JP7206744B2 - Conductive pattern substrate and method for manufacturing conductive pattern substrate - Google Patents

Description

TECHNICAL FIELD The present invention relates to a conductive pattern substrate and a method for manufacturing a conductive pattern substrate.

2. Description of the Related Art In fields such as mesh-type touch panel substrates, mesh antennas for moving bodies, and electromagnetic shielding substrates, conductive pattern substrates having wiring patterns made up of conductive wires arranged in a mesh pattern are used. The wiring pattern is electrically connected to the terminal portion, and is electrically connected to components outside the conductive pattern substrate via the terminal portion.

When the wiring pattern is composed of conductive wires made of a metal material, the wiring pattern may be visually recognized by an observer (user) due to the metallic luster of the metal material. In order to solve such problems, for example, in Cited Document 1, it is proposed to provide a coating layer having a pattern corresponding to the wiring pattern on the side of the viewer of the wiring pattern, and to apply a low-reflection treatment to the surface of the coating layer. ing.

JP 2015-49852 A

When the terminal portion is formed at the same time as the wiring pattern, the coating layer is also provided on the observer side of the terminal portion. In this case, when an attempt is made to electrically connect an external component to the terminal portion, the resistance value of the connection portion decreases due to the coating layer being interposed between the terminal portion and the external component. becomes higher.

An object of the present invention is to provide a conductive pattern substrate that can effectively solve such problems.

The present invention is a conductive pattern substrate, comprising: a substrate partitioned into a first region corresponding to a display region of a display device and a second region positioned around the first region; A plurality of first conductors having light shielding properties and conductivity arranged in a mesh pattern in the first region of the substrate, and a terminal located in the second region of the base material and electrically connected to the first conductors a low-reflection layer having a portion, a first portion located on the first conductor, and a second portion located on a portion of the terminal portion closer to the first conductor; covering the low-reflection layer an overcoat layer that extends over a part of the first region and the second region and has an end portion that crosses the terminal portion when viewed along the normal direction of the base material; The second portion of the low-reflection layer is a conductive pattern substrate having an outer edge coinciding with an edge of the overcoat layer.

In the conductive pattern substrate according to the present invention, the low reflection layer may have a total light reflectance of 20% or less.

In the conductive pattern substrate according to the present invention, a side surface of the first portion of the low reflection layer may coincide with a side surface of the first conductor.

In the conductive pattern substrate according to the present invention, the terminal portion is electrically connected to the second portion of the low-reflection layer when viewed along the normal direction of the base material. A connector having a conductive portion that overlaps the non-overlapping portion may further be provided.

The present invention relates to a method for manufacturing a conductive pattern substrate, comprising: a substrate partitioned into a first region corresponding to a display region of a display device; and a second region positioned around the first region; A preparation step of preparing a laminate including a metal layer positioned on the base material and a low-reflection layer positioned on the metal layer, and forming a resist pattern on the low-reflection layer of the laminate. A step of forming a resist pattern, and etching the metal layer and the low-reflection layer using the resist pattern as a mask, thereby patterning the metal layer and arranging it in a mesh pattern on the first region of the base material. a plurality of light-shielding and conductive first conductors, and a terminal portion located in the second region of the base material and electrically connected to the first conductors, and the low reflection a first etching step of patterning a layer to fabricate a first portion located on the first conductor and a second portion located on the terminal portion; An overcoat layer forming step of forming an overcoat layer extending over a part of the first region and the second region so as to cover the first portion and the portion of the second portion near the first conductor; a second etching step of removing a portion of the second portion not covered with the overcoat layer by etching the second portion of the low-reflection layer using the coat layer as a mask; A method for manufacturing a conductive pattern substrate, comprising:

In the method for manufacturing a conductive pattern substrate according to the present invention, the first etching step may include etching the metal layer and the low-reflection layer using the same etching means.

ADVANTAGE OF THE INVENTION According to this invention, the conductive pattern board|substrate with which the resistance value of the connection part when electrically connecting an external component with respect to a terminal part was reduced can be provided.

1 is an exploded view showing a display device with a touch position detection function according to an embodiment of the present invention; FIG. FIG. 2 is a plan view showing a touch panel substrate in the display device with a touch position detection function of FIG. 1; 3 is an enlarged plan view showing a first pattern and a second pattern in a portion surrounded by a dashed line denoted by reference numeral III in FIG. 2; FIG. 4 is a cross-sectional view showing a case where the touch panel substrate is cut along line IV in FIG. 3; FIG. FIG. 5 is a cross-sectional view showing an enlarged portion surrounded by a dashed-dotted line with reference sign V in FIG. 4 ; FIG. 4 is an enlarged plan view showing a second pattern in a portion surrounded by a dashed line labeled VI in FIG. 3; 6 is a cross-sectional view when a connector is electrically connected to the terminal portion of the touch panel substrate in FIG. 5; FIG. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. It is a figure for demonstrating the manufacturing method of a touch-panel board|substrate. FIG. 10 is a cross-sectional view when a connector is electrically connected to the terminal portion of the touch panel substrate according to the first modified example; It is a top view which expands and shows the 1st pattern and 2nd pattern of the touchscreen substrate which concerns on a 2nd modification. It is a cross-sectional view of a touch panel substrate according to a second modification. FIG. 11 is a plan view showing an enlarged first pattern and a second pattern of a touch panel substrate according to a third modified example; FIG. 11 is a cross-sectional view of a touch panel substrate according to a third modified example; It is a sectional view showing a touch panel board in the 4th modification. FIG. 11 is a plan view showing a touch panel substrate in a fifth modified example; It is a sectional view showing a touch panel board in the 5th modification. FIG. 11 is a plan view showing a touch panel substrate in a fifth modified example; It is a sectional view showing a touch panel board in the 5th modification. It is a sectional view showing a touch panel board in the 7th modification. FIG. 20 is a plan view showing a touch panel substrate in an eighth modified example; FIG. 20 is a plan view showing a touch panel substrate in an eighth modified example; It is a sectional view showing the touch panel substrate in the 8th modification. It is a top view which shows the mesh antenna in embodiment of this invention.

An example of an embodiment of the present invention will be described below with reference to FIGS. 1 to 7. FIG. In the drawings attached to this specification, for the sake of ease of illustration and understanding, the scale, length-to-width ratio, etc. are appropriately changed and exaggerated from those of the real thing. Also, in this specification, terms such as "substrate" and "base material" are not to be distinguished from each other based only on the difference in designation. For example, "substrate" and "base material" are concepts that include members that can be called sheets and films. Furthermore, terms used herein to specify shapes and geometric conditions and their degrees, such as terms such as "parallel" and "perpendicular", length and angle values, etc., are bound by strict meanings. However, it is interpreted to include the extent to which similar functions can be expected.

In this embodiment, an example in which the conductive pattern substrate functions as a touch panel substrate that detects the approach of an external conductor will be described. First, a display device (hereinafter also referred to as a display device with a touch position detection function) in which a touch panel substrate configured by a conductive pattern substrate is incorporated will be described.

Touch panel device and display device with touch position detection function As shown in FIG. and the touch panel substrate 30 are combined. The display device 15 has a display panel 16 having a display surface 16 a and a display controller (not shown) connected to the display panel 16 . The display panel 16 includes a rectangular display area A1 capable of displaying an image, and a non-display area A2 arranged around the display area A1 so as to surround the display area A1. The display control unit processes information regarding images to be displayed, and drives the display panel 16 based on the image information. The display panel 16 displays a predetermined image on the display surface 16a based on the control signal from the display control section. That is, the display device 15 plays a role as an output device for outputting information such as characters and figures as images.

The touch panel substrate 30 is bonded to the display surface 16a of the display device 15 via an adhesive layer (not shown), for example. Although not shown, a protective cover for protecting the touch panel substrate 30 and the display device 15 may be provided on the viewer's side of the touch panel substrate 30 .

Touch Panel Substrate Next, the touch panel substrate 30 will be described with reference to FIG. FIG. 2 is a plan view showing the touch panel substrate 30 as viewed from the observer side.

Here, an example in which the touch panel substrate 30 is configured as a projected capacitive touch panel substrate will be described. The "capacitive coupling" method is also called the "capacitance" method or the "capacitive coupling" method in the technical field of touch panels. It is handled as a term synonymous with the capacitive coupling method. A typical capacitive touch panel substrate has a translucent conductive pattern, and when an external conductor (typically a human finger) approaches the touch panel substrate, external A capacitor (capacitance) is formed between the conductors of the touch panel substrate and the conductive pattern of the touch panel substrate. Then, the position coordinates of the position where the external conductor is approaching on the touch panel substrate are identified based on the change in the electrical state that accompanies the formation of the capacitor. It should be noted that the technical concept, which will be described later, employed in the touch panel substrate 30 according to the present embodiment can be applied to either the self-capacitance method or the mutual capacitance method.

The touch panel substrate 30 includes a base material 32 , a first pattern 41 and a second pattern 42 . The touch panel substrate 30 may further include dummy patterns 47 . Each component of the touch panel substrate 30 will be described below.

(Base material)
The base material 32 is a translucent member including a first surface 32a facing the display device 15 side and a second surface 32b facing the viewer side. As shown in FIG. 2, the base material 32 has a rectangular shape including a first side 32c extending in a first direction D1 and a second side 32d extending in a second direction D2 orthogonal to the first direction D1. have.

As shown in FIGS. 1 and 2, the base material 32 corresponds to the display area A1 of the display device 15 when the display device 15 and the touch panel substrate 30 are combined to form the display device 10 with a touch position detection function. It is divided into a first area 33 and a second area 34 positioned around the first area 33 and corresponding to the non-display area A2 of the display device 15 .

The base material 32 functions as a dielectric in the touch panel substrate 30 . As a material constituting the base material 32, for example, a material having sufficient translucency such as polyethylene terephthalate (PET), cycloolefin polymer (COP), or glass is used. As long as the first pattern 41 and the second pattern 42 can be properly held, the specific configuration of the base material 32 is not particularly limited. For example, the base material 32 may further include an index matching layer for adjusting light reflectance and transmittance of the touch panel substrate 30 . In addition, the substrate 32 may further include a hard coat layer provided on the surface, such as a PET layer. That is, in the present embodiment, the base material 32 does not mean any specific structure or material, but serves as a base for patterns such as the first pattern 41 and the second pattern 42 that constitute the touch panel substrate 30. It just means

(first pattern)
The first pattern 41 is a conductive pattern located in the first region 33 on the first surface 32 a of the base material 32 . The first pattern 41 is a component for detecting contact or approach of an external conductor such as a finger to the touch panel substrate. As shown in FIG. 2, the plurality of first patterns 41 extend in a strip shape in the first direction D1. Also, the plurality of first patterns 41 are arranged in the second direction D2 at a constant arrangement pitch on the first surface 32a. The arrangement pitch of the first pattern 41 is determined according to the resolution required for detecting the touch position, and is, for example, several millimeters. As shown in FIG. 2 , the first pattern 41 may also be provided on the second surface 32 b of the base material 32 . The first pattern 41 located on the second surface 32b extends in a direction different from that of the first pattern 41 located on the first surface 32a, for example, the second direction D2. In FIG. 2, the components provided on the side of the first surface 32a of the base material 32 are represented by solid lines, and the components provided on the side of the second surface 32b of the base material 32 are represented by dotted lines. there is Although not shown, a first pattern 41 extending in the second direction D2 is provided on the first surface 32a of the base material 32, and a first pattern 41 extending in the first direction D1 is provided on the second surface 32b of the base material 32. 41 may be provided.

(second pattern)
The second pattern 42 is a conductive pattern located in the second region 34 on the first surface 32 a of the base material 32 . The second pattern 42 is electrically connected to the first pattern 41 at the boundary between the first region 33 and the second region 34 . The second pattern 42 is a component for extracting the signal detected by the first pattern 41 to the outside of the touch panel substrate 30 . As shown in FIG. 2, when the first pattern 41 is also provided on the second surface 32b of the substrate 32, the second pattern 42 is also provided on the second surface 32b, and the first pattern 41 is also provided on the second surface 32b. 41 may be electrically connected.

As shown in FIG. 2, the second pattern 42 according to the present embodiment is electrically connected to the lead-out wiring 44 electrically connected to the first pattern 41 and to the lead-out wiring 44. has a terminal portion 45 that is electrically connected to the first pattern 41 through the lead wiring 44 by means of the .

The lead wiring 44 is a component for transmitting the signal detected in the first pattern 41 to the terminal portion 45 . Also, the terminal portion 45 is a component for transmitting a signal detected in the first pattern 41 to the outside of the touch panel substrate 30 .

(dummy pattern)
The dummy pattern 47 is a pattern positioned between two adjacent first patterns 41 in the first region 33 . The dummy pattern 47 is electrically connected to neither the first pattern 41 nor the second pattern 42 . The dummy pattern 47 has the same pattern and structure as the first pattern 41 . By providing the dummy pattern 47 in the first region 33, it is possible to prevent the first pattern 41 from being visually recognized by the observer.

(Configuration of first pattern and second pattern)
Next, configurations of the first pattern 41 and the second pattern 42 will be described in detail with reference to FIGS. 3 and 4. FIG. FIG. 3 is an enlarged plan view showing the first pattern 41 and the second pattern 42 positioned on the first surface 32a in a portion surrounded by a dashed line denoted by reference numeral III in FIG. FIG. 4 is an enlarged view of a part of the cross section of the touch panel substrate 30 taken along line IV in FIG.

First, the configuration of the first pattern 41 will be described. In the present embodiment, the first pattern 41 includes a plurality of first conductors 51 arranged in a mesh pattern and having light shielding properties and conductivity. By arranging the first conductors 51 in a mesh pattern, a plurality of first conductor openings 51a are defined between the first conductors 51 .

The ratio of the area occupied by the first conductor opening 51a (hereinafter referred to as the opening ratio of the first conductor 51) to the total area of the first conductor 51 and the area of the first conductor opening 51a is sufficient. As long as this allows the image light from the display device 15 to pass through a region of the touch panel substrate 30 corresponding to the first region 33 of the base material 32 with an appropriate transmittance, the first The size and shape of the first conductor 51 forming the pattern 41 are not particularly limited. For example, in the example shown in FIG. 3, the first pattern 41 is configured by arranging rhombic first conductors 51 along the first direction D1. In the example shown in FIG. 3, the first conductors 51 are arranged such that the acute interior angles of the rhombic interior angles are aligned along the first direction D1. The range of the aperture ratio of the first conducting wire 51 is appropriately set according to the characteristics of the image light emitted from the display device 15 and the like.

The line width of the first conducting wire 51 is set according to the desired aperture ratio of the first conducting wire 51. For example, the width of the first conducting wire 51 is in the range of 1 μm to 10 μm, more preferably 2 μm to 7 μm. is set within the range of As a result, the influence of the first conducting wire 51 on the image visually recognized by the observer can be reduced to a negligible level. The thickness of the first conductive wire 51 is appropriately set according to the electrical resistance value required for the first pattern 41, and is, for example, within the range of 0.1 μm or more and 5 μm or less.

Next, the layer structure of the first conductor 51 forming the first pattern 41 will be described.
As shown in FIG. 4 , the first conductor 51 includes an adhesion layer 61 and a metal layer 62 provided on the adhesion layer 61 .

Among these, the adhesion layer 61 is a layer capable of ensuring adhesion between the metal layer 62 and the substrate 32, for example. The material of the adhesion layer 61 is, for example, a material that can ensure adhesion between the metal layer 62 and the base material 32 . Preferably, the material of the adhesion layer 61 has solubility in the etchant for the metal layer 62 . In this case, it is possible to simultaneously etch the metal layer 62 and the adhesion layer 61 using the same etchant. The adhesion layer 61 contains, for example, In (indium), Zn (zinc), Ni (nickel), Mn (manganese), or Mo (molybdenum). The material of the adhesion layer 61 containing In or Zn is, for example, an oxide film-based material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

Moreover, the metal layer 62 is a layer for mainly realizing conductivity in the first conducting wire 51 . The material of the metal layer 62 in the present embodiment is not particularly limited as long as it is a metal layer that can be used for conducting wires. By providing the metal layer 62 having such a configuration on the first conducting wire 51, high conductivity in the first conducting wire 51 can be ensured. Although not shown, the first conductor 51 may include a cap layer provided on the metal layer 62 to protect the metal layer 62 . As the material of the cap layer, for example, the same material as the material of the adhesion layer 61 described above can be used.

As shown in FIG. 4, a low-reflection layer 63 is provided on the first conducting wire 51 . The low-reflection layer 63 is a layer with less metallic luster than the metal layer 62 . By providing the low reflection layer 63 on the first conducting wire 51, the metallic luster of the first conducting wire 51 can be reduced.

The material of the low-reflection layer 63 is not particularly limited as long as the low-reflection layer 63 can suppress the metallic luster of the first conductor 51, but for example, metal oxide, metal nitride, or metal oxynitride. is. When the material of the low-reflection layer 63 is a metal oxide, the material of the low-reflection layer 63 is, for example, Mo oxide (molybdenum oxide), Fe oxide (iron oxide), In oxide (indium oxide), or any of these. It is a composite oxide sintered body.

Although the total light reflectance of the low-reflection layer 63 is not particularly limited, it is preferably 20% or less, more preferably 5% or less. By setting the total light reflectance of the low-reflection layer 63 within the above range, the low-reflection layer 63 can further suppress the metallic luster of the first conductor wire 51 and make the first conductor wire 51 less visible. can be done.

Here, "total reflectance" is the sum of specular reflectance and diffuse reflectance. The total light reflectance can be determined according to the total light reflectance measurement method of JIS K7375. Specifically, the total light reflectance is measured using a spectrophotometer and an integrating sphere test stand when light is incident on the low-reflection layer 63 on the metal layer 62 at an angle. It can be obtained by measuring at intervals of 10 nm at light wavelengths of 380 nm to 780 nm and calculating the average value thereof. The total light reflectance is obtained as a relative value with respect to the reflectance of a standard white plate containing barium sulfate as 100%.

The thickness of the low-reflection layer 63 is not limited as long as the low-reflection layer 63 can suppress the metallic luster of the first conductor 51, but is preferably 10 nm or more and 500 nm or less, more preferably 30 nm or more and 50 nm or less. The width of the low-reflection layer 63 is not particularly limited as long as it is equal to or greater than the width of the first conductor 51 , but is the same as the width of the first conductor 51 , for example.

Next, the configuration of the lead wiring 44 and the terminal portion 45 of the second pattern 42 will be described. The lead wiring 44 is a wiring having one end connected to the first pattern 41 and the other end connected to the terminal portion 45, and having light shielding properties and conductivity. As shown in FIG. 3, the lead wiring 44 linearly extends from the first pattern 41 to the terminal portion 45 and has a predetermined width W1. Further, the terminal portion 45 is a member connected to the other end of the lead wiring 44 and having light shielding properties and conductivity. In the example shown in FIG. 3 , the terminal portion 45 has a width W2 that is larger than the width W1 of the lead wire 44 .

The lead wiring 44 of the second pattern 42 has the same layer structure as the first conductor 51 included in the first pattern 41 . For example, as shown in FIG. 4 , the lead wiring 44 includes an adhesion layer 61 and a metal layer 62 provided on the adhesion layer 61 . Further, as shown in FIG. 4, a low reflection layer 63 is provided on the lead wiring 44 . In the following description, the portion of the low-reflection layer 63 located on the first conductive wire 51 of the first pattern 41 is referred to as a first portion 63a, and the portion located on the lead wire 44 and the terminal portion 45 of the second pattern 42 is referred to as a first portion 63a. The portion is also referred to as a second portion 63b.

Next, the layer structure of the terminal portion 45 of the second pattern 42 will be described. The terminal portion 45 has the same layer structure as the first conductive wire 51 included in the first pattern 41 . For example, as shown in FIG. 4 , the terminal portion 45 includes an adhesion layer 61 and a metal layer 62 provided on the adhesion layer 61 .

Further, as shown in FIG. 4, the second portion 63b of the low-reflection layer 63 is positioned on the portion of the terminal portion 45 near the first conductor 51. As shown in FIG. Here, “a portion of the terminal portion 45 near the first conductor 51 ” means a boundary portion between the first conductor 51 and the terminal portion 45 or a portion between the lead wire 44 and the terminal portion 45 in the terminal portion 45 . It refers to the part including the boundary between

On the other hand, as shown in FIG. 4 , the low-reflection layer 63 is not located on the portion of the terminal portion 45 located on the side opposite to the first conductor 51 . In the following description, the portion of the terminal portion 45 where the low-reflection layer 63 is not provided is also referred to as an exposed portion. As will be described later, a member such as a connector for transmitting signals from the first pattern 41 to the outside is superimposed on the exposed portion of the terminal portion 45 .

(overcoat layer)
Next, components provided on the first pattern 41 or the second pattern 42 will be described with reference to FIGS. 3, 4 and 5. FIG. FIG. 5 is a cross-sectional view showing an enlarged portion surrounded by a dashed-dotted line labeled V in FIG. 4 . As shown in FIGS. 4 and 5, the touch panel substrate 30 according to the present embodiment has a low-reflection touch panel provided on part of the lead wires 44 and the terminal portions 45 of the first pattern 41 and the second pattern 42 . Overcoat layer 71 extends over portions of first region 33 and second region 34 of substrate 32 to cover layer 63 .

The overcoat layer 71 has an end portion 71a that crosses the terminal portion 45 when viewed along the normal direction of the substrate 32, as indicated by the dotted line in FIG. The overcoat layer 71 extends over a region closer to the first pattern 41 than the end portion 71a shown in FIG.

A positional relationship between the overcoat layer 71 and the low-reflection layer 63 will be described. As shown in FIGS. 4 and 5, the second portion 63b of the low-reflection layer 63 has an outer edge 63c. The outer end portion 63c is the farthest portion from the first region 33 of the base material 32 when viewed along the normal direction of the base material 32 among the ends of the second portion 63b of the low-reflection layer 63. at the end. Outer edge 63 c coincides with edge 71 a of overcoat layer 71 . Note that “coincidence” means that the interface between the second portion 63b of the low-reflection layer 63 and the overcoat layer 71 is defined by the outer edge 63c of the second portion 63b and the edge 71a of the overcoat layer 71. , the distance in the direction (the first direction D1 in FIG. 3) perpendicular to the direction in which the end portion 71a extends is 10 μm or less.

The material of the overcoat layer 71 is not particularly limited as long as it has translucency and insulation and can protect the first pattern 41 and the second pattern 42, but is preferably an acrylic resin, more preferably an acrylic resin. It is a photocurable resin. The thickness of the overcoat layer 71 is such that the image light from the display device 15 can pass through the overcoat layer 71 with an appropriate transmittance, and the first pattern 41 and the second pattern 42 are protected. Although it is not particularly limited as long as it is possible, it is preferably 0.5 μm or more and 10 μm or less.

(transparent conductive film)
As shown in FIGS. 4 and 5, the touch panel substrate 30 according to this embodiment may further include a transparent conductive film 72 . As shown in FIGS. 4 and 5 , the transparent conductive film 72 covers the portion of the terminal portion 45 exposed from the overcoat layer 71 . The transparent conductive film 72 may extend over the overcoat layer 71 as shown in FIGS. The material of the transparent conductive film 72 is, for example, a transparent conductive material such as indium tin oxide (ITO). Although the thickness of the transparent conductive film 72 is not particularly limited, it is, for example, 0.1 μm or more and 0.5 μm or less. By covering the terminal portion 45 with the transparent conductive film 72, oxidation of the terminal portion 45 can be suppressed.

The dimensions of the transparent conductive film 72 will be described with reference to FIGS. FIG. 6 is an enlarged view of the second pattern 42 located on the first surface 32a in a portion surrounded by a dashed line labeled VI in FIG. It is the figure which displayed the outline 72a of the transparent conductive film 72 at the time of seeing. A width W1 where the transparent conductive film 72 and the overcoat layer 71 overlap when viewed along the normal direction of the substrate 32 shown in FIGS. 5 and 6 is not particularly limited, but is, for example, 10 μm or more. Moreover, as shown in FIG. 6 , it is preferable that one transparent conductive film 72 extends beyond the outline of the terminal portion 45 when viewed along the normal direction of the base material 32 . In this case, the width W2 in which the transparent conductive film 72 spreads beyond the outline of the terminal portion 45 in the first direction D1 is not particularly limited as long as the transparent conductive films 72 on the adjacent terminal portions 45 are not electrically connected. is, for example, 5 μm or more. Also, the width W3 of the transparent conductive film 72 extending beyond the contour of the terminal portion 45 in the second direction D2 is not particularly limited, but is, for example, 5 μm or more.

(connector)
Next, components that can be electrically connected to the terminal portion 45 will be described with reference to FIG. A connector 73 may be electrically connected to the terminal portion 45 . FIG. 7 is a cross-sectional view when the connector 73 is electrically connected to the terminal portion 45 of the touch panel substrate 30 in FIG.

The connector 73 is a component for extracting a signal from the first pattern 41 via the terminal portion 45 and transmitting it to the outside, or for inputting a signal from the outside to the first pattern 41 via the terminal portion 45. is. The connector 73 is electrically connected to the terminal portion 45, and the portion of the terminal portion 45 that does not overlap the second portion 63b of the low-reflection layer 63 when viewed along the normal direction of the base material 32 (the above-described (exposed portion of ). As shown in FIG. 7, in this embodiment, a transparent conductive film 72 covers the exposed portion of the terminal portion 45 . Therefore, in the present embodiment, the connector 73 can be electrically connected to the terminal portion 45 by connecting the conductive portion to the transparent conductive film 72 covering the terminal portion 45 .

A method for electrically connecting the connector 73 to the terminal portion 45 is not particularly limited. For example, as shown in FIG. The connector 73 and the terminal portion 45 can be electrically connected via the adhesive layer 74 .

Effects of the touch panel substrate 30 according to the present embodiment when the connector 73 is connected to the terminal portion 45 will be described with reference to FIGS. 5 and 7. FIG. As described above, the terminal portion 45 has exposed portions that are exposed from the overcoat layer 71 and the low-reflection layer 63 . As a result, as shown in FIG. 7, when the connector 73 is electrically connected to the terminal portion 45 to transmit an electrical signal, the number of interfaces between layers present in the path through which the electrical signal passes can be reduced. can. Therefore, the electrical resistance of the connecting portion between the terminal portion 45 and the connector 73 can be reduced.

A length L1 of the exposed portion of the terminal portion 45 in the direction orthogonal to the direction in which the end portion 71a extends is set so as to ensure stable electrical connection between the terminal portion 45 and the connector 73 .

Method for Manufacturing Touch Panel Substrate Next, a method for manufacturing the touch panel substrate 30 configured as described above will be described with reference to FIGS. 8 to 13. FIG. 8 to 13 are diagrams for explaining the method of manufacturing the touch panel substrate 30 according to this embodiment.

(Preparation process)
First, as shown in FIG. 8, a laminate 60 is prepared as a base material for fabricating the touch panel substrate 30 . The laminate 60 in the present embodiment includes a substrate 32, an adhesion layer 61 provided on the first surface 32a of the substrate 32, a metal layer 62 provided on the adhesion layer 61, and and a low-reflection layer 63 provided in. A method for forming the metal layer 62 on the adhesion layer 61 is not particularly limited, and a known method such as a vapor deposition method or a sputtering method can be appropriately used. A method for forming the low-reflection layer 63 on the metal layer 62 is not particularly limited. For example, when the material of the low-reflection layer 63 is molybdenum oxide, iron oxide, indium oxide, or a composite oxide sintered body thereof, sputtering is performed using the same material as the material of the low-reflection layer 63 to be formed as a target. A low-reflection layer 63 can be formed by a method. When forming the first pattern 41 and the second pattern 42 also on the second surface 32b of the substrate 32, the adhesion layer 61, the metal layer 62 and the low reflection layer 63 are also provided on the second surface 32b. may

(Resist layer forming step)
After preparing the laminated body 60, as shown in FIG. 9, a resist layer 81 having a pattern corresponding to the first conductive wire 51, the lead wire 44 and the terminal portion 45 is formed on the low reflection layer 63. FIG.

An example of resist layer 81 in the present embodiment will be described. The resist layer 81 is, for example, a photosensitive layer having photosensitivity to light in a specific wavelength range, such as ultraviolet rays. The type of photosensitive layer is not particularly limited. For example, a photocurable photosensitive layer may be used, or a photodissolving photosensitive layer may be used. Here, an example in which a photodissolving photosensitive layer is used as the resist layer 81 will be described.

The resist layer 81 is formed in a pattern corresponding to the first conducting wire 51 , the lead wire 44 and the terminal portion 45 . The resist layer 81 is formed, for example, by first coating the surface of the laminate 60 with a photosensitive material using a coater, and then exposing and developing the photosensitive material in a predetermined pattern.

(First etching step)
After forming the resist layer 81, the low-reflection layer 63 is etched using the resist layer 81 shown in FIG. 9 as a mask. Thereby, as shown in FIG. 10, the low-reflection layer 63 can be patterned to form a first portion 63a and a second portion 63b.

Also, using the resist layer 81 shown in FIG. 9 as a mask, the metal layer 62 is etched. Also, the adhesion layer 61 is etched using the resist layer 81 shown in FIG. 9 as a mask. Thereby, as shown in FIG. 10, the adhesion layer 61 and the metal layer 62 can be patterned to form the first conducting wire 51, the lead wire 44 and the terminal portion 45. Next, as shown in FIG.

In the first etching step, the low-reflection layer 63 and the metal layer 62 may be etched using the same etching means, or may be etched using separate means. Also, the metal layer 62 and the adhesion layer 61 may be etched using the same etching means, or may be etched using separate means.

When the low-reflection layer 63 and the metal layer 62 are etched together using the same etching means, as shown in FIG. It matches the side of the metal layer 62 . The etchant used to etch the low-reflection layer 63 and the metal layer 62 together is appropriately selected according to the material of the low-reflection layer 63 and the metal layer 62 . For example, when the material of the low-reflection layer 63 is molybdenum oxide, iron oxide, indium oxide, or a composite oxide sintered body thereof, and the material of the metal layer 62 is an Ag-based alloy, phosphorous nitric acid is used as an etchant. can be used. Further, when the same etchant is used to etch the adhesion layer 61, the material of the adhesion layer 61 is, for example, a material containing In, Zn, Ni, Mn, or Mo. Examples include oxide film-based materials such as indium tin oxide (ITO) and indium zinc oxide (IZO).

Next, the resist layer 81 remaining on the metal layer 62 is removed using an alkaline remover. The alkaline remover used to remove the resist layer 81 is not particularly limited as long as the resist layer 81 can be removed. Thereby, as shown in FIG. 11, the resist layer 81 can be removed.

(Overcoat layer forming step)
In the present embodiment, after etching, as shown in FIG. 12, of the low-reflection layer 63, a first portion 63a positioned above the first conductor 51 and a second portion 63b positioned above the lead wire 44 are formed. , and the portion of the second portion 63b located on the terminal portion 45 near the first conductor 51, the overcoat layer 71 is formed. When viewed along the normal direction of the base material 32 , the overcoat layer 71 is arranged so that the end portion 71 a of the overcoat layer 71 crosses the terminal portion 45 and the second portion 63 b of the low-reflection layer 63 on the terminal portion 45 . , extending over a portion of the first region 33 and the second region 34 of the substrate 32 . The overcoat layer 71 can be formed, for example, as follows. First, an overcoat layer material layer containing an acrylic photocurable resin is formed so as to cover the low-reflection layer 63 . Next, the overcoat layer material layer is irradiated with exposure light in a predetermined pattern through a mask (not shown) provided with openings in a predetermined pattern. As a result, the portion of the overcoat layer material layer that should remain as the overcoat layer 71 is cured. Thereafter, the overcoat layer material layer is developed to remove unnecessary portions of the overcoat layer material layer. Thereby, the overcoat layer 71 shown in FIG. 12 can be formed.

(Second etching step)
After forming the overcoat layer 71, using the overcoat layer 71 as a mask, as shown in FIG. . As a result, the low-reflection layer 63 on the portion of the terminal portion 45 opposite to the first conductor 51 is removed. Thereby, an exposed portion where the low-reflection layer 63 is not provided can be formed in the terminal portion 45 . In this case, the outer edge 63c of the second portion 63b of the low-reflection layer 63 coincides with the edge 71a of the overcoat layer 71, as shown in FIG.

Etching means for the low-reflection layer 63 in the second etching step is not particularly limited as long as the low-reflection layer 63 can be etched while leaving the metal layer 62 in contact with the low-reflection layer 63 . For example, the low-reflection layer 63 can be etched using an etchant that can selectively etch only the material of the low-reflection layer 63 . Further, even when an etching means capable of etching both the metal layer 62 and the low-reflection layer 63 is used, by limiting the etching time to a time corresponding to the thickness of the low-reflection layer 63, the metal layer 62 can be left.

(Transparent conductive film forming step)
After the second etching step, as shown in FIG. 4, a transparent conductive film 72 may be formed to cover the portion of the terminal portion 45 exposed from the overcoat layer 71 . For example, first, the transparent conductive film 72 is formed by a physical film forming method such as a sputtering method. Next, a resist having a pattern corresponding to the pattern of the plurality of transparent conductive films 72 to be obtained is formed on the transparent conductive film 72 . Next, using the resist as a mask, the transparent conductive film 72 is etched. Thereby, the transparent conductive film 72 shown in FIG. 4 can be obtained.

(First modification)
In the above embodiment, the outer edge 63c of the second portion 63b of the low-reflection layer 63 forms a plane perpendicular to the substrate 32, but the shape of the outer edge 63c is this. is not limited to An outer end portion 63c having a shape different from that of the above embodiment will be described. FIG. 14 is an enlarged sectional view showing the terminal portion 45 when the connector 73 is electrically connected to the terminal portion 45 of the touch panel substrate 30 according to this modification.

For example, as shown in FIG. 14, the outer edge 63c of the second portion 63b of the low-reflection layer 63 may have a concave portion due to side etching or the like in the second etching step. Even in this case, as in the case of the above-described embodiment, at the interface between the second portion 63b of the low-reflection layer 63 and the overcoat layer 71, the outer end portion 63c of the second portion 63b and the The end portion 71a of the overcoat layer 71 is aligned. Note that “coincidence” means that the interface between the second portion 63b of the low-reflection layer 63 and the overcoat layer 71 is defined by the outer edge 63c of the second portion 63b and the edge 71a of the overcoat layer 71. , means that the distance in the direction orthogonal to the direction in which the end portion 71a extends is 10 μm or less.

Moreover, although the overcoat layer 71 has a constant thickness in the above embodiment, the form of the overcoat layer 71 is not limited to this. For example, as shown in FIG. 14, the overcoat layer 71 may have a so-called forward tapered shape in which the thickness decreases from the first conductor 51 side toward the outer edge side of the base material 32 . In this case, when the connector 73 is connected to the terminal portion 45 via the conductive adhesive layer 74 , the touch panel substrate 30 has the conductive adhesive layer 74 when viewed along the normal direction of the base material 32 . You may have area|region A3 which overlaps with the overcoat layer 71. FIG.

(Second modification)
Although the second pattern 42 has a solid pattern of the metal layer 62 in the above embodiment, the form of the second pattern is not limited to this. In this modified example, an example in which the lead wiring 44 and the terminal portion 45 of the second pattern 42 include conductive wires arranged in a mesh pattern will be described. FIG. 15 is an enlarged plan view showing the first pattern 41 and the second pattern 42 of the touch panel substrate 30 according to this modification. Moreover, FIG. 16 is an enlarged view of a part of a cross section showing a case where the touch panel substrate 30 according to this modified example is cut along the XVI line of FIG. 15 .

For example, as shown in FIGS. 15 and 16, the lead wiring 44 and the terminal portion 45 of the second pattern 42 may include a plurality of second conductors 52 arranged in a mesh pattern and having light shielding properties and conductivity. . In this case, a plurality of second conductor openings 52a are defined between the second conductors 52 by arranging the second conductors 52 in a mesh pattern.

Also in this modification, as shown in FIG. 16, a low-reflection layer 63 is provided on a portion of the second conductor 52 that constitutes the terminal portion 45 and is located on the opposite side to the first conductor 51 . Absent. For example, the low-reflection layer 63 is provided on the portion of the second conductor 52 that constitutes the terminal portion 45 that is covered with the overcoat layer 71, but the portion that is exposed from the overcoat layer 71 is No low-reflection layer 63 is provided thereon. As a result, the electrical resistance of the connecting portion between the terminal portion 45 and the connector can be reduced, as in the case of the above-described embodiment.

(Third modification)
In the second modified example described above, an example in which the second pattern 42 is composed of the second conductors 52 is shown, but the form of the second pattern 42 is not limited to this. In this modified example, an example in which the terminal portion 45 of the second pattern 42 has the second conducting wire 52 and a solid portion will be described. FIG. 17 is an enlarged plan view showing the first pattern 41 and the second pattern 42 of the touch panel substrate 30 according to this modification. Moreover, FIG. 18 is an enlarged view of a part of a cross section showing a case where the touch panel substrate 30 according to this modification is cut along line XVIII in FIG. 17 .

For example, as shown in FIGS. 17 and 18 , the terminal portion 45 of the second pattern 42 may include a second conductor 52 and a plurality of solid portions 53 arranged to contact the second conductor 52 . 17 and 18 show the case where the terminal portion 45 of the second pattern 42 includes the solid portion 53, but the scope of this modification is not limited to this. For example, both the lead wire 44 and the terminal portion 45 may include the solid portion 53 .

The terminal portion 45 in the third modified example further has a plurality of solid portions 53 in addition to the mesh-like second conducting wire 52 . Therefore, compared to the second modification, the contact area between the terminal portion 45 and a component such as a connector provided on the terminal portion 45 can be increased, and the electrical resistance at the interface between the two can be reduced. can do.

Also in this modification, as shown in FIG. 18, the low-reflection layer 63 is formed on the portion of the second conductor 52 and the solid portion 53 that constitute the terminal portion 45, which is located on the opposite side to the first conductor 51. is not provided. For example, the low-reflection layer 63 is provided on the portion covered with the overcoat layer 71 of the second conductive wire 52 and the solid portion 53 that constitute the terminal portion 45 , but is exposed from the overcoat layer 71 . The low-reflection layer 63 is not provided on the portion where the As a result, the electrical resistance of the connecting portion between the terminal portion 45 and the connector can be reduced, as in the case of the above-described embodiment.

(Fourth modification)
FIG. 19 is a diagram showing a fourth modification of the touch panel substrate 30. As shown in FIG. FIG. 19 shows a partial cross-sectional view of the first region 33 of the fourth modification. 19, illustration of the layer structure of the first conductor 51 such as the adhesion layer 61 and the metal layer 62 is omitted, and only the outline of the first conductor 51 is illustrated. Also, in FIG. 19, illustration of the low-reflection layer 63 is omitted. 19, the second surface 32b of the base material 32 faces upward in the figure, and the partial cross-sectional view is displayed. In the fourth modification, two types of first patterns 41 that extend in different directions and are not connected to each other are provided on one surface of the touch panel substrate 30 . Hereinafter, when the touch panel substrate 30 includes two types of first patterns 41 having different extending directions and the like, one of the two types of first patterns 41 is also referred to as one first pattern 41a, and the other is referred to as the other first pattern 41a. It is also called 1 pattern 41b. In the fourth modification, one first pattern 41a is provided on the second surface 32b of the base material 32, as shown in FIG. A first overcoat layer 71b is provided to cover one first pattern 41a. Furthermore, the other first pattern 41b is provided on the first overcoat layer 71b, and the second overcoat layer 71c is provided so as to cover the other first pattern 41b. Although not shown, a protective cover may be provided on the second overcoat layer 71 c of the touch panel substrate 30 .

(Fifth Modification)
20 and 21 are diagrams showing a fifth modification. FIG. 20 shows a partial plan view of the first region 33 of the fifth modified example. Note that FIG. 20 shows the case where the first pattern 41 is configured by the first conductors 51 formed so that the first conductor openings 51a are square. FIG. 21 is a partial cross-sectional view showing the case where the touch panel substrate 30 is cut along line XXI in FIG. In FIG. 21, illustration of the layer structure of the conductor such as the adhesion layer 61 and the metal layer 62 is omitted, and only the outline of the conductor is illustrated. Also, in FIG. 21, illustration of the low-reflection layer 63 is omitted. In addition, in FIG. 21, the second surface 32b of the base material 32 faces upward in the figure, and a partial cross-sectional view is displayed. In the fifth modification, an overcoat layer 71 is provided in a portion where one first pattern 41a and the other first pattern 41b overlap in plan view of the base material 32 . One first pattern 41 a extends over the overcoat layer 71 , and the other first pattern 41 b extends between the base material 32 and the overcoat layer 71 . This prevents the two types of first patterns 41 from being electrically connected to each other in the portion where the two types of first patterns 41 overlap in plan view of the base material 32 .

In the example shown in FIG. 21 , one first pattern 41 a has one first conductor 51 c extending over the overcoat layer 71 . In addition, the other first pattern 41b extends between the other first conductive wire 51d divided into the plurality and the base material 32 and the overcoat layer 71, and the other first conductive wire divided into the plurality 51d and a connecting conductor 57 connecting the 51d to each other. Although not shown, the low-reflection layer 63 may be provided on the connection conductor 57 as well as on the first conductor 51 . Although not shown, in the fifth modification, one first pattern 41a has one first conductor 51c extending between the base material 32 and the overcoat layer 71, and the other first conductor 51c. The first pattern 41b includes the other divided first conductor 51d and a connection conductor 57 extending over the overcoat layer 71 and connecting the other divided first conductor 51d to each other. may have.

Further, as shown in FIGS. 22 and 23, the fifth modification has a connection conductor 57 provided on the second surface 32b of the base material 32 and a groove 71d for partially exposing the connection conductor 57. and an overcoat layer 71 provided so as to cover the entire base material 32 except for the portion where the groove portion 71d is provided. In this case, one first pattern 41 a has a first conductor 51 c provided on the overcoat layer 71 . The other first pattern 41b has the connection conductor 57 described above and the other first conductor 51d provided on the overcoat layer 71 and divided into a plurality of parts. As shown in FIG. 23, the other first conductor wire 51d divided into a plurality of pieces is electrically connected to the connection conductor wire 57 through the groove portion 71d.

In the fifth modification, although not shown, an additional overcoat layer may be provided so as to cover the conductors provided on the overcoat layer 71 . Moreover, although not shown, a protective cover may be provided on the additional overcoat layer of the touch panel substrate 30 .

(Sixth modification)
In the fourth modification and the fifth modification, cases where both of the two types of first patterns 41 extending in different directions are provided on the second surface 32b of the base material 32 are shown. However, without being limited to this, both of the two types of first patterns 41 extending in different directions may be provided on the first surface 32 a of the base material 32 . In this case, when manufacturing a touch panel using the touch panel substrate 30, the substrate 32 may be used as a protective cover for the touch panel.

(Seventh Modification)
In the seventh modification, the touch panel substrate 30 has two substrates 32 . One of the two substrates 32 is provided with one first pattern 41a, and the other substrate 32 is provided with the other first pattern 41b. 24A and 24B are diagrams showing a seventh modification of the touch panel substrate 30. FIG. FIG. 24 shows a partial cross-sectional view of the first region 33 of the seventh modification. 24, illustration of the layer structure of the first conductor 51 such as the adhesion layer 61 and the metal layer 62 is omitted, and only the outline of the first conductor 51 is illustrated. Also, in FIG. 24, illustration of the low-reflection layer 63 is omitted. In addition, in FIG. 24, the second surface 32b of the base material 32 faces upward in the figure, and the partial cross-sectional view is displayed. The touch panel substrate shown in FIG. 24 has a first laminated portion 66 , a second laminated portion 64 , and a connection portion 65 that connects the first laminated portion 66 and the second laminated portion 64 . The first laminated portion 66 includes the base material 32, one first pattern 41a provided on the second surface 32b of the base material 32, and an overcoat layer covering the one base material 32 and the one first pattern 41a. 71 and . The second laminated portion 64 includes the base material 32, the other first pattern 41b provided on the second surface 32b of the base material 32, and an overcoat layer covering the base material 32 and the one first pattern 41a. 71 and . In the example shown in FIG. 24 , the overcoat layer 71 side of the first laminated section 66 and the base material 32 side of the second laminated section 64 are connected by a connection section 65 . In the touch panel substrate 30 shown in FIG. 24, the display device 15 is arranged on the first lamination section 66 side. Note that the touch panel substrate 30 according to the seventh modification has the same layer configuration as the touch panel substrate 30 shown in FIG. good too.

(Eighth modification)
25 to 27 are diagrams showing an eighth modification. FIG. 25 shows a partial plan view of the eighth modification. In FIG. 25, illustration of the mesh-like first conductor 51 included in the first pattern 41 is omitted, and the outline of the first pattern 41 is shown. Also, in FIG. 25, illustration of the dummy pattern 47 is omitted. FIG. 26 is an enlarged plan view showing a portion surrounded by a dashed line labeled XXVI in FIG. 25. FIG. FIG. 27 is a partial cross-sectional view showing the case where the touch panel substrate 30 is cut along line XXVII of FIG. In FIG. 27, illustration of the layer structure of the conductor such as the adhesion layer 61 and the metal layer 62 is omitted, and only the outline of the conductor is illustrated. Also, in FIG. 27, illustration of the low-reflection layer 63 is omitted. In the example shown in FIG. 25, one first pattern 41a extends in one direction. In the example shown in FIG. 25, the other first pattern 41b has a plurality of first pattern constituent units 41b1 to 41b5 arranged in the extending direction of the one first pattern 41a. As shown in FIGS. 25 and 26, each of the plurality of first pattern structural units 41b1 to 41b5 faces one first pattern 41a. As shown in FIG. 27 , one first pattern 41 a and the other first pattern 41 b are provided on the first surface 32 a of the base material 32 . Although not shown, one first pattern 41 a and the other first pattern 41 b may be provided on the second surface 32 b of the base material 32 . In the eighth modification, for example, one first pattern 41a is used as a drive pattern for the touch panel, and the other first pattern 41b is used as a detection pattern for the touch panel.

(Ninth Modification of Touch Panel Substrate)
In the embodiment and each modified example described above, the case where the touch panel substrate 30 is a component different from the display device 15 has been described. However, the form of the touch panel substrate 30 is not limited to this, and the touch panel substrate 30 may be one component of the display device 15 . In this case, when manufacturing a touch panel using the touch panel substrate 30 according to the ninth modification, the touch panel substrate 30, which is one component of the display device 15, and the display device 15 are different components. A touch panel may be manufactured by combining the touch panel substrate 30 with the touch panel substrate 30 .

Other Uses of Conductive Pattern Substrate In the above-described embodiment, an example of using the conductive pattern substrate as the touch panel substrate 30 was shown, but the use of the conductive pattern substrate is not limited to this. For example, as shown in FIG. 28, the first pattern 41 can be formed in a loop shape and used as a mesh antenna. In the example shown in FIG. 28, the first pattern 41 is provided on the first surface 32a of the base material 32. In the example shown in FIG. Although not shown, the first pattern 41 may be provided on the second surface 32b. Although not shown, dummy patterns may be formed between the first patterns 41 .

10 Display device with touch position detection function 15 Display device 16 Display panel 16a Display surface 30 Touch panel substrate 32 Base material 32a First surface 32b Second surface 32c First side 32d Second side 33 First region 34 Second region 41 First Pattern 42 Second pattern 44 Leading wiring 45 Terminal portion 47 Dummy pattern 51 First conducting wire 51a First conducting wire opening 52 Second conducting wire 52a Second conducting wire opening 53 Solid portion 55 Inclined side 57 Connection conducting wire 60 Laminate 61 Adhesion layer 62 Metal layer 63 Low-reflection layer 63a First portion 63b Second portion 63c Outer edge 71 Overcoat layer 71a Edge 72 Transparent conductive film 72a Outline 73 Connector 74 Conductive adhesive layer 81 Resist layer 90 Mesh antenna

Claims (6)

A conductive pattern substrate,
a base material partitioned into a first region corresponding to a display region of a display device and a second region positioned around the first region;
a plurality of first conductive wires arranged in a mesh pattern in the first region of the base material and having light shielding properties and conductivity;
a terminal portion located in the second region of the base material and electrically connected to the first conductor;
a low reflective layer having a first portion located on the first conductor and a second portion located on a portion of the terminal portion closer to the first conductor;
An overcoat layer that extends over a portion of the first region and the second region so as to cover the low-reflection layer and has an edge portion that crosses the terminal portion when viewed along the normal direction of the base material. and
the second portion of the low-reflection layer has an outer edge coinciding with an edge of the overcoat layer;
The terminal portion has a plurality of second conductors arranged in a mesh,
Conductive, further comprising a transparent conductive film that extends beyond the outline of the terminal when viewed along the normal direction of the base material and covers a portion of the terminal that is exposed from the overcoat layer . pattern board. 2. The conductive pattern substrate according to claim 1, wherein said low reflection layer has a total light reflectance of 20% or less. 3. The conductive pattern substrate according to claim 1, wherein a side surface of said first portion of said low-reflection layer coincides with a side surface of said first conductor. a conductive portion that is electrically connected to the terminal portion and overlaps a portion of the terminal portion that does not overlap the second portion of the low-reflection layer when viewed along the normal direction of the base material; 4. The conductive pattern board according to any one of claims 1 to 3, further comprising a connector. A method for manufacturing a conductive pattern substrate,
A substrate partitioned into a first region corresponding to a display region of a display device and a second region positioned around the first region, a metal layer positioned on the base, and on the metal layer A preparation step of preparing a laminate including a low-reflection layer located in
a resist pattern forming step of forming a resist pattern on the low reflection layer of the laminate;
By etching the metal layer and the low-reflection layer using the resist pattern as a mask,
By patterning the metal layer, a plurality of first conductors having light shielding properties and conductivity, which are arranged in a mesh pattern in the first region of the base material, and located in the second region of the base material, the producing a terminal portion electrically connected to the first conducting wire, the terminal portion having a plurality of second conducting wires arranged in a mesh pattern ;
a first etching step of patterning the low-reflection layer to form a first portion located on the first conductor and a second portion located on the terminal portion;
Forming an overcoat layer that extends over a part of the first region and the second region so as to cover the first portion and a portion of the second portion near the first conductor line in the low-reflection layer an overcoat layer forming step;
a second etching step of removing a portion of the second portion not covered with the overcoat layer by etching the second portion of the low-reflection layer using the overcoat layer as a mask; ,
forming a transparent conductive film that extends beyond the outline of the terminal when viewed along the normal direction of the base material and covers the portion of the terminal that is exposed from the overcoat layer; A method for manufacturing a conductive pattern substrate , comprising: 6. The method of manufacturing a conductive pattern substrate according to claim 5, wherein said first etching step includes a step of etching said metal layer and said low reflection layer using the same etching means.

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