JP7182817B1 - Probe sheet and manufacturing method thereof - Google Patents

Abstract

The present invention provides a probe sheet having an appropriate vertical dynamic allowance and probes capable of stably and appropriately press-contacting with ball-shaped bumps. SOLUTION: A probe sheet according to the present invention includes a through electrode constituted by a through hole penetrating between upper and lower surfaces of the sheet, and a through slit penetrating between the upper and lower surfaces of the sheet while enclosing the circumference of the through electrode in a ring shape in plan view. a vertical motion probe separated from the sheet body via the through slit; and a guide hole surrounding the vertical motion probe via the through slit, wherein the vertical motion probe includes a first tapered surface and a second tapered surface. While having a bulging corner formed by a tapered surface on the side surface, the guide hole is formed by a third tapered surface facing the first tapered surface and a fourth tapered surface facing the second tapered surface. A corner portion is provided on the inner wall, and the receiving corner portion and the bulging corner portion allow vertical movement while preventing the vertical movement probe from coming off. [Selection diagram] Fig. 1

Description

The present invention relates to a probe sheet that can be used as a connection member for burn-in tests of IC packages (semiconductor packages) such as semiconductor wafers and CSPs (Chip Size Packages), or as an interposer, and a method for manufacturing the same.

Conventionally, this type of probe sheet is provided with probes corresponding to numerous ball-shaped bumps provided on a semiconductor component such as an IC package so as to penetrate between the upper and lower surfaces of the sheet, and ball-shaped bumps are provided at the upper ends of the respective probes. is pressurized to contact the burn-in test, etc.

In order for the probe and the ball-shaped bump to come into proper pressure contact, the probe must have a vertical dynamic allowance, that is, a play that allows it to move up and down appropriately. are arranged at a very small pitch at high density, it is difficult to provide a vertical dynamic allowance via an elastic member such as a spring member.

Therefore, as shown in Patent Document 1 below, the inventors of the present invention formed linear through slits in two or three directions, front, rear, left, and right, of the probe, and a region including the probe surrounded by these through slits. is a sheet piece, and the sheet piece bends in the vertical direction to enable the probe to move up and down.

Japanese Patent No. 3090920

In the probe sheet of Patent Document 1, since the probes are appropriately moved up and down by the sheet piece including the probes, it is possible to make appropriate pressure contact with the ball-shaped bumps. There is a problem that the amount of displacement in the vertical direction differs between the base portion serving as a fulcrum and the opposite free end portion side, and it may not be possible to make uniform and stable contact with the ball-shaped bump depending on how it bends. ing.

In addition, due to repeated use, etc., the base portion, which is the fulcrum of bending of the sheet piece, is elastically deteriorated, and there is a problem that it becomes difficult to maintain the contact pressure.

The present invention effectively solves the problems of the conventional probe sheet, and provides a probe sheet having an appropriate vertical dynamic allowance and capable of stably and appropriately contacting ball-shaped bumps under pressure, and a method of manufacturing the same. I will provide a.

Briefly, the probe sheet according to the present invention includes a vertically movable probe containing a through-electrode penetrating between the upper and lower surfaces of the sheet, a guide hole surrounding and holding the vertically movable probe, and a part of the guide hole. provided with a through slit extending between the upper and lower surfaces of the seat between the side surface of the vertical movement probe and the inner wall of the guide hole, and having an annular shape in a plan view, the vertical movement probe being composed of a first tapered surface and a second tapered surface. The inner wall of the guide hole has a receiving corner formed by a third tapered surface facing the first tapered surface and a fourth tapered surface facing the second tapered surface. The receiving corner portion and the bulging corner portion prevent the vertical movement probe from slipping out of the guide hole, and the through slit allows the vertical movement of the vertical movement probe. Therefore, the vertical movement allowance can be given to the vertical movement probe by the through slit, and the probe can press-contact with the ball-shaped bump with an appropriate contact pressure.

Preferably, the angle of the receiving corner of the guide hole is an obtuse angle, so that the receiving corner contributes both to preventing the vertical movement probe from slipping off and for smooth vertical movement.

Further, the vertical movement probe has a shape in which the bottom surfaces of a truncated cone and an inverted truncated cone are butted against each other, the side surface of the truncated cone is the first tapered surface, and the inverted truncated cone By making the side surface of the second tapered surface, smooth and stable vertical movement of the vertical movement probe is ensured.

Further, the through electrode may have a circular or polygonal cross-sectional shape and a cocktail glass or hourglass vertical cross-sectional shape .

A method for manufacturing a probe sheet according to the present invention comprises the steps of forming a through-hole in an insulating sheet, forming a metal layer on the inner wall of the through-hole to form a through-electrode, and forming a plane around the through-electrode. By forming a through slit penetrating between the upper and lower surfaces of the seat while enclosing it in an annular shape , the vertically movable probe containing the through electrode is provided separately from the seat body, and the side surface of the vertically movable probe is formed, and the through slit is formed. forming a guide hole for holding the vertical movement probe and forming an inner wall of the guide hole by forming the through slit to be present between the side surface of the vertical movement probe and the inner wall of the guide hole on the upper surface side of the sheet By engraving and forming from both the lower surface side of the sheet and the bottom surface of the sheet, the side surface of the vertical movement probe is provided with a bulging corner portion composed of the first tapered surface and the second tapered surface, while the inner wall of the guide hole is provided with the second tapered surface. A receiving corner is provided which is composed of a third tapered surface facing the first tapered surface and a fourth tapered surface facing the second tapered surface. Therefore, it is possible to manufacture a probe sheet having probes having a vertical motion allowance due to the penetration slits without using a complicated process or a new member other than an insulating sheet.

According to the probe sheet of the present invention, the vertically movable probes can be brought into pressure contact with the ball-shaped bumps by the vertical movement allowance of the through-slits, and can effectively cope with ball-shaped bumps with a very small pitch. can.

Further, according to the method of manufacturing a probe sheet according to the present invention, it is possible to manufacture a probe sheet having probes having a vertical movement allowance due to the penetration slits without using complicated processes or new members other than an insulating sheet. can.

1 is a cross-sectional view of a probe sheet according to the present invention; FIG. 1 is a plan view of a probe sheet according to the present invention; FIG. FIG. 4 is a cross-sectional view showing a state in which the ball-shaped bumps of the IC package and the vertically movable probes of the probe sheet are in contact with each other under pressure; It is a figure explaining the manufacturing process of a probe sheet, (A) is sectional drawing of an insulating sheet, (B) is sectional drawing which shows the state which perforated the insulating sheet. FIG. 4A is a cross-sectional view illustrating a state in which through electrodes are formed by forming a metal layer on an insulating sheet having through holes, and FIG. 4B is a through electrode; FIG. FIG. 4 is a cross-sectional view showing a state in which through slits are formed around the . FIG. 4 is a cross-sectional view showing another example of a through electrode; FIG. 8A is a plan view showing another example of the through electrode and the vertical movement probe, in which (A) shows that the upper opening of the through electrode is in the shape of a truncated inverted pyramid, and the vertical movement probe is a truncated pyramid and the bottom surfaces of the truncated inverted pyramid. (B) shows an example in which the upper opening of the through electrode is in the shape of a truncated inverted cone, and the vertical movement probe has a shape in which the bottom surfaces of the truncated pyramid and the truncated inverted pyramid are butted against each other. , and (C) shows an example in which the upper opening of the through electrode is in the shape of an inverted truncated pyramid, and the vertical movement probe has a shape in which the bottom surfaces of the truncated cone and the inverted truncated cone are butted against each other. ing. It is a figure which shows the example of the vertical movement probe which has a bulging corner|angular part partially, (A) is a top view, (B) is sectional drawing.

BEST MODE FOR CARRYING OUT THE INVENTION A probe sheet and a method for manufacturing the same according to the present invention will be described below with reference to FIGS. 1 to 8. FIG.

<Basic configuration of probe sheet>
As shown in FIGS. 1 and 2, the probe sheet 1 according to the present invention consists of an insulating sheet 1' as will be described later, and has the following basic configuration.

That is, a through-electrode 2 constituted by a through-hole 2' penetrating between the seat upper surface 1a and the seat lower surface 1b, and a through-electrode 2 surrounding the through-electrode 2 in a plan view annular shape and penetrating between the seat upper surface 1a and the seat lower surface 1b. It has a basic configuration including a through slit 3 , a vertical movement probe 4 separated from the sheet body through the through slit 3 , and a guide hole 5 surrounding the vertical movement probe 4 through the through slit 3 . .

As the insulating sheet 1', a sheet made of a known insulating material such as glass, ceramic, polyimide resin, rubber, or the like can be used, but a sheet made of quartz glass is preferably used. This is because the through slits 3, which will be described later, can be easily formed.

<<Structure of Through Silicon Via>>
The through electrode 2 is composed of a through hole 2' penetrating between the upper surface 1a and the lower surface 1b of the probe sheet 1. The inner surface of the upper opening 2a and the inner surface of the lower opening 2b, the upper opening 2a and the lower opening 2b are formed. A conductive metal layer is formed on the inner peripheral surface 2c between them by plating.

Therefore, for example, as shown in FIG. 3, a ball-shaped bump 11a of an IC package 11 is pressed into contact with the upper opening 2a of the through electrode 2, and a flat plate electrode 12a of the substrate 12 connected to an inspection device or the like is connected to the lower opening 2b. Electricity can be easily applied between the two by bringing them into contact with each other under pressure.

Preferably, as shown in FIGS. 1 and 2, the upper opening 2a of the through electrode 2 is formed in the shape of a truncated inverted cone and has a cocktail glass shape when viewed in cross section. In addition to absorbing variations, pressure contact can be achieved at an appropriate pressure. Furthermore, as shown in FIG. 6, the lower opening 2b is formed in the shape of a truncated cone so as to have an hourglass shape when viewed in cross section, so that the ball-shaped bump is appropriately brought into pressure contact with the lower opening 2b as well. The ball-shaped bumps 13a of the first member 13 are brought into pressure contact with the upper opening 2a, and the ball-shaped bumps 14a of the second member 14 are brought into pressure contact with the lower opening 2b, so that they can be utilized as an interposer. can be done.

The maximum opening diameter of both the upper opening 2a and the lower opening 2b is preferably set smaller than the diameter of the ball-shaped bump to be contacted. This is to prevent the ball-shaped bump from entering the through electrode 2 and to prevent the probe sheet 1 from coming into contact with a substrate such as an IC package.

In the present invention, when forming the upper opening 2a in the shape of an inverted truncated cone, as shown in FIGS. ), and as shown in FIG. Although not specifically illustrated, the lower opening 2b can be similarly shaped like a truncated cone or a truncated pyramid. In addition, the truncated triangular pyramid, the truncated inverted triangular pyramid, the truncated pentagonal pyramid, and the truncated inverted pentagonal pyramid, etc. It goes without saying that inverted polygonal pyramids are included.

<<Structure of vertical movement probe and guide hole>>
As shown in FIGS. 1 and 2, the vertical movement probe 4 is separated from the sheet body by the through slit 3, contains the through electrode 2, and has a first tapered surface 4a and a second tapered surface 4b on the side surface, It has a bulging corner portion 4c formed by the first and second tapered surfaces 4a and 4b.

In other words, the vertically movable probe 4 has a first tapered surface 4a inclined in a direction away from the inner peripheral surface 2c of the through electrode 2 as it goes downward from the upper end portion 4d, and a bulging corner portion 4c together with the first tapered surface 4a. , and has a second tapered surface 4b that slopes away from the inner peripheral surface 2c of the through electrode 2 as it goes upward from the lower end portion 4e. Therefore, the vertical movement probe 4 gradually expands in diameter downward from the upper end portion 4d by the first tapered surface 4a, and gradually expands in diameter upward from the lower end portion 4e by the second tapered surface 4b. The bulging corner portion 4c formed by the second tapered surfaces 4a and 4b exhibits a shape with the widest diameter.

As will be described later, the guide hole 5 is formed at the same time as the vertically movable probe 4 is formed when the through slit 3 is formed for separating the vertically movable probe 4 from the sheet body. Therefore, the side surface shape of the vertical movement probe 4 and the inner wall shape of the guide hole 5 are similar shapes.

The guide hole 5 surrounds the vertical movement probe 4 through the through slit 3, thereby holding the vertical movement probe 4 and allowing the vertical movement of the vertical movement probe 4 within the range of the vertical movement allowance of the through slit 3. . Therefore, the vertically movable probe 4 can press-contact with the ball-shaped bump with an appropriate contact pressure.

The guide hole 5 is composed of a third tapered surface 5a facing the first tapered surface 4a of the vertical movement probe 4 and a fourth tapered surface 5b facing the second tapered surface 4b of the vertical movement probe 4. The receiving corner portion 5c is provided on the inner wall, and by engaging the receiving corner portion 5c with the bulging corner portion 4c of the vertical movement probe 4, the vertical movement of the vertical movement probe 4 is prevented while allowing vertical movement.

Preferably, as shown in FIGS. 1 and 3, the receiving corner 5c of the guide hole 5 has an obtuse angle (internal corner angle) .theta. It can contribute to both smooth vertical movement. The angle θ can be appropriately adjusted according to the length of the stroke of the vertical motion allowance of the vertical motion probe 4 . Similarly, the angle (outer corner angle) .theta.' of the bulging corner portion 4c of the vertically movable probe 4 is also an obtuse angle and engages with the receiving corner portion 5c.

As described above, the vertical movement probe 4 has the first and second tapered surfaces 4a and 4b on the side surfaces to form the bulging corner portion 4c, and the guide hole 5 has the third and fourth tapered surfaces 5a and 5b on the inner wall. A receiving corner 5c is formed.

Therefore, the first and second tapered surfaces 4a and 4b are formed on the entire circumferential direction (entire circumference) of the side surface of the vertical movement probe 4 to form an annularly connected swollen corner portion 4c. If the third and fourth tapered surfaces 5a and 5b are formed over the entire circumference (entire circumference) to form the receiving corner portion 5c that is connected in a ring shape, the upper and lower sides can be vertically moved by the annular bulging corner portion 4c and the receiving corner portion 5c. Holding and vertical movement of the moving probe 4 can be further stabilized.

For example, the vertical movement probe 4 shown in FIGS. 1 and 2 has a shape in which the bottom surfaces of a truncated cone and an inverted truncated cone are butted against each other, and the side surface of the truncated cone is the first tapered surface 4a. At the same time, by forming the side surface of the inverted truncated cone as the second tapered surface 4b, it is possible to exhibit the overall shape as if it were an abacus ball, and to form the bulging corners 4c connected in an annular shape. The third and fourth tapered surfaces 5a and 5b of the guide hole 5 are formed corresponding to the first and second tapered surfaces 4a and 4b to form a receiving corner portion 5c connected in an annular shape. Therefore, smooth and stable vertical movement of the vertical movement probe 4 can be guaranteed.

In addition, in the present invention, when the bases of the truncated cone and the truncated inverted cone are butted against each other, the truncated cone is not limited to a cone, as shown in FIGS. Furthermore, similar effects can be obtained with a truncated pyramid, and the inverted truncated pyramid is not limited to an inverted truncated cone, and a similar effect can be obtained with an inverted truncated pyramid. Therefore, it is optional to match the bases of the truncated cone or truncated pyramid and the truncated inverted cone or truncated inverted pyramid by freely combining them. In addition, the truncated triangular pyramid, the truncated inverted triangular pyramid, the truncated pentagonal pyramid, and the truncated inverted pentagonal pyramid, etc. It goes without saying that inverted polygonal pyramids are included.

As shown in FIG. 3, the probe sheet 1 according to the present invention configured as described above can be used not only for burn-in testing of semiconductor components such as IC packages, but also as an interposer. The probe 4 can be properly pressure-contacted with the ball-shaped bump by the vertical movement allowance of the through slit 3, and since only the through slit 3 is formed without using a member other than the sheet such as an elastic member, it is extremely small. It is also possible to effectively deal with pitched ball-shaped bumps.

<Probe sheet manufacturing method>
A process for manufacturing a probe sheet according to the present invention will be described step by step.

≪Through-hole drilling process≫
In this process, an insulating sheet 1' as shown in FIG. 4A is provided with a sheet upper surface 1'a (the sheet upper surface 1a of the probe sheet 1) and a sheet lower surface 1'b as shown in FIG. 4B. (the lower surface 1b of the probe sheet 1). The through-holes 2', which ultimately constitute the through-electrode 2, are drilled by adjusting the number and pitch based on the arrangement and pitch of the ball-shaped bumps to be contacted by the through-electrode 2. FIG. In addition, as a drilling method, a known drilling method by laser or etching can be used.

Further, when the upper opening 2a of the through electrode 2, which will be described later, is formed in the shape of a truncated inverted cone, the upper opening 2'a of the through hole 2' is formed in this step. As for the lower opening 2b, the lower opening 2'b of the through-hole 2' is similarly processed in this step.

<<Through electrode formation process>>
In this step, the inner wall of the through hole 2', that is, the inner surface of the upper opening 2a of the through electrode 2, the inner surface of the lower opening 2b, and the subsequent inner peripheral surface 2c of the through electrode 2 are plated to form a metal layer to form the through electrode. 2 is formed. As the plating treatment, known electroplating treatment and electroless nickel plating treatment can be applied, and gold plating is applied to nickel under copper to utilize the high electrical conductivity of copper and the durability of gold. can apply.

Although plating may be applied only to the inner walls of the through holes 2', the through electrodes 2 can be efficiently formed by plating in the following manner according to the present invention.

That is, first, as shown in FIG. 5A, the entire exposed surface of the insulating sheet 1' in which the through-holes 2' are formed by the above-described through-hole forming process is plated to form a conductive metal. Create layer 2''.

By plating the entire exposed surface in this manner, the inner wall of the through hole 2', which is the exposed surface, that is, the inner surface of the upper opening 2a of the through electrode 2, the inner surface of the lower opening 2b, and the inner peripheral surface following these are formed. A metal layer 2'' is applied to 2c. However, although the entire exposed surface is connected by the metal layer 2'', only the portion of the through electrode 2 has an independent conducting path due to the through slit 3, which will be described later. Therefore, it is not necessary to plate each of the plurality of through-holes 2', and by plating the entire insulating sheet 1', all of the plurality of through-holes 2' are plated at once to form the through-electrodes 2. can be formed.

≪Through slit formation process≫
As shown in FIG. 5B, this step is a step of forming a through slit 3 that surrounds the above-described through electrode 2 in a ring shape in plan view and penetrates between the upper and lower surfaces of the sheet. As a forming method, a known laser cutting method or the like can be used.

In this step, the through slit 3 is formed, and at the same time, the vertically movable probe 4 separated from the sheet body by the through slit 3 and the guide hole 5 for holding the vertically movable probe 4 can be formed, as shown in FIG. Moreover, the probe sheet 1 according to the present invention can be completed. Further, in the step of forming the through electrode, when the entire exposed surface of the insulating sheet 1' is plated, the metal layer 2'' applied to the through electrode 2 becomes independent due to the through slit 3 and functions normally. It becomes the through electrode 2 .

In this step, the through slit 3 is carved from both the sheet upper surface 1a side and the sheet lower surface 1b side to form the first tapered surface 4a and the second tapered surface on the side surface of the vertically movable probe 4 simultaneously formed. A bulging corner 4c consisting of 4b can be provided. In addition, on the inner wall of the guide hole 5 formed at the same time, a receiving corner portion 5c composed of a third tapered surface 5a facing the first tapered surface 4a and a fourth tapered surface 5b facing the second tapered surface 4b can be easily formed. can be set to

In addition, the width of the through slit 3 can be appropriately adjusted according to the stroke of the desired vertical dynamic allowance.

In the method of manufacturing the probe sheet according to the present invention described above, the probe sheet provided with the probes 4 having the vertical motion allowance due to the through-slits 3 does not use any complicated processes or new members other than the insulating sheet 1'. 1 can be manufactured.

1'... insulating sheet, 1'a... upper surface of sheet, 1'b... lower surface of sheet,
DESCRIPTION OF SYMBOLS 1... Probe sheet, 1a... Upper surface of sheet, 1b... Lower surface of sheet,
2′ through hole 2′a upper opening 2′b lower opening 2″ metal layer
2... Through electrode, 2a... Upper opening, 2b... Lower opening, 2c... Inner peripheral surface,
3 ... through slit,
4... vertical movement probe, 4a... first tapered surface, 4b... second tapered surface, 4c... bulging corner part, 4d... upper end part, 4e... lower end part,
5... Guide hole, 5a... Third tapered surface, 5b... Fourth tapered surface, 5c... Receiving corner,
θ: the angle of the receiving corner, θ′: the angle of the bulging corner,
11... IC package, 11a... ball-shaped bump,
12... Substrate, 12a... Plate electrode,
13... First member, 13a... Ball-shaped bump,
14... Second member, 14a... Ball-shaped bump.

Claims (5)

a vertically movable probe containing a through-electrode penetrating between the upper and lower surfaces of a sheet; a guide hole surrounding and holding the vertically movable probe ; and a part of the guide hole comprising a side surface of the vertically movable probe and the guide. A through slit is provided between the inner walls of the hole and is circular in plan view and penetrates between the upper and lower surfaces of the seat. The guide hole has a receiving corner formed by a third tapered surface facing the first tapered surface and a fourth tapered surface facing the second tapered surface on the inner wall, and the receiving corner and the bulge A probe sheet according to claim 1, wherein corners prevent the vertically movable probe from slipping out of the guide hole, and the penetration slit allows the vertically movable probe to move vertically. 2. The probe sheet according to claim 1, wherein the angle of the receiving corner of said guide hole is an obtuse angle. The vertical movement probe has a shape in which the bottom surfaces of a truncated cone and an inverted truncated cone are butted against each other, and the side surface of the truncated cone is the first tapered surface, and the side surface of the inverted truncated cone. is the second tapered surface, the probe sheet according to claim 1 or 2. 4. The probe sheet according to claim 1, wherein said through electrodes have a circular or polygonal cross-sectional shape and a cocktail glass or hourglass vertical cross-sectional shape. forming a through-hole in an insulating sheet; forming a metal layer on the inner wall of the through-hole to form a through-electrode; By forming a penetrating slit through which the vertical movement probe containing the through electrode is provided separately from the sheet body and forming a side surface of the vertical movement probe, the through slit defines a guide hole for holding the vertical movement probe. and forming the inner wall of the guide hole, wherein the through slit to be present between the side surface of the vertical movement probe and the inner wall of the guide hole is formed by carving from both the upper surface side and the lower surface side of the sheet. By doing so, the side surface of the vertical movement probe is provided with a bulging corner portion composed of a first tapered surface and a second tapered surface, while the inner wall of the guide hole is provided with a third tapered surface facing the first tapered surface. A method of manufacturing a probe sheet, wherein a receiving corner is provided by a fourth tapered surface facing the second tapered surface.

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