JP7172334B2 - Apparatus and method for manufacturing resin film substrate with metal film provided with ion beam processing means - Google Patents

Description

TECHNICAL FIELD The present invention relates to an apparatus and method for manufacturing a resin film substrate with a metal film, which is equipped with an ion beam processing means, and in particular, before forming a metal film on a long resin film transported by a roll-to-roll system in a vacuum. The present invention also relates to an apparatus and method for manufacturing a metal film-coated resin film substrate that performs ion beam processing to improve adhesion.

BACKGROUND ART Electronic devices such as liquid crystal panels, notebook computers, digital cameras, and mobile phones use flexible wiring substrates having wiring circuits formed on the surface of a heat-resistant resin film. This flexible wiring board is produced by forming a metal film-attached resin film substrate by providing a metal film on one or both sides of a heat-resistant resin film, and then applying thin film techniques such as photolithography and etching to the metal film. It can be produced by performing a patterning process. In recent years, the wiring circuits of flexible wiring boards manufactured in this way have become increasingly finer and denser. It is required that

Conventionally, as a method for manufacturing the metal film-attached resin film substrate, there is a method in which a metal foil is attached to a heat-resistant resin film with an adhesive (a method for manufacturing a three-layer substrate), and a method in which a heat-resistant resin solution is applied to the metal foil. After coating, it is dried and manufactured (casting method), or a film is formed on a heat-resistant resin film only by a vacuum film-forming method, or a metal thin film layer is formed by a vacuum film-forming method and a metal by a wet plating method. A method (metallizing method) is known in which thick film layers are formed in this order. Vacuum deposition, sputtering, ion plating, ion beam sputtering and the like are generally used as the vacuum film forming method in the metallizing method.

Regarding the above-mentioned metallizing method, for example, in Patent Document 1, after sputtering chromium on a polyimide insulating layer, copper is sputtered to form a conductor layer on the polyimide insulating layer. Techniques for making film substrates are disclosed. Further, in Patent Document 2, a base metal layer formed by sputtering with a copper-nickel alloy as a target and a copper thin film layer formed by sputtering with a copper as a target are laminated in this order on a polyimide film. A technique for producing a material for a flexible circuit board is disclosed in which a decrease in adhesive strength between a copper thin film layer and a polyimide film is suppressed at high temperatures.

As described above, the resin film substrate with a metal film, which is produced by forming a metal film on the surface of the polyimide film by sputtering, is required to have high adhesion between the polyimide film and the metal film. Therefore, as a technique for further improving this adhesion, Patent Document 3 discloses that a long polyimide film transported by a roll-to-roll method is subjected to an ion beam treatment in a vacuum immediately before film formation. A technique is disclosed in which the outermost surface of the film is scraped off to expose a clean surface, thereby improving the adhesion between the polyimide film and the metal film.

JP-A-2-98994 JP-A-6-97616 JP 2017-088988 A

When performing vacuum film formation on the surface of a substrate made of a heat-resistant resin film such as a polyimide film, a long resin film is formed by a roll-to-roll method using a sputtering web coater as described in Patent Document 3. It is common to carry out vacuum film formation while conveying. In this case, before forming a metal film on the surface of the long resin film, if the long resin film being conveyed in the vacuum space is subjected to an ion beam treatment, the resin film can have a high density in an extremely short time. energy is simultaneously applied in the width direction, the long resin film may be thermally expanded or softened to cause so-called trough wrinkles. In particular, since it is effective to shave off a larger amount of clean surface in order to increase the adhesion, there is a general tendency to increase the output of the ion beam. However, when the ion beam power is increased, the softening of the resin film, which does not occur when the power is low, sometimes causes wrinkles.

In order to suppress the occurrence of the above trough wrinkles, a film widening mechanism such as a pinch roll may be installed immediately after the ion beam treatment to stretch the ion beam treated long resin film in its width direction. The effect of suppressing the occurrence could not be expected so much. In the present invention, when a metal film is formed on the surface of a long resin film by the roll-to-roll method, even if the long resin film is subjected to ion beam treatment as a pretreatment, trough wrinkles are generated. It is an object of the present invention to provide a manufacturing apparatus and a manufacturing method that are difficult to produce.

In order to achieve the above object, the apparatus for manufacturing a resin film substrate with a metal film according to the present invention includes vacuum film forming means for forming a metal film on a long resin film that is transported in a vacuum by a roll-to-roll method. A manufacturing apparatus for a metal film-coated resin film substrate comprising: a center portion in the width direction of a resin film transport path and both ends in the width direction downstream of the center portion in the transport direction on the upstream side of the vacuum film forming means Ions consisting of two ion beam irradiation devices arranged in a substantially V shape or one ion beam irradiation device having a substantially V shape that irradiates ion beams toward two linear regions connecting the part A beam irradiation means is provided.

A method for manufacturing a resin film substrate with a metal film according to the present invention is a method for manufacturing a resin film substrate with a metal film, in which a metal film is formed on a long resin film that is transported in a vacuum by a roll-to-roll method. In the resin film before film formation , using an ion beam irradiation means consisting of two ion beam irradiation devices arranged in a substantially V shape or one ion beam irradiation device having a substantially V shape , It is characterized in that two linear regions connecting the center portion in the width direction and both end portions in the width direction downstream of the center portion in the transport direction are subjected to ion beam processing at the same time.

According to the present invention, it is possible to suppress the occurrence of trough wrinkles that tend to occur when ion beam processing is performed on a long resin film transported by a roll-to-roll method. As a result, the irradiation energy of the ion beam can be increased, so that a high-quality metal film-coated resin film substrate with high adhesion can be produced with a high yield.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing a specific example of a manufacturing apparatus for a resin film substrate with a metal film according to the present invention; 2 is a perspective view of a specific example of ion beam irradiation means provided in the manufacturing apparatus of FIG. 1. FIG. FIG. 3 is a perspective view showing ion beam irradiation means provided in a conventional apparatus for manufacturing a resin film substrate with a metal film. 2 is a perspective view of another specific example of ion beam irradiation means provided in the manufacturing apparatus of FIG. 1. FIG.

1. Apparatus for Manufacturing Resin Film Substrate with Metal Film Hereinafter, as a specific example of the apparatus for manufacturing a resin film substrate with a metal film according to the present invention, heat load is applied while conveying a long heat-resistant resin film by a roll-to-roll method in a vacuum. A vacuum film forming apparatus for forming a metal film by such a film forming process will be described in detail with reference to FIG. The vacuum film forming apparatus shown in FIG. 1 is also called a sputtering web coater, and is an apparatus for continuously forming a metal film by sputtering film forming, which is a film forming process in which a heat load is applied to a long resin film A. be. In FIG. 1, among various rolls that play a role in conveying a long resin film along a predetermined path, the roll driven by a motor is denoted by M, which means a motor, and the tension measurement roll is denoted by a tension pickup. TP means free roll, and F means free in the circle.

The film substrate processing apparatus shown in FIG. 1 comprises an unwinding chamber 10 for unwinding the resin film A, a drying chamber 20 for drying the unwound resin film A, and a The ion beam processing chamber 30 performs ion beam processing in order to increase the adhesive force between the resin film A and the metal film, the film deposition chamber 40 performs the metal film deposition on the resin film A subjected to the ion beam processing, and the resin film A after deposition. The winding chambers 50 for winding are arranged in this order from the right side to the left side of the paper surface of FIG. By transporting A by a roll-to-roll method, a resin film substrate with a metal film can be continuously produced.

Specifically, in the unwinding chamber 10 , the resin film A before film formation unwound from the unwinding roll 11 follows a path defined by the free roll 12 , the tension measuring roll 13 and the free roll 14 . After being conveyed along, it exits the unwinding chamber 10 and enters the adjacent drying chamber 20 . The tension measuring roll 13 measures the tension of the resin film A when unwound from the unwinding roll 11, and is feedback-controlled by the unwinding roll 11 so that the tension is constant.

In the drying chamber 20, the resin film A is conveyed along a reciprocating path defined by a driving roll 21, a free roll 22, a tension measuring roll 23, a free roll 24, and a free roll 25. A drying process is performed by five heaters 26 provided at positions facing the resin film A running on the conveying path. The tension measured by the tension measuring roll 23 is feedback-controlled by the driving roll 21 so that the tension of the resin film A during the drying process is constant. After the above drying process, the resin film A leaves the drying chamber 20 and enters the adjacent ion beam processing chamber 30 .

In the ion beam processing chamber 30, the resin film A is transported along a path defined by the free rolls 31, 32, 33, 34, the transport path of the resin film A between the free rolls 32 and 33. The film-forming surface of the resin film A before film-forming is ion-beam-processed by the ion beam irradiation means 35 provided in the position facing . The resin film A subjected to the ion beam treatment by the ion beam irradiation means 35 is widened in the width direction by the widening mechanism 36 consisting of pinch rolls. These ion beam irradiation means 35 and widening mechanism 36 will be described later in detail. The resin film A, which has been subjected to the ion beam treatment and width expansion, exits the ion beam chamber 30 and enters the adjacent film formation chamber 40 .

In the film forming chamber 40, the resin film A is conveyed along a path defined by a drive roll 41, a tension measurement roll 42, a can roll 43, a tension measurement roll 44, and a drive roll 45. A metal film is deposited step by step by four magnetron sputtering cathodes 46, 47, 48 and 49 provided along the outer peripheral surface of the substrate. A coolant flows through the inside of the can roll 43, so that the resin film A can be cooled from the back side during sputtering. When a plate-shaped target is used for the magnetron sputtering cathode, nodules (growth of foreign matter) may occur on the target. may be used.

In the film forming chamber 40, the tension measured by the tension measuring roll 42 is feedback-controlled by the drive roll 41 so that the tension of the resin film A on the upstream side of the can roll 43 is constant. The tension measured by the tension measuring roll 44 is feedback-controlled by the drive roll 45 so that the tension of the resin film A is constant. A partition plate 40a is provided in the film forming chamber 40 in order to prevent sputtered particles scattered from the magnetron sputtering cathodes 46 to 49 from adhering to the walls and the like. The resin film A formed by sputtering leaves the film forming chamber 40 and enters the adjacent winding chamber 50 .

In the winding chamber 50 , the resin film A is transported along a path defined by a free roll 51 , a tension measuring roll 52 and a free roll 53 , and then wound on a winding roll 54 . The tension of the resin film A measured by the tension measuring roll 52 is feedback-controlled by the winding roll 54 so that the tension of the resin film A when wound by the winding roll 54 is constant.

A metal film can be formed on one side or both sides of the resin film A by using the apparatus for manufacturing a resin film substrate with a metal film. When forming a film on one side of the resin film A, the resin film A may be transported in one direction from the unwinding roll 11 to the winding roll 54 in a roll-to-roll manner. On the other hand, when forming a film on both sides of the resin film A, first, the resin film A is transported in one direction by roll-to-roll as described above to form a film on the first surface of the resin film A, and then this single-sided film formation is performed. The finished resin film A is removed from the winding roll 54 and set again on the unwinding roll 11 . Then, the resin film A may be formed on the second surface opposite to the first surface in the same manner as the film formation on the first surface except that the resin film A is unwound from the path indicated by the dotted line in FIG. .

As described above, when film formation is performed on both sides of the resin film A, if the resin film A after film formation on the second surface is wound up by the winding roll 54 as it is, the metal film on the first surface previously formed is removed. A so-called blocking phenomenon may occur in which the film and the metal film on the second surface come into strong contact and stick together in a vacuum. In order to prevent the occurrence of this blocking phenomenon, an interleaving paper unwinding roll 55 and a free roll 56 are provided in the winding chamber 50 , and the resin film A after the formation of the second surface is wound by the winding roll 54 . When taking it, the film-like interleaving paper B unwound from the interleaving paper unwinding roll 55 is passed through the free roll 56 and wound around the winding roll 54.例文帳に追加

In each of the unwinding chamber 10 to the winding chamber 50, various exhaust equipment (not shown) such as a dry pump, a turbomolecular pump, and a cryo-coil are installed in order to reduce the pressure in the interior to a vacuum atmosphere and maintain the vacuum atmosphere. Especially in the film forming chamber 40, for sputtering film formation, the pressure is reduced to about 10 ⁻⁴ Pa and then the pressure is adjusted to about 0.1 to 10 Pa by introducing a sputtering gas. A known gas such as argon is used as the sputtering gas, and a gas such as oxygen is further added depending on the purpose. The shape and material of each vacuum chamber are not particularly limited as long as they can withstand such a reduced pressure state, and various types can be used.

Since the apparatus for manufacturing a resin film substrate with a metal film according to one embodiment of the present invention described above performs sputtering film formation as a film formation process with a thermal load, the film formation chamber 40 includes vacuum film formation means. As described above, four magnetron sputtering cathodes are provided. Another type of vacuum deposition means is provided. Moreover, the various roll groups defining the transport path of the resin film A are not limited to those shown in FIG.

Examples of the material of the resin film used as the base material of the metal film-coated resin film substrate produced by the metal film-coated resin film substrate manufacturing apparatus include polyethylene terephthalate (PET), polyethylene, polypropylene, polystyrene, polyvinyl In addition to resin films with relatively poor heat resistance such as alcohol and polycarbonate, polyimide, polyamide, polyester, polytetrafluoroethylene, polyphenylene sulfide, polyethylene naphthalate, polyetheretherketone, polyethersulfone, aramid, triacetate, liquid crystal polymer A heat-resistant resin film such as Among these, polyimide is preferable because it is superior in flexibility required for a flexible substrate with a metal film, strength required in practical use, and electrical insulation suitable as a wiring material.

When a metal film is formed on the surface of the resin film by sputtering using the sputtering web coater shown in FIG. By attaching a Cu target, a long heat-resistant resin film substrate with a metal film is produced in which a base metal layer made of a Ni-based alloy and a thin film layer made of Cu are laminated on one or both sides of the resin film. be able to.

The base metal layer is also referred to as a seed layer, and its composition is appropriately selected according to the characteristics such as electrical insulation and migration resistance required for the resin film substrate with a metal film. , Monel, etc., are commonly selected. When the Cu thin film layer formed on the base metal layer is to be thickened, it is preferable to form the film by wet plating as a post-process of dry plating by vacuum film formation. This thickening by wet plating may be performed by electroplating alone, or may be performed by a combination of electroless plating as primary plating and electrolytic plating as secondary plating. In either case, the film can be favorably thickened under general wet plating conditions.

A flexible wiring board having a desired circuit pattern can be produced from the metal film-coated resin film substrate produced as described above by a general patterning process. For example, a flexible wiring board having a predetermined wiring pattern can be obtained by a subtractive method in which a patterned resist is provided on a metal film and then the metal film portion exposed from the resist is removed by etching.

2. Ion Beam Irradiation Means As described above, in the apparatus for manufacturing a resin film substrate with a metal film according to one embodiment of the present invention, the ion beam irradiation means is positioned upstream of the positions of the magnetron sputtering cathodes 46 to 49, which are the vacuum film formation means. 35 is provided. As shown in FIG. 2, the ion beam irradiation means 35 is composed of two rod-shaped ion beam irradiation devices 1a and 1b provided at positions facing the transport path of the resin film A transported in the direction of the arrow. These two ion beam irradiation devices 1a and 1b are arranged in two straight lines connecting the widthwise central portion of the conveying path of the resin film and both widthwise end portions downstream of the central portion in the conveying direction. They are arranged in a substantially V shape as a whole so as to irradiate ion beams toward the regions R1 and R2.

With such a configuration, the resin film A conveyed by the roll-to-roll method is gradually irradiated with an ion beam from the central portion toward both ends, so thermal expansion and softening of the resin film A are caused from the central portion in the width direction. It can occur gradually towards both ends. Therefore, it is possible to suppress the occurrence of trough wrinkles that may occur due to thermal expansion and softening.

That is, as shown in FIG. 3, the conventional ion beam irradiation means 2 was arranged so as to extend in the width direction of the transport path of the resin film A transported in the direction of the arrow. The ion beam was simultaneously irradiated to the linear region R3 extending in the width direction. As a result, since the linear region R3 in the width direction of the resin film A is simultaneously subjected to a thermal load in a very short time, the stress in the width direction due to thermal expansion or softening becomes excessive, and trough wrinkles are likely to occur.

On the other hand, the ion beam irradiation means 35 provided in the manufacturing apparatus of the specific example of the present invention is configured by arranging the two ion beam irradiation devices 1a and 1b as a whole in a substantially V shape as described above. Since the linear regions R1 and R2 inclined with respect to the width direction of the resin film A are simultaneously irradiated with the ion beam, the stress in the width direction due to thermal expansion or softening can be appropriately dispersed, thereby preventing the generation of trough wrinkles. can be effectively suppressed.

In the manufacturing apparatus of one specific example of the present invention, the extending direction of each of the two linear regions R1 and R2 is inclined at 30 to 60° with respect to the conveying direction of the conveying route of the resin film A. It is preferable to dispose the two rod-shaped ion beam irradiation devices at the same angle as above, and more preferable to arrange the two rod-shaped ion beam irradiation devices so as to be inclined at an angle of approximately 45°. If this angle is less than 30°, the ion beam irradiation apparatus becomes too long and requires a large space for its installation, resulting in high cost. Conversely, if this angle exceeds 60°, the effect of suppressing the generation of trough wrinkles is less likely to occur.

The ion beam irradiation means 35 provided in the apparatus for manufacturing a resin film substrate with a metal film according to the present invention is limited to the two ion beam irradiation devices 1a and 1b arranged in a substantially V-shape as a whole. Instead, one ion beam irradiation device having a substantially V shape may be used. Further, as shown in FIG. 4, two ion beam irradiation devices 1a and 1b are arranged so that the positions of the widthwise central portions of the transport path of the resin film A simultaneously irradiated by them are shifted from each other in the transport direction. may As a result, it is possible to more reliably irradiate the ion beam to the central portion of the resin film A in the width direction.

3. Widening Mechanism As described above, the apparatus for manufacturing a resin film substrate with a metal film according to one embodiment of the present invention widens the resin film A immediately after being ion beam treated by the ion beam irradiation means 35 in the width direction thereof. A mechanism 36 is provided. The widening mechanism 36 comprises two pairs of pinch rolls 3a, b and 4a, b, as shown in FIG. These two pairs of pinch rolls 3a, b and 4a, b are arranged so that the end portion located on the inner side in the width direction of the resin film A out of the both end portions of each pinch roll pair is closer to the end portion located on the outer side in the width direction. The rotating shafts thereof are tilted with respect to the width direction so that both are located downstream in the conveying direction. As a result, the resin film A is widened in its width direction.

In this way, by sandwiching and widening both ends of the resin film A from the front and back surfaces by the two pairs of pinch rolls 3a, b and 4a, b immediately after the ion beam treatment, the film widening effect is obtained by the pinch rolls. It can also extend downstream of 3a,b and 4a,b. As described above, in the case of the conventional ion beam irradiation means in which the rod-shaped ion beam irradiation device extends in the width direction of the resin film A, trough wrinkles are likely to occur. In this case, the width-enlarging mechanism such as a pinch roll is required to be severely adjusted. Since the pinch rolls and other widening mechanisms are not required to be particularly severely adjusted, the manufacturing apparatus of the embodiment of the present invention is preferable in this respect as well.

Although the apparatus for producing a resin film substrate with a metal film according to the present invention has been described above with reference to specific examples, the present invention is not limited to the above specific examples, and various modifications can be made without departing from the scope of the present invention. Modifications and variations may be included. For example, in the above specific example, when forming a metal film on both sides of a long resin film, first, it is transported in one direction by roll-to-roll to form a film on one side, and after the film formation on one side obtained It was necessary to remove the long resin film from the winding roll, set it on the unwinding roll, and transport it in one direction again by roll-to-roll to form a film on the other side, but the present invention is limited to this. Instead, for example, two can rolls are installed in a manufacturing apparatus for a resin film substrate with a metal film, and one side and the other side of a long resin film are wound around these two can rolls. By forming the film, the film may be formed on both sides by only one roll-to-roll transfer.

In addition, when forming films on both sides of the long resin film with two can rolls as described above, on one side and the other side of the long resin film at a position immediately upstream of the upstream can roll The ion beam treatment may be performed at the same time or with a time lag. Since the free roll or the like comes into contact with the ion beam, the effect of the ion beam treatment may be reduced. Therefore, at the position immediately upstream of the upstream can roll, only the first film forming surface was subjected to ion beam treatment, and at the position immediately upstream of the downstream can roll, the ion beam treatment was performed on the side opposite to the first film forming surface. It is preferable to subject the film formation surface to ion beam treatment.

[Example]
A long heat-resistant resin film with a metal film was produced using a vacuum film forming apparatus (sputtering web coater) as shown in FIG. A heat-resistant polyimide film "Upilex (registered trademark)" manufactured by Ube Industries, Ltd. having a width of 600 mm, a length of 1000 m, and a thickness of 25 μm was used as the long resin film A serving as the base material. On both sides of the resin film A, a metal film having a laminated structure consisting of a Ni—Cr film as a base metal layer and a Cu thin film layer thereon is formed. A -Cr target was used, and Cu targets were used as the targets of the magnetron sputtering cathodes 47, 48 and 49.

Further, in the ion beam irradiation means 35 installed in the ion beam processing chamber 30, there are two lines connecting the widthwise central portion of the conveying path of the resin film A and both widthwise end portions downstream of the central portion in the conveying direction. Two rod-shaped ion beam irradiation apparatuses of the anode layer source type with an irradiation effective width of 500 mm were used so as to irradiate the ion beams toward a linear region. It was placed at an angle of about 45°. Further, as shown in FIG. 4, by shifting these in the direction in which the resin film A is transported, the position of the central portion in the width direction of the resin film A that is simultaneously irradiated by the two ion beam irradiation devices 1a and 1b can be shifted to the transport direction. Directionally displaced from each other.

In the deposition chamber 40, the air inside was evacuated to 5 Pa using a plurality of dry pumps, and then evacuated to 3×10 ⁻³ Pa using a plurality of turbomolecular pumps and cryo-coils. In this state, the coolant is circulated in the can roll 43, and the motor-driven roll is started to transport the resin film A at a transport speed of 5 m/min. A power of 20 kW was applied to the magnetron sputtering cathodes 47 to 49, and a power of 30 kW was applied to each of the magnetron sputtering cathodes 47 to 49 to form a Ni—Cr layer of 25 nm and a Cu layer of 100 nm on the first surface of the resin film A.

When forming the film on the first surface, 100 sccm of argon gas was introduced into each of the two ion beam irradiation devices 1a and 1b, and the applied power was 0.5 kW, 1.0 kW, 1.0 kW, and 1.0 kW. It was changed stepwise to 5 kW and 2.0 kW. Then, the occurrence of trough wrinkles immediately after the ion beam treatment at each applied power was visually confirmed. In this way, after the long resin film A is transported in one direction by roll-to-roll to form a film on the first surface, the resin film A after film formation on one side is removed from the winding roll 54 and unwinding roll. 11, and again transported in one direction by roll-to-roll in the same manner as above to form a film on the second surface opposite to the first surface, and similarly immediately after the ion beam treatment at each applied power. The occurrence of trough wrinkles was visually confirmed.

[Comparative example]
As shown in FIG. 3, an anode layer source type ion beam irradiation device 2 with an irradiation effective width of 650 mm extending in the width direction of the resin film A is used as the ion beam irradiation means 35, and while introducing argon gas at 130 sccm, the ion beam is applied. Ni—Cr layers of 25 nm and 25 nm were formed on each of both sides of the resin film A in the same manner as in the above example, except that the power to A Cu layer of 100 nm was deposited.

[evaluation]
Table 1 below shows the results of the occurrence of trough wrinkles immediately after the ion beam treatment in Examples and Comparative Examples, together with the power applied to the ion beam irradiation apparatus. In Table 1 below, in addition to the ion beam power applied to the ion beam irradiation device, the ion beam power converted per effective width of 1 m of the ion beam irradiation device is also described. As can be seen from the ion beam power per effective width of 1 m, the applied power per effective width of 1 m in each stage of the example is the same as that of the comparative example. Since the energy density of the ion beam was the same, the irradiation time per unit length in the width direction of the resin film A was slightly longer in the example than in the comparative example.

From the results shown in Table 1 above, compared to the comparative example, the example showed less trough wrinkles caused by the ion beam treatment both during the film formation on the first surface and during the film formation on the second surface. It turns out that this is unlikely to occur. This is because, in the example, the ion beam treatment was applied gradually from the central portion in the width direction of the resin film toward both ends in the width direction. Therefore, it is considered that the widening effect of the pinch roll functioned effectively.

In addition, regarding the ion beam power per effective width of 1 m of the ion beam irradiation apparatus, wrinkles did not occur in the single-sided and double-sided film formation in both the examples and the comparative examples at 1.0 kW/m. Therefore, the ion beam power is preferably higher than 1.0 kW/m, more preferably 2.0 kW/m or more. However, in the comparative example, wrinkles occurred at 2.0 kW/m or more. On the other hand, in Example, the ion beam irradiation apparatus was arranged in a substantially V-shape, so that the film could be formed without wrinkles even at 3.0 kW/m. However, at 4.0 kW/m, trough wrinkles occurred even when arranged in a substantially V shape, so less than 4.0 kW/m is preferable.

1a, 1b, 2 ion beam irradiation device 3a, 3b, 4a, 4b pinch roll 10 unwinding chamber 20 drying chamber 30 ion beam processing chamber 40 film forming chamber 50 winding chamber 11 unwinding roll 12, 14, 22, 24, 25, 31, 32, 51, 53, 56 Free rolls 13, 23, 42, 44, 52 Tension measuring rolls 21, 41, 45 Drive rolls 26a, 26b, 26c, 26d, 26e Heaters 43 Can rolls 46, 47, 48 , 49 Magnetron sputtering cathode 54 Take-up roll 55 Interleaving paper unwinding roll 35, 135, 235 Ion beam irradiation means 36a, 36b, 37a, 37b Pinch roll A Resin film B Interleaving paper film R1, R2, R3 Linear region

Claims (10)

An apparatus for manufacturing a resin film substrate with a metal film, which is equipped with a vacuum film forming means for forming a metal film on a long resin film conveyed by a roll-to-roll method in a vacuum, wherein the vacuum film forming means On the upstream side, an approximately V-shaped ion beam is irradiated toward two linear regions connecting the center portion in the width direction of the transport path of the resin film and both end portions in the width direction downstream of the center portion in the transport direction. An apparatus for manufacturing a resin film substrate with a metal film, characterized in that an ion beam irradiation means comprising two ion beam irradiation devices arranged in a shape or one ion beam irradiation device having a substantially V shape is provided. . 2. The resin film substrate with a metal film according to claim 1, wherein the extending direction of each of the two linear regions is inclined at 30 to 60° with respect to the conveying direction of the conveying path. manufacturing equipment. The ion beam irradiation means is composed of two rod-shaped ion beam irradiation devices, and the positions of the widthwise central portion of the transport path irradiated simultaneously by these two ion beam irradiation devices are offset from each other in the transport direction. 3. The apparatus for manufacturing a metal film-coated resin film substrate according to claim 1, wherein 4. The resin film substrate with a metal film according to claim 1, further comprising a widening mechanism for stretching the resin film in the width direction immediately after the ion beam treatment. manufacturing device. The widening mechanism is composed of two pairs of pinch rolls that sandwich both ends of the resin film in the width direction from the front and back sides, and each pair of pinch rolls is positioned on the inner side of the resin film in the width direction of the both ends. 5. The rotating shafts are inclined with respect to the width direction so that the end located on the outer side in the width direction is located downstream in the conveying direction from the end located on the outer side in the width direction. A manufacturing apparatus for the metal film-attached resin film substrate described above. The resin film is polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyvinyl alcohol, polycarbonate, polyimide, polyamide, polyester, polytetrafluoroethylene, polyphenylene sulfide, polyethylene naphthalate, polyetheretherketone, polyethersulfone, aramid, triacetate. and a liquid crystal polymer. A method for manufacturing a metal film-coated resin film substrate in which a metal film is formed on a long resin film transported in a roll-to-roll system in a vacuum, comprising two ion beam irradiation devices arranged in a substantially V shape. Alternatively, using an ion beam irradiation means consisting of one ion beam irradiation device having a substantially V shape, in the resin film before the film formation, the center part in the width direction and the width downstream of the center part in the transport direction A method for manufacturing a resin film substrate with a metal film, characterized in that two linear regions connecting two directional end portions are simultaneously treated with an ion beam. 8. The method of manufacturing a resin film substrate with a metal film according to claim 7, wherein the width of the resin film immediately after the ion beam treatment is expanded in the width direction thereof. 2. The production of the metal film-attached resin film substrate according to claim 1, wherein the extending direction of each of the two linear regions is inclined by 30 to 60° with respect to the conveying direction of the resin film. Method. The resin film is polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyvinyl alcohol, polycarbonate, polyimide, polyamide, polyester, polytetrafluoroethylene, polyphenylene sulfide, polyethylene naphthalate, polyetheretherketone, polyethersulfone, aramid, triacetate. 10. The method for producing a metal film-attached resin film substrate according to claim 7, wherein the resin film substrate is a single product or a laminated product of any one of , and liquid crystal polymer.

Images