JP7262921B2 - 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 - Google Patents
情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 Download PDFInfo
- Publication number
- JP7262921B2 JP7262921B2 JP2017228337A JP2017228337A JP7262921B2 JP 7262921 B2 JP7262921 B2 JP 7262921B2 JP 2017228337 A JP2017228337 A JP 2017228337A JP 2017228337 A JP2017228337 A JP 2017228337A JP 7262921 B2 JP7262921 B2 JP 7262921B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017228337A JP7262921B2 (ja) | 2017-11-28 | 2017-11-28 | 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 |
KR1020180142652A KR102410234B1 (ko) | 2017-11-28 | 2018-11-19 | 정보 처리 장치, 컴퓨터 프로그램, 리소그래피 장치, 리소그래피 시스템 및 물품의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017228337A JP7262921B2 (ja) | 2017-11-28 | 2017-11-28 | 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019102495A JP2019102495A (ja) | 2019-06-24 |
JP2019102495A5 JP2019102495A5 (ko) | 2021-01-07 |
JP7262921B2 true JP7262921B2 (ja) | 2023-04-24 |
Family
ID=66845059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017228337A Active JP7262921B2 (ja) | 2017-11-28 | 2017-11-28 | 情報処理装置、プログラム、リソグラフィ装置、リソグラフィシステム、および物品の製造方法 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP7262921B2 (ko) |
KR (1) | KR102410234B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210069104A (ko) * | 2018-11-07 | 2021-06-10 | 에이에스엠엘 네델란즈 비.브이. | 공정에 대한 보정 결정 |
JP6896036B2 (ja) * | 2019-09-30 | 2021-06-30 | キヤノン株式会社 | 情報処理装置、判定方法、インプリント装置、リソグラフィシステム、物品の製造方法及びプログラム |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003124110A (ja) | 2001-07-03 | 2003-04-25 | Samsung Electronics Co Ltd | 工程装置の制御方法 |
JP2006013178A (ja) | 2004-06-28 | 2006-01-12 | Toshiba Corp | 露光方法及び露光システム |
JP2014053426A (ja) | 2012-09-06 | 2014-03-20 | Toshiba Corp | 露光装置、露光方法および半導体装置の製造方法 |
JP2014229675A (ja) | 2013-05-21 | 2014-12-08 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 重ね合わせ補正システム |
JP2015198173A (ja) | 2014-04-01 | 2015-11-09 | キヤノン株式会社 | パターン形成方法、露光装置、および物品の製造方法 |
JP2016063054A (ja) | 2014-09-17 | 2016-04-25 | キヤノン株式会社 | インプリント方法、インプリント装置、および物品の製造方法 |
US20160148850A1 (en) | 2014-11-25 | 2016-05-26 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2006002A (en) * | 2010-02-19 | 2011-08-22 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
WO2013178404A2 (en) * | 2012-05-29 | 2013-12-05 | Asml Netherlands B.V. | A method to determine the usefulness of alignment marks to correct overlay, and a combination of a lithographic apparatus and an overlay measurement system |
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2017
- 2017-11-28 JP JP2017228337A patent/JP7262921B2/ja active Active
-
2018
- 2018-11-19 KR KR1020180142652A patent/KR102410234B1/ko active IP Right Grant
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003124110A (ja) | 2001-07-03 | 2003-04-25 | Samsung Electronics Co Ltd | 工程装置の制御方法 |
JP2006013178A (ja) | 2004-06-28 | 2006-01-12 | Toshiba Corp | 露光方法及び露光システム |
JP2014053426A (ja) | 2012-09-06 | 2014-03-20 | Toshiba Corp | 露光装置、露光方法および半導体装置の製造方法 |
JP2014229675A (ja) | 2013-05-21 | 2014-12-08 | ピーエスフォー ルクスコ エスエイアールエルPS4 Luxco S.a.r.l. | 重ね合わせ補正システム |
JP2015198173A (ja) | 2014-04-01 | 2015-11-09 | キヤノン株式会社 | パターン形成方法、露光装置、および物品の製造方法 |
JP2016063054A (ja) | 2014-09-17 | 2016-04-25 | キヤノン株式会社 | インプリント方法、インプリント装置、および物品の製造方法 |
US20160148850A1 (en) | 2014-11-25 | 2016-05-26 | Stream Mosaic, Inc. | Process control techniques for semiconductor manufacturing processes |
Also Published As
Publication number | Publication date |
---|---|
KR20190062202A (ko) | 2019-06-05 |
KR102410234B1 (ko) | 2022-06-20 |
JP2019102495A (ja) | 2019-06-24 |
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