JP7130955B2 - Three-dimensional wiring board manufacturing method and three-dimensional wiring board - Google Patents

Description

The present invention relates to a three-dimensional wiring board manufacturing method and a three-dimensional wiring board.

A three-dimensional wiring board is known in which conductors are provided in a plurality of layers inside the board. A laminated ceramic substrate, which is one of such three-dimensional wiring substrates, is manufactured, for example, by forming a conductor pattern on a ceramic green sheet, laminating and firing a plurality of ceramic green sheets having the conductor pattern formed thereon. be able to.

However, firing of the ceramic green sheets may deform the substrate and change the positions of the conductors.

In Patent Document 1, by manufacturing a preceding ceramic substrate, the degree of deformation of the preceding ceramic substrate and the preceding conductor pattern on the surface of the substrate is grasped in advance, and the accuracy of the arrangement position of the conductors of the laminated ceramic substrate after manufacturing is improved. method is described.

That is, in the method for manufacturing a laminated ceramic substrate described in Patent Document 1, the degree of deformation of the preceding ceramic substrate and the preceding conductor pattern is grasped by manufacturing the preceding ceramic substrate, and the deformation of the preceding ceramic substrate and the preceding conductor pattern is determined. A conductor pattern is formed on the ceramic green sheet based on the degree. Then, by laminating and firing a plurality of ceramic green sheets, a laminated ceramic substrate is manufactured in which the accuracy of the arrangement position of the conductor is improved.

JP 2011-96821 A

However, in the above-described manufacturing method, the degree of deformation during firing changes depending on the conductor pattern, so there is a problem that it is difficult to manufacture a substrate with high conductor position accuracy according to various conductor patterns.

An object of the present invention is to solve the above problems, and to provide a three-dimensional wiring board having conductors with high positional accuracy and a method of manufacturing the same.

The method for manufacturing a three-dimensional wiring board of the present invention comprises:
A method for manufacturing a three-dimensional wiring board comprising an insulator, an in-plane conductor provided inside the insulator, and an interlayer support for supporting the in-plane conductor,
a step of applying a conductor paste for forming the in-plane conductor and an interlayer support paste for forming the interlayer support to a sheet that disappears during firing;
laminating a plurality of sheets including a sheet coated with the conductor paste and the interlayer support paste to form an unfired laminate;
firing the unfired laminate to eliminate the sheet and to sinter the conductor paste and the interlayer support paste;
placing and curing an insulating material on at least a portion of the portion where the sheet has disappeared;
and the plurality of sheets constituting the unfired laminate do not include a ceramic green sheet having a metal conductor paste .

The three-dimensional wiring board includes a plurality of the in-plane conductors and the interlayer supports,
Each of the plurality of in-plane conductors may be in contact with at least one of the plurality of interlayer supports.

The in-plane conductor positioned inside the three-dimensional wiring board may be in contact with at least two of the plurality of interlayer supports.

The interlayer support may include via conductors.

The interlayer support may comprise a non-conductive ceramic body.

A step of plating the in-plane conductor and the interlayer support after firing the unfired laminate and before disposing the insulating material may be further included.

A three-dimensional wiring board according to the present invention is a three-dimensional wiring board not provided with a ceramic layer containing a metal conductor,
an insulator that is not a sintered body ;
a plurality of in-plane conductors provided inside the insulator;
an interlayer support that supports the plurality of in-plane conductors;
with
unevenness is formed on the entire surface of the in-plane conductor,
The insulator is embedded in the concave portion of the in-plane conductor ,
The in-plane conductor and the interlayer support are sintered bodies .

A plating film may be formed on the upper and lower surfaces of the in-plane conductor.

each of the plurality of in-plane conductors has a flat plate shape,
The moisture-sensitive material, which is the insulator, may be arranged between the adjacent in-plane conductors.

Ceramic layers that do not contain the metal conductors may be arranged on both outer sides in the direction in which the plurality of in-plane conductors are arranged.

The interlayer support is a pair of external electrodes disposed on the outer surface of the insulator,
One of the two adjacent in-plane conductors is connected to one of the pair of external electrodes, and the other of the two adjacent in-plane conductors is connected to the other of the pair of external electrodes. may be connected to

According to the method for manufacturing a three-dimensional wiring board of the present invention, the sheet that disappears during firing is coated with the conductor paste and the interlayer support paste, laminated, and then fired, thereby causing the sheet to disappear. Since the insulating material is placed on at least part of the cut portion and cured, deformation is suppressed, and a three-dimensional wiring board having in-plane conductors with high positional accuracy can be manufactured. In other words, it is possible to prevent the arrangement position of the conductor inside the substrate from changing from the designed position due to the deformation of the ceramic substrate as in the conventional manufacturing method in which the electrode pattern is formed on the ceramic green sheet and then fired. can be done.

In addition, the three-dimensional wiring board of the present invention is manufactured by, for example, a method in which a conductive paste is applied on a sheet that disappears during firing and then fired, and an insulating material is placed in the portion where the sheet has disappeared and cured. As a result, unevenness is formed on the entire surface of the in-plane conductor, and the structure is such that the insulator enters into the recesses of the unevenness of the in-plane conductor. The in-plane conductors of the three-dimensional wiring board having such a structure are suppressed in deformation and have high positional accuracy.

1 is a perspective view of a three-dimensional wiring board according to a first embodiment; FIG. FIG. 2 is a side view of the three-dimensional wiring board cut along line II-II in the first embodiment; 4 is an enlarged view of an interface between an in-plane conductor and an insulator; FIG. 4A to 4C are diagrams for explaining the method of manufacturing the three-dimensional wiring board according to the first embodiment; FIG. FIG. 4 is a partial enlarged view of the three-dimensional wiring board in the second embodiment, and more specifically, an enlarged side view of an in-plane conductor and an interlayer support provided in the three-dimensional wiring board. It is a perspective view of a hygrometer as a three-dimensional wiring board in the third embodiment. FIG. 7 is a cross-sectional view of the hygrometer shown in FIG. 6 taken along line VII-VII; It is a figure for demonstrating the manufacturing method of a hygrometer. FIG. 4 is a side view of an unfired mother laminate produced in the manufacturing process of the hygrometer. 1 is a cross-sectional view of a hygrometer with a non-conductive interlayer support between adjacent in-plane conductors; FIG.

Embodiments of the present invention will be shown below, and features of the present invention will be specifically described.

<First embodiment>
FIG. 1 is a perspective view of a three-dimensional wiring board 100 according to the first embodiment. Also, FIG. 2 is a side view of the three-dimensional wiring board 100 according to the first embodiment cut along line II-II. 1, the surface electrode 10 shown in FIG. 2 is omitted.

A three-dimensional wiring board 100 includes an insulator 1 , a plurality of in-plane conductors 2 , and a plurality of interlayer supports 3 that support the in-plane conductors 2 .

The insulator 1 is made of resin or glass, for example, and has one main surface 1a and the other main surface 1b facing each other.

The in-plane conductor 2 is provided inside the insulator 1 in parallel with the one main surface 1a and the other main surface 1b. A plurality of in-plane conductors 2 are provided at different height positions, that is, different positions in the Z-axis direction, and constitute, for example, coils and capacitors. In the configuration example shown in FIG. 1, the in-plane conductors 2 include in-plane conductors 2a to 2c forming coils inside the insulator 1 and in-plane conductors 2d to 2e forming capacitors.

All the in-plane conductors 2 are in contact with at least one of the multiple interlayer supports 3 . In particular, the in-plane conductors 2 located inside the insulator 1 are in contact with at least two of the plurality of interlayer supports 3 . In-plane conductors 2a to 2e located inside insulator 1 may be connected to interlayer supports 3 at both ends thereof. In this case, for example, if the in-plane conductors 2a to 2c constitute the coil, the entire length of the in-plane conductors can be used as the coil pattern.

2, some of the in-plane conductors 2 are not in contact with the interlayer support 3, that is, appear to float without being supported by the interlayer support 3. This is because FIG. is a cross-sectional view taken along the line II-II, the figure shows a region in which some of the in-plane conductors 2 are not in contact with the interlayer support 3. Actually, all of the in-plane conductors 2 are It is in contact with the interlayer support 3 at some position.

An interlayer support 3 supports the in-plane conductor 2 . More specifically, the interlayer support 3 supports the in-plane conductors 2 provided at different positions in the Z-axis direction during manufacturing of the three-dimensional wiring board 100, which will be described later.

In this embodiment, the interlayer support 3 is provided inside the insulator 1 . The interlayer support 3 includes via conductors for conducting between a plurality of in-plane conductors 2 provided in different layers and between the in-plane conductors 2 and surface electrodes described later. For example, the interlayer support 3 forms a coil together with the in-plane conductors 2a-2c.

The interlayer support 3 may contain a non-conductive support in addition to the conductive via conductors. A non-conducting support is, for example, a ceramic body made of ceramic material. By making the interlayer supports 3 non-conductive, one supports the other while maintaining insulation between the interlayer supports 3, such as between the in-plane conductor 2d and the in-plane conductor 2e in FIG. can do.

Concavities and convexities are formed on the entire surface of the in-plane conductor 2 and the interlayer support 3 . The unevenness is formed in a baking process during manufacturing of the three-dimensional wiring board 100, as will be described later. The surface roughness Ra of the in-plane conductor 2 and the interlayer support 3 is, for example, 0.6 μm or more.

For reference, the surface roughness Ra of the plated electrode disposed on the conventional printed circuit board is 0.5 μm or less.

FIG. 3 is an enlarged schematic diagram of the interface between the in-plane conductor 2 and the insulator 1. As shown in FIG. As described above, unevenness is formed on the surface of the in-plane conductor 2 . As shown in FIG. 3, the insulator 1 enters into the recesses 21 forming the unevenness of the surface of the in-plane conductor 2 .

Similarly, the insulator 1 also enters into the recesses forming the unevenness of the surface of the interlayer support 3 .

The three-dimensional wiring board 100 in this embodiment further includes surface electrodes 10 connected to the conductive interlayer support 3 on one main surface 1 a and the other main surface 1 b of the insulator 1 . Surface electrode 10 is electrically connected to in-plane conductor 2 via interlayer support 3 . An electronic component (not shown) is mounted on the surface electrode 10, for example.

(Method for manufacturing three-dimensional wiring board)
FIG. 4 is a diagram for explaining the method of manufacturing the three-dimensional wiring board 100 according to the first embodiment.

First, a carbon sheet 41 prepared in advance is coated with a conductor paste 42 for forming an in-plane conductor 2 and an interlayer support paste 43 for forming an interlayer support 3 (FIG. 4A). ). The carbon sheet 41 is a sheet that disappears during firing.

Conductive paste 42 is placed on carbon sheet 41 . Further, the interlayer support paste 43 is arranged so as to fill the through holes provided in the carbon sheet 41 . Conductive paste containing Ag, Cu, Ni, or the like, for example, is used as the conductive paste 42 and the interlayer support paste 43 .

When a non-conductive interlayer support 3 such as a ceramic body is arranged in addition to the conductive interlayer support 3, a through hole is provided in the carbon sheet 41, and the through hole is filled with ceramic slurry. .

The carbon sheet 41 on which the conductor paste 42 and the interlayer support paste 43 are arranged is prepared corresponding to each layer to be laminated. Depending on the structure of the three-dimensional wiring board 100, a carbon sheet 41 on which only the interlayer support paste 43 is placed or a carbon sheet 41 on which neither the conductor paste 42 nor the interlayer support paste 43 are placed is prepared.

Further, the surface electrode paste 44 for forming the surface electrode 10 is arranged on the carbon sheet 41 arranged on the outermost side in the stacking direction. As the surface electrode paste 44, the same conductive paste as the conductive paste 42 and the interlayer support paste 43 can be used.

The carbon sheets 41 prepared for each layer are laminated by the method described above to produce an unfired laminate 45 (FIG. 4(b)).

Note that the outline of the carbon sheet 41 is omitted in FIG. 4(b).

Subsequently, the unfired laminate 45 is fired. The firing temperature is, for example, 900° C. when using a conductive paste containing Ag as a main component, and 1000° C. when using a conductive paste containing Cu as a main component. By firing the unfired laminate 45, the carbon sheet 41 disappears and the conductor paste 42, interlayer support paste 43 and surface electrode paste 44 are sintered. Thereby, only the in-plane conductor 2, the interlayer support 3 and the surface electrode 10 are formed (FIG. 4(c)). At this time, since the carbon sheet has less heat shrinkage than the ceramic green sheet, deformation due to firing can be suppressed, and the position and shape can be maintained with high accuracy.

In addition, since the carbon sheet 41 disappears and the conductor paste 42, interlayer support paste 43 and surface electrode paste 44 are sintered, the entire surface of the formed in-plane conductor 2, interlayer support 3 and surface electrode 10 is reduced. Asperities are formed on the surface.

In FIG. 4(c), it seems that there are in-plane conductors 2 and surface electrodes 10 that are not connected anywhere, but all the in-plane conductors 2 are connected to any one of the interlayer supports 3. there is All the surface electrodes 10 are also connected to one of the interlayer supports 3 . That is, all in-plane conductors 2, interlayer supports 3 and surface electrodes 10 are integrally connected.

As described above, the carbon sheet 41 disappears during firing, leaving only the in-plane conductor 2, the interlayer support 3 and the surface electrode 10 whose positions and shapes are maintained with high precision.

That is, in the conventional manufacturing method of firing a ceramic green sheet coated with a conductive paste, the positions of the conductors may change due to deformation when the ceramic is formed by firing. However, in the manufacturing method of the present embodiment, as described above, the carbon sheet 41 disappears by firing, so that the in-plane conductors 2, the interlayer supports 3 and the surface electrodes 10 whose positions and shapes are maintained with high precision are formed. can do.

Finally, an insulating material having fluidity is poured into the portion where the carbon sheet 41 has disappeared and hardened. For example, a mold for pouring the insulating material is prepared, and the integrated in-plane conductor 2, interlayer support 3 and surface electrode 10 are arranged in the mold. Then, an insulating material is poured into the mold and hardened. The fluid insulating material is, for example, thermosetting resin or liquid glass. The insulator 1 is formed by hardening the insulating material (FIG. 4(d)).

The insulating material does not have to be placed at exactly the same position where the carbon sheet 41 has disappeared. For example, the insulating material may be placed only on a portion of the portion where the carbon sheet 41 has disappeared, or the insulating material may be placed on a wider portion so as to include the portion where the carbon sheet 41 has disappeared.

In other words, the insulating material may be placed on at least a part of the portion where the carbon sheet 41 disappears so that the three-dimensional wiring board 100 to be manufactured has a desired shape. However, in the manufactured three-dimensional wiring board 100 , the conductive in-plane conductors 2 and the conductive interlayer supports 3 are preferably covered with the insulator 1 .

As described above, since the insulating material having fluidity is poured into the portion where the carbon sheet 41 has disappeared, the insulating material enters the uneven recesses formed on the surfaces of the in-plane conductor 2 and the interlayer support 3. As a result, in the manufactured three-dimensional wiring board 100, the insulator 1 is formed in such a manner as to enter the recesses forming the unevenness of the surface of the in-plane conductor 2, and the in-plane conductor 2 and the interlayer support 3 are formed. is in close contact with the insulator 1 .

If the insulating material adheres to the surface of the surface electrode 10 when the insulating material is poured, the insulating material adhering to the surface may be removed.

Alternatively, the surface electrode 10 may be arranged after the non-fired laminate 45 is produced without the surface electrode paste 44 applied and fired to form the insulator 1 .

<Second embodiment>
The three-dimensional wiring board 100A in the second embodiment differs from the three-dimensional wiring board 100 in the first embodiment in that a plating film is formed on the surfaces of the in-plane conductors 2 and the interlayer support 3. and other configurations are the same as in the first embodiment.

FIG. 5 is a partial enlarged view of a three-dimensional wiring board 100A according to the second embodiment, and more specifically, an enlarged side view of an in-plane conductor 2 and an interlayer support 3 provided in the three-dimensional wiring board 100A. is. As shown in FIG. 5 , plating films 50 are formed on the upper and lower surfaces of the in-plane conductor 2 . A plated film 50 is also formed on the side surfaces of the in-plane conductors 2 . Furthermore, a plated film is also formed on the surface of the interlayer support 3 . Although illustration is omitted, a plated film is also formed on the surface of the surface electrode 10 .

The surface roughness Ra of the in-plane conductor 2 and the interlayer support 3 on which the plating film 50 is formed is approximately the same as the surface roughness Ra of the in-plane conductor 2 and the interlayer support 3 on which the plating film 50 is not formed. be.

The plating film 50 is formed after firing the unfired laminate 45 and before pouring the insulating material in the manufacturing process of the three-dimensional wiring board described in the first embodiment. The method of forming the plated film 50 may be electrolytic plating or electroless plating.

As described above, after the unfired laminate 45 is fired, that is, after the carbon sheet 41 disappears, a plating film is formed on the in-plane conductors 2, the interlayer support 3, and the surface electrodes 10, whereby the in-plane conductors 2, A plating film can be formed on the entire surface of the interlayer support 3 and the surface electrode 10 .

<Third Embodiment>
The three-dimensional wiring board 100 in the first embodiment and the three-dimensional wiring board 100A in the second embodiment have been described as boards having coils and capacitors, for example.

In the third embodiment, it is assumed that the three-dimensional wiring board is a hygrometer having a moisture sensitive material.

FIG. 6 is a perspective view of a hygrometer 200 as a three-dimensional wiring board according to the third embodiment. 7 is a cross-sectional view of the hygrometer 200 shown in FIG. 6 taken along line VII-VII.

The hygrometer 200 includes a moisture sensitive material 61 , multiple in-plane conductors 62 a and 62 b , a pair of external electrodes 63 a and 63 b and a ceramic layer 64 .

The in-plane conductors 62a and 62b each have a plate-like shape and are made of a material containing Cu, for example. The in-plane conductor 62a is drawn out toward the external electrode 63a and connected to the external electrode 63a. Further, the in-plane conductor 62b is drawn out toward the external electrode 63b and connected to the external electrode 63b.

The in-plane conductors 62a and the in-plane conductors 62b are alternately arranged with the moisture sensitive material 61 interposed therebetween in the Z-axis direction. The intervals between the in-plane conductors 62a and the in-plane conductors 62b that are adjacent in the Z-axis direction are all the same or substantially the same.

A plated film may be formed on the surfaces of the in-plane conductors 62a and 62b, similarly to the in-plane conductors 2 of the three-dimensional wiring board 100A in the second embodiment.

The moisture-sensitive material 61 is arranged between an in-plane conductor 62a and an in-plane conductor 62b that are adjacent in the Z-axis direction. As the moisture-sensitive material 61, for example, a cellulose compound or a polyvinyl compound, which are hydrophilic polymers, can be used.

The pair of external electrodes 63a and 63b are made of a material containing Cu, for example, and are arranged on the outer surface of the hygrometer 200 so as to face each other. In the present embodiment, the pair of external electrodes 63a and 63b are electrodes for detecting humidity, and in-plane conductors 62a and 63b are provided at different positions in the Z-axis direction when manufacturing the hygrometer 200, which will be described later. It is also an interlayer support that supports 62b.

Of the side surfaces of the hygrometer 200, the above-described in-plane conductors 62a and 62b and the moisture sensitive material 61 are exposed on the surfaces on which the external electrodes 63a and 63b are not formed.

The ceramic layers 64 are arranged on both outer sides in the Z-axis direction, which is the stacking direction of the in-plane conductor 62a, the moisture sensitive material 61, and the in-plane conductor 62b.

The hygrometer 200 having the configuration described above detects humidity by detecting a change in capacitance. That is, when the humidity changes, the dielectric constant of the humidity sensitive material 61 arranged between the in-plane conductors 62a and 62b changes, and the capacitance changes. Humidity is detected by detecting

In the hygrometer 200 of this embodiment, as described above, the in-plane conductors 62a and the in-plane conductors 62b are alternately arranged in the Z-axis direction, and the moisture-sensitive material 61 is placed between the in-plane conductors 62a and 62b. It has a structure in which Since the hygrometer 200 according to the present embodiment has the laminated structure as described above, the capacitance is increased and the width of the change is also increased, so that the humidity can be detected with high accuracy.

In addition, since the in-plane conductor 62a, the moisture-sensitive material 61, and the in-plane conductor 62b are laminated in the Z-axis direction, the three-dimensional structure has a projected area of can be a small hygrometer.

Furthermore, the distances between the in-plane conductors 62a and 62b that are adjacent in the Z-axis direction are all the same or substantially the same, so humidity can be detected with high accuracy.

(Manufacturing method of hygrometer)
8A and 8B are diagrams for explaining a method for manufacturing the hygrometer 200. FIG.

A plurality of carbon sheets 72 coated with conductive paste 73 are laminated on a ceramic green sheet 71 prepared in advance, and the ceramic green sheet 71 is arranged on the top to obtain an unfired mother laminate 75 (Fig. 8(a)). The conductor paste 73 is applied to a predetermined area on the carbon sheet 72 as will be described later. As in the first embodiment, the carbon sheet 72 is a sheet that disappears during firing.

FIG. 9 is a side view of the unfired mother laminate 75. FIG. As shown in FIG. 9, the conductive paste 73 is not applied to the entire area of the carbon sheet 72, but is applied to a predetermined area. Specifically, as will be described later, the conductor paste 73 is applied so that the conductor paste 73 is alternately pulled out from the end face when the green mother laminate 75 is divided at the division line 80 .

Subsequently, the unfired mother laminate 75 is divided into predetermined sizes by dicing or the like to obtain unfired laminates 76 (FIG. 8(b)).

Next, an external electrode paste 77 for forming external electrodes is applied to the side surface 76a of the unfired laminate 76 (FIG. 8(c)). The external electrode paste 77 contains Ag or Cu, for example.

Subsequently, the unfired laminate 76 coated with the external electrode paste 77 is fired. The firing temperature is, for example, 900° C. for a conductive paste containing Ag as a main component, and 1000° C. for a conductive paste containing Cu as a main component. By firing the unfired laminate 76, the carbon sheet 72 disappears and the conductor paste 73 and the external electrode paste 77 are sintered. Thereby, in-plane conductors 62a, 62b and external electrodes 63a, 63b are formed. Also, ceramic layers 64 are formed on both outer sides in the stacking direction (FIG. 8(d)).

The in-plane conductor 62a is connected to the external electrode 63a, and the in-plane conductor 62b is connected to the external electrode 63b. Ceramic layer 64 is also connected to external electrodes 63a and 63b. Thereby, a structure in which the in-plane conductors 62a, 62b, the external electrodes 63a, 63b, and the ceramic layer 64 are integrally bonded is obtained.

Subsequently, the moisture-sensitive material 61 is poured into the portion where the carbon sheet 72 has disappeared, ie, the hollow portion inside, and is cured (FIG. 8(e)). For example, as described in the first embodiment, a mold is prepared, and the moisture-sensitive material 61 is poured into the mold and cured.

The hygrometer 200 is manufactured through the above steps. As described above, the in-plane conductors 62a and 62b whose positions and shapes are maintained with high precision are formed by the carbon sheet 72 disappearing during firing. As a result, the interval between the adjacent in-plane conductors 62a and 62b can be made the same or substantially the same, so a hygrometer with high measurement accuracy can be manufactured.

Here, in the hygrometer 200 described above, a non-conductive interlayer support may be provided between the in-plane conductors 62a and 62b adjacent to each other in the Z-axis direction.

FIG. 10 is a cross-sectional view of a hygrometer 200A in which a non-conductive interlayer support 90 is provided between adjacent in-plane conductors 62a and 62b. The non-conductive interlayer support 90 is, for example, a ceramic body made of ceramic material.

When a non-conductive interlayer support 90 such as a ceramic body is arranged as shown in FIG. should be filled.

By providing a non-conductive interlayer support 90 between the adjacent in-plane conductors 62a and 62b, the positions of the in-plane conductors 62a and 62b remaining after firing the unfired laminate 76 described above are reduced. And the shape can be kept more reliably. In addition, in the manufactured hygrometer 200A, the distance between the adjacent in-plane conductors 62a and 62b can be maintained, so humidity measurement accuracy can be maintained.

The present invention is not limited to the above embodiments, and various applications and modifications can be made within the scope of the present invention.

For example, the sheet that disappears during firing is not limited to a carbon sheet. However, if a sheet with a low vanishing temperature, such as a resin sheet, is used, the sheet vanishes before the conductive paste and the interlayer support paste are sintered in the manufacturing process of the three-dimensional wiring board, resulting in poor positional accuracy. It becomes difficult to form high in-plane conductors and interlayer supports. Therefore, it is preferable to use a sheet having a high vanishing temperature, such as a carbon sheet.

Reference Signs List 1 Insulator 2 In-plane conductor 3 Interlayer support 10 Surface electrode 21 Concave portion 41 formed by uneven surface of in-plane conductor Carbon sheet 42 Conductor paste 43 Interlayer support paste 44 Surface electrode paste 45 Unfired laminate 50 Plating film 61 Moisture-sensitive materials 62a, 62b In-plane conductors 63a, 63b External electrode 64 Ceramic layer 71 Ceramic green sheet 72 Carbon sheet 73 Conductor paste 75 Unfired mother laminate 76 Unburned laminate 77 External electrode paste 90 Non-conductive interlayer support Body 100 Three-dimensional wiring board 100A in the first embodiment Three-dimensional wiring boards 200 and 200A in the second embodiment Hygrometer

Claims (11)

A method for manufacturing a three-dimensional wiring board comprising an insulator, an in-plane conductor provided inside the insulator, and an interlayer support for supporting the in-plane conductor,
a step of applying a conductor paste for forming the in-plane conductor and an interlayer support paste for forming the interlayer support to a sheet that disappears during firing;
laminating a plurality of sheets including a sheet coated with the conductor paste and the interlayer support paste to form an unfired laminate;
firing the unfired laminate to eliminate the sheet and to sinter the conductor paste and the interlayer support paste;
placing and curing an insulating material on at least a portion of the portion where the sheet has disappeared;
and wherein the plurality of sheets constituting the unfired laminate do not include ceramic green sheets having a metal conductor paste. The three-dimensional wiring board includes a plurality of the in-plane conductors and the interlayer supports,
2. The method of manufacturing a three-dimensional wiring board according to claim 1, wherein each of the plurality of in-plane conductors is in contact with at least one of the plurality of interlayer supports. 3. The method of manufacturing a three-dimensional wiring board according to claim 2, wherein the in-plane conductor positioned inside the three-dimensional wiring board is in contact with at least two of the plurality of interlayer supports. 4. The method of manufacturing a three-dimensional wiring board according to claim 1, wherein the interlayer support includes via conductors. 5. The method for manufacturing a three-dimensional wiring board according to claim 1, wherein the interlayer support includes a non-conductive ceramic body. The method further comprises the step of plating the in-plane conductor and the interlayer support after firing the unfired laminate and before arranging the insulating material. 6. The method for manufacturing a three-dimensional wiring board according to any one of 5. A three-dimensional wiring board not provided with a ceramic layer containing a metal conductor,
an insulator that is not a sintered body ;
a plurality of in-plane conductors provided inside the insulator;
an interlayer support that supports the plurality of in-plane conductors;
with
unevenness is formed on the entire surface of the in-plane conductor,
The insulator is embedded in the concave portion of the in-plane conductor ,
A three-dimensional wiring board , wherein the in-plane conductor and the interlayer support are sintered bodies . 8. The three-dimensional wiring board according to claim 7, wherein plating films are formed on the upper and lower surfaces of the in-plane conductors. each of the plurality of in-plane conductors has a flat plate shape,
9. The three-dimensional wiring board according to claim 7, wherein the moisture-sensitive material, which is the insulator, is arranged between the adjacent in-plane conductors. The three-dimensional wiring according to any one of claims 7 to 9, characterized in that ceramic layers not containing the metal conductors are arranged on both outer sides of the direction in which the plurality of in-plane conductors are arranged. substrate. The interlayer support is a pair of external electrodes disposed on the outer surface of the insulator,
One of the two adjacent in-plane conductors is connected to one of the pair of external electrodes, and the other of the two adjacent in-plane conductors is connected to the other of the pair of external electrodes. 11. The three-dimensional wiring board according to any one of claims 7 to 10, wherein the three-dimensional wiring board is connected to the .

Images