JP7277572B2 - 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス - Google Patents

硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Download PDF

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JP7277572B2
JP7277572B2 JP2021518382A JP2021518382A JP7277572B2 JP 7277572 B2 JP7277572 B2 JP 7277572B2 JP 2021518382 A JP2021518382 A JP 2021518382A JP 2021518382 A JP2021518382 A JP 2021518382A JP 7277572 B2 JP7277572 B2 JP 7277572B2
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ring
group
resin composition
curable resin
formula
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JPWO2020226131A1 (https=
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俊栄 青島
遥菜 井上
明規 渋谷
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021518382A 2019-05-08 2020-05-01 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス Active JP7277572B2 (ja)

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JP2019088584 2019-05-08
JP2019088584 2019-05-08
PCT/JP2020/018409 WO2020226131A1 (ja) 2019-05-08 2020-05-01 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス

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JPWO2020226131A1 JPWO2020226131A1 (https=) 2020-11-12
JP7277572B2 true JP7277572B2 (ja) 2023-05-19

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TWI889955B (zh) * 2021-02-15 2025-07-11 日商住友電木股份有限公司 感光性樹脂組成物、硬化膜及半導體裝置
US20240389227A1 (en) * 2021-04-02 2024-11-21 Jsr Corporation Radiation-sensitive composition for forming insulation film, resin film having pattern, and semiconductor circuit board
CN116635453A (zh) * 2021-08-31 2023-08-22 富士胶片株式会社 固化物的制造方法、层叠体的制造方法及半导体器件的制造方法以及处理液
JP7259141B1 (ja) 2021-08-31 2023-04-17 富士フイルム株式会社 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液
CN120077104A (zh) * 2022-10-31 2025-05-30 富士胶片株式会社 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189109A (ja) 2000-01-05 2001-07-10 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物およびこれを用いた絶縁材
JP2008122562A (ja) 2006-11-10 2008-05-29 Jsr Corp 液晶配向剤および液晶表示素子
WO2017002858A1 (ja) 2015-06-30 2017-01-05 富士フイルム株式会社 前駆体組成物、感光性樹脂組成物、前駆体組成物の製造方法、硬化膜、硬化膜の製造方法および半導体デバイス
JP2018016793A (ja) 2016-07-25 2018-02-01 晉一化工股▲ふん▼有限公司Ｃｈｉｎ Ｙｅｅ Ｃｈｅｍｉｃａｌ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏ．， Ｌｔｄ． 熱硬化性樹脂及びその組成物、用途
WO2018225676A1 (ja) 2017-06-06 2018-12-13 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物
US20190016874A1 (en) 2017-07-17 2019-01-17 Elite Material Co., Ltd. Resin composition and articles made therefrom

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10252972B2 (en) * 2015-06-30 2019-04-09 Bizen Chemical Co., Ltd. Synthesis of long-chain unsaturated fatty acid by chemical reaction of carbon chain extension

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001189109A (ja) 2000-01-05 2001-07-10 Sumitomo Bakelite Co Ltd 絶縁材用樹脂組成物およびこれを用いた絶縁材
JP2008122562A (ja) 2006-11-10 2008-05-29 Jsr Corp 液晶配向剤および液晶表示素子
WO2017002858A1 (ja) 2015-06-30 2017-01-05 富士フイルム株式会社 前駆体組成物、感光性樹脂組成物、前駆体組成物の製造方法、硬化膜、硬化膜の製造方法および半導体デバイス
JP2018016793A (ja) 2016-07-25 2018-02-01 晉一化工股▲ふん▼有限公司Ｃｈｉｎ Ｙｅｅ Ｃｈｅｍｉｃａｌ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏ．， Ｌｔｄ． 熱硬化性樹脂及びその組成物、用途
WO2018225676A1 (ja) 2017-06-06 2018-12-13 富士フイルム株式会社 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物
US20190016874A1 (en) 2017-07-17 2019-01-17 Elite Material Co., Ltd. Resin composition and articles made therefrom

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JPWO2020226131A1 (https=) 2020-11-12
WO2020226131A1 (ja) 2020-11-12
TWI845667B (zh) 2024-06-21

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