JP7137512B2 - Crimp joining device - Google Patents

Description

The present invention relates to a cooling device for an image display panel.

FIG. 4 is (a) a cross-sectional view and (b) a top view showing a state in which the FPC board is pressure-bonded to the liquid crystal display panel. As shown in FIG. 4, the liquid crystal display panel 1 includes a first substrate 4 made of a non-translucent silicon substrate having integrated circuits and pixel electrodes, and a second substrate 4 made of a translucent glass substrate having transparent electrodes. 5 are pasted together at a predetermined interval with the electrode surfaces facing each other, and the liquid crystal 6 is sealed in the gap formed. A terminal electrode portion 8 of a flexible printed circuit board 2 (hereinafter referred to as an FPC board) is connected to the terminal electrode portion 8 of the liquid crystal display panel 1 . As a connection method, there is a method of driving a wire made of aluminum fine wire into the terminal electrode portion 8 by a wire bonding method. are connected via an anisotropic conductive film (hereinafter referred to as ACF) disposed on the terminal electrode portion 8 in order to save space. The periphery of the connection portion of the terminal electrode portion 8 is covered with a sealing resin 16 . An image is displayed in the effective pixel area 7 of the liquid crystal display panel 1 by supplying a voltage to the liquid crystal display panel 1 through the FPC board 2 .

As a conventional general connection method using ACF, first, the liquid crystal display panel 1 is placed on a heat-dissipating crimping stage, the ACF is attached to the terminal electrode portion 8 of the liquid crystal display panel 1, and the FPC is placed thereon. The substrate 2 is supplied, and the terminal electrode portions 8 of the FPC substrate 2 and the terminal electrode portions 8 of the liquid crystal display panel 1 are overlapped at predetermined positions. Next, the crimping head is heated, and the heated crimping head is pressed against the superimposed terminal electrode portion 8 through the protective sheet, thereby crimping and joining the terminal electrode portion 8 .

5 and 6 are cross-sectional views showing an ACF crimping and joining apparatus in the prior art. When the heated crimping head 10 is pressed against the terminal electrode portion 8 via the protective sheet 12, heat conduction from the crimping head 10 heats the pixels of the liquid crystal display panel 1, causing thermal deterioration of the members forming the pixels. etc. are likely to occur. As a countermeasure, a blowing unit 14 for blowing gas is arranged as shown in FIG. A method of cooling the liquid crystal display panel 1 by sending gas toward the periphery of the terminal electrode portion 8 of the liquid crystal display panel 1 through the use of a liquid crystal display panel 1 has been proposed (see Patent Documents 1 and 2). Further, a method of cooling the liquid crystal display panel 1 by arranging a Peltier element 13 inside the compression stage 9 as shown in FIG. 6 and adjusting the temperature thereof has been proposed (see Patent Document 3).

Japanese Patent Laid-Open No. 8-211401 JP 2015-197571 JP 2015-109359

In the prior art ACF crimping and joining apparatus as described in Patent Documents 1 and 2, a blower is provided toward the liquid crystal display panel placed on the crimping stage, and the liquid crystal display panel is cooled by gas sent from the blower. Therefore, the liquid crystal display panel can be cooled quickly. However, there is a concern that the cool air sent from the air blower escapes and the liquid crystal display panel cannot be stably cooled.

In the conventional ACF crimping and bonding apparatus as described in Patent Document 3, a Peltier element for temperature control is placed inside the crimping stage, and the liquid crystal display panel is cooled by adjusting the temperature. The liquid crystal display panel can be stably cooled. However, since the liquid crystal display panel is cooled by indirect heat conduction from the Peltier element, there is a concern that the liquid crystal display panel cannot be cooled quickly.

The above problem is not a problem that occurs only in the liquid crystal display panel, but a problem that can also occur in image display panels (organic EL panels, etc.) other than the liquid crystal display panel.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an image display panel cooling device capable of quickly and stably cooling an image display panel.

A cooling device for an image display panel, comprising: a mounting section on which an image display panel is mounted; and a cooling section for cooling the image display panel with a fluid, wherein the mounting section contains the fluid. A cooling device for an image display panel is provided with a recess for retention.

A cooling device for an image display panel may be provided in which a temperature control unit for controlling the temperature of the fluid is disposed inside the concave portion.

The temperature control unit may be a cooling device for an image display panel that is composed of a Peltier element.

The concave portion may be a cooling device for an image display panel provided at a position facing an effective pixel area of the image display panel.

The recess may be a cooling device for an image display panel configured to be closed by the image display panel when the image display panel is placed on the placement portion.

The fluid may be a cooling device for an image display panel, which is gas.

According to the present invention, the image display panel can be cooled quickly and stably.

FIG. 4 is a flow chart showing a method of pressure bonding an FPC board to a liquid crystal display panel; FIG. 2 is a diagram showing an ACF pressure bonding device according to an embodiment of the present invention, (a) a cross-sectional view of the ACF pressure bonding device without a Peltier element installed, and (b) a cross section of the ACF pressure bonding device with a Peltier element installed. figure. FIG. 2 is a diagram schematically showing the conductive particles of the ACF, (a) a diagram showing a good electrical connection, and (b) a diagram showing a bad electrical connection. FIG. 3(a) is a cross-sectional view and (b) is a top view showing a state in which an FPC board is pressure-bonded to a liquid crystal display panel; FIG. 2 is a cross-sectional view showing an ACF crimping and joining device in the prior art; FIG. 2 is a cross-sectional view showing an ACF crimping and joining device in the prior art;

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a flow chart showing a method of pressure bonding an FPC board to a liquid crystal display panel. FIG. 2 is a diagram showing an ACF pressure bonding apparatus according to an embodiment of the present invention, (a) a cross-sectional view of an ACF pressure bonding apparatus without a Peltier element installed, and (b) an ACF pressure bonding apparatus with a Peltier element installed. 1 is a cross-sectional view of the device; FIG.

As shown in FIG. 2(a), the crimping stage 9 is provided with a box-shaped concave portion 11 whose top is open. The concave portion 11 is arranged so as to face the effective pixel region 7 of the liquid crystal display panel 1 . A blower 14 is provided on the bottom surface of the recess 11 . A gas such as air or nitrogen is sent from the air blower 14 toward the effective pixel area 7 of the liquid crystal display panel 1 . The air blower 14 is composed of a blower such as a fan, and an injection nozzle connected to an externally installed gas supply device via a pipe. The temperature of the gas sent out from the air blower 14 is, for example, normal temperature or lower. When the temperature of the gas sent from the blowing section 14 is lower than that of the surrounding atmosphere, the gas is relatively heavy and tends to stay inside the recess 11 . Further, since the recess 11 is closed by the liquid crystal display panel 1 placed on the compression stage 9, the gas stays inside the recess 11 in a sealed state. The gas remaining inside the recess 11 contacts the first substrate 4 of the liquid crystal display panel 1, where heat exchange takes place. By causing the gas to stay inside the concave portion 11, the liquid crystal display panel 1 can be cooled more stably than the cooling method of only blowing the gas. If the pixels of the liquid crystal display panel 1 are heated to a temperature of, for example, 120° C. or more, liquid crystal decomposition or color unevenness may occur. is preferred.

As shown in FIG. 2(b), a Peltier element 13 for adjusting the temperature of the gas sent from the air blower 14 may be arranged inside the recess 11 provided in the pressure bonding stage 9. As shown in FIG. The Peltier element 13 is arranged between the air blower 14 and the effective pixel area 7 of the liquid crystal display panel 1, directly receives the gas sent from the air blower 14, and cools or heats the gas to adjust the temperature of the gas. . Since the temperature of the gas staying inside the recess 11 is directly controlled by the Peltier element 13, the liquid crystal display panel 1 can be cooled quickly and stably.

When the FPC board 2 is pressure-bonded to the liquid crystal display panel 1, first, the liquid crystal display panel 1 is formed in the liquid crystal display panel manufacturing process G1 shown in FIG. The liquid crystal display panel 1 is similar to the liquid crystal display panel 1 shown in FIG. 4, for example.

Next, in the ACF attaching step G2 shown in FIG. 1, the ACF 3 is attached to the terminal electrode portion 8 of the liquid crystal display panel 1. As shown in FIG. Specifically, first, as a preparatory step, pre-production inspections such as activation of the ACF pressure bonding apparatus and temperature adjustment and position adjustment of the pressure bonding head 10 are sequentially performed, and the terminal electrode portions 8 of the liquid crystal display panel 1 and the FPC board 2 are inspected. Clean up. If the ACF 3 is pressure-bonded with foreign matter or stains adhering to the terminal electrode portion 8, the bonding becomes weak and the bonding surface may peel off. After cleaning the terminal electrode portion 8, parts necessary for pressure bonding are added to a predetermined parts loader, and a tray for storing the pressure bonded liquid crystal display panel 1 is installed on the unloader side. After that, the position of the liquid crystal display panel 1 is adjusted so that the effective pixel area 7 fits within the opening of the concave portion 11 formed in the compression stage 9 , and the liquid crystal display panel 1 is placed on the compression stage 9 . Both the pressure bonding stage 9 and the pressure bonding head 10 can be moved in the x-axis direction, the y-axis direction, and the z-axis direction by an air cylinder.

After these preparatory steps are completed, the ACF 3 cut into a shape necessary for pressure bonding is conveyed from the parts loader and attached to the terminal electrode portion 8 of the liquid crystal display panel 1 . When attaching the ACF 3, it is preferable to prevent air bubbles from entering between the terminal electrode portion 8 and the ACF 3, because this eliminates concerns about insufficient bonding strength and crimping failure. Next, the FPC board 2 is transferred onto the ACF 3, and the positions of the terminal electrode portions 8 of the liquid crystal display panel 1 and the terminal electrode portions 8 of the FPC board 2 are adjusted so that they are at predetermined bonding positions. In addition, a protective sheet 12 is provided on the FPC board 2 to prevent the FPC board 2 from warping or thermally deteriorating due to heating during compression bonding.

Next, in the temporary crimping step G3 shown in FIG. 1, the preheated crimping head 10 is moved downward and is brought into contact with the protective sheet 12, whereby the terminal electrode portion 8 of the liquid crystal display panel 1 and the FPC substrate are bonded together. 2 is temporarily pressure-bonded to the terminal electrode portion 8. Temporary compression bonding is performed at a lower temperature and in a shorter time than the final compression bonding. At this time, the pressing position of the compression head 10 may be shifted away from the liquid crystal 6 from the central portion of the terminal electrode portion 8 so that the pixels of the liquid crystal display panel 1 are less likely to be affected by the heating by the compression head 10 . Further, when the temporary pressure bonding is performed, the liquid crystal display panel 1 is cooled by blowing gas from the air blower 14 as shown in FIG. As a result, it is possible to prevent thermal deterioration of pixels due to heat from the compression head 10 .

Next, in the final pressure bonding step G4 of FIG. 1, the pressure bonding head 10 is applied to the ACF 3 more uniformly than during temporary pressure bonding, and the terminal electrode portions 8 of the liquid crystal display panel 1 and the terminal electrode portions 8 of the FPC board 2 are bonded together. Perform full pressure bonding with The heat transferred to the ACF 3 is desirably within the range of about 160° C. to 200° C. Since the heat is conducted from the pressure bonding head 10 to the ACF 3 via the protective sheet 12 and the FPC board 2, the temperature of the pressure bonding head 10 is actually higher than that temperature. needs to be adjusted slightly higher. Further, when performing the final compression bonding, the liquid crystal display panel 1 is cooled by blowing gas from the air blower 14 as shown in FIG. As a result, it is possible to prevent thermal deterioration of pixels due to heat from the compression head 10 . The liquid crystal display panel 1 subjected to the final compression bonding is transported to a storage tray on the unloader side.

FIG. 3 is a diagram schematically showing the conductive particles of the ACF, (a) a diagram showing a good electrical connection, and (b) a diagram showing a bad electrical connection. In the ACF pressure bonding, it is desirable to evenly crush the conductive particles 15 present in the ACF 3 as a whole to the state shown in FIG. If the conductive particles 15 are not evenly crushed as in , the bonding strength of the crimped joint portion is weakened, and the crimped joint portion of the ACF 3 is peeled off during a reliability test or use, resulting in poor conduction.

In addition, in crimping and bonding using the ACF 3, rework is possible in the case where the conductive particles 15 are inadequately crushed or the position of the crimped portion is displaced. The ACF 3 can be easily peeled off with tweezers or the like, and after the peeling off, dirt such as deposits on the joint surface can be cleaned, and the ACF 3 can be pasted again and crimped and joined.

Next, in the resin fixing step G5 in FIG. 1, a thermosetting or ultraviolet-curing sealing resin 16, such as an acrylic sealing resin, is applied to the periphery of the pressure-bonded joint and cured to form a liquid crystal display as shown in FIG. Panel 1 is assembled. By applying the sealing resin 16, the strength of the crimped joint can be increased.

In the case where the conductive particles 15 sandwiched between the terminal electrode portion 8 of the liquid crystal display panel 1 and the terminal electrode portion 8 of the FPC board 2 are dispersed during pressure bonding, and the strength of the pressure bonding is insufficient, the ACF 3 is used. A particle matching type ACF in which 15 is difficult to separate may be used.

The air blower 14 and the Peltier element 13 may be arranged on the inner surface of the recess 11 of the crimping stage 9 or the like.

The air blower 14 may be a mechanism for sending liquid such as water or oil. However, the gas can control the temperature more quickly than the liquid and is easier to handle, so from that point of view, the gas is more suitable. Here, fluid media such as gases and liquids are collectively referred to as fluids.

The liquid crystal display panel 1 may be another image display panel such as an organic electroluminescence panel (organic EL panel).

The present invention can also be applied to devices other than ACF crimping and joining devices.

1 liquid crystal display panel 2 flexible printed circuit board (FPC board)
3 Anisotropic Conductive Film (ACF)
4 First Substrate 5 Second Substrate 6 Liquid Crystal 7 Effective Pixel Area 8 Terminal Electrode Section 9 Crimping Stage 10 Crimping Head 11 Recess 12 Protective Sheet 13 Peltier Element 14 Air Blower 15 Conductive Particle 16 Sealing Resin

Claims (5)

a placement section on which the image display panel is placed;
a cooling unit that cools the image display panel with a fluid;
a crimping head that bonds components to the image display panel by thermocompression;
A crimping and joining device comprising:
The mounting portion is provided with a recess for retaining the fluid ,
the recess is configured to be closed by the image display panel when the image display panel is placed on the placement portion;
A fluid delivery unit for delivering the fluid is provided inside the recess,
A pressure bonding device characterized by: 2. The apparatus according to claim 1, further comprising a temperature control section for controlling the temperature of the fluid, which is arranged inside the concave portion between the fluid delivery section and an effective pixel area of the image display panel. crimp bonding equipment. 3. The pressure bonding apparatus according to claim 2 , wherein the temperature control unit is composed of a Peltier element. 4. The pressure bonding apparatus for an image display panel according to claim 1, wherein the recess is provided at a position facing an effective pixel area of the image display panel. The pressure bonding apparatus according to any one of claims 1 to 4 , wherein the fluid is gas.

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