JP7142081B2 - 積層体、及び半導体装置 - Google Patents

積層体、及び半導体装置 Download PDF

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JP7142081B2
JP7142081B2 JP2020504473A JP2020504473A JP7142081B2 JP 7142081 B2 JP7142081 B2 JP 7142081B2 JP 2020504473 A JP2020504473 A JP 2020504473A JP 2020504473 A JP2020504473 A JP 2020504473A JP 7142081 B2 JP7142081 B2 JP 7142081B2
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oxide
insulator
conductor
film
region
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Japanese (ja)
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JPWO2019171205A1 (ja
JPWO2019171205A5 (https=
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舜平 山崎
正弘 高橋
智記 平松
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2022144504A priority Critical patent/JP2022171783A/ja
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Priority to JP2024082375A priority patent/JP2024103536A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/68—Floating-gate IGFETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/69—IGFETs having charge trapping gate insulators, e.g. MNOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H10D62/405—Orientations of crystalline planes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3434—Deposited materials, e.g. layers characterised by the chemical composition being oxide semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3466—Crystal orientation

Landscapes

  • Thin Film Transistor (AREA)
  • Semiconductor Memories (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
JP2020504473A 2018-03-06 2019-02-26 積層体、及び半導体装置 Active JP7142081B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2022144504A JP2022171783A (ja) 2018-03-06 2022-09-12 半導体装置
JP2024082375A JP2024103536A (ja) 2018-03-06 2024-05-21 半導体装置

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2018040042 2018-03-06
JP2018040041 2018-03-06
JP2018040046 2018-03-06
JP2018040046 2018-03-06
JP2018040041 2018-03-06
JP2018040042 2018-03-06
PCT/IB2019/051516 WO2019171205A1 (ja) 2018-03-06 2019-02-26 積層体、及び半導体装置

Related Child Applications (1)

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JP2022144504A Division JP2022171783A (ja) 2018-03-06 2022-09-12 半導体装置

Publications (3)

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JPWO2019171205A1 JPWO2019171205A1 (ja) 2021-02-25
JPWO2019171205A5 JPWO2019171205A5 (https=) 2022-02-17
JP7142081B2 true JP7142081B2 (ja) 2022-09-26

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JP2020504473A Active JP7142081B2 (ja) 2018-03-06 2019-02-26 積層体、及び半導体装置
JP2022144504A Withdrawn JP2022171783A (ja) 2018-03-06 2022-09-12 半導体装置
JP2024082375A Withdrawn JP2024103536A (ja) 2018-03-06 2024-05-21 半導体装置

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JP2022144504A Withdrawn JP2022171783A (ja) 2018-03-06 2022-09-12 半導体装置
JP2024082375A Withdrawn JP2024103536A (ja) 2018-03-06 2024-05-21 半導体装置

Country Status (5)

Country Link
US (2) US11387343B2 (https=)
JP (3) JP7142081B2 (https=)
KR (1) KR102740089B1 (https=)
CN (1) CN111819670B (https=)
WO (1) WO2019171205A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102208520B1 (ko) 2016-07-19 2021-01-26 어플라이드 머티어리얼스, 인코포레이티드 디스플레이 디바이스들에서 활용되는 지르코늄 산화물을 포함하는 하이-k 유전체 재료들
KR102686124B1 (ko) * 2021-09-07 2024-07-17 한양대학교 산학협력단 헥사고날 구조를 갖는 준-단배향 igzo 물질막, 및 그 제조방법, 그리고 준-단배향 igzo 물질막이 사용된 반도체 소자
TW202339171A (zh) * 2021-09-21 2023-10-01 日商半導體能源研究所股份有限公司 半導體裝置
CN115386887A (zh) * 2022-08-31 2022-11-25 青岛云路先进材料技术股份有限公司 一种非晶、纳米晶合金层叠体切割面的清洗液和清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017118106A (ja) 2015-12-18 2017-06-29 株式会社半導体エネルギー研究所 半導体装置
JP2017139460A (ja) 2016-01-29 2017-08-10 株式会社半導体エネルギー研究所 マイクロコントローラシステム
US20170256652A1 (en) 2016-03-03 2017-09-07 United Microelectronics Corp. Oxide semiconductor device and method of manufacturing the same
WO2017158465A1 (ja) 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 記憶装置

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KR102089200B1 (ko) * 2009-11-28 2020-03-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제조 방법
WO2011142371A1 (en) * 2010-05-14 2011-11-17 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
CN107947763B (zh) * 2010-08-06 2021-12-28 株式会社半导体能源研究所 半导体集成电路
TWI657580B (zh) * 2011-01-26 2019-04-21 Semiconductor Energy Laboratory Co., Ltd. 半導體裝置及其製造方法
JP5806905B2 (ja) * 2011-09-30 2015-11-10 株式会社半導体エネルギー研究所 半導体装置
US8941113B2 (en) * 2012-03-30 2015-01-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor element, semiconductor device, and manufacturing method of semiconductor element
US9048323B2 (en) * 2012-04-30 2015-06-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR102099261B1 (ko) * 2012-08-10 2020-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
US9263531B2 (en) * 2012-11-28 2016-02-16 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film, film formation method thereof, and semiconductor device
WO2015125042A1 (en) * 2014-02-19 2015-08-27 Semiconductor Energy Laboratory Co., Ltd. Oxide, semiconductor device, module, and electronic device
WO2015145292A1 (en) * 2014-03-28 2015-10-01 Semiconductor Energy Laboratory Co., Ltd. Transistor and semiconductor device
WO2016092427A1 (en) 2014-12-10 2016-06-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP6674269B2 (ja) * 2015-02-09 2020-04-01 株式会社半導体エネルギー研究所 半導体装置、及び半導体装置の作製方法
US9653613B2 (en) 2015-02-27 2017-05-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2016225613A (ja) * 2015-05-26 2016-12-28 株式会社半導体エネルギー研究所 半導体装置及び半導体装置の駆動方法
US10096631B2 (en) * 2015-11-30 2018-10-09 Semiconductor Energy Laboratory Co., Ltd. Signal processing circuit and semiconductor device including the signal processing circuit

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2017118106A (ja) 2015-12-18 2017-06-29 株式会社半導体エネルギー研究所 半導体装置
JP2017139460A (ja) 2016-01-29 2017-08-10 株式会社半導体エネルギー研究所 マイクロコントローラシステム
US20170256652A1 (en) 2016-03-03 2017-09-07 United Microelectronics Corp. Oxide semiconductor device and method of manufacturing the same
WO2017158465A1 (ja) 2016-03-18 2017-09-21 株式会社半導体エネルギー研究所 記憶装置

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Publication number Publication date
JPWO2019171205A1 (ja) 2021-02-25
US20200411658A1 (en) 2020-12-31
JP2024103536A (ja) 2024-08-01
US20220336616A1 (en) 2022-10-20
WO2019171205A1 (ja) 2019-09-12
KR20200128554A (ko) 2020-11-13
KR102740089B1 (ko) 2024-12-10
US11387343B2 (en) 2022-07-12
JP2022171783A (ja) 2022-11-11
CN111819670B (zh) 2024-04-09
CN111819670A (zh) 2020-10-23

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