JP7212070B2 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
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- JP7212070B2 JP7212070B2 JP2020567432A JP2020567432A JP7212070B2 JP 7212070 B2 JP7212070 B2 JP 7212070B2 JP 2020567432 A JP2020567432 A JP 2020567432A JP 2020567432 A JP2020567432 A JP 2020567432A JP 7212070 B2 JP7212070 B2 JP 7212070B2
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- JP
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- Prior art keywords
- zone
- resistance heating
- heating element
- terminals
- ceramic heater
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 59
- 238000010438 heat treatment Methods 0.000 claims description 87
- 230000002093 peripheral effect Effects 0.000 claims description 46
- 230000036581 peripheral resistance Effects 0.000 claims description 16
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 20
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000003870 refractory metal Substances 0.000 description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Description
ウエハ載置面を有し、円形の内周側ゾーンと環状の外周側ゾーンとを備えたセラミックプレートと、
前記内周側ゾーンに設けられた二次元形状の内周側抵抗発熱体と、
前記外周側ゾーンに設けられたコイル状の外周側抵抗発熱体と、
を備え、
前記内周側ゾーンには、前記内周側抵抗発熱体の端子と前記外周側抵抗発熱体の端子とが配置されている、
ものである。
Claims (4)
- ウエハ載置面を有し、円形の内周側ゾーンと環状の外周側ゾーンとを備えたセラミックプレートと、
前記内周側ゾーンに設けられた二次元形状の内周側抵抗発熱体と、
前記外周側ゾーンに設けられたコイル状の外周側抵抗発熱体と、
を備え、
前記内周側ゾーンには、前記内周側抵抗発熱体の端子と前記外周側抵抗発熱体の端子とが配置され、
前記内周側ゾーンに配置された前記外周側抵抗発熱体の端子から前記外周側ゾーンに設けられた前記外周側抵抗発熱体までの引き出し線は、リボンで作製され、前記内周側抵抗発熱体の折り返し部同士が対向する隙間を通過し、
前記内周側抵抗発熱体、前記外周側抵抗発熱体及び前記引き出し線は、前記セラミックプレートの内部で前記ウエハ載置面に平行な同一平面上に設けられている、
セラミックヒータ。 - 前記内周側抵抗発熱体は、前記端子の間隙を通って前記内周側ゾーンの全体にわたって配線されている、
請求項1に記載のセラミックヒータ。 - 前記内周側ゾーンの面積は、前記外周側ゾーンの面積より狭い、
請求項1又は2に記載のセラミックヒータ。 - 前記内周側ゾーンは、1つのゾーンであり、
前記外周側ゾーンは、2つ以上のゾーンに分けられており、前記外周側抵抗発熱体は、前記ゾーンごとに独立して配線されている、
請求項1~3のいずれか1項に記載のセラミックヒータ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019011301 | 2019-01-25 | ||
JP2019011301 | 2019-01-25 | ||
PCT/JP2019/050259 WO2020153071A1 (ja) | 2019-01-25 | 2019-12-23 | セラミックヒータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020153071A1 JPWO2020153071A1 (ja) | 2021-09-30 |
JP7212070B2 true JP7212070B2 (ja) | 2023-01-24 |
Family
ID=71736802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020567432A Active JP7212070B2 (ja) | 2019-01-25 | 2019-12-23 | セラミックヒータ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11984329B2 (ja) |
JP (1) | JP7212070B2 (ja) |
KR (1) | KR102581102B1 (ja) |
CN (1) | CN113170535B (ja) |
TW (1) | TWI813839B (ja) |
WO (1) | WO2020153071A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102639158B1 (ko) * | 2019-07-23 | 2024-02-22 | 삼성전자주식회사 | 웨이퍼 처리 장치 및 이를 이용한 웨이퍼 처리 방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005063691A (ja) | 2003-08-13 | 2005-03-10 | Ngk Insulators Ltd | 加熱装置 |
JP2009009795A (ja) | 2007-06-27 | 2009-01-15 | Taiheiyo Cement Corp | セラミックスヒーター |
JP2010109316A (ja) | 2008-03-11 | 2010-05-13 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2015018704A (ja) | 2013-07-11 | 2015-01-29 | 日本碍子株式会社 | セラミックヒータ |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3897563B2 (ja) | 2001-10-24 | 2007-03-28 | 日本碍子株式会社 | 加熱装置 |
JP3888531B2 (ja) * | 2002-03-27 | 2007-03-07 | 日本碍子株式会社 | セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品 |
JP4761723B2 (ja) * | 2004-04-12 | 2011-08-31 | 日本碍子株式会社 | 基板加熱装置 |
TWI501339B (zh) | 2010-09-24 | 2015-09-21 | Ngk Insulators Ltd | Semiconductor manufacturing device components |
CN202230996U (zh) * | 2011-09-01 | 2012-05-23 | 中微半导体设备(上海)有限公司 | 温度可分区调控的静电吸盘 |
WO2018030433A1 (ja) * | 2016-08-10 | 2018-02-15 | 日本碍子株式会社 | セラミックヒータ |
-
2019
- 2019-12-23 JP JP2020567432A patent/JP7212070B2/ja active Active
- 2019-12-23 CN CN201980077625.9A patent/CN113170535B/zh active Active
- 2019-12-23 WO PCT/JP2019/050259 patent/WO2020153071A1/ja active Application Filing
- 2019-12-23 KR KR1020217013833A patent/KR102581102B1/ko active IP Right Grant
- 2019-12-25 TW TW108147551A patent/TWI813839B/zh active
-
2021
- 2021-04-23 US US17/302,080 patent/US11984329B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005063691A (ja) | 2003-08-13 | 2005-03-10 | Ngk Insulators Ltd | 加熱装置 |
JP2009009795A (ja) | 2007-06-27 | 2009-01-15 | Taiheiyo Cement Corp | セラミックスヒーター |
JP2010109316A (ja) | 2008-03-11 | 2010-05-13 | Tokyo Electron Ltd | 載置台構造及び処理装置 |
JP2015018704A (ja) | 2013-07-11 | 2015-01-29 | 日本碍子株式会社 | セラミックヒータ |
Also Published As
Publication number | Publication date |
---|---|
TWI813839B (zh) | 2023-09-01 |
KR20210066918A (ko) | 2021-06-07 |
WO2020153071A1 (ja) | 2020-07-30 |
CN113170535B (zh) | 2023-07-07 |
US11984329B2 (en) | 2024-05-14 |
KR102581102B1 (ko) | 2023-09-20 |
CN113170535A (zh) | 2021-07-23 |
US20210242048A1 (en) | 2021-08-05 |
TW202031092A (zh) | 2020-08-16 |
JPWO2020153071A1 (ja) | 2021-09-30 |
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