JP2022009114A5 - - Google Patents
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- Publication number
- JP2022009114A5 JP2022009114A5 JP2021168373A JP2021168373A JP2022009114A5 JP 2022009114 A5 JP2022009114 A5 JP 2022009114A5 JP 2021168373 A JP2021168373 A JP 2021168373A JP 2021168373 A JP2021168373 A JP 2021168373A JP 2022009114 A5 JP2022009114 A5 JP 2022009114A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- oxide
- uneven shape
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims 3
- 238000009413 insulation Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021168373A JP7208328B2 (ja) | 2019-02-26 | 2021-10-13 | 基板、電子部品及び実装装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2019/007192 WO2020174558A1 (ja) | 2019-02-26 | 2019-02-26 | 基板、電子部品及び実装装置 |
| JP2020517232A JP6961809B2 (ja) | 2019-02-26 | 2019-02-26 | 基板、電子部品及び実装装置 |
| JP2021168373A JP7208328B2 (ja) | 2019-02-26 | 2021-10-13 | 基板、電子部品及び実装装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020517232A Division JP6961809B2 (ja) | 2019-02-26 | 2019-02-26 | 基板、電子部品及び実装装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022009114A JP2022009114A (ja) | 2022-01-14 |
| JP2022009114A5 true JP2022009114A5 (enExample) | 2022-03-09 |
| JP7208328B2 JP7208328B2 (ja) | 2023-01-18 |
Family
ID=87852220
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021168373A Active JP7208328B2 (ja) | 2019-02-26 | 2021-10-13 | 基板、電子部品及び実装装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7208328B2 (enExample) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2963538A (en) * | 1957-04-11 | 1960-12-06 | Sanders Associates Inc | Flat cables |
| US2997521A (en) * | 1960-04-11 | 1961-08-22 | Sanders Associates Inc | Insulated electric circuit assembly |
| US3186887A (en) * | 1960-12-27 | 1965-06-01 | Sanders Associates Inc | Encapsulated article and method of making |
| JPS56153797A (en) * | 1980-04-28 | 1981-11-27 | Hitachi Chemical Co Ltd | Method of manufacturing multilayer printed circuit board substrate |
| JPS61176192A (ja) * | 1985-01-31 | 1986-08-07 | 株式会社日立製作所 | 銅と樹脂との接着方法 |
| JPS61266241A (ja) * | 1985-05-21 | 1986-11-25 | 株式会社日立製作所 | 銅の表面処理法 |
| JPH0644676B2 (ja) * | 1989-05-22 | 1994-06-08 | 松下電工株式会社 | 多層配線基板の製造方法 |
| JPH05175648A (ja) * | 1991-12-24 | 1993-07-13 | Matsushita Electric Works Ltd | 回路板の銅回路の処理方法 |
| JPH1051113A (ja) * | 1996-07-29 | 1998-02-20 | Ibiden Co Ltd | 多層プリント配線板の製造方法 |
-
2021
- 2021-10-13 JP JP2021168373A patent/JP7208328B2/ja active Active
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