JP7179175B2 - 複合材 - Google Patents
複合材 Download PDFInfo
- Publication number
- JP7179175B2 JP7179175B2 JP2021523541A JP2021523541A JP7179175B2 JP 7179175 B2 JP7179175 B2 JP 7179175B2 JP 2021523541 A JP2021523541 A JP 2021523541A JP 2021523541 A JP2021523541 A JP 2021523541A JP 7179175 B2 JP7179175 B2 JP 7179175B2
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- JP
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- Prior art keywords
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- metal foam
- metal
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- Prior art date
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- 239000002131 composite material Substances 0.000 title claims description 108
- 239000006262 metallic foam Substances 0.000 claims description 237
- 239000010410 layer Substances 0.000 claims description 112
- 229910052751 metal Inorganic materials 0.000 claims description 89
- 239000002184 metal Substances 0.000 claims description 89
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 33
- 239000000126 substance Substances 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 239000010949 copper Substances 0.000 claims description 17
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 229910000676 Si alloy Inorganic materials 0.000 claims description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 229910052742 iron Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 4
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 229910001257 Nb alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052791 calcium Inorganic materials 0.000 claims description 4
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 4
- 239000010955 niobium Substances 0.000 claims description 4
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- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
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- 239000004925 Acrylic resin Substances 0.000 claims description 2
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- 229910002804 graphite Inorganic materials 0.000 claims description 2
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- 239000010703 silicon Substances 0.000 claims description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 1
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- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 4
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- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
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- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Description
本出願は、2018年9月28日に提出された韓国特許出願第10-2018-0116436号及び韓国特許出願第10-2018-0116435号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示されたすべての内容は本明細書の一部として組み込まれる。
第1領域の金属フォームの製造
平均粒径(D50粒径)が約10μm未満レベルである銅(Cu)粉末を金属成分で用いた。分散剤としてエチレングリコール(EG)及びバインダーとしてエチルセルロース(EC)が4:5の重量割合(EG:EC)で混合された混合物に、前記銅粉末を前記バインダーと銅粉末が約10:1の重量割合(Cu:EC)になるように混合してスラリーを製造した。前記スラリーをフィルム形態でコーティングし、約120℃で約1時間の間乾燥して金属フォーム前駆体を形成した。このとき、コーティングされた金属フォーム前駆体の厚さは、約90μm程度であった。前記前駆体が水素/アルゴンガス雰囲気の約1000℃の温度で2時間の間維持されるように電気炉で外部熱源を印加して焼結を進行し、厚さが約25μm程度である銅フォームを製造した。製造されたシート形態の銅フォームの最大気孔サイズは、約25μm未満レベルであった。
鉄とニッケルの合金(Fe/Ni=1/4、重量比)粉末を適用して第2領域の金属フォームを製造した。前記合金粉末の平均粒径(D50)は、約7μm程度であった。前記合金粉末とポリ酢酸ビニルを3:2の重量割合(合金粉末:ポリ酢酸ビニル)で混合してスラリーを形成した。前記スラリーをフィルム形態でコーティングし、約1,000℃で約1時間の間乾燥して金属フォーム前駆体を形成した。このとき、コーティングされた金属フォーム前駆体の厚さは、約200μm程度であった。前記前駆体が水素/アルゴンガス雰囲気の約1000℃の温度で2時間の間維持されるように電気炉で外部熱源を印加して焼結を進行し、厚さが約80μm程度である金属フォームを製造した。製造されたシート形態の金属フォームの最大気孔サイズは、約10μmレベルであった。
上記製造された銅金属フォームと鉄とニッケルの合金金属フォームを一般的な接着フィルムで積層して複合材を製造した。
第1領域の銅金属フォームの製造時に、最終金属フォームの厚さが70μm程度になるようにしたこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ25μm未満)。また、第2領域の金属フォームの製造時に、ポリ酢酸ビニルの代わりにエチルセルロースを適用し、最終金属フォームの厚さが95μm程度になるようにしたこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ10μmレベル)。前記第1及び第2領域の金属フォームを実施例1と同一の方式で付着して複合材を製造した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の銅金属フォームの製造時に、最終金属フォームの厚さが100μm程度になるように変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ15μm未満)。また、第2領域の金属フォームの製造時に、厚さを40μm程度に変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ10μmレベル)。前記第1及び第2領域の金属フォームを実施例1と同一の方式で付着して複合材を製造した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の銅金属フォームの製造時に、最終金属フォームの厚さが70μm程度になるように変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ25μm未満)。また、第2領域の金属フォームの製造時に、金属合金粉末として、鉄とニッケルの1/3(Fe/Ni重量比)合金粉末(平均粒径(D50粒径):9μm)を適用し、最終金属フォームの厚さが40μm程度になるように変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ10μmレベル)。前記第1及び第2領域の金属フォームを実施例1と同一の方式で付着して複合材を製造した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の銅金属フォームの製造時に、最終金属フォームの厚さが70μm程度になるように変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ25μm未満)。また、第2領域の金属フォームの製造時に、金属合金粉末として、鉄とニッケルの1/4(Fe/Ni重量比)合金粉末(平均粒径(D50粒径):7μm)を適用し、最終金属フォームの厚さが100μm程度になるように変更したこと以外は、実施例1と同一に金属フォームを製造した(最大気孔サイズ10μmレベル)。前記第1及び第2領域の金属フォームを実施例1と同一の方式で付着して複合材を製造した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の金属フォームの製造時に、銅粉末の代わりに類似な平均粒径のアルミニウム粉末を適用し、最終金属フォームの厚さが70μm程度になるように変更したこと以外は、実施例1と同一にして第1領域の金属フォームを製造した(最大気孔サイズ10μm未満)。また、第2領域の金属フォームの製造時に、最終金属フォームの厚さを40μm程度に変更したこと以外は、実施例1と同一にして第2領域の金属フォームを製造した(最大気孔サイズ10μmレベル)。前記第1及び第2領域の金属フォームを実施例1と同一の方式で付着して複合材を製造した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
伝導性物質含有層である粘着剤層を適用して複合材を製造した。伝導性粘着剤は、一般的なアクリル系粘着剤に伝導性物質としてCNT(カーボンナノチューブ)粉末(DP50~10μm)を導入して製造した。前記粘着剤のベース樹脂であるアクリル系樹脂100重量部に対して、約100重量部の前記伝導性物質を配合して伝導性粘着剤を製造した。2枚の離型フィルムの間に前記伝導性粘着剤層を形成した後、複合材への適用時には、前記離型フィルムのうち一枚の離型フィルムを剥離し、剥離により現れた粘着剤層の表面を目的とする複合材の表面に適用した後、他の離型フィルムを剥離して適用した。
第1領域の金属フォームとして実施例2の金属フォームを用い、第2領域の金属フォームとして実施例2の金属フォームを適用したこと以外は、実施例7と同一に複合材の構造を形成した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の金属フォームとして実施例3の金属フォームを用い、第2領域の金属フォームとして実施例3の金属フォームを適用したこと以外は、実施例7と同一に複合材の構造を形成した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の金属フォームとして実施例4の金属フォームを用い、第2領域の金属フォームとして実施例4の金属フォームを適用したこと以外は、実施例7と同一に複合材の構造を形成した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の金属フォームとして実施例5の金属フォームを用い、第2領域の金属フォームとして実施例5の金属フォームを適用したこと以外は、実施例7と同一に複合材の構造を形成した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
第1領域の金属フォームとして実施例6の金属フォームを用い、第2領域の金属フォームとして実施例6の金属フォームを適用したこと以外は、実施例7と同一に複合材の構造を形成した。前記複合材の遮蔽効率は、50kHz~3GHzの範囲で約90dB超過であり、透磁率は、50kHz~300kHzで約100超過であった。
20 第2領域の金属フォーム層
30 伝導性物質含有層
Claims (12)
- 20℃での伝導度が8MS/m以上である伝導性金属成分を有する金属フォームで形成される第1領域と、軟磁性金属成分を有する金属フォームで形成される第2領域と、を含み、
前記伝導性金属成分は、銀、銅、金、アルミニウム、カルシウム、タングステン、亜鉛、リチウム、白金、スズ、鉛、チタン、マンガン、マグネシウム、及びクロムからなる群より選択された一種以上の金属であり、
前記第1領域の金属フォームの気孔度と前記第2領域の金属フォームの気孔度がそれぞれ50%以上99%以下であり、
前記第1領域の金属フォームと前記第2領域の金属フォームがそれぞれ金属を55重量%以上含む多孔性構造体を意味し、
前記第1領域と前記第2領域はそれぞれ金属フォーム層であり、前記第1領域の金属フォーム層と前記第2領域の金属フォーム層が互いに積層されている、複合材。 - 前記軟磁性金属成分がFe/Ni合金、Fe/Ni/Mo合金、Fe/Al/Si合金、Fe/Si/B合金、Fe/Si/Nb合金、Fe/Si/Cu合金、又はFe/Si/B/Nb/Cu合金である、請求項1に記載の複合材。
- 前記第1領域の金属フォーム層及び前記第2領域の金属フォーム層の合計厚さが10μm~2mmの範囲内である、請求項1に記載の複合材。
- 前記第1領域の金属フォーム層の厚さ(T1)及び前記第2領域の金属フォーム層の厚さ(T2)の割合(T2/T1)は、0.2~10の範囲内である、請求項3に記載の複合材。
- 前記第1領域の金属フォーム層と前記第2領域の金属フォーム層との間に存在する粘着剤層又は接着剤層をさらに含む、請求項1に記載の複合材。
- 伝導性物質含有層をさらに含み、前記伝導性物質含有層は、ベース樹脂として、アクリル樹脂、エポキシ樹脂、シリコン樹脂又はウレタン樹脂を含み、前記第1領域の金属フォームと前記第2領域の金属フォームは、互いに積層されており、前記伝導性物質含有層は、前記第1領域の金属フォーム又は前記第2領域の金属フォーム上に存在する、請求項1に記載の複合材。
- 前記第1領域の金属フォームと前記第2領域の金属フォームは、互いに交差した状態に積層されており、前記伝導性物質含有層は、前記第1領域の金属フォームの前記第2領域の金属フォームと対向する表面のうち前記第2領域の金属フォームと重畳されない表面又は前記第2領域の金属フォームの前記第1領域の金属フォームと対向する表面のうち前記第1領域の金属フォームと重畳されない表面に形成されている、請求項6に記載の複合材。
- 前記伝導性物質含有層の伝導性物質は、黒鉛、カーボンブラック、カーボンファイバー、カーボンナノチューブ、ニッケル、鉄、コバルト、銀、銅、金、アルミニウム、カルシウム、タングステン、亜鉛、リチウム、白金、スズ、鉛、チタン、マンガン、マグネシウム又はクロムである、請求項6に記載の複合材。
- 前記伝導性物質含有層は、粘着剤層又は接着剤層である、請求項6に記載の複合材。
- 前記伝導性物質含有層の伝導性物質は、ベース樹脂100重量部に対して、30~200重量部の割合で伝導性物質含有層に含まれている、請求項6に記載の複合材。
- 2個以上の請求項6に記載の複合材が該複合材内の伝導性物質含有層を媒介として組み合わされている、複合材構造体。
- 単一複合材の第1領域の金属フォームと第2領域の金属フォームは、互いに交差した状態に積層されており、前記単一複合材内で伝導性物質含有層は、第1領域の金属フォームの第2領域の金属フォームと対向する表面のうち前記第2領域の金属フォームと重畳されない表面又は第2領域の金属フォームの第1領域の金属フォームと対向する表面のうち前記第1領域の金属フォームと重畳されない表面に形成されており、複数の複合材は、前記伝導性物質含有層を媒介として一つの複合材の第1領域の金属フォームと他の複合材の第2領域の金属フォームが重畳されるように組み合わされている、請求項11に記載の複合材構造体。
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