JP7172580B2 - Manufacturing method of cylindrical sputtering target - Google Patents

Description

The present invention relates to a method for manufacturing a cylindrical sputtering target used in a sputtering apparatus.

A sputtering apparatus that performs sputtering while rotating a cylindrical sputtering target is known. A cylindrical sputtering target used in this type of sputtering apparatus has an inner peripheral surface of a cylindrical target material joined to an outer peripheral surface of a cylindrical backing tube, as disclosed in Patent Document 1.
In this bonding, a surface treatment bonding material that is the same as or similar to the bonding material is applied to the outer peripheral surface of the cylindrical backing tube and the inner peripheral surface of the cylindrical target material, which are the bonding surfaces, to form a surface treatment coating. A cylindrical backing tube is inserted into the target material to provide a gap for the joint between the two, the target material and the cylindrical backing tube are kept in a heated state, and a molten bonding material is poured into the gap. A joining method is known in which the supply is performed to fill the gap. Indium (In) is often used as the bonding material.

In this case, the surfaces of the target material and the surface treatment bonding material of the cylindrical backing tube are cooled after the surface treatment and reheated before bonding to fill the gap between the two with the bonding material. An oxide film is formed.
The formation of an oxide film on the surface of the bonding material for surface treatment hinders contact between the bonding material to be filled and the bonding material for surface treatment, which tends to cause defective bonding. A poorly bonded cylindrical sputtering target needs to be entirely heated to melt the bonding material, remove the target material from the backing tube, and perform bonding again. On the other hand, as the size of the substrate to be sputtered has increased, the target material has become longer, and from the viewpoint of improving production efficiency, there is a tendency to increase the power density during sputtering film formation, and there is also a desire to improve the bonding strength. there is

As a countermeasure, for example, in Patent Document 2, after filling the gap between the cylindrical target material and the cylindrical backing tube with a molten bonding material, a steel wire or steel plate is inserted and the bonding material is filled between them. is disclosed to agitate and integrate the filled bonding material and the surface treatment bonding material.
In Patent Document 3, a powder material having a specific gravity lighter than that of a solder material, which is a bonding material, is placed in a space between a cylindrical target material and a cylindrical backing tube, and then molten solder is injected into the space to obtain a powder material. is floating on the liquid surface of the solder material, and the solder material is physically agitated by injecting the powder material while vibrating it.
In Patent Document 4, a solid bonding material is filled in the gap between the cylindrical target material and the cylindrical backing tube, and the bonding material is heated and melted to reduce the contact area between the surface to be treated and the atmosphere. , suppresses the generation of an oxide film on the undercoating surfaces of the target material and the cylindrical backing tube.

JP 2014-37619 A Japanese Patent No. 6341146 JP 2012-177156 A Japanese Patent Application Laid-Open No. 2018-111868

However, in the case of Patent Document 2, it takes time and effort to stir the bonding material. Moreover, in order to remove the oxide film of the applied bonding material over the entire surface, it is necessary to stir the entire gap between the target material and the backing tube. is high.
The same is true for Patent Document 3. A vibration source for vibrating the powder substance is required as a separate device, and if the solder material is not sufficiently agitated by the vibration of the powder substance, it may lead to poor bonding. There is
In the manufacturing method of Patent Document 4, if an oxide film adheres to the outer peripheral surface of the solid bonding material and the inner and outer peripheral surfaces of the target material and the backing tube before bonding, it becomes difficult to avoid defective bonding. Therefore, before placing the target material in the backing tube, it is necessary to remove the oxide film formed on the surface of the bonding material, the target material, and the inner and outer peripheral surfaces of the backing tube.

In view of such circumstances, the present invention prevents the occurrence of defective bonding due to an oxide film on the surface of a bonding material that has undergone surface treatment, without requiring a separate special step for removing the oxide film, thereby improving yield. It is intended to

In the method for manufacturing a cylindrical sputtering target of the present invention, a cylindrical sputtering target is bonded by filling a gap between a cylindrical target material and an outer peripheral surface of a cylindrical backing tube inserted inside the cylindrical target material with a bonding material. 3, wherein a surface treatment step of applying a surface treatment bonding material to at least one of the inner peripheral surface of the target material and the outer peripheral surface of the backing tube to form a surface treatment layer; and a surface treatment step. After that, a bonding step of inserting the backing tube into the target material and filling a gap between the target material and the backing tube with a filling bonding material, and in this bonding step, the target material or the Either or both of the backing tubes are provided along the circumferential direction with a scraping plate that can be arranged so as to protrude in the radial direction in the gap, and the surface of the undercoating layer is heated to at least a semi-molten state. Then, the backing tube is inserted into the target material while scraping off the oxide film formed on the surface of the undercoating layer with the scraping plate.

In this manufacturing method, the surface of the surface treatment layer formed in the surface treatment process is oxidized during cooling after the application of the surface treatment bonding material and during reheating in the bonding process to form an oxide film. On the other hand, since the surface of the base treatment layer is at least semi-molten during the bonding process and the oxide film on the surface of the base treatment layer is removed by a scraping plate, the newly filled bonding material and the base treatment bonding The integration with the material is not hindered by the oxide film and can be firmly joined. Moreover, since the oxide film can be removed by the operation of inserting the backing tube into the target material, the oxide film can be reliably removed without requiring a separate special treatment process for removing the oxide film, and the work is easy. is.

As one embodiment of the method for manufacturing a cylindrical sputtering target, the target material is divided in the length direction by a plurality of divided target materials, and a plate-shaped annular spacer is provided between the divided target materials, The inner peripheral portion of the annular spacer protrudes radially inward to form the scraping plate, and when the backing tube is inserted into the target material, the inner peripheral portion of the annular spacer scrapes the backing tube. It is preferable to scrape off the oxide film of the undercoating layer on the outer peripheral surface of the substrate.

When a long target material is composed of a plurality of divided target materials, an annular spacer is provided between the divided target materials to prevent the outflow of the bonding material. This annular spacer can be used as a scraping plate. , the oxide film can be removed more easily, and the oxide film can be removed efficiently.

As another embodiment of the method for manufacturing a cylindrical sputtering target, the scraping plate may be provided at the end of the target material on the side into which the backing tube is inserted.
When the backing tube is inserted into the target material, the scraping plate at the end of the target material can scrape off the oxide film of the surface treatment layer on the outer peripheral surface of the backing tube. can be removed.

As still another embodiment of the method for manufacturing a cylindrical sputtering target, the scraping plate is provided at the end of the backing tube on the side to be inserted into the target material, and the backing tube is inserted into the target material. At this time, the outer peripheral portion of the scraping plate may scrape off the oxide film of the underlying treatment layer on the inner peripheral surface of the target material.
When the backing tube is inserted into the target material, the scraping plate at the end of the backing tube can scrape off the oxide film of the underlying treatment layer on the inner peripheral surface of the target material. The oxide film can be removed.

As still another embodiment of the method for manufacturing a cylindrical sputtering target, it is preferable to form a hole or a notch through which the filler bonding material can pass in the scraping plate.
As a result, when the scraping plate is arranged in the gap between the target material and the backing tube during the process of bonding the target material and the backing tube, the flow path of the bonding material is secured by the hole or the notch. It is possible to reliably fill the entire gap with the bonding material through the hole and the notch.

According to the present invention, the oxide film can be scraped off by the operation of inserting the backing tube into the target material without requiring a separate step of removing the oxide film. can be prevented and the yield can be improved.

It is a longitudinal cross-sectional view showing an example of a cylindrical sputtering target. 4 is a flow chart illustrating an example of a method for manufacturing a cylindrical sputtering target; It is a longitudinal section showing a state in the middle of manufacture in a manufacturing method of a 1st embodiment. FIG. 4 is a longitudinal sectional view showing a state in which the backing tube of FIG. 3 is lowered; It is a top view which shows a scraping board. It is a longitudinal cross-sectional view showing a state in the middle of manufacturing in the manufacturing method of the second embodiment. It is a longitudinal section showing a state in the middle of manufacture in a manufacturing method of a 3rd embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of a method for manufacturing a cylindrical sputtering target according to the present invention will be described below with reference to the drawings.
A cylindrical sputtering target 1, for example, as shown in FIG. are joined via the joining portion 4. In this case, the target material 2 and the backing tube 3 are arranged with their central axes aligned.

Since the target material 2 is elongated, it is generally constructed by connecting a plurality of divided target materials 2a divided in the length direction.

The material and dimensions of the target material 2 and the backing tube 3 are not particularly limited. A cylindrical member of 120 mm to 140 mm can be used, and the backing tube 3 is made of titanium, stainless steel, copper or copper alloy, and has an outer diameter of 119 mm to 139 mm and a length of 0.5 m to 4 m. can be done. In this case, the target material 2 is arranged on the outer circumference of the cylindrical backing tube 3 in a state in which a plurality of short divided target materials 2a having a length of about 30 cm are connected. When the backing tube 3 is inserted into the target material 2, a gap of about 0.5 mm to 1 mm is formed in the radial direction between the outer peripheral surfaces of the two. A spacer (not shown) may be inserted. In this case, the target material 2 and the backing tube 3 are integrated together with the rod-like spacer at the joint 4 .

For example, an indium alloy or pure indium having an indium content of 60% by mass or more, a tin alloy or pure tin having a tin content of 60% by mass or more, or the like is used for the joint portion 4 . The joint portion 4 is composed of a surface treatment joint material applied to the target material 2 and the backing tube 3, and a filling joint material filled in the gap between them, and is provided by integrating and solidifying these.

<Manufacturing method of cylindrical sputtering target>
A first embodiment of a method for manufacturing the cylindrical sputtering target 1 will be described. In this manufacturing method, the outer peripheral surface of the cylindrical backing tube 1 and the inner peripheral surface of the target material 2 are used as bonding surfaces, and the bonding material provided between these bonding surfaces is used for bonding.
As shown in FIG. 2, in the first embodiment, the heating step of the target material 2 and the backing tube 3, the surface treatment step of applying the surface treatment bonding material to the target material 2 and the backing tube 3, and the surface treatment bonding material applied are applied. A surface treatment bonding material cooling step that cools and solidifies, a reheating step that reheats the solidified surface treatment bonding material, and a bonding material filling step that fills the gap between the target material 2 and the backing tube 3 with a filling bonding material (bonding step), and a bonding material cooling step of cooling and solidifying the filled bonding material. The order of steps will be described below.

(Heating process)
The target material 2 and the backing tube 3 are heated, and the inner peripheral surface of the target material 2 and the outer peripheral surface of the backing tube 3, which serve as bonding surfaces, are heated to a temperature equal to or higher than the melting point (or liquidus temperature) of the surface treatment bonding material. do.

(Surface treatment process)
In the heating step, the melted surface treatment bonding material is applied to the inner peripheral surface of the heated target material 2 and the outer peripheral surface of the backing tube 3 to form the surface treatment layers 41a and 41b, respectively. In this case, by applying ultrasonic vibrations with an ultrasonic soldering iron (not shown) equipped with a heater to apply the surface treatment bonding material, dirt and oxidation on the inner peripheral surface of the target material 2 and the outer peripheral surface of the backing tube 3 are removed. The removal of the film and the like is promoted, and the surface treatment bonding material can be applied to these surfaces.
The surface treatment process may be performed in the air, but if it is performed in an inert atmosphere such as argon or nitrogen, oxidation of the surfaces of the surface treatment layers 41a and 41b formed by the bonding material for surface treatment can be suppressed. Therefore, it is desirable to carry out in such an atmosphere.

(Surface treatment bonding material cooling process)
The surface treatment bonding material cooling step is performed by appropriate cooling means after the surface treatment step. As a result, the surface treatment bonding material is solidified, and surface treatment layers 41 a and 41 b are formed on the inner peripheral surface of the target material 2 and the outer peripheral surface of the backing tube 3 . Then, the oxide film 42 is formed through the next reheating process.
In this embodiment and a second embodiment, which will be described later, the oxide film is not removed from the target material 2 by using a scraping plate. It is better to keep For example, the base treatment layer 41a of the backing tube 3 has a thickness of 10 μm to 50 μm, while the base treatment layer 41b of the target material 2 has a thickness of 100 μm to 800 μm.

(Reheating process)
The target material 2 having the surface treatment layer 41a formed thereon is vertically placed on the mounting table 11 shown in FIG. A concave portion 12 is provided on the surface of the mounting table 11 , and the target material 2 is arranged so as to surround this concave portion 12 . The lower end of the backing tube 3 is closed with a plug 6 to prevent the bonding material from entering the backing tube 3 .
The recess 12 is filled with the filling bonding material 40 in a molten state. As the filling bonding material 40, the same material as the surface treatment bonding material is used, and in this example, pure indium or an indium alloy is filled.
In this case, an annular spacer 5 is interposed between the divided target materials 2a that are connected vertically. The annular spacer 5 has the function of absorbing dimensional errors in the length direction of the split target materials 2a and the surface roughness of the end faces, and having the function of coaxially arranging these split target materials 2a, as well as the function of eliminating gaps between the split target materials 2a. It also has a function of a packing to close, and the divided target materials 2a can be accurately connected to each other in the length direction (height direction).
The annular spacer 5 is made of an elastic resin material or the like. In this embodiment, it is made of PTFE (polytetrafluoroethylene). is formed to have an inner diameter that is approximately the same as the outer diameter of the backing tube 3 (matched, slightly smaller or slightly larger), and functions as a scraping plate in the joining process described later. Since the annular spacer 5 is removed after the target material 2 and the backing tube 3 are joined, the outer diameter of the annular spacer 5 is set larger than the outer diameter of the target material 2 so that it can be easily removed.

Further, as shown in FIG. 5, the annular spacer (scraping plate) 5 is provided with a hole 51 and a notch 52 . These holes 51 and notches 52 allow the melted filling bonding material to flow through the holes 51 and notches 52 in the later-described bonding step. The holes 51 and the notches 52 may be provided in any shape other than the shape shown in FIG. Only one of 51 and notch 52 may be formed.
A saucer 7 is provided at the upper end of the target material 2 for receiving the filling bonding material 40 overflowing from the gap between the target material 2 and the backing tube 3 .
Then, as shown in FIG. 3, the backing tube 3 is coaxially arranged above the target material 2 and heated by a heater (not shown) arranged around the target material 2 . For example, by heating at 200° C. for 1 hour to 2 hours, the undercoating layers 41a and 41b are melted or at least semi-molten. As described above, since the surface treatment layer 41b of the target material 2 is formed thick, the oxide film 42 is likely to be destroyed by dripping down due to its own weight when melted.

(Bonding Material Filling Step (Bonding Step))
As shown in FIG. 3, the backing tube 3 is inserted from above the target material 2 into the inside of the target material 2 while maintaining a constant gap, and the lower end side of this backing tube 3 is inserted into the recess 12 of the mounting table 11. .
As shown in FIG. 4 , when the lower end of the backing tube 3 is inserted into the recess 12 , the inner peripheral surface of the target material 2 and the outer peripheral surface of the backing tube 3 are pushed out so that the molten bonding material 40 for filling is pushed out of the recess 13 . , and the filling bonding material 40 is filled between the inner peripheral surface of the target material 2 and the outer peripheral surface of the backing tube 3 .
The volume of the concave portion 12 of the mounting table 11 is the gap formed between the outer peripheral surface of the backing tube 3 and the inner peripheral surface of the target material 2 when the lower end of the backing tube 3 is inserted to the vicinity of the bottom surface. It is sufficient that the filling bonding material 40 rises in the gap and slightly overflows to the upper end side of the target material 2 .
In this case, it can be confirmed that the filling bonding material 40 is filled between the target material 2 and the backing tube 3 without gaps in a state where the filling bonding material 40 overflows the upper end receiving pan 7 of the target material 2 .

In this bonding process, the scraping plate 5 provided on the target material 2 has an inner diameter substantially equal to the outer diameter of the backing tube 3, so that when the backing tube 3 is inserted, the scraping plate 5 is The outer peripheral surface of the backing tube 3 is rubbed by the inner peripheral portion of the plate 5, and the oxide film 42 on the outer peripheral surface is scraped off. The scraped oxide film 42 is destroyed as a film, is pushed up by the filling bonding material 40 rising in the gap, and is discharged into the tray 7 . Moreover, even if a part of the oxide film 42 remains in the filling bonding material 40 , it is dispersed in the filling bonding material 40 and integrated into the gap to be filled.
On the other hand, on the outer peripheral surface of the backing tube 3 after the oxide film 42 has been removed by the scraping plate 5, the surface treatment layer 41b without the oxide film 42 remains thinly, and the filling bonding material 40 is deposited on this surface treatment layer 41b. Integrates evenly.

By inserting the lower end of the backing tube 3 to the vicinity of the bottom surface of the recess 12 in this way, the gap between the target material 2 and the backing tube 3 is filled with the filling bonding material 40 without any gap.
Although not necessarily limited, the reheating step and the bonding material filling step (at least until the filling is completed) are preferably performed in an inert atmosphere to suppress oxidation of the bonding material and prevent further bonding. It is possible to improve the strength.

(Bonding material cooling process)
After filling the gap between the target material 2 and the backing tube 3 with the filling bonding material 40 , the target material 2 and the backing tube 3 are integrated by the bonding portion 4 by cooling and solidifying.
After that, the cylindrical sputtering target 1 is obtained by removing the annular spacer 5, the saucer 7, the protruding bonding material, etc., and cleaning them. At this time, by removing the annular spacer 5, the thickness of the joining portion 4 is reduced in the portion where the annular spacer 5 was provided.

In the example shown in FIG. 3 and the like, the target material 2 is composed of three divided target materials 2a, and each annular spacer 5 between the divided target materials 2a functions as a scraping plate. is projected from the split target material 2a, but as a scraping plate, one of the annular spacers 5 has the same function as the scraping plate, and the other annular spacers have the same inner peripheral edge as the split target material 2a. Alternatively, the inner peripheral portions of all the annular spacers may protrude radially inward from the split target material 2a to function as scraping plates.

By the method described above, the annular spacer 5 is used as a scraping plate to scrape and destroy the oxide film 42 of the surface treatment bonding material 41b which is at least semi-molten on the outer peripheral surface of the backing tube 3 during the bonding process. , the gap between the backing tube 3 and the target material 2 is filled with the filling bonding material 40 . Therefore, the integration of the filling bonding material 40 and the surface treatment bonding material 41b is not hindered by the oxide film 42, and can be integrated while improving the bonding strength, resulting in a cylindrical sputtering target of excellent quality. 1 can be manufactured.
Moreover, the oxide film 42 can be removed by the operation of inserting the backing tube 3 into the target material 2, and the oxide film 42 can be efficiently removed without a special process.

FIG. 6 shows a state in the middle of manufacturing by the manufacturing method of the second embodiment of the present invention. In this embodiment and subsequent embodiments, the same parts as those in the above embodiment are denoted by the same reference numerals, and the description thereof is omitted. The same applies to the embodiment shown in FIG. 6 below.
In this embodiment, the receiving plate 71 at the upper end of the target material 2 (the end into which the backing tube 3 is inserted) is used as a scraping plate. That is, the inner peripheral portion of the receiving plate 71 protrudes radially inward, and the inner diameter thereof is formed to be approximately the same as the outer diameter of the backing tube 3 . When the backing tube 3 is inserted from above the target material 2, the scraping plate (receptacle) 71 is used to scrape off the oxide film 42 of the surface treatment layer 41b on the outer peripheral surface of the backing tube 3. . In this case, the tray 71 receives the filling bonding material 40 that has risen in the gap, and the oxide film 42 is scraped off by the inner peripheral portion of the tray 71 . Similar to the annular spacer 5 described above, the receiving plate 71 is provided with cuts and holes through which the filling bonding material 40 can pass. Since the oxide film 42 is scraped off by the receiving plate 71 , the scraped oxide film remains on the scraping plate 71 , and part of the oxide film is mixed in the gap between the target material 2 and the backing tube 3 . will be less.
In FIG. 6, the scraping plate 5 formed by the annular spacer between the divided target materials 2a of the first embodiment is also installed together with the receiving pan (scraping plate) 71 at the upper end. The oxide film 42 can be reliably removed by the scraping plates 5 and 71 of FIG.

FIG. 7 shows a state in the middle of manufacturing by the manufacturing method of the third embodiment of the present invention.
In the above-described first and second embodiments, the oxide film 42 of the undercoat layer 41a on the inner peripheral surface of the target material 2 is removed by making the undercoat layer 41a thicker and dripping down under its own weight during melting. However, in the third embodiment, the oxide film 42 is removed in the bonding process without increasing the thickness of the underlying layer 41a. That is, the scraping plate 8 is provided at the lower end of the backing tube 3 (the end on the side to be inserted into the target material 2 ), and when the backing tube 3 is inserted into the target material 2 , the outer peripheral portion of the scraping plate 8 The oxide film 42 of the underlying layer 41a on the inner peripheral surface of the target material 2 is scraped off.
In this case, the scraping plate 8 may be fixed to the stopper 6 described above. The scraping plate 8 is formed to have an outer diameter approximately the same as the inner diameter of the target material 2 (matched, slightly smaller or slightly larger).

The oxide film 42 scraped from the inner peripheral surface of the target material 2 by the scraping plate 8 flows into the recess 12 and mixes with the filling bonding material 40 filling the recess 12, but is destroyed as a film. Therefore, it is not formed into a film again.

Further, as shown in FIG. 6, by providing scraping plates 5 and 8 on both the target material 2 and the backing tube 3, the surface treatment layers 41a and 41b of both the target material 2 and the backing tube 3 can be removed. The oxide film 42 can be scraped off. In this case, the mutual scraping plates 5 and 8 are flexed elastically and overcome each other to prevent breakage while removing the oxide film 42 on the surface of the target material 2 and the backing tube 3 . can be done.

In the above-described embodiment, the surface treatment bonding material is applied to both the target material 2 and the backing tube 3, but if either surface is in a state where the filling bonding material 40 is easily wetted, that surface Application of the bonding material for surface treatment may be omitted. In other words, during the bonding process, the bonding material for surface treatment may be applied to at least one of the target material 2 and the backing tube 3 to form the surface treatment layer 11 .
In that case, the scraping plate may be provided on the target material 2 or the backing tube 3 on which the surface treatment layer is not formed.

An experiment was conducted to confirm the effect of the present invention. The materials listed in Table 1 were used for the target material and the backing tube, and those with and without the surface treatment bonding material were prepared. In addition, SIZ, which is the target species of Example 4, is an oxide sintered body of Si, In, and Zr, CuNi in Example 6 is an alloy of Cu and Ni, and CuCuO in Example 7 is Cu. , and CuO, and CuGa in Examples 8 to 11 and Comparative Example 2 is an alloy of Cu and Ga. As shown in Table 1, pure indium, a tin alloy, and pure tin were used as the bonding material for surface treatment. During surface treatment, heat with hot air until the surface temperature reaches 240°C to 260°C, apply the surface treatment bonding material in an air atmosphere, treat it using an ultrasonic soldering iron, and then cool to room temperature. did.
Then, a scraping plate was provided on either or both of the target material and the backing tube to bond them, and the bonding area ratio after bonding was measured. In this case, the target material is composed of three divided target materials, and an annular spacer made of PTFE (polytetrafluoroethylene) as a scraping plate is provided between these divided target materials. A scraping plate made of PTFE (polytetrafluoroethylene) was provided. In addition, the same bonding material for filling was used as the bonding material for surface treatment.
After bonding, the bonding area ratio was measured by an ultrasonic inspection device. The bonding area ratio is the ratio of the bonded area excluding defective bonding points to the total area of the bonding surface between the target material and the backing tube. A bonding area ratio of 90% or more can be regarded as acceptable.
Table 1 shows the results.

As can be seen from Table 1, the bonding area ratio was 90% or more in any of the examples in which a scraping plate was provided on either the target material or the backing tube for bonding. Among them, in Examples 1, 4 to 9, 12, and 13, in which the bonding material was applied as a base treatment to both the target material and the backing tube, and then a scraping plate was placed on both to bond, the bonding area ratio was It was particularly high (97.5% or more).
On the other hand, Comparative Examples 1 and 2, in which neither the target material nor the backing tube was provided with the scraping plate, had low bonding area ratios.

REFERENCE SIGNS LIST 1 Cylindrical sputtering target 2 Cylindrical target material 2a Divided target material 3 Cylindrical backing tube 4 Joint 40 Filling joint material 41a, 41b Surface treatment layer 5 Annular spacer (scraping plate)
51 hole 52 notch 6 plug 7 saucer 71 saucer (scraping plate)
8 scraping plate 11 mounting table 12 concave portion

Claims (5)

A method for manufacturing a cylindrical sputtering target in which a gap between a cylindrical target material and an outer peripheral surface of a cylindrical backing tube inserted inside the cylindrical target material is filled with a bonding material and bonded, wherein the target material is a surface treatment step of applying a surface treatment bonding material to at least one of the peripheral surface and the outer peripheral surface of the backing tube to form a surface treatment layer; and after the surface treatment step, the backing tube is placed in the target material. a bonding step of inserting the target material and filling the gap between the target material and the backing tube with a filling bonding material, and in this bonding process, the gap is filled in either or both of the target material and the backing tube. A scraping plate protruding in the radial direction is provided along the circumferential direction, and the surface of the surface treatment layer is heated to at least a semi-molten state. A method of manufacturing a cylindrical sputtering target, wherein the backing tube is inserted into the target material while scraping off an oxide film formed on the surface thereof. The target material is composed of a plurality of divided target materials obtained by dividing the target material in the length direction, and a plate-like annular spacer is provided between the divided target materials, and the inner peripheral portion of the annular spacer protrudes radially inward. and is formed as the scraping plate, and when the backing tube is inserted into the target material, the inner peripheral portion of the annular spacer scrapes the oxide film of the undercoating layer on the outer peripheral surface of the backing tube. 2. The method for manufacturing a cylindrical sputtering target according to claim 1, wherein the cylindrical sputtering target is taken. 3. The method of manufacturing a cylindrical sputtering target according to claim 1, wherein the scraping plate is provided at the end of the target material on the side where the backing tube is inserted. The scraping plate is provided at the end of the backing tube on the side to be inserted into the target material. 4. The method of manufacturing a cylindrical sputtering target according to any one of claims 1 to 3, wherein the oxide film of the undercoat layer on the peripheral surface is scraped off. 5. The method of manufacturing a cylindrical sputtering target according to claim 1, wherein the scraping plate is formed with a hole or a notch through which the filling bonding material can pass.

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