JPWO2020226131A1 - - Google Patents
Info
- Publication number
- JPWO2020226131A1 JPWO2020226131A1 JP2021518382A JP2021518382A JPWO2020226131A1 JP WO2020226131 A1 JPWO2020226131 A1 JP WO2020226131A1 JP 2021518382 A JP2021518382 A JP 2021518382A JP 2021518382 A JP2021518382 A JP 2021518382A JP WO2020226131 A1 JPWO2020226131 A1 JP WO2020226131A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/22—Polybenzoxazoles
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019088584 | 2019-05-08 | ||
| JP2019088584 | 2019-05-08 | ||
| PCT/JP2020/018409 WO2020226131A1 (ja) | 2019-05-08 | 2020-05-01 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2020226131A1 true JPWO2020226131A1 (https=) | 2020-11-12 |
| JP7277572B2 JP7277572B2 (ja) | 2023-05-19 |
Family
ID=73051355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021518382A Active JP7277572B2 (ja) | 2019-05-08 | 2020-05-01 | 硬化性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7277572B2 (https=) |
| TW (1) | TWI845667B (https=) |
| WO (1) | WO2020226131A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI889955B (zh) * | 2021-02-15 | 2025-07-11 | 日商住友電木股份有限公司 | 感光性樹脂組成物、硬化膜及半導體裝置 |
| US20240389227A1 (en) * | 2021-04-02 | 2024-11-21 | Jsr Corporation | Radiation-sensitive composition for forming insulation film, resin film having pattern, and semiconductor circuit board |
| CN116635453A (zh) * | 2021-08-31 | 2023-08-22 | 富士胶片株式会社 | 固化物的制造方法、层叠体的制造方法及半导体器件的制造方法以及处理液 |
| JP7259141B1 (ja) | 2021-08-31 | 2023-04-17 | 富士フイルム株式会社 | 硬化物の製造方法、積層体の製造方法、及び、半導体デバイスの製造方法、並びに、処理液 |
| CN120077104A (zh) * | 2022-10-31 | 2025-05-30 | 富士胶片株式会社 | 树脂组合物、固化物、层叠体、固化物的制造方法、层叠体的制造方法、半导体器件的制造方法及半导体器件 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189109A (ja) * | 2000-01-05 | 2001-07-10 | Sumitomo Bakelite Co Ltd | 絶縁材用樹脂組成物およびこれを用いた絶縁材 |
| JP2008122562A (ja) * | 2006-11-10 | 2008-05-29 | Jsr Corp | 液晶配向剤および液晶表示素子 |
| WO2017002858A1 (ja) * | 2015-06-30 | 2017-01-05 | 富士フイルム株式会社 | 前駆体組成物、感光性樹脂組成物、前駆体組成物の製造方法、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2018016793A (ja) * | 2016-07-25 | 2018-02-01 | 晉一化工股▲ふん▼有限公司Ｃｈｉｎ Ｙｅｅ Ｃｈｅｍｉｃａｌ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏ．， Ｌｔｄ． | 熱硬化性樹脂及びその組成物、用途 |
| WO2018225676A1 (ja) * | 2017-06-06 | 2018-12-13 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物 |
| US20190016874A1 (en) * | 2017-07-17 | 2019-01-17 | Elite Material Co., Ltd. | Resin composition and articles made therefrom |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10252972B2 (en) * | 2015-06-30 | 2019-04-09 | Bizen Chemical Co., Ltd. | Synthesis of long-chain unsaturated fatty acid by chemical reaction of carbon chain extension |
-
2020
- 2020-05-01 WO PCT/JP2020/018409 patent/WO2020226131A1/ja not_active Ceased
- 2020-05-01 JP JP2021518382A patent/JP7277572B2/ja active Active
- 2020-05-05 TW TW109114836A patent/TWI845667B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001189109A (ja) * | 2000-01-05 | 2001-07-10 | Sumitomo Bakelite Co Ltd | 絶縁材用樹脂組成物およびこれを用いた絶縁材 |
| JP2008122562A (ja) * | 2006-11-10 | 2008-05-29 | Jsr Corp | 液晶配向剤および液晶表示素子 |
| WO2017002858A1 (ja) * | 2015-06-30 | 2017-01-05 | 富士フイルム株式会社 | 前駆体組成物、感光性樹脂組成物、前駆体組成物の製造方法、硬化膜、硬化膜の製造方法および半導体デバイス |
| JP2018016793A (ja) * | 2016-07-25 | 2018-02-01 | 晉一化工股▲ふん▼有限公司Ｃｈｉｎ Ｙｅｅ Ｃｈｅｍｉｃａｌ Ｉｎｄｕｓｔｒｉｅｓ Ｃｏ．， Ｌｔｄ． | 熱硬化性樹脂及びその組成物、用途 |
| WO2018225676A1 (ja) * | 2017-06-06 | 2018-12-13 | 富士フイルム株式会社 | 感光性樹脂組成物、硬化膜、積層体、硬化膜の製造方法、半導体デバイスおよび化合物 |
| US20190016874A1 (en) * | 2017-07-17 | 2019-01-17 | Elite Material Co., Ltd. | Resin composition and articles made therefrom |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202104367A (zh) | 2021-02-01 |
| JP7277572B2 (ja) | 2023-05-19 |
| WO2020226131A1 (ja) | 2020-11-12 |
| TWI845667B (zh) | 2024-06-21 |
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