JP2014204094A - Resistor and method of manufacturing resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve such a problem of a conventional method of manufacturing a chip resistor having a low resistance that the low resistance at a part becoming an electrode becomes an obstacle when making a resistor having a lower resistance, and to provide a method for obtaining a lower resistance relatively easily.SOLUTION: A resistor includes a resistor member having a predetermined resistance, and an electrode to be connected electrically with the resistor member. The resistor member has a resistance reducing member for reducing the resistance. A manufacturing method therefor is also provided.

Description

  The present invention relates to a resistor and a manufacturing method thereof.

The conventional method of manufacturing a chip-type low resistor is as follows:
A) Forming electrodes such as copper on the metal foil laminated on the ceramic plate,
B) Metal plating on the deposited thin film, and electrodes are made of copper on both sides.
C) There is a type that cuts a metal thin plate and uses copper or the like as printed electrodes on both sides, or d) a type that prints on a ceramic plate and constitutes a resistor and an electrode.
Specifically, it is disclosed in the following patent document. Any patent document is description regarding the shape of a member, adhesiveness, or resistance value range 10-15 m (ohm).

Japanese Patent No. 1658620 JP 2012-174760 A JP 2009-111308 A

  With recent advances in electronics, chip-type resistors having a low electrical resistivity are used as current detection elements because of demands for miniaturization and safety of device devices. However, higher accuracy and higher performance have been demanded year by year, and devices with lower resistance values have been required. The subject of this invention is providing the resistor provided with a lower resistance value, and its manufacturing method.

The inventors have devised the following solution based on the knowledge that the influence of the resistance value of the electrode portion of the resistor on the resistance value of the resistor is relatively large through intensive research. In particular,
A first aspect of the resistor of the present invention is a resistor having a predetermined resistance value,
A resistor member having a predetermined electrical resistivity (specific resistance);
An electrode electrically connected to the resistor member,
The resistor member has a resistance value reducing member for reducing the predetermined resistance value.

  According to the 2nd aspect of the resistor of this invention, it is a resistor of the said 1st aspect, Comprising: The said resistor member has a through-hole or a recessed part, The said resistance is contained in the said through-hole or the said recessed part. The value reducing member is filled.

  According to a third aspect of the resistor of the present invention, in the resistor according to the first or second aspect, the electrical resistivity of the resistance value reducing member is a predetermined electrical resistivity of the resistor member. Smaller than.

  According to a fourth aspect of the resistor of the present invention, in the resistor according to any one of the first to third aspects, at least a part of the resistance value reducing member is electrically connected to the electrode. Has been.

  According to a fifth aspect of the resistor of the present invention, in the resistor according to any one of the first to fourth aspects, the resistance value of the resistor is 5 mΩ to 0.1 mΩ.

A first aspect of the method for manufacturing a resistor according to the present invention is a resistor having a predetermined resistance value, and is electrically connected to the resistor member having a predetermined electric resistivity and the resistor member. An electrode, and a resistance member having a resistance value reducing member for reducing the predetermined resistance value in the resistor member,
Prepare the resistor member, engrave a through hole or a recess in the resistor member,
The resistance value reducing member is filled in the through hole or the recess.

  According to the 2nd aspect of the manufacturing method of the resistor of this invention, it is 1st aspect of the said manufacturing method, Comprising: The electrical resistivity of the said resistance value reduction member with which it fills is predetermined | prescribed of the said resistance member Less than electrical resistivity.

In this specification, an electrode component means a portion of a resistor member that is covered with an electrode in a plan view of the resistor, and the electrode unit includes an electrode component and an electrode.
The predetermined resistance value of the present invention is preferably 5 mΩ to 0.1 mΩ. The predetermined electrical resistivity is preferably 2 × 10 ⁻⁷ to 5 × 10 ⁻⁶ Ωm.
The electrical resistivity of the resistance value reducing member is preferably 1.5 × 10 ⁻⁸ to 4 × 10 ⁻⁸ Ωm.

  Conventionally, in order to obtain a resistor having a desired resistance value, development and selection of a resistor member constituting the resistor have been performed, but it has been difficult to obtain a lower resistance value. On the other hand, in the resistor manufactured by the resistor of the present invention or the manufacturing method thereof, since the resistor member includes the resistance value reducing member, the resistance value can be easily reduced. That is, it is possible to manufacture a resistor having a lower resistance value relatively easily and inexpensively by providing a through hole or a recess in the electrode part or resistor member of the resistor and providing a member for reducing the resistance value. . Further, it is possible to obtain a resistor that depends on a characteristic value such as a temperature coefficient indicating a resistance value change with respect to a temperature change of the resistor member and a voltage coefficient indicating a resistance value change with respect to an applied voltage.

It is a top view of the resistor regarding Embodiment 1-2. 1 is a cross-sectional view taken along line 1-1 of FIG. It is sectional drawing shown similarly to FIG. 2 of the resistor regarding Embodiment 2. FIG. It is a top view of the resistor member regarding Examples 1-2. FIG. 5 is a cross-sectional view taken along line 2-2 of FIG. It is the top view which divided | segmented FIG. 4 regarding Examples 1-2 into the magnitude | size of the predetermined resistor. It is the top view which perforated the electrode structure part of the divided | segmented resistor regarding Example 1. FIG. FIG. 8 is a cross-sectional view taken along line 3-3 in FIG. FIG. 9 is a cross-sectional view similar to FIG. 8 in which an electrode portion of a resistor relating to Example 1 is formed and a perforated portion is filled with a resistance value reducing member. It is sectional drawing shown similarly to FIG. 9 of the resistor which concerns on Example 2. FIG.

Embodiments according to the present invention will be described with reference to FIGS. The same applies to the resistor of the long side electrode that can make the resistance value smaller.
These embodiments are examples, and the present invention is not limited to the embodiments. In either case, the resistance value of the resistor can be reduced, and the temperature coefficient of the resistor can be reduced and the voltage coefficient can be reduced.

  FIG. 1 is a plan view of the resistor 101 according to the first embodiment as viewed from above. For example, the size is 1.6 mm for the short side and 3.2 mm for the long side, which conforms to the recommended dimensional standard of EIAJ. Is.

FIG. 2 is a resistor having a through-hole or a recess in the electrode component, and shows a section cut along 1-1 shown by a dotted line in FIG.
Reference numeral 1 denotes a substrate (for example, an alumina thin plate having a short side of 1.6 mm, a long side of 3.2 mm, and a thickness of 0.4 mm).
Reference numeral 2 denotes a resistor member (for example, a manganin foil having a thickness of 30 μm, an electric resistivity of 4.82 × 10 ⁻⁷ Ωm), and is firmly attached to the substrate 1 by thermocompression bonding via a heat conductive double-sided adhesive tape 3. It is pasted.
Reference numeral 4 denotes an electrode (for example, a portion of 0.8 mm from both ends of the short side of the resistor member 2) made in the electrode component 11 of the resistor member 2. A member having a lower electrical resistivity than the resistor member 2 (for example, copper, electrical resistivity 1.68 * 10 ⁻⁸ Ωm) is applied to the electrode component 11 by a plating method or the like (2 to 3 μm thickness). By applying the same member to the inside of the through-hole (reference numeral 12) formed in the electrode component 11, the resistance value of the electrode component 11 is sufficiently reduced and the resistance value related to the resistor 102 is reduced. Accuracy improvement is measured.
Reference numeral 5 denotes a copper plating part laminated on the electrode 4 and having a thickness of several μm.
Reference numeral 6 denotes a layer (for example, a tin solder layer formed by a plating method) formed to facilitate bonding to an electric circuit to be used.
Reference numeral 7 denotes a protective film (for example, an epoxy resin having a thickness of 10 to 15 μm) laminated on the surface of the resistor member 2 excluding the electrode component 11. The protective film 7 has a function to electrically insulate while protecting from the surrounding humidity and temperature environment in order to maintain the function of the resistor 101.
Reference numeral 8 denotes a protective layer having a thickness of about 20 μm, in which the same kind or different kind of resin is further applied to the protective film 7 to maintain the function.

FIG. 3 is a cross-sectional view of a resistor having a through hole or a recess on the entire surface of the resistor member, taken along 1-1 shown by a dotted line in FIG.
Reference numeral 1 denotes a substrate (for example, an alumina thin plate having a short side of 1.6 mm, a long side of 3.2 mm, and a thickness of 0.4 mm).
Reference numeral 2 denotes a resistor member (for example, a manganin foil having a thickness of 30 μm, an electric resistivity of 4.82 × 10 ⁻⁷ Ωm), and is firmly attached to the substrate 1 by thermocompression bonding via a heat conductive double-sided adhesive tape 3. It is pasted.
Reference numeral 4 denotes an electrode (for example, a portion of 0.8 mm from both ends of the short side of the resistor member 2) made in the electrode component 11 of the resistor member 2. A member having a lower electrical resistivity than the resistor member 2 (for example, copper, electrical resistivity 1.68 * 10 ⁻⁸ Ωm) is applied to the electrode component 11 by, for example, a plating method (2 to 3 μm thickness). At the same time, the same member is applied to the inside of the through hole 12 or the recess 13 formed in the entire resistor member. As a result, the resistance value related to the resistor 103 is further reduced and the accuracy of the resistance value is improved.
Reference numeral 5 denotes a plated portion having a thickness of several μm laminated on the electrode 4.
Reference numeral 6 is a tin solder layer formed to facilitate bonding to an electric circuit to be used, and is formed by a plating method.
Reference numeral 7 denotes a protective film laminated on the surface of the resistor member 2 excluding the electrode constituting portion 11. The protective film 7 (for example, an epoxy resin having a thickness of 10 to 15 μm) has a function of protecting the resistor 101 from the surrounding humidity and temperature environment and electrically insulating it.
Reference numeral 8 denotes a protective layer having a thickness of about 25 μm, in which the protective film 7 is further coated with the same or different protective material for maintaining the function.
According to the second embodiment, the resistance value can be further reduced as compared with the first embodiment.

In the present invention, a resistor that perforates only the electrode portion of the resistor is manufactured by the following process.
The resistance value is determined by appropriately selecting the thickness of the metal foil.
1) Prepare the following materials to be used. (Dimensional unit: mm)
-Alumina thin plate (length 50, width 50, thickness 0.4). . . . . 1
Resistor material (manganin foil: 50 vertical, 50 horizontal, 0.03 thickness). . 2
-Thermally conductive double-sided adhesive tape (width 50, thickness 0.02). . . . . . . 3
·Epoxy resin . . . . . . . . . . . . . . . . . . 7 and 8
・ Photographic film (length 50, width 50). . . . . . . . . . . . . . 9
It is partitioned into a predetermined shape (one frame; length 1.6, width 3.2), and there are almost one or more holes with a diameter of 0.2 in the portions (0.5 from the top and bottom sides) that serve as electrodes in each section. Has spots to form evenly.
・ Photosensitive film. . . . . . . . . . . . . . . . . . . . . . 10
2) Alumina sheet 1. 2. Thermally conductive double-sided adhesive tape And paste the resistor material on top of it. Is heat-bonded. See FIG. 4 and FIG.
3) Photosensitive film on the above substrate 10. 8. A photographic film 9. Transfer using. FIG. 6 is an overall view thereof, and FIG. 7 has spots for forming a through hole in a portion to be an electrode portion in a frame of one frame (for example, 1.6 mm × 3.2 mm).
4) Perform processing for developing, fixing and etching the substrate.
5) An etching process is performed. See FIG.
6) After cleaning and drying the substrate, copper electroplating is performed by a jet type.
7) Photosensitive film Remove and clean and dry. FIG. reference.
8) The resistance value is corrected.
9) Resin for protection Is applied and dried by a printing method, and after temporary baking (see FIG. 10), a protective resin 8. Is applied by a printing method, dried and baked, and then divided into predetermined sizes.
10) Tin plating on the divided resistors And finished product. (See Figure 2.)

In the present invention, a resistor that perforates the entire resistor is manufactured by the following process.
The resistance value is determined by appropriately selecting the thickness of the metal foil.
1) As materials to be used, the same materials as in Example 1 are prepared except for the following.
(Number unit: mm)
・ Photographic film (length 50, width 50). . . . . . . . . . . . . . . 9
Spots that are partitioned into a predetermined shape (one frame; length 1.6, width 3.2), and that one or more holes with a diameter of about 0.2Φ are formed almost uniformly over almost the entire surface of each section. Have
2) Affixing the photosensitive film 10 on the substrate Hereinafter, the manufacturing process is performed in the same process as in Example 1 to obtain a finished product. (See Figure 3.)

1. Substrate (eg alumina plate)
2. Resistor (eg, Manganin board)
3. Thermally conductive double-sided adhesive tape4. Copper plating part of electrode part (including through holes and recesses)
5. 5. Copper plating part formed on the electrode part 6. Tin solder layer Insulating layer 1
8). Insulating layer 2
9. Photosensitive pattern 10. 10. Photosensitive film Electrode component 12. Through hole 13. Recess

Claims (7)

A resistor having a predetermined resistance value, a resistor member having a predetermined electrical resistivity;
An electrode electrically connected to the resistor member,
A resistor having a resistance value reducing member for lowering the predetermined resistance value in the resistor member. The resistor according to claim 1, wherein the resistor member has a through hole or a recess, and the resistance value reducing member is filled in the through hole or the recess. The resistor according to claim 1 or 2, wherein an electrical resistivity of the resistance value reducing member is smaller than a predetermined electrical resistivity of the resistor member.   The resistor according to any one of claims 1 to 3, wherein at least a part of the resistance value reducing member is electrically connected to the electrode.   5. The resistor according to claim 1, wherein a resistance value of the resistor is 5 mΩ to 0.1 mΩ. A resistor having a resistor member having a predetermined resistance value and an electrode electrically connected to the resistor member, the resistor member having a resistance value reducing member for lowering the predetermined resistance value. A manufacturing method comprising:
Prepare the resistor member, engrave a through hole or a recess in the resistor member,
A method of manufacturing a resistor, wherein the through hole or the recess is filled with the resistance value reducing member.   The method of manufacturing a resistor according to claim 6, wherein an electrical resistivity of the resistance value reducing member to be filled is smaller than a predetermined electrical resistivity of the resistor member.

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