JP7128381B2 - 電子部品、リード部の接続構造及びリード部の接続方法 - Google Patents

電子部品、リード部の接続構造及びリード部の接続方法 Download PDF

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Publication number
JP7128381B2
JP7128381B2 JP2022500122A JP2022500122A JP7128381B2 JP 7128381 B2 JP7128381 B2 JP 7128381B2 JP 2022500122 A JP2022500122 A JP 2022500122A JP 2022500122 A JP2022500122 A JP 2022500122A JP 7128381 B2 JP7128381 B2 JP 7128381B2
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Japan
Prior art keywords
lead
conductive wire
wire
lead portion
electronic component
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JP2022500122A
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English (en)
Japanese (ja)
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JPWO2021200154A5 (https=
JPWO2021200154A1 (https=
Inventor
光敏 小倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semitec Corp
Original Assignee
Semitec Corp
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Publication of JPWO2021200154A5 publication Critical patent/JPWO2021200154A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/10—Spot welding; Stitch welding
    • B23K11/11—Spot welding
    • B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K11/00—Resistance welding; Severing by resistance heating
    • B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
    • B23K11/18—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded of non-ferrous metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/38—Conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/02—Iron or ferrous alloys
    • B23K2103/04—Steel or steel alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/18—Dissimilar materials
    • B23K2103/26—Alloys of Nickel and Cobalt and Chromium
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
    • G01K2007/163—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements provided with specially adapted connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)
  • Thermistors And Varistors (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
JP2022500122A 2020-03-31 2021-03-17 電子部品、リード部の接続構造及びリード部の接続方法 Active JP7128381B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020064180 2020-03-31
JP2020064180 2020-03-31
PCT/JP2021/010810 WO2021200154A1 (ja) 2020-03-31 2021-03-17 電子部品、リード部の接続構造及びリード部の接続方法

Publications (3)

Publication Number Publication Date
JPWO2021200154A1 JPWO2021200154A1 (https=) 2021-10-07
JPWO2021200154A5 JPWO2021200154A5 (https=) 2022-04-20
JP7128381B2 true JP7128381B2 (ja) 2022-08-30

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022500122A Active JP7128381B2 (ja) 2020-03-31 2021-03-17 電子部品、リード部の接続構造及びリード部の接続方法

Country Status (5)

Country Link
US (1) US12510421B2 (https=)
JP (1) JP7128381B2 (https=)
CN (1) CN115315617A (https=)
DE (1) DE112021000628T5 (https=)
WO (1) WO2021200154A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201804622D0 (en) * 2018-03-22 2018-05-09 Central Glass Co Ltd Method of producing a vehicle glass assembly

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62265703A (ja) * 1986-05-14 1987-11-18 三井金属鉱業株式会社 サ−ミスタ−とリ−ド線の結合装置
JPH06215851A (ja) * 1993-01-20 1994-08-05 Toshiba Home Technol Corp 温度ヒューズの接続方法
JP4921425B2 (ja) * 2008-06-18 2012-04-25 日立オートモティブシステムズ株式会社 導線接続法ならびに接続端子、固定子および回転電機
DE102008045751B4 (de) 2008-09-04 2020-01-30 Te Connectivity Germany Gmbh Vorrichtung und Verfahren zum Kompaktierschweißen
JP5813599B2 (ja) 2011-09-07 2015-11-17 日本特殊陶業株式会社 センサ及びその製造方法
JP2015232552A (ja) 2014-05-12 2015-12-24 日本特殊陶業株式会社 センサ及びその製造方法
JP2016083671A (ja) 2014-10-23 2016-05-19 オムロン株式会社 リード線の接合方法、リード線の接合装置、及び加圧型枠
JP6352557B1 (ja) 2017-03-24 2018-07-04 株式会社芝浦電子 センサ素子、及び、センサ素子の製造方法
JP2018190617A (ja) * 2017-05-09 2018-11-29 Smk株式会社 端子付き電線

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019087755A1 (ja) 2017-10-30 2019-05-09 Ｓｅｍｉｔｅｃ株式会社 温度センサ及び温度センサを備えた装置

Also Published As

Publication number Publication date
DE112021000628T5 (de) 2022-11-24
US12510421B2 (en) 2025-12-30
US20230093829A1 (en) 2023-03-30
JPWO2021200154A1 (https=) 2021-10-07
CN115315617A (zh) 2022-11-08
WO2021200154A1 (ja) 2021-10-07

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