモジュールと、
前記基板を処理し、複数設けられる工程チャンバと、
前記工程チャンバに隣接して設けられ、前記第1搬送ロボットによって搬送された未処理基板を前記工程チャンバに搬入したり、既処理基板を前記工程チャンバから搬出する第2搬送ロボットを備えるトランスファーチャンバを含み、
前記ロードポートモジュールはバッテリ充電装置を備え、前記バッテリ充電装置を用いて前記コンテナに搭載されたウエハ型センサを充電させ、
前記バッテリ充電装置は、
第1電力を供給する電源供給モジュールと、
前記ロードポートモジュールの内部に設けられ、前記第1電力を第2電力に変換する電力変換モジュールと、
前記ロードポートモジュールの上部に設けられ、前記コンテナのコネクタと接続される電源出力端子を含む、半導体素子製造設備。 - 前記ロードポートモジュールは複数である、請求項2に記載の半導体素子製造設備。
- それぞれのロードポートモジュール上に安着するそれぞれのコンテナは互いに異なる物
を搭載する、請求項3に記載の半導体素子製造設備。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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KR10-2020-0171125 | 2020-12-09 | ||
KR20200171125 | 2020-12-09 | ||
KR1020210037356A KR102591723B1 (ko) | 2020-12-09 | 2021-03-23 | 기판 처리 시스템 및 이를 포함하는 오토 티칭 시스템 |
KR10-2021-0037356 | 2021-03-23 |
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JP2022091722A JP2022091722A (ja) | 2022-06-21 |
JP7290705B2 true JP7290705B2 (ja) | 2023-06-13 |
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US (1) | US20220179000A1 (ja) |
JP (1) | JP7290705B2 (ja) |
CN (1) | CN114613657A (ja) |
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US20230069081A1 (en) * | 2021-08-30 | 2023-03-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007536726A (ja) | 2004-04-29 | 2007-12-13 | センサレー コーポレイション | 集積化されたプロセス条件検出ウエハおよびデータ解析システム |
JP2011091071A (ja) | 2009-10-20 | 2011-05-06 | Hitachi High-Tech Control Systems Corp | ティーチング支援ユニットおよびティーチング方法 |
JP2011238823A (ja) | 2010-05-12 | 2011-11-24 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2018526814A (ja) | 2015-06-16 | 2018-09-13 | ケーエルエー−テンカー コーポレイション | 半導体工場自動化システムのパラメタを監視するシステム及び方法 |
WO2020180607A1 (en) | 2019-03-04 | 2020-09-10 | Lam Research Corporation | Fixture for automatic calibration of substrate transfer robot |
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JP2007005582A (ja) * | 2005-06-24 | 2007-01-11 | Asm Japan Kk | 基板搬送装置及びそれを搭載した半導体基板製造装置 |
JP5445335B2 (ja) * | 2010-05-31 | 2014-03-19 | 東京エレクトロン株式会社 | 基板処理装置のデータ取得方法及び基板処理システム |
US9356822B2 (en) * | 2012-10-30 | 2016-05-31 | Kla-Tencor Corporation | Automated interface apparatus and method for use in semiconductor wafer handling systems |
-
2021
- 2021-12-02 CN CN202111515895.9A patent/CN114613657A/zh active Pending
- 2021-12-07 JP JP2021198285A patent/JP7290705B2/ja active Active
- 2021-12-07 US US17/543,884 patent/US20220179000A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007536726A (ja) | 2004-04-29 | 2007-12-13 | センサレー コーポレイション | 集積化されたプロセス条件検出ウエハおよびデータ解析システム |
JP2011091071A (ja) | 2009-10-20 | 2011-05-06 | Hitachi High-Tech Control Systems Corp | ティーチング支援ユニットおよびティーチング方法 |
JP2011238823A (ja) | 2010-05-12 | 2011-11-24 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2018526814A (ja) | 2015-06-16 | 2018-09-13 | ケーエルエー−テンカー コーポレイション | 半導体工場自動化システムのパラメタを監視するシステム及び方法 |
WO2020180607A1 (en) | 2019-03-04 | 2020-09-10 | Lam Research Corporation | Fixture for automatic calibration of substrate transfer robot |
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JP2022091722A (ja) | 2022-06-21 |
US20220179000A1 (en) | 2022-06-09 |
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