JP7214663B2 - 層状構造物 - Google Patents
層状構造物 Download PDFInfo
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- JP7214663B2 JP7214663B2 JP2019567988A JP2019567988A JP7214663B2 JP 7214663 B2 JP7214663 B2 JP 7214663B2 JP 2019567988 A JP2019567988 A JP 2019567988A JP 2019567988 A JP2019567988 A JP 2019567988A JP 7214663 B2 JP7214663 B2 JP 7214663B2
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
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- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
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- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2481/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
- C08J2481/06—Polysulfones; Polyethersulfones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/301—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen or carbon in the main chain of the macromolecule, not provided for in group H01B3/302
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
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Description
本出願は、2017年6月20日出願の米国仮特許出願第62/522,430号、2017年7月25日出願の米国仮特許出願第62/536,613号、及び2017年9月21日出願の欧州特許出願第17192343.6号に対する優先権を主張するものであり、それらの全内容は、あらゆる目的のために参照により援用される。
本明細書で用いるところでは、「ポリ(エーテルエーテルケトン)(PEEK)」は、その繰り返し単位(RPEEK)の50モル%超が、式:
(式中:
互いに等しいか又は異なる、各R1は、ハロゲン、アルキル、アルケニル、アルキニル、アリール、エーテル、チオエーテル、カルボン酸、エステル、アミド、イミド、アルカリ又はアルカリ土類金属スルホネート、アルキルスルホネート、アルカリ又はアルカリ土類金属ホスホネート、アルキルホスホネート、アミン及び第四級アンモニウムからなる群から独立して選択され;
互いに等しいか又は異なる、各aは、0、1、2、3、及び4から独立して選択される)
の繰り返し単位である任意のポリマーを意味する。好ましくは、各aは0である。
(式中、各R2及びbは、出現ごとに、それぞれ、R1及びaについて上に記載された群から独立して選択される)
の繰り返し単位である。好ましくは式(A-1)中の各bはゼロである。
本明細書で用いるところでは、「ポリ(アリールエーテルスルホン)(PAES)」は、その繰り返し単位の少なくとも50モル%が、式:
[式中:
互いに等しいか又は異なる、各R3は、ハロゲン、アルキル、アルケニル、アルキニル、アリール、エーテル、チオエーテル、カルボン酸、エステル、アミド、イミド、アルカリ又はアルカリ土類金属スルホネート、アルキルスルホネート、アルカリ又はアルカリ土類金属ホスホネート、アルキルホスホネート、アミン及び第四級アンモニウムからなる群から独立して選択され;
互いに等しいか又は異なる、各cは、0、1、2、3、及び4、好ましくは0から独立して選択され;
Tは、結合、スルホン基[-S(=O)2-]、及び基-C(R4)(R5)-(ここで、互いに等しいか又は異なる、R4及びR5は、水素、ハロゲン、アルキル、アルケニル、アルキニル、エーテル、チオエーテル、カルボン酸、エステル、アミド、イミド、アルカリ又はアルカリ土類金属スルホネート、アルキルスルホネート、アルカリ又はアルカリ土類金属ホスホネート、アルキルホスホネート、アミン、及び第四級アンモニウムから独立して選択される)からなる群から選択される]の繰り返し単位(RPAES)である任意のポリマーを意味する。R4及びR5は好ましくはメチル基である。
(式中、R6及びdは、出現ごとに、それぞれ、R3及びcについて上に記載された群から独立して選択される)
の繰り返し単位である任意のポリマーを意味する。好ましくは、式(B-1)中の各dはゼロである。
(式中、各R7及びeは、出現ごとに、それぞれ、R3及びbについて上に記載された群から独立して選択される)
の繰り返し単位である任意のポリマーを意味する。好ましくは、式(B-2)中の各eはゼロである。
(式中、各R8及びfは、出現ごとに、それぞれ、R3及びcについて上に記載された群から独立して選択される)
の繰り返し単位である任意のポリマーを意味する。好ましくは、式(B-3)中の各fはゼロである。
ポリマー層は、任意選択的に、繊維状又は粒子状フィラーなどの補強フィラーも含んでもよい。繊維状補強フィラーは、平均長さが幅及び厚さの両方よりもかなり大きい、長さ、幅、及び厚さを有する材料である。好ましくは、そのような材料は、少なくとも5の、長さと最小の幅及び厚さとの間の平均比と定義される、アスペクト比を有する。好ましくは、補強繊維のアスペクト比は、少なくとも10、より好ましくは少なくとも20、さらにより好ましくは少なくとも50である。粒子状フィラーは、最大でも5、好ましくは最大でも2のアスペクト比を有する。
PEEK、PAES、及び任意選択の補強フィラーに加えて、ポリマー組成物は、二酸化チタン、硫化亜鉛、酸化亜鉛、紫外光安定剤、熱安定剤、有機ホスファイト及びホスホナイトなどの酸化防止剤、酸捕捉剤、加工助剤、核形成剤、潤滑剤、難燃剤、発煙抑制剤、帯電防止剤、アンチブロッキング剤、及びカーボンブラックなどの導電性添加剤などの任意選択の添加剤を更に含んでもよい。
層状構造物のワニス層は、50モル%超の、式:
[式中:
Yは、C2~C6アルキル基、好ましくはエチル基であり;
Zは、式:
(式中、nは、0~25の範囲の整数であり、
各Aは、ヒドロキシル基(-OH)及び、追加のZ基の末端炭素に結合している酸素からなる群から独立して選択される)
の基である]の繰り返し単位(REPOX)を含むコポリマーを含む。式(D)において、末端炭素は、部分の主鎖のそれぞれの末端での炭素原子である。したがって、当業者によって理解されるように、各A基は、ヒドロキシル基であっても、下に記載されるエポキシ樹脂の末端エポキシド基との反応によって追加のZ基へのエーテル架橋を形成する酸素であってもよい。好ましくは、コポリマーは、このように分岐しており、3次元架橋した熱硬化構造の形態で存在する。
層状構造物は、ポリマー層と、ポリマー層に接触したワニス層とを含む。いくつかの実施形態において、層状構造物は、下に詳細に記載されるような、金属基材を含む。
ハードディスクヘッドアクチュエータ、電磁石、及び絶縁ワイヤのタイトコイルを必要とする他の用途の構築に使用することができる。
例示的な実施形態はまた、上に記載された層状構造物の製造方法を含む。
下記の原材料を実施例及び比較例に使用した:
Solvay Specialty Polymers USA,L.L.C.から入手可能なKetaSpire(登録商標)PEEK KT-880P。
SABIC Innovative Plasticsから入手可能なUltem(登録商標)PEI1000天然樹脂。
Solvay Specialty Polymers USA,L.L.C.から入手可能なUdel(登録商標)PSU P-3703P NT。
Solvay Specialty Polymers USA,L.L.C.から入手可能なRadel(登録商標)PPSU 5600 NT。
ステアリン酸カルシウム。
ELANTAS GmbHから入手可能なPedigree(登録商標)923-50エポキシワニス。
Dupontから入手可能なKapton(登録商標)200Hポリイミドフィルム(厚さ50μm)。
実施例及び比較例の組成を表1において下に示す。全てのポリマーブレンド物は、ブレンドされる樹脂のペレットをそれぞれの量で約20分間先ずタンブルブレンドし、引き続き溶融配合することによって調製した。
機械的特性は、タイプI引張試験片からなる射出成形した0.125インチ(3.2mm)厚さのASTM試験検体を使用して調合物の全てについて試験した。下記のASTM試験方法を、調合物の機械的特性を評価する際に用いた:
D638:引張特性
D790:曲げ特性
D256:アイゾット(Izod)耐衝撃性(ノッチ付き)
D3835:溶融粘度(400℃、1,000 1/s)
D3418:結晶化温度は、1分当たり20℃の加熱及び冷却速度を用いるDSCによって測定した。
PEEK調合物へのエポキシワニスの接着強度は、剥離強度試験を用いて評価した。各場合に、50μm厚さのポリイミドフィルムをエポキシワニスでコートし、160℃で2分間プレベーキングした。ASTM曲げ試験片(3.2mm×12.7mm×125mm)を次に、ポリイミドフィルムのトップ上に置き、この組み合わせを180℃で30分間ベーキングした。室温(23℃)に冷却した後、接着したポリイミドフィルムをカットしてASTM曲げ試験片の寸法(12.7mm×125mm)に一致させた。剥離強度は、チャック距離100mm、及び50mm/分の速度のInstron機を用いて評価した。
Claims (15)
- 前記ポリ(アリールエーテルスルホン)(PAES)が、少なくとも50モル%の、式:
[式中:
互いに等しいか又は異なる、各R3は、ハロゲン、アルキル、アルケニル、アルキニル、アリール、カルボン酸、アルカリ又はアルカリ土類金属スルホネート、アルキルスルホネート、アルカリ又はアルカリ土類金属ホスホネート、アルキルホスホネート、アミン及び第四級アンモニウムからなる群から独立して選択され;
互いに等しいか又は異なる、各cは、0、1、2、3、及び4から独立して選択され;
Tは、結合、スルホン基[-S(=O)2-]、及び基-C(R4)(R5)-(ここで、互いに等しいか又は異なる、R4及びR5は、水素、ハロゲン、アルキル、アルケニル、アルキニル、カルボン酸、アルカリ又はアルカリ土類金属スルホネート、アルキルスルホネート、アルカリ又はアルカリ土類金属ホスホネート、アルキルホスホネート、アミン、及び第四級アンモニウムから独立して選択される)からなる群から選択される]
の繰り返し単位(RPAES)を含む、請求項1又は2に記載の層状構造物。 - 前記ポリ(アリールエーテルスルホン)(PAES)がポリスルホン(PSU)である、請求項1~3のいずれか一項に記載の層状構造物。
- 前記ポリ(アリールエーテルスルホン)(PAES)ポリマーがポリフェニルスルホン(PPSU)を更に含む、請求項4に記載の層状構造物。
- 前記ポリ(アリールエーテルスルホン)(PAES)が、前記ポリ(エーテルエーテルケトン)(PEEK)及び前記ポリ(アリールエーテルスルホン)(PAES)の総量を基準として、約1~25重量%の範囲の総量で存在する、請求項1~5のいずれか一項に記載の層状構造物。
- 前記ポリマー層に隣接する、及びそれに任意選択的に接触する金属基材を更に含む、請求項1~7のいずれか一項に記載の層状構造物。
- 前記金属基材が前記ポリマー層に接触している、請求項8に記載の層状構造物。
- 前記金属基材が、銅、アルミニウム、又はそれらの組み合わせを含む、請求項8又は9に記載の層状構造物。
- 前記金属基材がワイヤの導電体であり、前記ポリマー層が前記ワイヤの電気絶縁層である、請求項8~10のいずれか一項に記載の層状構造物。
- 前記ワイヤが、非円形横断面を有する、請求項11に記載の層状構造物。
- 前記ワイヤがコイル状マグネットワイヤであり、前記ワニス層が前記コイル状マグネットワイヤを充満させている、請求項11又は12に記載の層状構造物。
- 前記ポリマー層が、296℃~298℃の範囲のDSCによって測定される結晶化温度を有する、請求項1~13のいずれか一項に記載の層状構造物。
- 請求項1~14のいずれか一項に記載の層状構造物の製造方法であって、エポキシ系樹脂組成物を前記ポリマー層に塗布する工程と、前記エポキシ系樹脂組成物を200℃未満の温度で硬化させて前記ワニス層を形成する工程とを含む方法。
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JP2016058230A (ja) | 2014-09-09 | 2016-04-21 | 古河電気工業株式会社 | 絶縁電線、コイルおよび電気・電子機器ならびに絶縁電線の製造方法 |
WO2017094789A1 (ja) | 2015-12-04 | 2017-06-08 | 古河電気工業株式会社 | 自己融着性絶縁電線、コイル及び電気・電子機器 |
JP2017199566A (ja) | 2016-04-27 | 2017-11-02 | 日立金属株式会社 | 絶縁電線及びその製造方法並びに電気機器の製造方法 |
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EP2738219A1 (en) * | 2012-11-28 | 2014-06-04 | Solvay Specialty Polymers USA, LLC. | PAEK/PAES compositions |
EP2994499A1 (en) * | 2013-05-08 | 2016-03-16 | Solvay Specialty Polymers USA, LLC. | Polyarylene ether sulfone (paes) compositions |
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