JP2015054323A - Microwave heating joining method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a microwave heating joining method in which local heating performance is good and a junction characteristic of a junction layer can be enhanced.SOLUTION: A microwave heating joining method according to an embodiment is a method for joining metal junction members 1, 2 by use of a microwave, and comprises: an arrangement process in which a microwave sensitive material 4 and a junction assistant 3 made of metal are arranged on at least parts of junction surfaces 11, 21 of the joint members 1, 2; a microwave radiation process in which a microwave is irradiated onto the microwave sensitive material 4 so as to generate a heat in the material 4 thereby melting the junction assistant 3; and a removal process in which the microwave sensitive material 4 is separated from the melted junction assistant 3.

Description

  Embodiments described herein relate generally to a heat bonding method using a microwave.

  In recent years, microwaves (sometimes used for narrower and wider ranges, but generally known as electromagnetic waves with a frequency of 300 MHz to 300 GHz) and millimeter waves (including 20 GHz to 20 GHz, including near millimeter waves with a frequency of 20 GHz to 30 GHz). An electromagnetic wave of ˜300 GHz (microwave is an electromagnetic wave in a range including millimeter waves) is used to heat and join a joining member such as a metal material or a ceramic material. In a bonding method using microwaves with a high frequency (millimeter wave region), the bonding surface of the bonding member is directly heated. At this time, the bonding member itself is also heated and the characteristics of the bonding member are likely to deteriorate. On the other hand, a bulk metal cannot be directly heated by a bonding method using a microwave having a low frequency (for example, a microwave of 2.45 GHz). For this reason, microwave sensitive materials such as metal nano-sized particles and dielectric ceramic particles are placed on the bonding surface, and the microwave-irradiated nano-sized particles and microwaves are arranged. There has been proposed a method of heating the joint surface using heat generated by the sensitive material.

  As a joining method using microwaves, for example, a method of heating by irradiating a millimeter wave to a joining surface on which dielectric particles or a microwave-sensitive material is directly arranged is known (see, for example, Patent Document 1). In addition, when only the heating part of the bonding surface is locally heated, a microwave-sensitive material is arranged in the heating part, and a heat insulating material is arranged outside the vicinity of the heating part of the bonding part to keep the heat and heat. There has also been proposed a method in which a metal cover having a high thermal conductivity is disposed in a portion off the portion. (For example, see Patent Document 2.)

  Also proposed is a method in which a microwave-sensitive material made of dielectric ceramic particles is added to metal particles such as brazing material and placed on the bonding surface, and the metal particles are melted by the heat generated by the microwave-sensitive material and bonded to the bonding member. Has been. (For example, refer to Patent Document 3.)

JP 2011-121096 A JP 2007-111709 A JP 2008-73767 A

  However, in the above-described method, the local heatability is low, the temperature of the joining member itself is increased, and the characteristics of the joining member are easily deteriorated. Moreover, since materials other than metals, such as a ceramic material, remain on the bonding surface, the bonding characteristics of the bonding layer are likely to deteriorate.

As described above, the conventional joining method using microwaves has a problem that the temperature of the joining member itself is likely to rise and the joining characteristics of the joining layer are likely to be lowered.
The problem to be solved by the present invention is to provide a microwave heating bonding method that is excellent in local heating property and can improve the bonding characteristics of the bonding layer.

  The microwave heating joining method of the embodiment is a joining method of metal joining members using microwaves, and a joining aid made of a microwave sensitive material and a metal is provided on at least a part of the joining surface of the joining member. An arrangement step of arranging, a microwave irradiation step of irradiating microwaves to generate heat by heating the microwave-sensitive material and melting the bonding aid, and removing to separate the microwave-sensitive material from the molten bonding aid And a process.

It is sectional drawing which shows roughly the conjugate | zygote obtained by the microwave heating joining method of 1st Embodiment. It is sectional drawing which shows schematically the paste-form mixture which concerns on 1st Embodiment. It is sectional drawing which shows roughly the foil-shaped mixture which concerns on 1st Embodiment. It is sectional drawing which shows the composite_body | complex which concerns on 1st Embodiment schematically. It is sectional drawing which shows schematically the other composite_body | complex which concerns on 1st Embodiment. It is sectional drawing which shows the mixture containing an active metal roughly. It is sectional drawing which shows the composite body of a microwave sensitive material and an active metal roughly. It is sectional drawing which shows schematically the mixture containing the composite of a microwave sensitive material and an active metal. It is process drawing which shows the microwave heating joining method which concerns on 1st Embodiment. It is sectional drawing which shows roughly an example of the arrangement | positioning process of the microwave heating joining method which concerns on 1st Embodiment. In 1st Embodiment, it is sectional drawing which shows roughly the other arrangement | positioning process which provided the opening part. It is sectional drawing which shows roughly the microwave irradiation process of the microwave heating joining method which concerns on 1st Embodiment. In 1st Embodiment, it is sectional drawing which shows roughly the microwave irradiation process using a temperature measuring apparatus. It is sectional drawing which shows roughly an example of the removal process of the microwave heating joining method which concerns on 1st Embodiment. In 1st Embodiment, it is sectional drawing which shows schematically the removal process using a pressurization apparatus. In 1st Embodiment, it is another sectional drawing which shows roughly the removal process using a pressurization apparatus. In 1st Embodiment, it is sectional drawing which shows roughly the removal process and cooling process using a cooling device. It is sectional drawing which shows roughly an example of the cooling process of the microwave heating joining method which concerns on 1st Embodiment. It is sectional drawing which shows roughly the arrangement | positioning process which concerns on 2nd Embodiment. It is sectional drawing which shows roughly the removal process which concerns on 2nd Embodiment. It is sectional drawing which shows roughly the cooling process which concerns on 2nd Embodiment. It is sectional drawing which shows roughly the foil-like mixture in which microwave sensitivity material concentration differs partially. It is sectional drawing which shows schematically the other foil-shaped mixture from which a microwave sensitive material density | concentration differs partially. It is sectional drawing which shows roughly the several foil-shaped mixture from which a microwave sensitive material density | concentration differs. It is sectional drawing which shows roughly the arrangement | positioning process using the mixture shown in FIG. FIG. 25 is a cross-sectional view schematically showing an arrangement process using the mixture shown in FIG. 24. It is sectional drawing which shows roughly the arrangement | positioning process using the mixture shown in FIG. It is sectional drawing which shows roughly the arrangement | positioning process which concerns on 4th Embodiment. It is sectional drawing which shows schematically the microwave irradiation process which concerns on 4th Embodiment. It is sectional drawing which shows roughly the cooling process which concerns on 4th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each figure, components having common functions are denoted by the same reference numerals, and redundant description is omitted.

(First embodiment)
FIG. 1 shows a joined body 100 obtained by the microwave heating joining method of the first embodiment. The joined body 100 includes a first joining member 1 and a second joining member 2 that are members to be joined, and a joining layer 5 that joins the first and second joining members 1 and 2.

  The first and second joining members 1 and 2 are both made of a metal material. These metal materials may be the same or different. The metal material is not particularly limited, and pure copper, copper alloy, Ni-base alloy, Fe-base alloy such as stainless steel and Cr steel, and the like can be used. Moreover, there is no limitation in particular also about the shape of the 1st and 2nd joining members 1 and 2, and rod shape, column shape, plate shape, polyhedron shape etc. are mentioned, Both shapes may be the same or different. . Further, the first and second joining members 1 and 2 may have the same or different volumes, or may have partially different volumes.

  The bonding layer 5 is formed by using a mixture containing the bonding aid 3 and the microwave sensitive material 4 and removing the microwave sensitive material 4 during bonding. The joining aid 3 is not particularly limited as long as it is a metal capable of joining the first and second joining members 1 and 2. As the bonding aid 3, for example, an element such as boron (B), tin (Zn), zinc (Sn), or phosphorus (P) is added to a metal such as silver (Ag), nickel (Ni), or copper (Cu). Thus, a brazing material having a composition corresponding to desired characteristics can be used while lowering the melting point. As the brazing material, silver brazing added with Cu, Zn, Sn, Cd, etc. to Ag, Ni-based brazing added with heat resistance and corrosion resistance by adding B, Cr, Si, Fe, C, etc. to Ni, Cu Examples thereof include phosphorous copper brazing added with P. The joining aid 3 can be appropriately selected and used depending on the type of metal material constituting the first and second joining members 1 and 2. Further, these brazing materials can be used in a desired shape such as powder, foil or rod.

  As a preferable combination of the materials of the first and second joining members 1 and 2 and the joining aid 3, for example, when both the first and second joining members 1 and 2 are pure copper, the joining aid 3 is used. When silver solder or phosphor copper solder having a relatively low brazing temperature is used and the first and second joining members 1 and 2 are both heat-resistant stainless steel (SUS304 or the like), the melting point is relatively high. It is preferable to use a high nickel-based braze. Further, when the first joining member 1 is pure copper and the second joining member 2 is stainless steel, it is preferable to use, for example, an Ag—Cu—Zn—Sn based silver solder.

As the microwave sensitive material 4, a material having high sensitivity to microwaves can be used without particular limitation. The microwave sensitive material 4 is preferably a material having high sensitivity to microwaves of 2 to 30 GHz. Examples of such materials include ceramic materials having a high dielectric constant, such as low-purity alumina (Al ₂ O ₃ ), silicon carbide (SiC), and silicon nitride (Si ₃ N ₄ ). Among these, SiC is preferably used because of its excellent microwave sensitivity. Further, the specific gravity of the microwave sensitive material 4 is preferably smaller than the specific gravity of the bonding aid 3 in order to facilitate separation from the molten bonding aid 3 when the bonding aid 3 is melted.

  The microwave sensitive material 4 is preferably in powder form. The powder shape of the microwave sensitive material 4 is not particularly limited, and may be various shapes such as a spherical shape, a plate shape, a polyhedral shape, a rod shape, and an indefinite shape, and two or more shapes may be mixed. . Among them, a spherical shape is preferable, and the particle size (physical conversion diameter measured by laser diffraction scattering method) is a laser diffraction particle size distribution measuring device (for example, SALD manufactured by Shimadzu Corporation) in order to prevent aggregation. -3100, SALD-2300, etc.), preferably 1 μm or more, more preferably 10 μm or more. Further, the particle diameter of the microwave sensitive material 4 is preferably 100 μm or less, more preferably 50 μm or less in order to easily separate from the bonded portion and to reduce the adverse effect on the bonded portion.

  The particle size of the microwave sensitive material 4 is preferably less than the thickness of the bonding layer 5, more preferably 50% or less of the thickness of the bonding layer 5, and even more preferably 10% or less. When the particle size of the microwave sensitive material 4 is 50% or less of the bonding layer 5, the bonding aid 3 easily penetrates into the gap between the microwave sensitive materials 4 between the bonding surfaces 11 and 21, and is 10% or less. This is because the microwave-sensitive material 4 is easily lifted and moved in the removing step, and is easily separated from the bonding aid 3.

  Next, the structure of the mixture will be described. FIG. 2 shows a mixture 61 in which the joining aid 3 and the microwave sensitive material 4 are in a paste form, and FIG. 3 shows a mixture in which the joining aid 3 and the microwave sensitive material 4 are mixed and rolled into a foil form. FIG. In addition, in the paste-like mixture 61, what contains the joining auxiliary material 3, the microwave sensitive material 4, and all other components is called the mixture 61.

  As a method of making the bonding aid 3 and the microwave sensitive material 4 into the paste-like mixture 61, for example, the paste auxiliary 7 and the flux are added to the bonding aid 3 and the microwave sensitive material 4 and mixed to form a paste-like mixture. There is a method to make the body 61. In this case, the bonding aid 3 is preferably in the form of a powder, and its particle size (physical conversion diameter measured by a laser diffraction scattering method) is laser diffraction to make the mixing with the microwave sensitive material 4 uniform. It is preferably 1 to 100 μm, and more preferably 10 to 50 μm, as measured by an equation particle size distribution measuring apparatus (for example, SALD-3100, SALD-2300 manufactured by Shimadzu Corporation).

  As a method of making the joining aid 3 and the microwave sensitive material 4 into the foil-like mixture 62, for example, there is a method of dispersing the microwave sensitive material 4 in the brazing foil made of the joining aid 3. The foil-like mixture 62 is coated, for example, by a method in which the microwave-sensitive material 4 is rolled between the brazing foil made of the bonding aid 3 or by spraying the microwave-sensitive material 4 on the brazing foil made of the bonding aid 3. Can be obtained by

  When the foil-like mixture 62 is used, it is preferable that the microwave sensitive material 4 is exposed on the surface of the mixture 62 from the viewpoint of microwave absorption. This can be achieved by etching the surface.

  The content of the microwave sensitive material 4 in the mixture 61, 62 is sufficient to secure a heat generation amount that sufficiently heats the bonding aid 3 and to reduce adverse effects on the bonding layer. The content is preferably 5 to 20% by mass, particularly preferably about 10 to 15% by mass with respect to the total mass of the wave-sensitive material 4.

  In this way, by using the mixtures 61 and 62, the joining aid 3 and the microwave sensitive material 4 are arranged in appropriate amounts at desired positions of the first and second joining members 1 and 2. Can do. The mode of the mixtures 61 and 62 can be appropriately selected and changed according to the shape and purpose of use of the first and second joining members 1 and 2.

  When the bonding aid 3 and the microwave sensitive material 4 are used as the paste-like mixture 61, the bonding aid 3 and the microwave sensitive material 4 may be used as individual particles as shown in FIG. The bonding aid 3 and the microwave sensitive material 4 may be used as a composite formed integrally. 4 and 5 are cross-sectional views showing the composites 81 and 82 made of the bonding aid 3 and the microwave sensitive material 4, respectively.

  A composite 81 shown in FIG. 4 is a composite in which the joining aid 3 and the microwave sensitive material 4 are joined. The composite 81 can be obtained by a method of plating the bonding aid 3 on the surface of the microwave sensitive material 4, a method of spraying the bonding aid 3, or the like.

  A composite 82 shown in FIG. 5 is a composite in which a film of the bonding aid 3 is formed on the surface of the microwave sensitive material 4. Similarly, the composite 82 can be obtained by a method of plating the bonding aid 3 on the surface of the microwave sensitive material 4, a method of spraying the bonding aid 3, and the like. In the composite 82, the microwave absorbability of the microwave sensitive material 4 can be improved by setting the thickness of the bonding aid 3 to 1 μm or less.

  The composite 82 is preferably formed such that a part of the microwave sensitive material 4 is exposed. Thereby, the microwave sensitive material 4 becomes easy to absorb a microwave. As a method of forming the composite 82 so that a part of the microwave sensitive material 4 is exposed, a method of etching a part of the surface of the composite 82 to expose a part of the microwave sensitive material 4 or a composite There is a method in which the microwave sensitive material 4 is arranged on the surfaces of 81 and 82, pressed, and pushed.

  The active metal 9 can be further dispersed in the mixture 61 and 62 of the bonding aid 3 and the microwave sensitive material 4. FIG. 6 shows a mixture 61 in which the active metal 9 is dispersed in the mixture 61. Thereby, the wettability with respect to the microwave sensitive material 4 of the joining aid 3 can be improved, the dispersibility of the microwave sensitive material 4 in a mixture can be improved, and the joining layer 5 by aggregation of the microwave sensitive material 4 can be improved. It is possible to suppress the deterioration of characteristics.

  Examples of the active metal 9 include titanium (Ti), zirconium (Zr), and hafnium (Hf). One of these may be used alone, or two or more may be used in combination. The active metal 9 is preferably Ti from the viewpoint of availability. Further, a material that is difficult to alloy with the bonding aid 3 may be appropriately selected and used.

  The active metal 9 may be dispersed as single particles of the active metal 9 or may be dispersed as a composite. FIG. 7 shows a composite 10 in which the active metal 9 and the microwave sensitive material 4 are integrally formed. Alternatively, the bonding aid 3, the active metal 9, and the microwave sensitive material 4 may be integrally formed to form a composite. The composite 10 of the active metal 9 and the microwave sensitive material 4 can be obtained by coating the surface of the microwave sensitive material 4 with the active metal 9 by plating or spraying. FIG. 8 shows a case where the composite 10 is used to form a foil-like mixture 62.

  The content of the active metal 9 can be determined based on the mass of the bonding aid 3. In this case, the content of the active metal 9 is preferably 1 to 2% by mass with respect to the total mass of the joining aid 3 and the active metal 9. When the content of the active metal 9 is 1% by mass or more, the wettability of the microwave sensitive material 4 is excellent, and when the content is 2% by mass or less, the hardness of the bonding layer 5 is increased or the bonding characteristics are decreased due to an increase in electric resistance. Absent.

  Moreover, you may determine content of the active metal 9 on the basis of the total surface area of the microwave sensitive material 4 contained in a mixture. In this case, the content of the active metal 9 with respect to the microwave sensitive material 4 is determined as follows. Assuming that the two bonding materials are made of the microwave sensitive material 4, the total area of the bonding surfaces of these bonding materials is the same as the total surface area of the microwave sensitive material 4 included in the mixtures 61 and 62. To do. The content of the active metal 9 is preferably an amount equivalent to the amount of the active metal 9 used for forming a bonding layer having a desired thickness with this bonding material to obtain a good bonding.

  For example, when Ti is contained in a mixture containing 10% by mass of SiC having a diameter of 20 μm with respect to the total mass of the bonding aid 3 and SiC, the content of Ti is preferably relative to the total mass of SiC and Ti. Is 20 to 25% by mass, particularly preferably 22 to 23% by mass. When the Ti content is 20% by mass or more, the microwave-sensitive material 4 is excellent in wettability, and when it is 25% by mass or less, there is no decrease in bonding characteristics due to increase in hardness or electrical resistance of the bonding layer 5.

In addition, when the total mass of the microwave sensitive material 4 does not change and the total surface area changes, for example, when the radius of the microwave sensitive material 4 becomes A times, the content of the active metal 9 becomes 1 / A times. Like that. This is because when the radius is A times with the same mass, the number of particles is 1 / A ³ times, and each surface area is A ² times, so that the total surface area is 1 / A times.

  Next, each process in the microwave heating joining method of this embodiment is demonstrated. FIG. 9 is a process diagram illustrating the microwave heating bonding method according to the first embodiment. The microwave heating joining method of this embodiment is a method of joining the first joining member 1 and the second joining member 2 made of a metal material using the joining aid 3 and the microwave sensitive material 4. . In this joining method, an arrangement step of placing the microwave sensitive material 4 and the joining aid 3 made of metal on at least a part of the joining surfaces 11 and 21 of the first and second joining members 1 and 2, A microwave irradiation step of irradiating and heating the microwave sensitive material 4 to melt the bonding aid 3; and a removing step of separating the microwave sensitive material 4 from the molten bonding aid 3 .

(Arrangement process (S101))
FIG. 10 shows an arrangement step in the microwave heating bonding method of the present embodiment. In the arrangement step, as shown in FIG. 10, the mixture 61 and 62 of the bonding aid 3 and the microwave sensitive material 4 are arranged on the respective bonding surfaces 11 and 21 of the first bonding member 1 and the second bonding member 2. To do. At this time, the mixtures 61 and 62 may be arranged on both the joining surfaces 11 and 21, or may be arranged on either one.

  The means for disposing the bonding aid 3 and the microwave sensitive material 4 on the bonding surfaces 11 and 21 is not particularly limited. When the paste-like mixture 61 is used, the paste is applied to the bonding surfaces 11 and 21 and the foil-like mixture 62 is applied. It is sufficient to sandwich the joint surfaces 11 and 21.

  FIG. 11 shows another arrangement step in the microwave heating bonding method of the present embodiment. As shown in FIG. 11, the arrangement of the first and second joining members 1, 2 is inclined, a tapered opening 13 is provided between the joining surfaces 11, 21, and joining aids 11, 21 are joined. Mixtures 61 and 62 of the material 3 and the microwave sensitive material 4 can also be arranged. The interval between the openings 13 is preferably 4 cm or more at least at one end. Thereby, it becomes easy to enter a microwave from the said opening part 13, and heat_generation | fever of the microwave sensitive material 4 can be accelerated | stimulated. This utilizes the property that the microwave is likely to enter a gap of about ¼ to ３ of the wavelength. For example, in the case of irradiating a microwave with a frequency of 2.45 GHz (wavelength of about 12 cm), the opening 13 is preferably 4 cm or more of 1/3 of the wavelength, and a microwave of 28 GHz (wavelength of about 11 mm) is used. In the case of irradiation, the opening 13 is preferably 3 mm or more.

(Microwave irradiation process (S102))
FIG. 12 shows the microwave irradiation process of this embodiment. In the microwave irradiation step, the microwave irradiation device 12 irradiates microwaves to the bonding surfaces 11 and 21 on which the bonding aid 3 and the microwave sensitive material 4 are arranged. By irradiating the microwave, the microwave sensitive material 4 is heated, and the bonding aid 3 is melted by the generated heat.

  The frequency of the microwave irradiated by the microwave irradiation apparatus is 2 to 30 GHz, and preferably 2.45 GHz. The microwave irradiating device 12 is not particularly limited as long as it can generate a microwave having the above-described frequency. For example, a magnetron oscillation tube, a gyrotron oscillation tube, or the like is used.

  The microwave irradiation conditions are not particularly limited as long as the joining aid 3 is melted, but the temperature of the joining aid 3 is about the brazing temperature of the brazing material used as the joining aid 3. The conditions are preferable. The brazing temperature of the brazing material is about 650 to 900 ° C. for silver brazing, about 800 to 1200 ° C. for Ni brazing, and about 700 to 850 ° C. for phosphor copper brazing. Specifically, for example, when the joining member has a size of 50 × 50 mm and a thickness of about 5 to 10 mm, the output of the microwave irradiation apparatus is 1 to 2 kW, and the heating time is 5 to 30. About minutes.

  FIG. 13 shows another example of the microwave irradiation step in the microwave heating bonding method of the present embodiment. When the first and second joining members 1 and 2 are made of different metal materials, a temperature measuring device such as a thermocouple for measuring the temperatures of the first and second joining members 1 and 2 as shown in FIG. 17 may be provided to cool the bonding members 1 and 2 when the temperature measured by the temperature measuring device 17 rises near the softening point of the first and second bonding members 1 and 2. For example, the upper limit temperature of each of the joining members 1 and 2 is set in advance, and the cooling device 16 is controlled to cool when the temperature measured by the temperature measuring device 17 reaches the upper limit temperature. Can be achieved.

  Moreover, in order to measure the temperature of the 1st and 2nd joining members 1 and 2 more correctly, and to suppress these temperature rises, the distance from the joining surfaces 11 and 21 is preferably 1 to 21. It is installed at a position of 5 mm, more preferably 0.5-1 mm.

  Specifically, for example, when the first joining member is a stainless steel plate having a length of 50 × 50 mm and a thickness of 10 mm, and the second joining member is a pure copper plate having a length of 50 × width 50 mm and a thickness of 15 mm, Pure copper plate is more likely to rise in temperature. Therefore, the upper limit temperature of the pure copper plate is set to 150 ° C., and the thermocouple is arranged at a position of about 1 mm from the joining surface of the pure copper plate. When the temperature in the thermocouple reaches 150 ° C., cooling of the pure copper plate is started so that the pure copper plate does not exceed this upper limit temperature.

  Thus, in the microwave irradiation process of the present embodiment, the microwave sensitive material 4 is heated, and the bonding aid 3 is melted by this heat generation. Therefore, it is possible to heat the bonding aid 3 and the bonding surfaces 11 and 21 while suppressing the first and second bonding members 1 and 2 themselves from being heated as much as possible. Therefore, characteristic deterioration such as softening due to heat of the joining members 1 and 2 can be suppressed.

(Removal step (S103))
FIG. 14 is a cross-sectional view showing an example of a removal step in the microwave heating bonding method of the present embodiment. In the removing step, the microwave sensitive material 4 is separated from the molten bonding aid 3 and removed. The removal method is not particularly limited as long as the microwave sensitive material 4 is removed. For example, the removal is performed as follows. When the bonding aid 3 is melted and becomes compatible with the first and second bonding members 1 and 2, for example, in the cross section of FIG. 13, fillets 14 are formed at the upper and lower ends of the bonding surfaces 11 and 21. By applying ultrasonic vibration to the bonding aid 3 melted at this stage by the ultrasonic vibrator 15, the microwave sensitive material 4 can be discharged into the fillet 14 at the upper end. Since the microwave-sensitive material 4 has a specific gravity smaller than that of the bonding aid 3, the microwave-sensitive material 4 floats into the upper fillet 14 by melting the bonding aid 3, but gives ultrasonic vibration. Thus, the floating of the microwave sensitive material 4 can be further promoted.

  15 and 16 show a removal process using a pressure device. In the removing step, as shown in FIG. 15, when most of the microwave sensitive material 4 floats near the upper end portions of the first and second joining members, the first and second joining members 1 and 2 are, for example, It is preferable that the pressure is applied by the pressure device 18 to be pressure-bonded. Thereby, the microwave sensitive material 4 remaining in the vicinity of the ends of the joining surfaces 11 and 21 can be discharged into the fillet 14 to form the joining layer 5 from which the microwave sensitive material 4 has been removed (FIG. 16). .

  FIG. 17 is a diagram illustrating a removal process using a cooling device. In the cooling step, as shown in FIG. 17, the cooling direction by the cooling device 16 may be set from the bottom to the top so that the bonding aid 3 is solidified, and the microwave sensitive material 4 may be discharged in this direction. When the cooling has directionality, the microwave sensitive material 4 in the bonding aid 3 segregates in the molten bonding aid 3 when the bonding aid 3 solidifies. Therefore, the microwave sensitive material 4 can be discharged in the cooling direction. In addition, when removing the microwave sensitive material 4 using the said cooling method, the discharge direction of the microwave sensitive material 4 does not necessarily need to be upwards, and may discharge in a horizontal direction.

(Cooling step (S104))
FIG. 18 shows an example of the cooling process in the microwave heating joining method of this embodiment. After the microwave sensitive material 4 is removed, the bonding aid 3 is naturally cooled or cooled by the cooling device 16 in the cooling step shown in FIG. As the cooling device 16, a cooling device 16 that uses cooling water as a cooling medium can be used. In the cooling process, the joining members 1 and 2 may be cooled as a whole, or the cooling device 16 may be moved while being partially cooled as shown in FIG. In the cooling step, the bonding aid 3 from which the microwave sensitive material 4 has been removed is solidified to form a bonding layer 5 to bond the first and second bonding members 1 and 2. After the joining, the fillet 14 is removed by, for example, a grinding machine to complete the joining.

  Further, when the opening 13 is provided between the first and second joining members 1 and 2, the first and second joining members 1 and 2 are brought into contact with each other and then bonded and cooled.

  In addition, from the viewpoint of bonding characteristics, the thickness of the bonding layer 5 is preferably 0.01 to 0.1 mm.

  As described above, according to the first embodiment, the microwave sensitive material 4 does not remain on the bonding surfaces 11 and 21, and the bonding layer 5 having excellent bonding characteristics can be obtained.

(Second Embodiment)
The second embodiment is different from the first embodiment in that the bonding aid 3 and the microwave sensitive material 4 are separately arranged in the arrangement step. Other configurations are the same as those of the first embodiment, and thus redundant description is omitted.

  In the present embodiment, the joining aid 3 and the microwave sensitive material 4 are not mixed, and the joining aid 3 is a joining material formed in a paste form by adding the paste assistant 7 or the joining aid. 3 is a bonding material formed in a foil shape. The microwave sensitive material 4 is formed in a block shape, and the shape is embedded in, for example, the opening 13. Moreover, when using the active metal 9, it is preferable to mix the active metal 9 with the joining aid 3 of paste shape or foil shape.

  19 to 21 are diagrams showing a microwave heating joining method according to the third embodiment. FIG. 19 shows an arrangement step, FIG. 20 shows a removal step, and FIG. 21 shows a cooling step. In the present embodiment, as shown in FIG. 19, an opening 13 is provided between the joining surfaces 11 and 21, only the joining aid 3 is disposed on the joining surfaces 11 and 21, and the microwave sensitive material 4 is placed in the opening 13. Arrange as an embedding material. At this time, the microwave sensitive material 4 does not necessarily need to block all the openings, and may be in contact with the bonding aid 3 so that the bonding aid 3 is sufficiently heated.

  Next, a microwave irradiation process is performed as in the second embodiment. In the microwave irradiation step, the bonding aid 3 is heated by the microwave sensitive material 4 generating heat. In the removing step, as shown in FIG. 19, the microwave sensitive material 4 arranged as the embedding material is taken out, and the first and second joining members 1 and 2 are brought into contact with each other. In the cooling step, as shown in FIG. 20, the first and second joining members 1 and 2 are pressure-bonded and cooled to form the joining layer 5 (FIG. 21).

  In this embodiment, since the microwave sensitive material 4 is arranged as an embedding material, it can be easily removed in the removing step. Therefore, the microwave sensitive material 4 does not remain on the bonding surfaces 11 and 21, and the bonding layer 5 having excellent bonding characteristics can be obtained.

(Third embodiment)
The third embodiment is different from the first embodiment in that the arrangement amount of the bonding aid 3 and the microwave sensitive material 4 is set on the bonding surface according to the desired heating amount of the first and second bonding members 1 and 2. The configuration is changed depending on the position, and the other configurations and effects are the same as those in the first embodiment, and therefore, a duplicate description is omitted.

  22 to 24 show a mixture 63 to a mixture 67 used in the present embodiment. In the mixture 63 shown in FIG. 22, a large amount of the microwave sensitive material 4 is disposed on one side, and a smaller amount is disposed on the other side. The mixture 63 may be dispersed so that the microwave-sensitive material 4 has a high concentration on one side and the concentration of the microwave-sensitive material decreases toward the other side. A mixture 64 shown in FIG. 23 is a mixture in which the microwave sensitive material 4 is dispersed at a predetermined concentration at a high concentration, and the mixture 65 to the mixture 67 shown in FIG. 24 are dispersions of the microwave sensitive material 4. A plurality of mixtures having different concentrations.

  25 to 27 show the arrangement process in the present embodiment. FIG. 25 is an arrangement process using the mixture 64, and FIG. 26 is an arrangement process using the mixture 65 to the mixture 67. In the arranging step, as shown in FIG. 25, the mixture 64 is arranged so that the portion where the microwave sensitive material 4 is in contact with the portion where the heating amount of the joining members 1 and 2 is to be increased in the arranging step. Further, as shown in FIG. 26, a plurality of mixtures having different dispersion concentrations of the microwave sensitive material 4 are arranged according to a desired heating amount.

  Next, after performing the microwave irradiation process, the removal process, and the cooling process as in the first embodiment, the fillet 14 is removed to complete the bonding. In this embodiment, in the microwave irradiation process, the bonding aid 3 in a portion including a large amount of the microwave sensitive material 4 is heated more than a portion including a small amount, so that the first and second bonding members 1 and 2 are released. Even when the amount of heat is partially different, local uniform heating is possible.

  Thus, according to the microwave heating joining method of the present embodiment, various joining members 1 and 2 can be obtained by changing the arrangement amounts of the joining aid 3 and the microwave sensitive material 4 according to the desired heating amount. The joint surfaces 11 and 21 corresponding to the shape and the material can be easily heated locally and the joining layer 5 having excellent joining characteristics can be formed.

  Further, in the present embodiment, in the arranging step, the microwave-sensitive material 4 is placed in the direction in which the molten joining aid 3 flows at one end between the joining surfaces 11 and 21 as shown in FIG. You may arrange | position so that it may increase. In the microwave irradiation process, the temperature of the side containing more microwave-sensitive material 4 becomes higher than the side containing less thereof. When the joining aid 3 is melted, it tends to flow toward the higher temperature, so that the joining aid 3 flows toward the high temperature side, and defects such as voids easily move in this flow direction. Therefore, defects can be discharged in this flow direction, and the bonding layer 5 with good bonding characteristics can be formed.

(Fourth embodiment)
The fourth embodiment is a method using a microwave sensitive metal 41 in place of the microwave sensitive material 4 in the first embodiment, and the other configuration is the same as that of the first embodiment, so that the description is repeated. Is omitted.

  In the present embodiment, the microwave sensitive metal 41 is a metal that generates heat by absorbing microwaves. For example, metal particles Zn, Sn having high electrical resistance, or metal particles having a particle size of 1 to 500 nm in nano size are used. Can be used. Among these, nano-sized particles of an alloy containing Zn and Sn are preferable, and specifically, nano-sized particles of an Ag—Cu—Zn—Sn-based silver brazing material are preferable. Such a microwave microwave highly sensitive metal 41 is excellent in the microwave heat absorbability, and thus is excellent in the local heating property of the bonding aid 3.

  The joining aid 3 and the microwave sensitive metal 41 are preferably used as a mixture. As the mixture including the bonding aid 3 and the microwave sensitive material 41, a mixture obtained by pasting the bonding aid 3 and the microwave sensitive material 41 with the paste aid 7 or the bonding aid 3 and the microwave height. A mixture in which the sensitive material 41 is foil-like can be used.

  28 to 30 are cross-sectional views schematically showing the microwave heating joining method of the present embodiment, in which FIG. 28 shows an arrangement step, FIG. 29 shows a microwave irradiation step, and FIG. 30 shows a cooling step.

  In the microwave heating and bonding method of the present embodiment, the bonding aid 3 and the microwave sensitive metal 41 are disposed on at least a part of the bonding surfaces 11 and 21 in the arrangement step. When the microwave sensitive metal 41 functions also as the bonding aid 3, only the microwave sensitive metal 41 may be disposed. Next, similarly to the first embodiment, the microwave irradiation process and the cooling process are sequentially performed to form the bonding layer 5. Finally, the fillet 14 is removed. In this embodiment, since the microwave sensitive metal 41 is used in place of the microwave sensitive material 4, it is not necessary to perform a removal step. Moreover, since the ceramic material does not remain on the bonding surfaces 11 and 21, the bonding layer 5 having excellent bonding characteristics can be obtained.

  In the fourth embodiment, it is preferable to perform a preheating step of irradiating microwaves prior to the microwave irradiating step. In the preheating step, the joining members 1 and 2 are preferably irradiated with microwaves having a frequency of 20 to 30 GHz, particularly preferably a frequency of 28 GHz, and the joining members 1 and 2 are heated to about 100 ° C. or less. Thereby, the joining members 1 and 2, the joining aid 3, and the microwave sensitive metal 41 can be easily combined, and the joining characteristics of the joining layer 5 can be improved.

  As described above, since the microwave heating joining method of the fourth embodiment is excellent in local heating property by using the microwave high-sensitivity metal 41, the first and second joining members 1 and 2 are softened by heat. Characteristic deterioration can be suppressed. Further, since the microwave high-sensitivity metal 41 is used, the ceramic material does not remain in the bonding layer 5, and the bonding layer 5 having excellent bonding characteristics can be obtained.

  As described above, according to the embodiment described above, the local heating property is excellent, and the bonding characteristics of the bonding layer can be improved.

  Although several embodiments of the present invention have been described, these embodiments are presented by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the scope of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

  DESCRIPTION OF SYMBOLS 1 ... 1st joining member, 2 ... 2nd joining member, 3 ... Joining aid, 4 ... Wave micro sensitive material, 5 ... Joining layer, 61, 62, 63, 64, 65, 66, 67 ... Mixture 7 ... Paste aid, 81, 82 ... Composite, 9 ... Active metal, 10 ... Composite, 11, 21 ... Bonding surface, 12 ... Microwave irradiation device, 13 ... Opening, 14 ... Fillet, 15 ... Super Sonic vibrator, 16 ... cooling device, 17 ... temperature measuring device, 18 ... pressurizing device, 41 ... microwave sensitive metal, S101 ... placement step, S102 ... microwave irradiation step, S103 ... removal step, S104 ... cooling step .

Claims (11)

A method for joining metal joining members using microwaves,
An arrangement step of arranging a bonding aid made of a microwave sensitive material and a metal on at least a part of the bonding surface of the bonding member;
A microwave irradiation step of melting the bonding aid by irradiating microwaves to heat the microwave sensitive material; and
A removal step of separating the microwave sensitive material from the molten joining aid;
A microwave heating joining method comprising: The microwave sensitive material and the bonding aid are each in a powder form, and a paste aid is added to form a paste-like mixture.
In the arranging step, the paste-like mixture is arranged on at least a part of the joining surface,
The microwave heating joining method according to claim 1, wherein in the removing step, the microwave sensitive material is discharged from at least one end of the joining surface. The joining aid is formed as a foil-like mixture containing the microwave sensitive material,
In the arranging step, the foil-like mixture is arranged on at least a part of the joining surface,
The microwave heating joining method according to claim 1, wherein in the removing step, the microwave sensitive material is discharged from at least one end of the joining surface. The bonding aid is in powder form, and a paste auxiliary is added to form a paste-like bonding material, and the microwave sensitive material is formed in a block shape,
The arrangement step includes
Placing the joint surfaces apart from each other;
Disposing the paste-like bonding material on at least a part of the bonding surface;
Arranging the microwave-sensitive material so as to contact at least a part of the paste-like bonding material arranged on the bonding surface,
The microwave heating joining method according to claim 1, wherein in the removing step, the microwave sensitive material is taken out and the separated joining surfaces are brought into contact with each other. The bonding aid is formed as a foil-shaped bonding material, and the microwave sensitive material is formed in a block shape,
The arrangement step includes
Placing the joint surfaces apart from each other;
Arranging the foil-like bonding material on at least a part of the bonding surface;
Disposing the microwave sensitive material so as to contact at least a part of the foil-shaped bonding material disposed on the bonding surface,
The microwave heating joining method according to claim 1, wherein in the removing step, the microwave sensitive material is taken out and the separated joining surfaces are brought into contact with each other.   The microwave heating joining method according to any one of claims 1 to 3, wherein a particle diameter of the microwave sensitive material is 1 to 100 µm.   The microwave heating joining method according to claim 1, wherein the microwave sensitive material is a ceramic material having a large dielectric constant.   The microwave heating joining method according to any one of claims 1 to 7, wherein the microwave sensitive material is silicon carbide (SiC).   The microwave heating joining method according to any one of claims 1 to 3 and 6 to 8, wherein the mixture contains an active metal.   6. The microwave heating joining method according to claim 4, wherein the joining material contains an active metal.   The microwave heating joining method according to any one of claims 1 to 3 and 6 to 10, wherein the joining aid and the microwave sensitive material are combined and formed integrally.

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