JP7208328B2 - 基板、電子部品及び実装装置 - Google Patents

基板、電子部品及び実装装置 Download PDF

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Publication number
JP7208328B2
JP7208328B2 JP2021168373A JP2021168373A JP7208328B2 JP 7208328 B2 JP7208328 B2 JP 7208328B2 JP 2021168373 A JP2021168373 A JP 2021168373A JP 2021168373 A JP2021168373 A JP 2021168373A JP 7208328 B2 JP7208328 B2 JP 7208328B2
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Prior art keywords
layer
metal layer
oxidation
insulating layer
reduction
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JP2021168373A
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Japanese (ja)
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JP2022009114A5 (enExample
JP2022009114A (ja
Inventor
ベジ 佐々木
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Priority claimed from PCT/JP2019/007192 external-priority patent/WO2020174558A1/ja
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Priority to JP2021168373A priority Critical patent/JP7208328B2/ja
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Publication of JP2022009114A5 publication Critical patent/JP2022009114A5/ja
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  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021168373A 2019-02-26 2021-10-13 基板、電子部品及び実装装置 Active JP7208328B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021168373A JP7208328B2 (ja) 2019-02-26 2021-10-13 基板、電子部品及び実装装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
PCT/JP2019/007192 WO2020174558A1 (ja) 2019-02-26 2019-02-26 基板、電子部品及び実装装置
JP2020517232A JP6961809B2 (ja) 2019-02-26 2019-02-26 基板、電子部品及び実装装置
JP2021168373A JP7208328B2 (ja) 2019-02-26 2021-10-13 基板、電子部品及び実装装置

Related Parent Applications (1)

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JP2020517232A Division JP6961809B2 (ja) 2019-02-26 2019-02-26 基板、電子部品及び実装装置

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JP2022009114A JP2022009114A (ja) 2022-01-14
JP2022009114A5 JP2022009114A5 (enExample) 2022-03-09
JP7208328B2 true JP7208328B2 (ja) 2023-01-18

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JP2021168373A Active JP7208328B2 (ja) 2019-02-26 2021-10-13 基板、電子部品及び実装装置

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JP (1) JP7208328B2 (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2963538A (en) 1957-04-11 1960-12-06 Sanders Associates Inc Flat cables
US2997521A (en) 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3186887A (en) 1960-12-27 1965-06-01 Sanders Associates Inc Encapsulated article and method of making

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153797A (en) * 1980-04-28 1981-11-27 Hitachi Chemical Co Ltd Method of manufacturing multilayer printed circuit board substrate
JPS61176192A (ja) * 1985-01-31 1986-08-07 株式会社日立製作所 銅と樹脂との接着方法
JPS61266241A (ja) * 1985-05-21 1986-11-25 株式会社日立製作所 銅の表面処理法
JPH0644676B2 (ja) * 1989-05-22 1994-06-08 松下電工株式会社 多層配線基板の製造方法
JPH05175648A (ja) * 1991-12-24 1993-07-13 Matsushita Electric Works Ltd 回路板の銅回路の処理方法
JPH1051113A (ja) * 1996-07-29 1998-02-20 Ibiden Co Ltd 多層プリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2963538A (en) 1957-04-11 1960-12-06 Sanders Associates Inc Flat cables
US2997521A (en) 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3186887A (en) 1960-12-27 1965-06-01 Sanders Associates Inc Encapsulated article and method of making

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JP2022009114A (ja) 2022-01-14

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