JP7176536B2 - 接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 - Google Patents
接着剤組成物、フィルム状接着剤、接着シート、及び半導体装置の製造方法 Download PDFInfo
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- JP7176536B2 JP7176536B2 JP2019568439A JP2019568439A JP7176536B2 JP 7176536 B2 JP7176536 B2 JP 7176536B2 JP 2019568439 A JP2019568439 A JP 2019568439A JP 2019568439 A JP2019568439 A JP 2019568439A JP 7176536 B2 JP7176536 B2 JP 7176536B2
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---|---|---|---|---|
JP2007302881A (ja) | 2006-04-11 | 2007-11-22 | Hitachi Chem Co Ltd | 接着剤組成物及び接着シート |
JP2012214526A (ja) | 2011-03-28 | 2012-11-08 | Hitachi Chemical Co Ltd | フィルム状接着剤、接着シート及び半導体装置 |
JP2013060524A (ja) | 2011-09-13 | 2013-04-04 | Hitachi Chemical Co Ltd | フィルム状接着剤、接着シート、半導体装置及びその製造方法 |
JP2014175459A (ja) | 2013-03-08 | 2014-09-22 | Hitachi Chemical Co Ltd | 半導体装置及び半導体装置の製造方法 |
JP2015122425A (ja) | 2013-12-24 | 2015-07-02 | 日東電工株式会社 | 半導体装置の製造方法、半導体装置、包埋用接着フィルム、及びダイシング・ダイボンドフィルム |
JP2016216562A (ja) | 2015-05-18 | 2016-12-22 | 日東電工株式会社 | 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101016402A (zh) * | 2003-01-07 | 2007-08-15 | 积水化学工业株式会社 | 固化性树脂组合物、粘接性环氧树脂膏、粘接性环氧树脂薄片、导电连接膏、导电连接薄片和电子器件接合体 |
JP4668001B2 (ja) | 2005-08-18 | 2011-04-13 | リンテック株式会社 | ダイシング・ダイボンド兼用シートおよびこれを用いた半導体装置の製造方法 |
US8692394B2 (en) * | 2009-09-30 | 2014-04-08 | Sekisui Chemical Co., Ltd. | Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device |
TWI564361B (zh) * | 2009-10-16 | 2017-01-01 | Lg化學股份有限公司 | 晶粒接附膜 |
JP4922474B2 (ja) * | 2010-04-13 | 2012-04-25 | 積水化学工業株式会社 | 半導体装置 |
WO2014024849A1 (ja) * | 2012-08-06 | 2014-02-13 | 積水化学工業株式会社 | 半導体装置の製造方法及びフリップチップ実装用接着剤 |
KR101850592B1 (ko) * | 2013-01-23 | 2018-04-19 | 헨켈 아이피 앤드 홀딩 게엠베하 | 언더필 조성물 및 이를 사용하는 패키징 방법 |
JP5991335B2 (ja) | 2013-03-07 | 2016-09-14 | 住友ベークライト株式会社 | 接着フィルム、ダイシングシート一体型接着フィルム、バックグラインドテープ一体型接着フィルム、バックグラインドテープ兼ダイシングシート一体型接着フィルム、積層体、積層体の硬化物、および半導体装置、並び半導体装置の製造方法 |
CN105308730A (zh) * | 2013-08-22 | 2016-02-03 | 积水化学工业株式会社 | 半导体用粘接剂 |
JP6223155B2 (ja) | 2013-11-29 | 2017-11-01 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 接着剤層用塗布組成物、半導体用接着フィルムおよびその製造方法、ならびに、これを用いた半導体装置の製造方法 |
JP6364187B2 (ja) * | 2013-12-19 | 2018-07-25 | 新日鉄住金化学株式会社 | 光学用エポキシ樹脂組成物およびその硬化物 |
JP6310748B2 (ja) | 2014-03-31 | 2018-04-11 | 日東電工株式会社 | ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法 |
JP6274306B2 (ja) * | 2014-03-31 | 2018-02-07 | 荒川化学工業株式会社 | プリント配線板用接着剤組成物、積層板およびフレキシブルプリント配線板 |
WO2016194952A1 (ja) * | 2015-06-02 | 2016-12-08 | デクセリアルズ株式会社 | 接着剤組成物 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007302881A (ja) | 2006-04-11 | 2007-11-22 | Hitachi Chem Co Ltd | 接着剤組成物及び接着シート |
JP2012214526A (ja) | 2011-03-28 | 2012-11-08 | Hitachi Chemical Co Ltd | フィルム状接着剤、接着シート及び半導体装置 |
JP2013060524A (ja) | 2011-09-13 | 2013-04-04 | Hitachi Chemical Co Ltd | フィルム状接着剤、接着シート、半導体装置及びその製造方法 |
JP2014175459A (ja) | 2013-03-08 | 2014-09-22 | Hitachi Chemical Co Ltd | 半導体装置及び半導体装置の製造方法 |
JP2015122425A (ja) | 2013-12-24 | 2015-07-02 | 日東電工株式会社 | 半導体装置の製造方法、半導体装置、包埋用接着フィルム、及びダイシング・ダイボンドフィルム |
JP2016216562A (ja) | 2015-05-18 | 2016-12-22 | 日東電工株式会社 | 接着フィルム、ダイシングテープ一体型接着フィルム、複層フィルム、半導体装置の製造方法および半導体装置 |
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