JP7273796B2 - 表面突起研磨パッド - Google Patents

表面突起研磨パッド Download PDF

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Publication number
JP7273796B2
JP7273796B2 JP2020511324A JP2020511324A JP7273796B2 JP 7273796 B2 JP7273796 B2 JP 7273796B2 JP 2020511324 A JP2020511324 A JP 2020511324A JP 2020511324 A JP2020511324 A JP 2020511324A JP 7273796 B2 JP7273796 B2 JP 7273796B2
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Japan
Prior art keywords
polishing pad
major surface
polishing
protrusions
substrate
Prior art date
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JP2020511324A
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English (en)
Japanese (ja)
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JP2020531298A5 (enExample
JP2020531298A (ja
Inventor
スーン タン，リアン
シー． コード，エリック
ダブリュ． レアバッケン，ジャスティン
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3M Innovative Properties Co
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3M Innovative Properties Co
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Publication of JP2020531298A5 publication Critical patent/JP2020531298A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2020511324A 2017-08-25 2018-08-21 表面突起研磨パッド Active JP7273796B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762550055P 2017-08-25 2017-08-25
US62/550,055 2017-08-25
PCT/IB2018/056320 WO2019038675A1 (en) 2017-08-25 2018-08-21 SURFACE SURFACE SURFACE POLISHING PAD

Publications (3)

Publication Number Publication Date
JP2020531298A JP2020531298A (ja) 2020-11-05
JP2020531298A5 JP2020531298A5 (enExample) 2021-09-30
JP7273796B2 true JP7273796B2 (ja) 2023-05-15

Family

ID=65439977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020511324A Active JP7273796B2 (ja) 2017-08-25 2018-08-21 表面突起研磨パッド

Country Status (4)

Country Link
US (1) US12048980B2 (enExample)
JP (1) JP7273796B2 (enExample)
CN (1) CN111032285B (enExample)
WO (1) WO2019038675A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230219189A1 (en) * 2022-01-07 2023-07-13 Applied Materials, Inc. Apparatus and method for selective material removal during polishing
KR20230106863A (ko) * 2022-01-07 2023-07-14 삼성전자주식회사 연마 패드, 그를 포함하는 화학적 기계적 연마 장치, 및 그를 이용하는 반도체 소자의 제조 방법

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JP2005514217A (ja) 2001-12-28 2005-05-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品の製造方法
JP2007190678A (ja) 2000-11-03 2007-08-02 Three M Innovative Properties Co 可撓性研磨剤製品、ならびに該製品の製造方法および使用方法
JP2009082995A (ja) 2007-09-27 2009-04-23 Covalent Materials Corp ラッピング用研磨布、プラズマエッチング装置用シリコン電極のラッピング方法
JP2009534202A (ja) 2006-04-18 2009-09-24 スリーエム イノベイティブ プロパティズ カンパニー エンボス構造研磨物品並びにその製造及び使用方法
JP2010046791A (ja) 2008-07-24 2010-03-04 Three M Innovative Properties Co 研磨材製品、その製造方法及び使用方法
JP2017042910A (ja) 2013-07-31 2017-03-02 ネクスプラナー コーポレイション 低密度研磨パッド
WO2017062719A1 (en) 2015-10-07 2017-04-13 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

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JPS61187657U (enExample) * 1985-05-17 1986-11-22
JPS6316980A (ja) * 1986-07-04 1988-01-23 Fuji Photo Film Co Ltd 研磨テ−プ
US5177908A (en) * 1990-01-22 1993-01-12 Micron Technology, Inc. Polishing pad
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5958794A (en) * 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US6612917B2 (en) * 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7160178B2 (en) 2003-08-07 2007-01-09 3M Innovative Properties Company In situ activation of a three-dimensional fixed abrasive article
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7449124B2 (en) 2005-02-25 2008-11-11 3M Innovative Properties Company Method of polishing a wafer
TWI409136B (zh) * 2006-07-19 2013-09-21 Innopad Inc 表面具微溝槽之化學機械平坦化墊
US20090011679A1 (en) * 2007-04-06 2009-01-08 Rajeev Bajaj Method of removal profile modulation in cmp pads
KR101161015B1 (ko) * 2010-09-10 2012-07-02 신한다이아몬드공업 주식회사 Ｃｍｐ 패드 컨디셔너 및 그 제조방법
SG10201508090WA (en) * 2011-11-29 2015-10-29 Nexplanar Corp Polishing pad with foundation layer and polishing surface layer
KR101389572B1 (ko) * 2012-04-23 2014-04-29 주식회사 디어포스 다방향성 연마돌기를 갖는 연마제품
JP6188286B2 (ja) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法
KR102148050B1 (ko) * 2012-11-06 2020-10-14 캐보트 마이크로일렉트로닉스 코포레이션 오프셋 동심형 그루빙 패턴을 갖는 폴리싱 패드, 및 이로써 기판을 폴리싱하는 방법
EP3049215B1 (en) 2013-09-25 2021-04-14 3M Innovative Properties Company Composite ceramic abrasive polishing solution
KR102252673B1 (ko) 2013-09-25 2021-05-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층화된 폴리싱 패드
US20170008143A1 (en) * 2014-01-24 2017-01-12 3M Innovative Properties Company Abrasive material having a structured surface
JP6376922B2 (ja) * 2014-02-18 2018-08-22 株式会社松風 歯科用研磨器具
KR102347711B1 (ko) * 2014-04-03 2022-01-06 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 시스템과 이의 제조 및 사용 방법
US20150306737A1 (en) * 2014-04-23 2015-10-29 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing pad
US10105812B2 (en) * 2014-07-17 2018-10-23 Applied Materials, Inc. Polishing pad configuration and polishing pad support
US10946495B2 (en) * 2015-01-30 2021-03-16 Cmc Materials, Inc. Low density polishing pad
JP6789982B2 (ja) * 2015-05-13 2020-11-25 スリーエム イノベイティブ プロパティズ カンパニー 研磨パッド、並びに当該研磨パッドを使用するためのシステム及び方法
US9539694B1 (en) 2015-06-26 2017-01-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Composite polishing layer chemical mechanical polishing pad
CN106853610B (zh) * 2015-12-08 2019-11-01 中芯国际集成电路制造(北京)有限公司 抛光垫及其监测方法和监测系统

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010019940A1 (en) 1998-11-30 2001-09-06 Agarwal Vishnu K. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
JP2007190678A (ja) 2000-11-03 2007-08-02 Three M Innovative Properties Co 可撓性研磨剤製品、ならびに該製品の製造方法および使用方法
JP2005514217A (ja) 2001-12-28 2005-05-19 スリーエム イノベイティブ プロパティズ カンパニー 研磨製品の製造方法
JP2009534202A (ja) 2006-04-18 2009-09-24 スリーエム イノベイティブ プロパティズ カンパニー エンボス構造研磨物品並びにその製造及び使用方法
JP2009082995A (ja) 2007-09-27 2009-04-23 Covalent Materials Corp ラッピング用研磨布、プラズマエッチング装置用シリコン電極のラッピング方法
JP2010046791A (ja) 2008-07-24 2010-03-04 Three M Innovative Properties Co 研磨材製品、その製造方法及び使用方法
JP2017042910A (ja) 2013-07-31 2017-03-02 ネクスプラナー コーポレイション 低密度研磨パッド
WO2017062719A1 (en) 2015-10-07 2017-04-13 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same

Also Published As

Publication number Publication date
CN111032285B (zh) 2022-07-19
US12048980B2 (en) 2024-07-30
WO2019038675A1 (en) 2019-02-28
CN111032285A (zh) 2020-04-17
US20200171619A1 (en) 2020-06-04
JP2020531298A (ja) 2020-11-05

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