JP2002040459A - Compression bonding device for liquid crystal driving ic - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a liquid crystal driving IC thermocompression bonding device which can carry out easily and speedily positioning for thermocompression bonding between a connection terminal of a liquid crystal display panel and an output terminal of a liquid crystal driving IC while properly preheating the terminal part of the liquid crystal display panel. SOLUTION: A mount 31 is formed of a transparent material and a mount heating means 32 is so constituted as to generate heat by applying a voltage to a transparent conductive film 34 formed on the top surface of the mount 31 facing a terminal part 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC crimping apparatus for driving a liquid crystal, and more particularly, to a method for mounting a TC on a connection terminal of a liquid crystal display panel.
The present invention relates to a liquid crystal driving IC crimping apparatus for thermocompression bonding a liquid crystal driving IC such as a P or a bare chip via an anisotropic conductive material.

[0002]

2. Description of the Related Art FIG. 7 shows the structure of a liquid crystal display panel which has been generally used in the past. This liquid crystal display panel 1 is composed of two transparent substrates 2 made of, for example, glass and the like. , 3 and both transparent substrates 2,
A transparent electrode 4 made of ITO (indium tin oxide) or the like is formed on the inner side surface of 3. These transparent substrates 2 and 3 are bonded to each other while a predetermined gap 6 is held by a peripheral sealing material 5, and a liquid crystal 7 is sealed in the gap 6. The size of one of the transparent substrates 2 and 3 is larger than the size of the other transparent substrate 2 opposed thereto. A terminal portion 9 having a connection terminal 8 connected to the electrode 4 is formed.

The connection terminal 8 has a so-called TCP (ta
8 such as a pe carrier package) and a bare chip (hereinafter simply referred to as a liquid crystal driving IC) 11 shown in FIG.
Output terminal 12 is connected.

Conventionally, as a method of connecting the output terminal 12 to the connection terminal 8, the connection terminal 8
By heating the anisotropic conductive material 13 in a state where an anisotropic conductive material 13 in which conductive particles are mixed with an adhesive is interposed between the output terminal 12 and the connection terminal 8, the output terminal 12 is connected to the output terminal 12. A method of thermocompression-bonding conductive material 12 with conductive material 12 via anisotropic conductive material 13 has been adopted.

As a device for crimping the liquid crystal driving IC 11, a liquid crystal driving IC crimping device has been conventionally used.

As shown in FIG. 8, the liquid crystal driving IC crimping device 15 has a receiving table 16 on which the terminal portion 9 of the liquid crystal display panel 1 is placed.

As shown in FIG. 9, a peripheral table 17 is provided on the outer periphery of the receiving table 16 on the same plane as the receiving table 16.
The peripheral table 17 is provided with parts other than the terminal parts 9 of the liquid crystal display panel 1.

When the connection terminal 8 of the liquid crystal display panel 1 and the output terminal 12 of the liquid crystal driving IC 11 are thermocompression-bonded via the anisotropic conductive material 13 at the position facing the receiving table 16, A conductive material heating means 19 such as a heater head for heating the conductive conductive material 13 is provided.

Further, conventionally, the liquid crystal driving IC crimping device 15 has a method of preheating the terminal portion 9 prior to heating by the conductive material heating means 19 from the viewpoint of reducing defective bonding such as voids. Was adopted.

As means for performing such preliminary heating, the liquid crystal driving IC crimping device 15 has a pedestal heating means 20 for heating the pedestal 16.

An example of the cradle heating means 20 is as follows.
The pedestal 16 is formed using a metal or ceramic member, and a heater 21 made of a heating resistor such as a coil is provided on the peripheral table 17 as shown in FIG. There is a way to do that.

Then, the connection terminal 8 of the liquid crystal display panel 1 and the output terminal 1 of the liquid crystal driving IC 11 are
In the case of performing thermocompression bonding with the terminal portion 9, first,
And a position, for example, using a marker or the like, for performing positioning at the time of thermocompression bonding to a position facing the portion of the liquid crystal driving IC 11 having the output terminal 12 (hereinafter referred to as an output terminal portion 23). Make a mark.

After the terminal 9 is placed on the pedestal 16, the pedestal 16 is heated by the pedestal heating means 20, and the heat is conducted to the terminal 9 on the pedestal 16. Section 9 is preheated.

Then, the anisotropic conductive material 13 is adhered on the connection terminal 8 of the terminal portion 9 which has been preheated by using its own viscosity or the heat of the preheating.

In this state, the liquid crystal driving IC 1 is placed above the terminal portion 9 to which the anisotropic conductive material 13 is attached in FIG.
Position 1.

At this time, a camera 24 shown in FIG. 8 is positioned between the anisotropic conductive material 13 and the liquid crystal driving IC 11, and the camera 24 adjusts the position of the terminal 9 to the liquid crystal driving IC 11. I do.

That is, as shown in FIG. 10, the camera 24 has a terminal part side lens 27 for recognizing an alignment mark formed on the terminal part 9 of the liquid crystal display panel 1 inside a flat camera body 25. And an IC-side lens 28 for recognizing a positioning mark provided on the output terminal section 23 of the liquid crystal driving IC 11.

When positioning is performed by the camera 24, first, the terminal side lens 27 is driven so that the positioning mark of the terminal section 9 is recognized by the terminal side lens 27. 28, and the liquid crystal driving IC 1 is driven by the IC lens 28.
1 to recognize the alignment mark of the output terminal unit 23.

The position error between the two marks is calculated from the two alignment marks recognized by the camera 24, and the liquid crystal driving IC 11 is manually or automatically moved so as to eliminate the error. 8 and the output terminal 12 are aligned for thermocompression bonding.

After the alignment is completed, the camera 24 is connected to the anisotropic conductive material 13 and the liquid crystal driving IC 11.
And the liquid crystal driving IC 11
Is placed on the terminal portion 9 to which the anisotropic conductive material 13 is attached.

At this time, the liquid crystal driving IC 11 is connected to the terminal 9
And the anisotropic conductive material 13 is heated by the conductive material heating means 19.

As a result, the connection terminal 8 of the liquid crystal display panel 1 and the output terminal 12 of the liquid crystal driving IC 11 are thermocompression-bonded conductively via the anisotropic conductive material 13.

[0023]

In the conventional liquid crystal driving IC crimping apparatus 15, the positioning mark of the terminal 9 of the liquid crystal display panel 1 and the position of the output terminal 23 of the liquid crystal driving IC 11 are arranged. The alignment marks are recognized by different lenses 27 and 28 in different steps.

Originally, when aligning the terminal 9 of the liquid crystal display panel 1 with the output terminal 23 of the liquid crystal driving IC 11, both alignment marks are simultaneously recognized from the same direction using the same lens. This is preferable from the viewpoint that a complicated calculation is not required and alignment is easy.

However, conventionally, from the viewpoint of preheating the terminal portion 9 of the liquid crystal display panel 1, the pedestal 16 is made of an opaque metal or ceramic excellent in heat conduction. For this reason, in order to simultaneously recognize both alignment marks from the same direction using the same lens, even when a camera having a lens on the upper surface is positioned below the cradle 16 in FIG. And the positioning mark of the output terminal 23 could not be recognized.

To solve such a problem, for example,
It is also conceivable that the receiving table 16 is formed of a transparent member and the receiving table is heated from the side end surface of the receiving table 16 made of the transparent member.

In such a case, it is possible to simultaneously recognize the alignment mark of the terminal section 9 and the alignment mark of the output terminal section 23 from below the pedestal 16, but the pedestal 16 is weakly heated. Therefore, there is a problem that the terminal portion 9 cannot be appropriately preheated.

For this reason, the pre-heating of the terminal portion 9 of the liquid crystal display panel 1 is appropriately performed, and the alignment for the thermocompression bonding between the connection terminal 8 of the liquid crystal display panel 1 and the output terminal 12 of the liquid crystal driving IC 11 is simplified. In addition, there has been a problem that it cannot be performed quickly.

The present invention has been made in view of such a problem, and the pedestal is formed of a transparent material.
The pedestal heating means is configured to heat the pedestal by generating heat from the transparent conductive film formed on the surface of the pedestal. It is an object of the present invention to provide a liquid crystal driving IC crimping apparatus that can easily and quickly perform alignment for thermocompression bonding between a connection terminal of a panel and an output terminal of a liquid crystal driving IC.

[0030]

In order to achieve the above object, a liquid crystal driving IC crimping apparatus according to the present invention is characterized in that the pedestal is formed of a transparent material, and the pedestal heating means is provided on the pedestal. The configuration is such that heat is generated by applying a voltage to a transparent conductive film formed on a surface facing the terminal portion.

By adopting such a configuration, the alignment mark formed on the liquid crystal display panel and the liquid crystal driving IC are interposed via the pedestal made of a transparent material having excellent light transmittance and the transparent conductive film. The alignment marks that have been made can be simultaneously checked from the same direction by a camera, and the terminal portion can be appropriately preheated by causing the transparent conductive film to generate surface heat.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a liquid crystal driving I according to the present invention will be described.
An embodiment of a C crimping apparatus will be described with reference to FIGS.

Note that parts having the same or similar basic configuration as those of the related art will be described using the same reference numerals.

As shown in FIG. 1, the liquid crystal driving IC crimping apparatus 30 of the present embodiment has a substantially rectangular receiving base 31 on which the terminal portion 9 of the liquid crystal display panel 1 is mounted. The receiving base 31 is formed to have a larger plane area than the terminal portion 9. In the present embodiment, the cradle 31 is formed of a transparent material such as glass.

The pedestal 31 is provided with pedestal heating means 32 for heating the pedestal 31. That is, the pedestal heating means 32 has the transparent conductive film 34 formed on the surface of the pedestal 31. The transparent conductive film 34 may be formed by forming ITO (indium tin oxide) to a desired film thickness, for example.

A pair of electrode terminals 35 for applying a voltage to the transparent conductive film 34 is provided on the surface of the transparent conductive film 34 and outside the mounting portion of the terminal portion 9. Each of the electrode terminals 35 is connected to a voltage applying unit (not shown) via conductive means (not shown) such as a flexible wiring board.

Therefore, by applying a voltage to the transparent conductive film 34 through the electrode terminals 35, the transparent conductive film 34 can be heated.

The pedestal 31 and the pedestal heating means 32 are both formed of a transparent material or a transparent conductive film 34 having excellent light transmittance. When the camera 36 is positioned at the same position, the camera 36 can simultaneously recognize the alignment mark of the terminal 9 and the alignment mark of the output terminal 23 from the same direction.

The formation range and pattern of the transparent conductive film 34 may be set as desired according to the design concept.

That is, as shown in FIG.
4 is not limited to being formed entirely on the surface of the pedestal 31. For example, as shown in FIG.
Further, as shown in FIG. 4, the formation pattern of the transparent conductive film 34 may be formed in a substantially cross shape. In such a case, it is possible to simultaneously perform thermocompression bonding of a plurality of liquid crystal driving ICs and to cope with terminal portions having various shapes. In addition, to prevent the heating of the non-heatable portion of the liquid crystal display panel,
Alternatively, the heating area can be reduced to prevent the anisotropic conductive material 13 from being excessively heated.

On the outer periphery of the pedestal 31, the pedestal 3
A peripheral table 17 is provided on the same plane as the peripheral table 17.
On the peripheral table 17, a portion other than the terminal portion 9 of the liquid crystal display panel 1 is placed.

When the connection terminal 8 and the output terminal 12 are thermocompression-bonded to each other through the anisotropic conductive material 13 at a position facing the pedestal 31, the anisotropic conductive material 13 is heated. For example, a conductive material heating means 19 such as a heater head is provided. The conductive material heating means 19 heats the anisotropic conductive material 13 sandwiched between the connection terminal 8 and the output terminal 12 from above the liquid crystal driving IC 11 in FIG. It has become.

Next, the operation of the present embodiment will be described.

When thermocompression bonding of the liquid crystal driving IC 11 to the connection terminal 8 is performed by using the liquid crystal driving IC crimping device 30 in the present embodiment, first, thermocompression bonding of the connection terminal 8 and the output terminal 12 is performed. Alignment marks are provided on the terminal portion 9 of the liquid crystal display panel and the output terminal portion 23 of the liquid crystal driving IC 11, respectively.

Then, as shown in FIG.
After the terminal portion 9 of the liquid crystal display panel 1 is mounted on the terminal 1, an anisotropic conductive material 13 is attached on the connection terminal 8 of the terminal portion 9 by utilizing its own viscosity. In FIG. 5, parts of the liquid crystal display panel 1 other than the terminal section 9 are omitted.

Next, the liquid crystal driving IC 11 is positioned above the anisotropic conductive material 13 and the connection terminals 8 and the output terminals 12 are aligned for thermocompression bonding.

In this embodiment, since the pedestal 31 and the pedestal heating means 32 are each formed of a transparent transparent material or a transparent conductive film 34, one upwardly facing one in FIG. A camera 36 having a lens can be positioned below the cradle 31 in FIG.

Then, the positioning mark provided on the terminal portion 9 by the camera 36 and the output terminal portion 23
Is recognized, and the position error between the two recognized positioning marks is calculated by an arithmetic unit (not shown) such as a computer.

At this time, since the positioning mark provided on the terminal portion 9 and the positioning mark provided on the output terminal portion 23 can be simultaneously recognized from the same direction by the camera 36, both the positioning marks can be recognized. The calculation of the position error can be performed easily and quickly.

By moving the liquid crystal driving IC 11 in the X direction or the Y direction shown in FIG. 5 so as to eliminate the position error, the position of the connection terminal 8 and the output terminal 12 for thermocompression bonding can be adjusted. Done. This liquid crystal driving I
The movement of C11 may be performed manually, or an automatic transfer unit of the liquid crystal drive IC 11 such as a robot arm is provided, and the operation of the automatic transfer unit is controlled based on the calculation result of the calculation device. Thereby, the alignment may be performed automatically.

Further, by applying a voltage to the transparent conductive film 34 through the electrode terminal 35, the transparent conductive film 34 is heated and the pedestal 31 is heated.

Accordingly, the heat of the cradle 31 is conducted to the terminal portion 9 placed on the cradle 31,
Thereby, the preheating of the terminal portion 9 is performed.

At this time, since the terminal portion 9 of the liquid crystal display panel 1 can be directly heated by causing the receiving base 31 to generate surface heat, the terminal portion 9 can be appropriately preheated. In addition, since the surface of the cradle 31 is uniformly heated, the temperature can be easily controlled, and the energy can be efficiently used.

Further, since the terminal portion 9 is directly heated,
The influence of the outside air is small, and the temperature of the terminal portion 9 can be raised quickly. Therefore, for example, before the start of the alignment, the pedestal heating means 32 is turned off, and the pedestal heating means is turned on from the start of the alignment until the thermocompression bonding of the connection terminal 8 and the output terminal 12 is performed. The terminal section 9 may be preheated by turning on the terminal 32. In such a case, since the power consumption can be reduced, the manufacturing cost of the liquid crystal display panel 1 can be reduced.

After the terminal section 9 is preheated, the liquid crystal driving IC is manually or manually operated by pressing means (not shown).
11 is pressed against the terminal portion 9 via the anisotropic conductive material 13, and in this state, the conductive material heating means 19 heats the anisotropic conductive material 13.

As a result, as shown in FIG. 6, the connection terminal 9 of the liquid crystal display panel 1 and the output terminal 1 of the liquid crystal driving IC 11 are connected.
2 are thermocompression-bonded via the anisotropic conductive material 13 so as to be conductive.

Therefore, according to the present embodiment, the pedestal 31 and the transparent conductive film 3 made of a transparent material having excellent light transmittance.
4, the alignment mark provided on the liquid crystal display panel 1 and the alignment mark provided on the liquid crystal driving IC 11 can be simultaneously confirmed from the same direction by the camera 36, so that the connection terminal 8 and the output terminal 12 Can be easily and quickly adjusted for thermocompression bonding.

The surface of the transparent conductive film 34 is heated,
Since the terminal portion 9 can be directly heated, the preheating of the terminal portion 9 can be appropriately performed, and accordingly, the connection terminal 8 and the output terminal 1 can be reduced while crimping defects such as voids are reduced.
2 can be properly performed. Further, since the temperature difference between the upper surface and the lower surface of the terminal portion 9 can be reduced by causing the transparent conductive film 34 to generate heat, the warpage of the terminal portion 9 due to heating can be reduced.

It should be noted that the present invention is not limited to the above-described embodiment, but can be variously modified as needed.

For example, the anisotropic conductive material 13 may have a thermoplastic adhesive, or may have a thermosetting adhesive.

[0061]

As described above, according to the liquid crystal driving IC crimping apparatus according to the present invention, the thermocompression bonding between the connection terminal of the liquid crystal display panel and the output terminal of the liquid crystal driving IC can be performed simply and quickly. In addition, this thermocompression bonding can be appropriately performed while reducing bonding defects such as voids and the like, and a good liquid crystal display by a liquid crystal display panel can be realized.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a liquid crystal drive IC crimping apparatus according to the present invention.

FIG. 2 is a plan view showing a configuration around a pedestal in the embodiment of the liquid crystal driving IC crimping apparatus according to the present invention.

FIG. 3 is a plan view showing another embodiment different from FIG. 2 in the embodiment of the liquid crystal driving IC crimping apparatus according to the present invention.

FIG. 4 is a plan view showing another embodiment different from FIGS. 2 and 3 in the embodiment of the liquid crystal driving IC crimping apparatus according to the present invention.

FIG. 5 is a perspective view showing an alignment for performing thermocompression bonding between a connection terminal and an output terminal in the embodiment of the liquid crystal drive IC crimping apparatus according to the present invention.

FIG. 6 is a schematic longitudinal sectional view showing a crimped state of a connection terminal of a liquid crystal display panel and an output terminal of a liquid crystal driving IC.

FIG. 7 is a cross-sectional view showing a conventionally used liquid crystal display panel.

FIG. 8 is a perspective view showing a conventional liquid crystal driving IC crimping apparatus.

FIG. 9 is a plan view showing a configuration around a cradle in a conventional liquid crystal driving IC crimping apparatus.

FIG. 10 is a cross-sectional view showing a camera used for alignment for thermocompression bonding between a connection electrode and an output electrode in a conventional liquid crystal drive IC crimping apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Liquid crystal display panel 4 Transparent electrode 8 Connection terminal 9 Terminal part 11 Liquid crystal drive IC 12 Output terminal 13 Anisotropic conductive material 19 Conductive material heating means 30 Liquid crystal drive IC crimping apparatus 31 Cradle 32 Cradle heating means 34 Transparent conductive film

 ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Hiroyuki Nakado 18-8 Techno Park, Mita City, Hyogo Prefecture Opterex Co., Ltd. Amagasaki Plant Mita Office F term (reference) 2H092 GA48 GA51 GA57 GA60 HA25 MA32 MA35 NA27 NA29 PA06 5F044 NN13 NN19 PP11 5G435 AA17 BB12 EE44 EE45 HH12 KK03 KK05 KK09 KK10

Claims (1)

[Claims] 1. A pedestal on which a terminal portion of a liquid crystal display panel on which a connection terminal connected to a transparent electrode is formed, and pedestal heating means for heating the pedestal are provided, and a position facing the pedestal is provided. And a conductive material heating means for heating the anisotropic conductive material when the connection terminal and the terminal of the liquid crystal driving IC are thermocompressed via an anisotropic conductive material. A liquid crystal driving IC crimping device performs thermocompression bonding between the connection terminal and the liquid crystal driving IC terminal after preheating the terminal portion mounted on the receiving table with heating of the receiving table by means. In the apparatus, the cradle is formed of a transparent material, and the cradle heating means generates heat by applying a voltage to a transparent conductive film formed on a surface of the cradle facing the terminal portion. Must be configured Liquid crystal driving IC crimping apparatus characterized.