JP7144748B2 - Production apparatus and production method for resin film with metal film - Google Patents

Description

The present invention provides an apparatus for producing a resin film with a metal film, which is obtained by forming a metal film by a wet plating method on the metal seed layer of a long resin film on which a metal seed layer is formed by a vacuum film formation method such as sputtering. The present invention relates to a manufacturing method and, more particularly, to an improved apparatus and method for manufacturing a metal film-coated resin film in which defects such as pinholes are less likely to occur in a metal film formed on a metal seed layer by wet plating.

Various types of flexible wiring boards are used in liquid crystal panels, notebook computers, digital cameras, mobile phones, and the like. As a material for this flexible wiring board, a resin film with a metal film is used, in which a metal film is formed on one or both sides of a heat-resistant resin film. A flexible wiring board having a predetermined wiring pattern can be obtained by applying the above. In recent years, wiring patterns of flexible wiring substrates have become finer and denser, so it has become more important that the metal film of the metal film-coated resin film is free of defects such as pinholes.

As a method for producing this kind of resin film with a metal film, there is a method in which a metal foil is attached to a heat-resistant resin film with an adhesive (called a method for manufacturing a three-layer substrate), and a method in which a heat-resistant resin solution is applied to a metal foil. A method of manufacturing by drying after coating (called a casting method), a method of forming a metal film on a heat-resistant resin film by a vacuum film-forming method, or a heat-resistant resin film by a vacuum film-forming method Conventionally known is a method of forming a metal seed layer thereon and forming a metal film on the metal seed layer by a wet plating method (referred to as a metallizing method). Vacuum deposition methods in the metallizing method include a vacuum evaporation method, a sputtering method, an ion plating method, an ion beam sputtering method, and the like.

As the metallizing method, Patent Document 1 discloses a method of forming a conductor layer on the polyimide insulating layer by sputtering chromium on the polyimide insulating layer and then sputtering copper. Further, in Patent Document 2, a first metal thin film formed by sputtering with a copper-nickel alloy as a target and a second metal thin film formed by sputtering with copper as a target are formed in this order on a polyimide film. A material for a flexible circuit board obtained by laminating to a substrate is disclosed. When performing vacuum film formation on a heat-resistant resin film (substrate) such as a polyimide film, it is common to use a sputtering web coater.

In recent years, resin films with metal films on both sides have been produced as high-density wiring boards by the metallizing method. Specifically, a metal seed layer is formed on both sides of a heat-resistant long resin film by a vacuum film formation method such as sputtering, and a metal film is formed on the metal seed layer by a wet plating method. Resin films with metal films on both sides have been produced. The metal seed layer is formed using a vacuum film forming apparatus such as a sputtering web coater, and the metal film is formed using a wet plating apparatus. is manufactured in two different steps. That is, the long resin film on which the metal seed layer has been formed by the vacuum film-forming device is once wound into a roll shape in the vacuum film-forming device, and then carried out from the vacuum film-forming device to be applied to the wet plating device. A metal film is formed on the metal seed layer of the long resin film after being carried into the wet plating bath.

By the way, since the surface of the metal seed layer immediately after film formation in the vacuum film formation apparatus is not oxidized and the activity is high, the long resin film with the metal seed layer formed thereon is placed in the air inside the vacuum film formation apparatus. When the resin film is wound into a roll without the intervening metal seed layer, a blocking phenomenon occurs in which the metal seed layers stick to each other, and when the long resin film is unwound from the roll, one side of the metal seed layer is locally peeled off. There was something that was done.

Therefore, in order to avoid this phenomenon, when the long resin film on which the metal seed layer is formed is wound into a roll, a long interleaving paper made of a resin film or the like is sandwiched between the layers of the long resin film. method is commonly used.

However, in the method of winding while sandwiching the long interleaving paper between the layers of the long resin film on which the metal seed layer is formed, the long interleaving paper comes into contact with the surface of the metal seed layer immediately after film formation. When a long resin film is strongly wound in a vacuum, components of the long interleaving paper (for example, resin film components, solvent components contained in the resin film, etc.) are locally transferred to the surface of the metal seed layer. something happened.

Then, when the long resin film in which the component of the long interleaving paper is locally transferred to the surface of the metal seed layer is unwound from the roll and wet-plated, as shown in FIG. There was a problem that defects such as pinholes were caused in the metal film due to the component 100 of the long interleaving paper. To solve this problem, after the long resin film in which the component 100 of the long interleaving paper is locally transferred to the surface of the metal seed layer 101 is unwound from the roll, the metal seed layer 101 is removed before the metal seed layer 101 is carried into the wet plating bath. A method of pickling the surface with a dilute sulfuric acid solution or the like is being studied. However, it has been difficult to completely remove the component 100 of the long interleaving paper transferred to the surface of the metal seed layer 101 with a dilute sulfuric acid solution or the like, and it has been difficult to completely eliminate the occurrence of pinholes and the like.

Under such a technical background, the present inventor has developed an "atmospheric pressure plasma cleaning device" between the long resin film unwinding roll 600 shown in FIG. has already been proposed, in which the surface of the metal seed layer of the long resin film 601 unwound from the long resin film unwinding roll 600 is plasma-cleaned by incorporating a metal film-attached resin film manufacturing apparatus (Patent Document 3 reference). When the long resin film 601 is unwound from the long resin film unwinding roll 600, the long interleaving paper 603 sandwiched between the layers of the long resin film 601 is separated from the long resin film 601 and It is wound up on a roll 602 of measuring paper and collected.

JP-A-2-98994 Japanese Patent No. 3447070 Patent application 2018-199073

By the way, as shown in FIG. 662 and atmospheric pressure plasma heads 665 and 666 arranged side by side along the transport direction of the long resin film 601 in the plasma processing box 662, and are transported in the plasma processing box 662 in a floating state. One metal seed layer surface (first surface) of the long resin film 601 is irradiated with atmospheric pressure plasma from the upstream atmospheric pressure plasma head 666 to wash the first surface. The second surface is cleaned by irradiating atmospheric pressure plasma from the atmospheric pressure plasma head 665 on the downstream side toward the other metal seed layer surface (second surface).

According to the apparatus for manufacturing a resin film with a metal film incorporating the "atmospheric pressure plasma cleaning apparatus", before the long resin film 601 is carried into the wet plating bath (642, 643, 644, 645), Since the transfer component of the long interleaving paper is removed from the surface of the metal seed layer (first and second surfaces), defects such as pinholes are less likely to occur in the metal film formed by the wet plating method, resulting in high-quality metal. The film-coated resin film could be produced with a high yield.

However, plasma is irradiated from the upstream atmospheric pressure plasma head 666 toward one metal seed layer surface (first surface) of the long resin film 601, and then the long resin film is irradiated from the downstream atmospheric pressure plasma head 665. When a method of irradiating plasma toward the other metal seed layer surface (second surface) of 601 (that is, a method of alternately irradiating the first surface and the second surface of long resin film 601 with plasma) is adopted, The surface of the metal seed layer on the side opposite to the metal seed layer irradiated with plasma was sometimes discolored (when the metal seed layer was made of copper, it was discolored to red). The reason for this is that the temperature of the long resin film with a small heat capacity on which the metal seed layer is formed rapidly rises due to the thermal energy of the atmospheric pressure plasma, and the metal seed layer surface (second surface) on the back side that is not irradiated with the plasma It is considered that it was oxidized by oxygen in the atmosphere (atmosphere).

When the surface (second surface) of the metal seed layer is oxidized by oxygen in the atmosphere surrounding the back surface (atmosphere), the cleaning effect of atmospheric pressure plasma irradiation is slightly reduced. A small amount of the transfer component of the interleaving paper remains, and there is a problem of causing defects such as pinholes in the metal film formed by the wet plating method.

The present invention has been made by paying attention to such problems, and the object thereof is to provide a resin film with a metal film in which the first surface and the second surface of the metal seed layer are evenly cleaned by atmospheric pressure plasma. An object of the present invention is to provide a manufacturing apparatus and a manufacturing method.

That is, the first invention according to the present invention is
A long resin film unwinding roll in which a long resin film having metal seed layers formed on both sides is wound while sandwiching a long interleaving paper between the layers;
a long interleaving paper winding roll for separating and winding the long interleaving paper from the long resin film unwound from the long resin film unwinding roll;
a wet plating bath in which the long resin film from which the long interleaving paper has been separated is loaded and a metal film is formed on the metal seed layer;
A long resin film winding roll for winding the long resin film on which the metal film is formed, and
Resin with a metal film provided with an atmospheric pressure plasma cleaning device for cleaning the surface of the metal seed layer of the long resin film from which the long interleaving paper has been separated, between the long resin film unwinding roll and the wet plating tank. In film manufacturing equipment,
In the plasma processing box of the atmospheric pressure plasma cleaning apparatus, a first atmospheric pressure plasma head and a second atmospheric pressure plasma head are arranged facing each other with a long resin film interposed therebetween. It is characterized in that the plasma is simultaneously irradiated toward the surface of the metal seed layer of the film,
The second invention is
In the apparatus for producing a resin film with a metal film according to the first invention,
A gas partition wall is provided around the outer peripheral edge of the long resin film side and each slit part in the first atmospheric pressure plasma head and the second atmospheric pressure plasma head,
The third invention is
In the apparatus for producing a resin film with a metal film according to the first invention or the second invention,
The metal seed layer and the metal film of the long resin film are mainly composed of Cu,
The fourth invention is
In the apparatus for producing a resin film with a metal film according to the first invention or the second invention,
The long interleaf paper is made of polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl alcohol, polycarbonate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, aramid, polyimide, triacetate, or affixed thereto. It is characterized by being composed of a combined composite,
Moreover, the fifth invention is
In the apparatus for producing a resin film with a metal film according to the first invention or the second invention,
The atmospheric pressure plasma cleaning apparatus is characterized in that it is of a remote control type.

Next, the sixth invention according to the present invention is
A step of unwinding the long resin film from a long resin film unwinding roll in which a long resin film having metal seed layers formed on both sides is wound while sandwiching a long interleaving paper between the layers;
A step of separating the long interleaving paper from the long resin film unwound from the long resin film unwinding roll and winding it on a long interleaving paper winding roll;
a step of carrying the long resin film from which the long interleaving paper has been separated into a wet plating tank to form a metal film on the metal seed layer;
In the method for producing a resin film with a metal film, the method for producing a resin film with a metal film comprising the step of winding the long resin film having the metal film formed thereon on a long resin film take-up roll,
Before the long resin film from which the long interleaving paper is separated is carried into the wet plating tank, plasma is generated from the first atmospheric pressure plasma head and the second atmospheric pressure plasma head which are arranged facing each other with the long resin film interposed therebetween. Simultaneously irradiating the surface of each metal seed layer of the long resin film with atmospheric pressure plasma cleaning,
The seventh invention is
In the method for producing a resin film with a metal film according to the sixth invention,
The metal seed layer and the metal film of the long resin film are mainly composed of Cu,
The eighth invention is
In the method for producing a resin film with a metal film according to the sixth invention,
The above long interleaving paper is pasted with polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl alcohol, polycarbonate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, aramid, polyimide, triacetate alone or these It is characterized by being composed of a combined composite,
Moreover, the ninth invention is
In the method for producing a resin film with a metal film according to the sixth invention,
The apparatus is characterized in that the apparatus for cleaning the surface of each metal seed layer of the long resin film with atmospheric pressure plasma is a remote-controlled apparatus.

According to the manufacturing apparatus and manufacturing method for a resin film with a metal film according to the present invention,
A first atmospheric pressure plasma head and a second atmospheric pressure plasma head with the long resin film sandwiched in the plasma processing box of the atmospheric pressure plasma cleaning device provided between the long resin film unwinding roll and the wet plating tank. are arranged facing each other, and plasma is simultaneously irradiated from the slit part of each plasma head toward the metal seed layer surface (first surface and second surface) of the long resin film, and plasma cleaning Both surfaces (first surface and second surface) of the metal seed layer are in an atmosphere containing extremely little oxygen due to the plasma gas emitted from the slits of each plasma head. The resulting rear surface oxidation is less likely to occur, and each surface (first surface and second surface) of the metal seed layer can be uniformly cleaned.

Therefore, defects such as pinholes are unlikely to occur in the metal films formed on the first and second surfaces of the metal seed layer by the wet plating method, and a high-quality resin film with a metal film can be produced at a high yield. becomes possible.

FIG. 2 is a configuration explanatory diagram of a sputtering web coater (vacuum film forming apparatus) for forming a metal seed layer on one side of a long resin film. FIG. 2 is a configuration explanatory diagram of a sputtering web coater (vacuum film forming apparatus) for forming metal seed layers on both sides of a long resin film. Apparatus for manufacturing a resin film with a metal film incorporating a conventional "atmospheric pressure plasma cleaning apparatus" in which two sets of atmospheric pressure plasma heads are arranged side by side along the conveying direction of a long resin film in a plasma processing box. Illustration of . A first embodiment in which a first atmospheric pressure plasma head and a second atmospheric pressure plasma head are arranged facing each other across a long resin film in a plasma processing box, which is incorporated in the apparatus for producing a resin film with a metal film according to the present invention. Explanatory drawing of the "atmospheric pressure plasma cleaning apparatus". FIG. 5(A) is a bottom view of the first atmospheric pressure plasma head, and FIG. (B) is a front view of a first atmospheric pressure plasma head and a second atmospheric pressure plasma head arranged opposite to each other across a long resin film in the plasma processing box of the "atmospheric pressure plasma cleaning apparatus"; is a top view of the second atmospheric pressure plasma head; Fig. 6(A) shows the components of the "atmospheric pressure plasma cleaning apparatus" according to the first embodiment incorporated in the apparatus for producing a resin film with a metal film of the present invention, and Fig. 6(A) shows the first atmospheric pressure plasma head viewed from the bottom side. FIG. 6B is a schematic perspective view of the second atmospheric pressure plasma head viewed from above; FIG. A second embodiment in which a first atmospheric pressure plasma head and a second atmospheric pressure plasma head are arranged facing each other across a long resin film in a plasma processing box, which is incorporated in the apparatus for producing a resin film with a metal film according to the present invention. Explanatory drawing of the "atmospheric pressure plasma cleaning apparatus". Fig. 8 shows the components of the "atmospheric pressure plasma cleaning apparatus" according to the second embodiment incorporated in the metal film-attached resin film manufacturing apparatus of the present invention, Fig. 8(A) is a bottom view of the first atmospheric pressure plasma head; (B) is a front view of a first atmospheric pressure plasma head and a second atmospheric pressure plasma head arranged opposite to each other with a long resin film sandwiched in the plasma processing box of the "atmospheric pressure plasma cleaning apparatus"; is a top view of the second atmospheric pressure plasma head; FIG. 9A shows the components of the "atmospheric pressure plasma cleaning apparatus" according to the second embodiment incorporated in the metal film-attached resin film manufacturing apparatus of the present invention, and FIG. 9A shows the first atmospheric pressure plasma head viewed from the bottom side FIG. 9B is a schematic perspective view of the second atmospheric pressure plasma head as viewed from above; FIG. FIG. 4 is an explanatory diagram showing the components of the long interleaving paper transferred to the surface of the metal seed layer of the long resin film.

Hereinafter, an apparatus for producing a resin film with a metal film according to an embodiment of the present invention will be described in detail, and a sputtering web coater (vacuum film forming apparatus) for forming a metal seed layer will also be specifically described.

1. Sputtering web coater (vacuum coating equipment) that deposits a metal seed layer on one side
First, a sputtering web coater (vacuum film forming apparatus) for forming a metal seed layer on one side will be specifically described with reference to FIG.

In FIG. 1, a roller driven by a motor is denoted by M (motor), a tension measuring roller is denoted by TP (tension pickup), and a free roller is denoted by F (free).

This sputtering web coater (vacuum film forming apparatus) comprises an unwinding chamber 210 , a drying chamber 211 , a film forming chamber 212 and a winding chamber 213 . A "surface treatment chamber" may be installed between the drying chamber 211 and the film forming chamber 212 to improve adhesion between the film and the metal film by performing plasma irradiation or ion beam irradiation.

In the unwinding chamber 210, an unwinding roll 215 wound with a long resin film 214 that is unfilmed or has a metal seed layer formed on one side thereof is arranged, and the long resin unwound from the unwinding roll 215 Film 214 is configured to be carried out to drying chamber 211 via free roller 216 , tension measuring roller 217 and free roller 218 . The unwinding force of the film is measured by the tension measuring roller 217 and is feedback-controlled to the unwinding roller 215 .

A film drying heater 224 is arranged in the drying chamber 211, and the long resin film 214 carried in from the unwinding chamber 210 is dried, and a driving roller 219, a free roller 220, a tension measuring roller 221, It is configured to be carried out to the film forming chamber 212 via the free rollers 222 and 223 . The drying tension of the film is measured by the tension measuring roller 221 and feedback-controlled to the driving roller 219 .

Sputtering cathodes 239 , 240 , 241 and 242 are arranged in the film forming chamber 212 , and a metal seed layer is formed on one side of the long resin film 214 carried in from the drying chamber 211 . , a tension measuring roller 230 , a can roller 231 , a tension measuring roller 232 , and a drive roller 233 , and are carried out to the winding chamber 213 . The film tension upstream of the can roller 231 is measured by the tension measuring roller 230 and feedback-controlled to the driving roll 229, and the film tension downstream of the can roller is measured by the tension measuring roller 232 and is controlled by the driving roll. It is configured to be feedback controlled to H.233. Reference numeral 238 in FIG. 1 denotes a shielding plate, which prevents sputtering particles ejected from the target of the sputtering cathode from deviating from a predetermined traveling path and heading toward the drying chamber 211, the winding chamber 213, and the like. It is configured.

A winding roll 246 and a long interleaving paper unwinding roll 248 are arranged in the winding chamber 213, and the long resin film 214 having a metal seed layer carried in from the film forming chamber 212 is used to unwind the long interleaving paper. A long interleaving paper 249 unwound from a roll 248 is sandwiched between film layers via a free roller 247, and passed through a free roller 243, a tension measuring roller 244, and a free roller 245 to a take-up roll 246. configured to be rolled up. The film winding tension is measured by a tension measuring roller 244 and feedback-controlled to a winding roller 246 .

After passing through the unwinding chamber 210, the drying chamber 211 and the film forming chamber 212, the long resin film 214 formed with the metal seed layer is wound in the winding chamber 213 while sandwiching the long interleaving paper 249 between the layers. It is adapted to be taken up by a take-up roll 246 . When the metal seed layer is formed on both sides of the long resin film 214 using this sputtering web coater (vacuum film forming apparatus), the metal seed layer is formed on one side wound on the winding roll 246. The elongated resin film 214 is temporarily taken out, set again on the unwinding roll 215, and passed through the unwinding chamber 210, the drying chamber 211 and the film forming chamber 212 to form a long film having a metal seed layer previously formed on one side. A metal seed layer is formed on the other side of the resin film 214 . In this case, the paper passing route from the unwinding roll 215 is the dashed line shown in the unwinding chamber 210 .

By the way, when the long resin film 214 having the metal seed layer formed on the other side is wound up on the take-up roll 246 as it is, the metal seed layers formed on the one side and the other side are strongly affected in a vacuum. A blocking phenomenon occurs in which they come into contact and stick to each other. In order to prevent this blocking phenomenon, the long interleaving paper 249 unwound from the long interleaving paper unwinding roll 248 is sandwiched between the layers of the film, as in the case where the metal seed layer is formed on one side. The film 214 may be wound onto the winding roll 246 in the winding chamber 213 . In FIG. 1, only the minimum number of rollers for explaining the sputtering web coater (vacuum film forming apparatus) is shown, but some rollers are not shown.

Each vacuum chamber constituting the unwinding chamber 210, the drying chamber 211, the film forming chamber 212, ^and the winding chamber 213 is equipped with exhaust equipment. The pressure is reduced to about ⁴ Pa, and then the pressure is adjusted to about 0.1 to 10 Pa by introducing a sputtering gas. A known gas such as argon is used as the sputtering gas, and a gas such as oxygen is further added depending on the purpose. The shape and material of each vacuum chamber are not particularly limited as long as they can withstand such a reduced pressure state, and various types can be used. Various devices such as a dry pump, a turbomolecular pump, and a cryo-coil (not shown) are provided to reduce the pressure in each vacuum chamber and maintain that state.

Also, when a metal seed layer is formed by sputtering, a plate-shaped target is used as shown in FIG. There is If this is a problem, it is preferable to use a cylindrical rotary target that does not generate nodules and has a high target usage efficiency.

In addition, although a magnetron sputtering cathode is illustrated in the sputtering web coater (vacuum film forming apparatus) of FIG. Alternatively, other vacuum deposition means are incorporated.

2. Sputtering web coater (vacuum coating equipment) that deposits metal seed layers on both sides
Next, a sputtering web coater (vacuum film forming apparatus) for forming metal seed layers on both surfaces will be described in detail with reference to FIG.

In FIG. 2, a roller driven by a motor is denoted by M (motor), a tension measuring roller is denoted by TP (tension pickup), and a free roller is denoted by F (free).

This sputtering web coater (vacuum film forming apparatus) comprises an unwinding chamber 110, a drying chamber 111, a film forming chamber 112, a transfer chamber 400, a film forming chamber 312, and a winding chamber 113, as shown in FIG. It is A "surface treatment chamber" may be installed between the drying chamber 111 and the film forming chamber 112 to improve adhesion between the film and the metal film by performing plasma irradiation or ion beam irradiation.

In the unwinding chamber 110, an unwinding roll 115 around which a long uncoated resin film 114 is wound is arranged. It is configured to be carried out to the drying chamber 111 via rollers 117 and free rollers 118 . The unwinding force of the film is measured by the tension measuring roller 117 and is feedback-controlled to the unwinding roller 115 .

A heater 124 for drying a film is arranged in the drying chamber 111, and the uncoated long resin film 114 carried in from the unwinding chamber 110 is dried. It is configured to be carried out to the film forming chamber 112 via rollers 121 , free rollers 122 and 123 . The drying tension of the film is measured by the tension measuring roller 121 and feedback-controlled to the drive roller 119 .

Sputtering cathodes 139 , 140 , 141 , 142 are arranged in the film forming chamber 112 , and a metal seed layer is formed on one side of the unformed long resin film 114 carried in from the drying chamber 111 . It is configured to be carried out to the carrying chamber 400 via the roller 129 , the tension measuring roller 130 , the can roller 131 , the tension measuring roller 132 and the driving roller 133 . Further, the film tension upstream of the can roller 131 is measured by the tension measuring roller 130 and feedback-controlled to the drive roll 129, and the film tension downstream of the can roller 131 is measured by the tension measuring roller 132 and is controlled by the drive roll. 133 is configured to be feedback-controlled. Incidentally, reference numeral 138 in FIG. 2 indicates a shielding plate.

Free rollers 401, 402, and 403 are arranged in the transfer chamber 400, and the long resin film 114 having a metal seed layer on one side carried in from the film forming chamber 112 passes through the free rollers 401, 402, and 403. It is configured to be carried out to the film forming chamber 312 as a whole. By passing the long resin film 114 through the transfer chamber 400, the non-film formed side of the long resin film 114 is exposed to the sputtering cathode side and the other side is also formed in the film forming chamber 312 for the next step. adjusted to be covered.

Sputtering cathodes 339, 340, 341, and 342 are arranged in the film forming chamber 312, and a metal seed layer is formed on the other surface of the long resin film 114 carried in from the transfer chamber 400, and a driving roller 333 , a tension measuring roller 332 , a can roller 331 , a tension measuring roller 330 , and a drive roller 329 , and are carried out to the winding chamber 113 . The film tension upstream of the can roller 331 is measured by a tension measuring roller 332 and feedback-controlled to the drive roll 333. The film tension downstream of the can roller is measured by a tension measurement roller 330 and is controlled by the drive roll. It is configured to be feedback controlled to H.329. Incidentally, reference numeral 338 in FIG. 2 indicates a shielding plate.

A winding roll 146 and a long interleaving paper unwinding roll 148 are arranged in the winding chamber 113, and the long resin film 114 having metal seed layers on both sides carried in from the film forming chamber 312 is applied to the long interleaving film. A long interleaving paper 149 unwound from a paper unwinding roll 148 is sandwiched between film layers via a free roller 147, and a winding roll via a free roller 143, a tension measuring roller 144, and a free roller 145. 146 is configured to be wound up. The film take-up tension is measured by a tension measuring roller 144 and feedback-controlled to a take-up roll 146 .

In this way, the elongated resin film 114 having the metal seed layers formed on both sides through the unwinding chamber 110, the drying chamber 111, the film forming chamber 112, the transfer chamber 400, and the film forming chamber 312 is formed between the layers. It is wound around the winding roll 146 in the winding chamber 113 while sandwiching the long interleaving paper 149 .

By the way, when the long resin film 114 with the metal seed layers formed on both sides is wound up on the take-up roll 146 as it is, the metal seed layers formed on one side and the other side come into strong contact in a vacuum. Then, a blocking phenomenon in which it sticks occurs. In order to prevent this blocking phenomenon, the long resin film 114 may be wound onto the take-up roll 146 while the long interleaving paper 149 unwound from the long interleaving paper unwinding roll 148 is sandwiched between the film layers as described above. . In FIG. 2, only the minimum number of rollers for explaining the sputtering web coater (vacuum film forming apparatus) is shown, but some rollers are not shown.

Each of the vacuum chambers constituting the unwinding chamber 110, the drying chamber 111, the film forming chamber 112, the transfer chamber 400, the film forming chamber 312, and the winding chamber 113 is equipped with exhaust equipment. In 312, the pressure is reduced to about 10 ^-4 Pa for sputtering film formation, and the pressure is adjusted to about 0.1 to 10 Pa by introducing sputtering gas. A known gas such as argon is used as the sputtering gas, and a gas such as oxygen is further added depending on the purpose. The shape and material of each vacuum chamber are not particularly limited as long as they can withstand such a reduced pressure state, and various types can be used. Various devices such as a dry pump, a turbomolecular pump, and a cryo-coil (not shown) are provided to reduce the pressure in each vacuum chamber and maintain that state.

Also, when a metal seed layer is formed by sputtering, a plate-shaped target is used as shown in FIG. There is If this is a problem, it is preferable to use a cylindrical rotary target that does not generate nodules and has a high target usage efficiency.

In addition, although a magnetron sputtering cathode is illustrated in the sputtering web coater (vacuum film forming apparatus) in FIG. Alternatively, other vacuum deposition means are incorporated.

3. Problems when a long resin film is wound with a long interleaving paper sandwiched between the layers
Long resin films that are applied to resin films with metal films include polyimide films, polyamide films, polyester films, polytetrafluoroethylene films, polyphenylene sulfide films, polyethylene naphthalate films, and liquid crystal polymer films. A heat-resistant resin film selected from is exemplified. This is because the resin film with a metal film obtained by using these resin films is excellent in the flexibility required for the flexible wiring substrate described above, the strength required in practical use, and the electrical insulation suitable as a wiring material. .

On the other hand, the long interleaving paper sandwiched between the layers of the long resin film having a metal seed layer formed on one side or both sides also includes polyimide film, polyamide film, polyester film, polytetrafluoroethylene film, and polyphenylene sulfide. A resin film or the like selected from a base film, a polyethylene naphthalate film, or a liquid crystal polymer film is used.

By the way, when a long resin film having metal seed layers formed on both sides is wound into a roll in a vacuum film forming apparatus such as a sputtering web coater without the presence of air, a blocking phenomenon occurs in which the metal seed layers stick to each other. There is a problem that either side of the metal seed layer is locally peeled off when the long resin film is unwound from the roll. In order to avoid this problem, the long interleaving paper is used, but when the long interleaving paper is sandwiched between the layers of the long resin film and wound, the long interleaving paper is left on the surface of the metal seed layer immediately after the film is formed. Because of the contact, the components of the long interleaving paper (for example, the resin film component described above, the solvent component contained in the resin film, etc.) may locally transfer to the surface of the metal seed layer. Then, when the long resin film in which the components of the long interleaving paper are locally transferred to the surface of the metal seed layer is unwound from the roll and wet-plated, the components transferred to the surface of the metal seed layer cause A new problem has been confirmed in which defects such as pinholes are generated in the metal film.

To solve this problem, after the long resin film in which the above components have been locally transferred to the surface of the metal seed layer is unwound from the roll, the surface of the metal seed layer is treated with a dilute sulfuric acid solution or the like before being carried into a wet plating tank. A method of acid washing has been studied, but it is difficult to completely remove the components of the long interleaving paper transferred to the surface of the metal seed layer with a dilute sulfuric acid solution, etc., and it is difficult to completely eliminate the occurrence of pinholes. Met.

In the apparatus for manufacturing a resin film with a metal film according to the present embodiment, the surface of the metal seed layer is cleaned with atmospheric pressure plasma to eliminate pinholes before the long resin film having the metal seed layer formed thereon is carried into the wet plating tank. The present invention provides a resin film with a metal film in which there is no such as.

4. Resin film manufacturing equipment with metal film incorporating conventional atmospheric pressure plasma cleaning equipment
In the plasma processing box 662, two sets of atmospheric pressure plasma heads 665, 666 are arranged side by side along the conveying direction of the long resin film 601. With a metal film incorporating the "atmospheric pressure plasma cleaning device" according to the conventional example FIG. 3 shows a resin film manufacturing apparatus.

As in the case of the sputtering web coater (vacuum film forming apparatus), only the minimum number of rolls for explaining the apparatus for producing a resin film with a metal film is shown, and the rollers driven by motors are M (motor), A tension measuring roller is denoted by TP (tension pickup), and a free roller is denoted by F (free).

As shown in FIG. 3, a resin film manufacturing apparatus with a metal film incorporating a conventional atmospheric pressure plasma cleaning device has a long resin film unwinding roll around which a long resin film 601 having a metal seed layer is wound. 600, an "atmospheric pressure plasma cleaning apparatus" for cleaning the surface of the metal seed layer of the long resin film 601 unwound from the long resin film unwinding roll 600, and a length conveyed from the "atmospheric pressure plasma cleaning apparatus". It consists of a “wet plating device” for forming a metal film on the metal seed layer of the long resin film 601 and a long resin film take-up roll 641 for winding the long resin film 601 unloaded from the “wet plating device”. It is

A long resin film 601 formed with a metal seed layer is wound around the long resin film unwinding roll 600 while a long interleaving paper 603 is sandwiched between the layers. The long interleaving paper 603 is separated when the long resin film 601 is unwound from the long interleaving paper 601 , and the long interleaving paper 603 is collected by the long interleaving paper take-up roll 602 via the free roller 604 . The long interleaf paper winding tension may be feedback-controlled to the motor torque of the long interleaf paper winding roll 602 by disposing a tension measuring roller in the middle, or obtained from a torque meter attached to the motor and an encoder signal. may

The long resin film 601 unwound from the long resin film unwinding roll 600 passes through a free roller 605, a tension measuring roller 606, and a free roller 607, and enters the plasma processing box 662 of the "atmospheric pressure plasma cleaning device". is brought into

Atmospheric pressure plasma head 665 arranged side by side along the transport direction of long resin film 601 with respect to long resin film 601 transported in a floating state inside plasma processing box 662 of the above-mentioned "atmospheric pressure plasma cleaning apparatus". , 666 is irradiated with atmospheric pressure plasma. The atmospheric pressure plasma heads 665 and 666 are arranged on opposite sides of the long resin film 601 so that both sides (first and second sides) of the long resin film 601 can be processed. there is Depending on the gas and conditions used, atmospheric pressure plasma treatment generates a large amount of ozone, which requires evacuation. The temperature is appropriately adjusted so that the temperature of the long resin film does not become too high.

The long resin film 601 unloaded from the "atmospheric pressure plasma cleaning apparatus" is carried into a "wet plating apparatus" having wet plating baths 642, 643, 644, 645. FIG.

That is, the long resin film 601 carried out from the plasma processing box 662 of the "atmospheric pressure plasma cleaning apparatus" is carried into the wet plating bath 642 via the free roller 608 and the power supply rollers 609 and 610 corresponding to both sides. and after being carried out of the wet plating tank 642 via free rollers 613 and 614 in the wet plating tank 642, it passes through power supply rollers 615 and 616, and passes through free rollers 617 and power supply rollers 618 corresponding to both sides. , 619 into the wet plating bath 643 .

Next, the long resin film 601 carried into the wet plating tank 643 is conveyed out of the wet plating tank 643 via free rollers 620 and 621 in the wet plating tank 643, and then fed rollers 622 and 623. , and is conveyed into a wet plating bath 644 via a free roller 624 and feeder rollers 625 and 626 corresponding to both sides.

Next, the long resin film 601 carried into the wet plating tank 644 passes through free rollers 627 and 628 in the wet plating tank 644 and is carried out from the wet plating tank 644. Then, it is conveyed into the wet plating tank 645 via a free roller 631 and feeder rollers 632 and 633 corresponding to both sides.

The elongated resin film 601 carried into the wet plating tank 645 passes through the free rollers 634 and 635 in the wet plating tank 645 and is carried out from the wet plating tank 645. It passes through and is carried out of the "wet plating apparatus".

In this apparatus for manufacturing a resin film with a metal film, the "wet plating apparatus" is composed of four wet plating tanks 642, 643, 644 and 645, but is not limited to four tanks. It may be composed of four or more wet plating tanks. In addition, FIG. 3 omits illustration of pumps and the like necessary for circulating the washing tank and the plating tank.

Further, anodes 646, 647, 648, 649, 650, 651 corresponding to both sides of the long resin film 601 to be carried in are placed in the wet plating tanks 642, 643, 644, 645 constituting the "wet plating apparatus". , 652, 653, 654, 655, 656, 657, 658, 659, 660, 661 are arranged respectively. In the wet plating tanks 642, 643, 644, and 645, the long resin films 601 on each side of the wet plating tanks 642, 643, 644, and 645 are connected to a plating power source (rectifier) in pairs and the anodes and power supply rollers for the cathodes. The wet plating baths 642, 643, 644 and 645 are copper sulfate plating baths.

Next, the long resin film 601 carried out from the "wet plating apparatus" passes through a free roller 638, a tension measuring roller 639, and a free roller 640 so as to be taken up by a long resin film take-up roll 641. is configured to The film take-up tension is measured by a tension measuring roller 639 and feedback-controlled to a long resin film take-up roll 641 .

According to the conventional (conventional example) apparatus for manufacturing a resin film with a metal film in which an "atmospheric pressure plasma cleaning apparatus" is incorporated, one side of the long resin film 601 transported in the plasma processing box 662 in a floating state The surface of the metal seed layer (first surface) is irradiated with atmospheric pressure plasma from the upstream atmospheric pressure plasma head 666 to wash the first surface. 2 surface), the second surface is also cleaned by irradiating the atmospheric pressure plasma from the downstream atmospheric pressure plasma head 665, so pinholes in the metal film on the metal seed layer (first surface and second surface) Since such defects are less likely to be formed, it is possible to manufacture a high-quality resin film with a metal film.

[ Problems when the conventional (conventional) atmospheric pressure plasma cleaning device is incorporated ]
However, plasma is applied to one metal seed layer surface (first surface) of the long resin film 601 from the atmospheric pressure plasma head 666 on the upstream side, and then the long resin film 601 is irradiated from the atmospheric pressure plasma head 665 on the downstream side. When the conventional "atmospheric pressure plasma cleaning apparatus" that irradiates plasma toward the other metal seed layer surface (second surface) is incorporated, the metal on the opposite side of the metal seed layer (first surface) that is irradiated with plasma The surface of the seed layer (second surface) is likely to be oxidized by oxygen in the ambient atmosphere (atmosphere) of the back surface, and there is a problem that the effect of cleaning the surface of the metal seed layer (second surface) by the atmospheric pressure plasma head 665 on the downstream side is reduced. Were present.

5. Atmospheric pressure plasma cleaning device according to the first embodiment
An atmospheric pressure plasma apparatus is an apparatus capable of irradiating a resin film with plasma without requiring vacuum equipment, and is used for the purpose of modifying the surface of the resin film, roughening the surface, and the like. As with the vacuum plasma apparatus, there are medium frequency (MHz), high frequency (MHz), and microwave (GHz) types of power sources, and the higher the frequency, the less rough the surface and the more uniform the effect can be expected. Nitrogen, argon, air, or the like is used as the plasma gas base, and is mixed with a small amount of additive gas depending on the purpose.

The atmospheric pressure plasma cleaning apparatus according to the first embodiment incorporated in the metal film-attached resin film manufacturing apparatus shown in FIG. It is designed to uniformly clean each surface (first surface and second surface) of the metal seed layer while preventing back surface oxidation caused by plasma heat load.

4 to 6, the atmospheric pressure plasma cleaning apparatus according to the first embodiment is arranged to face the plasma processing box 700 with the long resin film 10 transported in the plasma processing box 700 interposed therebetween. The plasma P generated by the first atmospheric pressure plasma head 701 and the second atmospheric pressure plasma head 702 is generated by the plasma heads 701 and 702. Each surface (first surface and second surface) of the metal seed layer of the long resin film 10 is simultaneously irradiated with the plasma gas from the slit portions 703 and 704 . The plasma gas emitted together with the plasma P from the slit portions 703 and 704 of the plasma heads 701 and 702 may contain a small amount of oxygen, hydrogen, or the like added to nitrogen or argon, but at most 0.1 %, far less than the oxygen concentration in the atmosphere.

According to the atmospheric pressure plasma cleaning apparatus according to the first embodiment, each surface (first surface and second surface) of the metal seed layer to be plasma cleaned is separated from the slit portions 703 and 704 of the plasma heads 701 and 702. Since the released plasma gas places the substrate in an atmosphere containing extremely little oxygen, oxidation of the rear surface caused by the thermal load of the atmospheric pressure plasma becomes difficult, and each surface (first surface and second surface) of the metal seed layer is Even washing becomes possible.

Therefore, defects such as pinholes are less likely to occur in the metal films formed on the first surface and the second surface of the metal seed layer by the wet plating method, and a higher quality metal film-coated resin film can be obtained at a high yield. It becomes possible to manufacture.

6. Atmospheric pressure plasma cleaning apparatus according to the second embodiment
The atmospheric pressure plasma cleaning apparatus according to the second embodiment incorporated in the metal film-attached resin film manufacturing apparatus shown in FIG. It is intended to uniformly clean each surface (first surface and second surface) of the metal seed layer by preventing back surface oxidation caused by the thermal load of the atmospheric pressure plasma when the is incorporated.

That is, the atmospheric pressure plasma cleaning apparatus according to the second embodiment is arranged to face the plasma processing box 800 with the long resin film 10 conveyed in the plasma processing box 800 interposed therebetween, as shown in FIGS. It is composed of a first atmospheric pressure plasma head 801 and a second atmospheric pressure plasma head 802, and as in the atmospheric pressure plasma cleaning apparatus according to the first embodiment, the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head Slits 803 and 804 are provided on the long resin film 10 side of 802, and the outer peripheral edge portions of the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802 on the long resin film 10 side and each Gas partitions 811, 812, 821, 822 are attached around the slits 803, 804, and the plasma P generated by the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802 is Each surface (first surface and second surface) of the metal seed layer of the long resin film 10 is simultaneously irradiated from the slit portions 803 and 804 together with the plasma gas.

According to the atmospheric pressure plasma cleaning apparatus according to the second embodiment, gas is provided around the outer peripheral edge portions of the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802 and the slit portions 803 and 804. Due to the action of the partition walls 811, 812, 821, and 822, it becomes difficult for oxygen present in the plasma processing box 800 to flow into the plasma P irradiation area of FIG. Since each surface (first surface and second surface) of the layer is placed in an atmosphere with a lower oxygen concentration, backside oxidation is more difficult to occur, and each surface (first surface and second surface) of the metal seed layer is Even washing becomes possible.

Examples of the present invention will be specifically described below.

The vacuum film forming apparatus used in the examples is the sputtering web coater shown in FIG. 2 for forming metal seed layers on both sides of a long resin film. A resin film manufacturing apparatus with a metal film incorporating the atmospheric pressure plasma cleaning apparatus according to the second embodiment shown in FIG. 9 is applied.

[Deposition of Metal Seed Layer]
Metal seed layers were formed on both sides of the long resin film using the sputtering web coater shown in FIG. A heat-resistant polyimide film "Upilex (registered trademark)" manufactured by Ube Industries, Ltd., having a width of 600 mm, a length of 1000 m, and a thickness of 25 μm, was used for the long resin film 114 shown in FIG.

The metal seed layers formed on both sides (first and second surfaces) of the long resin film 114 are formed by forming a Cu film as the second layer on the Ni—Cr film as the first layer. Therefore, a Ni—Cr target is used as the target of the magnetron sputtering cathode 139 provided in the film forming chamber 112 for forming the metal seed layer on the first surface of the long resin film 114, and the magnetron sputtering cathodes 140, 141, A Cu target was used as the 142 target. A Ni—Cr target is used as the target of the magnetron sputtering cathode 342 provided in the film forming chamber 312 for forming the metal seed layer on the second surface of the long resin film 114 . A Cu target was used as the target of .

In this state, after the air in the film formation chamber 112 and the film formation chamber 312 is evacuated to 5 Pa using a plurality of dry pumps, 3×10 pumps are further pumped using a plurality of turbomolecular pumps and cryo-coils. It was evacuated to ^-3 Pa.

Next, while starting the rotation drive device of the sputtering web coater to transport the long resin film 114 at a transport speed of 5 m/min, argon gas was introduced at 300 sccm, and each magnetron sputtering cathode of the Ni—Cr target. A power of 20 kW and a power of 30 kW were applied to the magnetron sputtering cathodes of the Cu targets, respectively, to form a Ni—Cr layer of 25 nm as the first layer and a Cu layer of 100 nm as the second layer.

Then, the long resin film 114 with the metal seed layers formed on both sides is carried into the winding chamber 113, and the long interleaving paper 149 is sandwiched between the layers of the long resin film 114 to prevent blocking. The long resin film 114 was wound around the take-up roll 146 .

Although a PET film having a thickness of 10 μm is used for the long interleaving paper 149, a PP (polypropylene) film may be used.

[Formation of metal film]
A long resin film 601 having metal seed layers composed of a Ni—Cr layer and a Cu layer formed on both sides and wound while sandwiching a long interleaving paper for blocking prevention between the film layers is used as the metal film-coated resin film 601. The long interleaving paper 603 is unwound while being separated from the long resin film unwinding roll 600 of the manufacturing apparatus, and the long resin film 601 is carried into the "atmospheric pressure plasma cleaning apparatus" at a conveying speed of 1 m / min, After cleaning the surface of the metal seed layer with the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802 to remove the component from the long interleaving paper 603 transferred to the surface of the metal seed layer, the transfer speed is 1 m / min. A Cu layer of 1 μm was plated on the metal seed layer by carrying it into a “wet plating apparatus”.

Furthermore, the conveying speed is changed to 3 m/min, the long resin film 601 is carried into the "atmospheric pressure plasma cleaning apparatus", and the surface of the metal seed layer is cleaned by the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802. is washed to remove the components from the long interleaving paper 603 transferred to the surface of the metal seed layer, and then carried into the "wet plating apparatus" at a conveying speed of 3 m / min to deposit 1 μm of Cu on the metal seed layer. layer was plated.

As the "atmospheric pressure plasma cleaning apparatus", a remote type high frequency (13 MHz) plasma apparatus using plasma gas in which 100 ppm of oxygen is mixed with argon gas is used. A voltage of 500 V is applied from a plasma power supply (not shown) to the first atmospheric pressure plasma head 801 and the second atmospheric pressure plasma head 802 which are arranged opposite to the long resin film 10 conveyed in a floating state.

Observation of both sides (metal seed layer surface) of the long resin film 601 immediately after being carried out from the "atmospheric pressure plasma cleaning apparatus" revealed that the transport speed was 1 m/min and the transport speed was 3 m/min. Even in the case of minutes, the phenomenon of red discoloration (that is, the phenomenon of oxidation of the metal seed layer) was not confirmed.

[Comparative example]
Using the metal film-attached resin film manufacturing apparatus of FIG. The long resin film 601 is carried into the "atmospheric pressure plasma cleaning apparatus" at 1 m/min, and the surface of the metal seed layer is cleaned by the atmospheric pressure plasma head 665 and the atmospheric pressure plasma head 666 to transfer the long interleaving paper 603. After removing the components from the metal seed layer, it was carried into a "wet plating apparatus" at a conveying speed of 1 m/min, and a Cu layer of 1 μm was plated on the metal seed layer.

Further, the conveying speed is changed to 3 m/min, the long resin film 601 is carried into the "atmospheric pressure plasma cleaning apparatus", and the atmospheric pressure plasma head 665 and the atmospheric pressure plasma head 666 are used to clean the surface of the metal seed layer. After removing the components from the long interleaving paper 603 transferred to the surface of the metal seed layer, it is carried into the "wet plating apparatus" at a conveying speed of 3 m / min, and a 1 μm Cu layer is plated on the metal seed layer. did.

In addition, a remote type high frequency (13 MHz) plasma device using a plasma gas in which 100 ppm of oxygen is mixed with argon gas is used for the above-mentioned "atmospheric pressure plasma cleaning device". A voltage of 500 V is applied from a plasma power source (not shown) to the atmospheric pressure plasma head 665 and the atmospheric pressure plasma head 666 which are arranged side by side along the transport direction of the film 601 .

Observation of both sides (metal seed layer surfaces) of the long resin film 601 immediately after the plasma cleaning carried out from the "atmospheric pressure plasma cleaning apparatus" revealed that the transport speed was 1 m/min and the transport speed was 3 m. A phenomenon of red discoloration (that is, a phenomenon in which the metal seed layer is oxidized) was confirmed in both cases at 1 m/min.

[Evaluation method]
As shown in FIG. 10, components 100 of the long interleaving paper (such as the resin film component and the solvent component contained in the resin film as described above) are locally transferred to the surface of the metal seed layer 101 of the long resin film. It has been confirmed by observation with an electron microscope that this portion becomes a pinhole with a diameter of several μm after wet plating. By applying this, it is possible to evaluate the cleaning effect of the transfer component by the atmospheric pressure plasma by the number of pinholes.

However, since it is difficult to confirm pinholes in a resin film with metal films on both sides having metal films on both sides, first, the metal film on the first surface of the resin film with metal films on both sides prepared for evaluation was masked. The metal film on the opposite surface (second surface) was removed by etching, then pinholes with a field of view of 5.6 mm × 4.2 mm were photographed with a transmission microscope, and pinholes with a diameter of 3 μm or more were counted by image analysis. to evaluate. Similarly, the metal film on the second surface of another resin film with metal films on both sides prepared for evaluation was masked and the metal film on the opposite surface (first surface) was removed by etching. A pinhole with a field of view of 6 mm×4.2 mm is photographed, and pinholes with a diameter of 3 μm or more are counted and evaluated by image analysis.

Table 1 shows the reduction in the number of pinholes in the presence or absence of atmospheric pressure plasma based on such evaluation.

The column "without plasma irradiation" in Table 1 indicates the number of pinholes on the first and second surfaces of the resin film with metal films on both sides, which was not subjected to plasma cleaning.

[confirmation]
(1) From the results shown in Table 1, in Examples, the first surface of the double-sided metal film-coated resin film that was not plasma-cleaned both when the transport speed was 1 m/min and when the transport speed was 3 m/min. and the number of pinholes on the second surface (see "Without plasma irradiation" column in Table 1).

(2) On the other hand, in the comparative example, it was confirmed that the number of pinholes on the first and second surfaces of the resin film with metal films on both sides was significantly reduced compared to the number of pinholes on the second surface, which was not plasma-cleaned. It is also confirmed that the number of pinholes is slightly larger than that of the first surface.

The reason for this is that when the first surface of the resin film with metal films on both sides is plasma-cleaned by the atmospheric pressure plasma head 666, the second surface on the back side is oxidized. It is inferred that this is because the cleaning effect of the cleaning agent of

According to the present invention, a high-quality metal-coated resin film having no pinholes or the like in the metal film can be produced with a high yield. It has industrial applicability as a film manufacturing device.

P Plasma 100 Components transferred from long interleaving paper 101 Metal seed layers 110, 210 Unwinding chambers 111, 211 Drying chambers 124, 224 Heater units 112, 212, 312 Film forming chamber 400 Transfer chambers 113, 213 Winding chamber 114, 214 long resin films 10, 601 long resin films 115, 215, 600 with metal seed layers deposited long resin film unwinding rolls 146, 246, 641 long resin film winding rolls 149, 249, 603 long Interleaving papers 148, 248 Long interleaving paper unwinding roll 602 Long interleaving paper winding rolls 131, 231, 331 Can rollers 138, 238, 338 Shielding plates 139, 140, 141, 142, 239, 240, 241, 242, 339 , 340, 341, 342 sputtering cathodes 116, 118, 120, 122, 123, 143, 145, 147, 216, 218, 220, 222, 223, 243, 245, 247, 401, 402, 403, 604, 605, Free rollers 117, 121, 130, 132, 144, 217, 221, 230, 232, 244 , 332, 330, 606, 639 tension measuring rollers 119, 129, 133, 219, 229, 233, 333, 329 motor driven rollers 642, 643, 644, 645 wet plating baths 609, 610, 615, 616, 618, 619 , 622, 623, 625, 626, 629, 630, 632, 633, 636, 637 Feed rollers 646, 647, 648, 649, 650, 651, 652, 653, 654, 655, 656, 657, 658, 659, 660, 661 anodes 662, 700, 800 plasma processing boxes 665, 666 atmospheric pressure plasma heads 701, 801 first atmospheric pressure plasma heads 702, 802 second atmospheric pressure plasma heads 703, 704, 803, 804 slit portions 811, 812, 821, 822 gas partition

Claims (9)

A long resin film unwinding roll in which a long resin film having metal seed layers formed on both sides is wound while sandwiching a long interleaving paper between the layers;
a long interleaving paper winding roll for separating and winding the long interleaving paper from the long resin film unwound from the long resin film unwinding roll;
a wet plating bath in which the long resin film from which the long interleaving paper has been separated is loaded and a metal film is formed on the metal seed layer;
A long resin film winding roll for winding the long resin film on which the metal film is formed, and
Resin with a metal film provided with an atmospheric pressure plasma cleaning device for cleaning the surface of the metal seed layer of the long resin film from which the long interleaving paper has been separated, between the long resin film unwinding roll and the wet plating tank. In film manufacturing equipment,
In the plasma processing box of the atmospheric pressure plasma cleaning apparatus, a first atmospheric pressure plasma head and a second atmospheric pressure plasma head are arranged facing each other with a long resin film interposed therebetween. 1. An apparatus for producing a resin film with a metal film, characterized in that the surface of the metal seed layer of the film is simultaneously irradiated with plasma. 2. The metal film according to claim 1, wherein a gas partition wall is provided around the outer periphery of the long resin film side of the first atmospheric pressure plasma head and the second atmospheric pressure plasma head and around each of the slits. Equipment for manufacturing resin films with 3. The apparatus for manufacturing a resin film with a metal film according to claim 1, wherein the metal seed layer and the metal film of the long resin film contain Cu as a main component. The long interleaf paper is made of polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl alcohol, polycarbonate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, aramid, polyimide, triacetate, or affixed thereto. 3. The apparatus for producing a resin film with a metal film according to claim 1, wherein the apparatus is composed of a combined composite. 3. The apparatus for producing a resin film with a metal film according to claim 1, wherein said atmospheric pressure plasma cleaning apparatus is of a remote control type. A step of unwinding the long resin film from a long resin film unwinding roll in which a long resin film having metal seed layers formed on both sides is wound while sandwiching a long interleaving paper between the layers;
A step of separating the long interleaving paper from the long resin film unwound from the long resin film unwinding roll and winding it on a long interleaving paper winding roll;
a step of carrying the long resin film from which the long interleaving paper has been separated into a wet plating tank to form a metal film on the metal seed layer;
In the method for producing a resin film with a metal film, the method for producing a resin film with a metal film comprising the step of winding the long resin film having the metal film formed thereon on a long resin film take-up roll,
Before the long resin film from which the long interleaving paper is separated is carried into the wet plating tank, plasma is generated from the first atmospheric pressure plasma head and the second atmospheric pressure plasma head which are arranged facing each other with the long resin film interposed therebetween. simultaneously irradiating the surface of each metal seed layer of the long resin film with atmospheric pressure plasma cleaning method. 7. The method for producing a resin film with a metal film according to claim 6, wherein the metal seed layer and the metal film of the long resin film contain Cu as a main component. The above long interleaving paper is pasted with polyethylene, polypropylene, polyethylene terephthalate, polyethylene naphthalate, polystyrene, polyvinyl alcohol, polycarbonate, polyphenylene sulfide, polyether ether ketone, polyether sulfone, aramid, polyimide, triacetate alone or these 7. The method for producing a resin film with a metal film according to claim 6, wherein the resin film is composed of a combined composite. 7. The method for producing a resin film with a metal film according to claim 6, wherein the apparatus for cleaning the surface of each metal seed layer of the long resin film with atmospheric pressure plasma is a remote-controlled apparatus.

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