JP7159898B2 - ウェーハ回収装置、研磨システム、および、ウェーハ回収方法 - Google Patents

ウェーハ回収装置、研磨システム、および、ウェーハ回収方法 Download PDF

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Publication number
JP7159898B2
JP7159898B2 JP2019024185A JP2019024185A JP7159898B2 JP 7159898 B2 JP7159898 B2 JP 7159898B2 JP 2019024185 A JP2019024185 A JP 2019024185A JP 2019024185 A JP2019024185 A JP 2019024185A JP 7159898 B2 JP7159898 B2 JP 7159898B2
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Japan
Prior art keywords
wafer
polishing
carrier
press
liquid
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JP2019024185A
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English (en)
Japanese (ja)
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JP2020131309A (ja
Inventor
優 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
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Sumco Corp
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Publication date
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Priority to JP2019024185A priority Critical patent/JP7159898B2/ja
Priority to CN201911319916.2A priority patent/CN111558895B/zh
Publication of JP2020131309A publication Critical patent/JP2020131309A/ja
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Publication of JP7159898B2 publication Critical patent/JP7159898B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B24B37/345—Feeding, loading or unloading work specially adapted to lapping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2019024185A 2019-02-14 2019-02-14 ウェーハ回収装置、研磨システム、および、ウェーハ回収方法 Active JP7159898B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2019024185A JP7159898B2 (ja) 2019-02-14 2019-02-14 ウェーハ回収装置、研磨システム、および、ウェーハ回収方法
CN201911319916.2A CN111558895B (zh) 2019-02-14 2019-12-19 晶圆回收装置、研磨系统及晶圆回收方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019024185A JP7159898B2 (ja) 2019-02-14 2019-02-14 ウェーハ回収装置、研磨システム、および、ウェーハ回収方法

Publications (2)

Publication Number Publication Date
JP2020131309A JP2020131309A (ja) 2020-08-31
JP7159898B2 true JP7159898B2 (ja) 2022-10-25

Family

ID=72069563

Family Applications (1)

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JP2019024185A Active JP7159898B2 (ja) 2019-02-14 2019-02-14 ウェーハ回収装置、研磨システム、および、ウェーハ回収方法

Country Status (2)

Country Link
JP (1) JP7159898B2 (zh)
CN (1) CN111558895B (zh)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015013353A (ja) 2013-07-08 2015-01-22 浜井産業株式会社 ワーク剥離装置および剥離方法
US20180043501A1 (en) 2016-08-12 2018-02-15 Samsung Display Co., Ltd. Substrate polishing system and substrate polishing method

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51131139A (en) * 1975-05-10 1976-11-15 Mitsuminegawa Denriyoku Kk Method of repairing concrete crack
CN2059391U (zh) * 1989-12-22 1990-07-18 温少凡 汽门研磨机
JP3084669B2 (ja) * 1996-10-17 2000-09-04 日本ダースボンド株式会社 研磨製品の製造方法
JPH11233462A (ja) * 1998-02-09 1999-08-27 Naoetsu Electronics Co Ltd 半導体ウエハの両面研磨方法
KR101075053B1 (ko) * 2006-02-22 2011-10-21 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판반송장치, 기판파지장치, 및 약액처리장치
JP2009252877A (ja) * 2008-04-03 2009-10-29 Disco Abrasive Syst Ltd ウエーハの搬送方法および搬送装置
JP5669518B2 (ja) * 2010-10-18 2015-02-12 株式会社ディスコ ウエーハ搬送機構
JP5807648B2 (ja) * 2013-01-29 2015-11-10 信越半導体株式会社 両面研磨装置用キャリア及びウェーハの両面研磨方法
CN203125525U (zh) * 2013-03-11 2013-08-14 北京机械工业自动化研究所 用于水平多关节机器人的车用锂电池装配机械手
JP2016215342A (ja) * 2015-05-22 2016-12-22 信越半導体株式会社 ウェーハの回収方法及び両面研磨装置
CN104900763A (zh) * 2015-06-14 2015-09-09 茆康建 一种硅片机械手
KR101898121B1 (ko) * 2015-10-22 2018-09-12 저지앙 마이크로테크 머테리얼 컴퍼니 리미티드 워크피스 처리 방법 및 그러한 방법을 위해 설계된 장치
CN106625207B (zh) * 2016-09-27 2018-11-20 天津华海清科机电科技有限公司 晶圆片的卸片方法、辅助装置、装置和具有其的cmp设备
JP2018051702A (ja) * 2016-09-29 2018-04-05 三菱マテリアルテクノ株式会社 研磨パッド保持定盤、基板研磨装置及び研磨パッド保持方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015013353A (ja) 2013-07-08 2015-01-22 浜井産業株式会社 ワーク剥離装置および剥離方法
US20180043501A1 (en) 2016-08-12 2018-02-15 Samsung Display Co., Ltd. Substrate polishing system and substrate polishing method

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Publication number Publication date
CN111558895A (zh) 2020-08-21
JP2020131309A (ja) 2020-08-31
CN111558895B (zh) 2022-10-14

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