JP2023146053A5 - - Google Patents
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- JP2023146053A5 JP2023146053A5 JP2022053039A JP2022053039A JP2023146053A5 JP 2023146053 A5 JP2023146053 A5 JP 2023146053A5 JP 2022053039 A JP2022053039 A JP 2022053039A JP 2022053039 A JP2022053039 A JP 2022053039A JP 2023146053 A5 JP2023146053 A5 JP 2023146053A5
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- JP
- Japan
- Prior art keywords
- section
- larger
- semiconductor
- easy
- band gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004065 semiconductor Substances 0.000 description 2
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022053039A JP2023146053A (ja) | 2022-03-29 | 2022-03-29 | 半導体装置およびパワーデバイス |
| CN202310310606.4A CN116895694A (zh) | 2022-03-29 | 2023-03-27 | 半导体装置以及功率器件 |
| US18/191,177 US20230317817A1 (en) | 2022-03-29 | 2023-03-28 | Semiconductor device and power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022053039A JP2023146053A (ja) | 2022-03-29 | 2022-03-29 | 半導体装置およびパワーデバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2023146053A JP2023146053A (ja) | 2023-10-12 |
| JP2023146053A5 true JP2023146053A5 (enExample) | 2025-03-03 |
Family
ID=88193645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022053039A Pending JP2023146053A (ja) | 2022-03-29 | 2022-03-29 | 半導体装置およびパワーデバイス |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20230317817A1 (enExample) |
| JP (1) | JP2023146053A (enExample) |
| CN (1) | CN116895694A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7722004B2 (ja) * | 2021-07-21 | 2025-08-13 | セイコーエプソン株式会社 | 半導体装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7205604B2 (en) * | 2001-03-13 | 2007-04-17 | International Business Machines Corporation | Ultra scalable high speed heterojunction vertical n-channel MISFETs and methods thereof |
| JP4108537B2 (ja) * | 2003-05-28 | 2008-06-25 | 富士雄 舛岡 | 半導体装置 |
| TWI294670B (en) * | 2003-06-17 | 2008-03-11 | Ibm | Ultra scalable high speed heterojunction vertical n-channel misfets and methods thereof |
| JP2005310921A (ja) * | 2004-04-19 | 2005-11-04 | Okayama Prefecture | Ｍｏｓ型半導体装置及びその製造方法 |
| JP2012099541A (ja) * | 2010-10-29 | 2012-05-24 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法 |
| JP2014229885A (ja) * | 2013-05-27 | 2014-12-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| JP2016167499A (ja) * | 2015-03-09 | 2016-09-15 | 株式会社東芝 | 半導体装置 |
| US10685886B2 (en) * | 2017-12-15 | 2020-06-16 | International Business Machines Corporation | Fabrication of logic devices and power devices on the same substrate |
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2022
- 2022-03-29 JP JP2022053039A patent/JP2023146053A/ja active Pending
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2023
- 2023-03-27 CN CN202310310606.4A patent/CN116895694A/zh active Pending
- 2023-03-28 US US18/191,177 patent/US20230317817A1/en active Pending