JP7128381B2 - 電子部品、リード部の接続構造及びリード部の接続方法 - Google Patents
電子部品、リード部の接続構造及びリード部の接続方法 Download PDFInfo
- Publication number
- JP7128381B2 JP7128381B2 JP2022500122A JP2022500122A JP7128381B2 JP 7128381 B2 JP7128381 B2 JP 7128381B2 JP 2022500122 A JP2022500122 A JP 2022500122A JP 2022500122 A JP2022500122 A JP 2022500122A JP 7128381 B2 JP7128381 B2 JP 7128381B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- conductive wire
- wire
- lead portion
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/002—Resistance welding; Severing by resistance heating specially adapted for particular articles or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/10—Spot welding; Stitch welding
- B23K11/11—Spot welding
- B23K11/115—Spot welding by means of two electrodes placed opposite one another on both sides of the welded parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K11/00—Resistance welding; Severing by resistance heating
- B23K11/16—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded
- B23K11/18—Resistance welding; Severing by resistance heating taking account of the properties of the material to be welded of non-ferrous metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/023—Soldered or welded connections between cables or wires and terminals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/02—Iron or ferrous alloys
- B23K2103/04—Steel or steel alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/26—Alloys of Nickel and Cobalt and Chromium
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K2007/163—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements provided with specially adapted connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/70—Insulation of connections
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020064180 | 2020-03-31 | ||
| JP2020064180 | 2020-03-31 | ||
| PCT/JP2021/010810 WO2021200154A1 (ja) | 2020-03-31 | 2021-03-17 | 電子部品、リード部の接続構造及びリード部の接続方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021200154A1 JPWO2021200154A1 (https=) | 2021-10-07 |
| JPWO2021200154A5 JPWO2021200154A5 (https=) | 2022-04-20 |
| JP7128381B2 true JP7128381B2 (ja) | 2022-08-30 |
Family
ID=77927853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022500122A Active JP7128381B2 (ja) | 2020-03-31 | 2021-03-17 | 電子部品、リード部の接続構造及びリード部の接続方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12510421B2 (https=) |
| JP (1) | JP7128381B2 (https=) |
| CN (1) | CN115315617A (https=) |
| DE (1) | DE112021000628T5 (https=) |
| WO (1) | WO2021200154A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201804622D0 (en) * | 2018-03-22 | 2018-05-09 | Central Glass Co Ltd | Method of producing a vehicle glass assembly |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019087755A1 (ja) | 2017-10-30 | 2019-05-09 | Semitec株式会社 | 温度センサ及び温度センサを備えた装置 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62265703A (ja) * | 1986-05-14 | 1987-11-18 | 三井金属鉱業株式会社 | サ−ミスタ−とリ−ド線の結合装置 |
| JPH06215851A (ja) | 1993-01-20 | 1994-08-05 | Toshiba Home Technol Corp | 温度ヒューズの接続方法 |
| JP4921425B2 (ja) | 2008-06-18 | 2012-04-25 | 日立オートモティブシステムズ株式会社 | 導線接続法ならびに接続端子、固定子および回転電機 |
| DE102008045751B4 (de) | 2008-09-04 | 2020-01-30 | Te Connectivity Germany Gmbh | Vorrichtung und Verfahren zum Kompaktierschweißen |
| JP5813599B2 (ja) | 2011-09-07 | 2015-11-17 | 日本特殊陶業株式会社 | センサ及びその製造方法 |
| JP2015232552A (ja) | 2014-05-12 | 2015-12-24 | 日本特殊陶業株式会社 | センサ及びその製造方法 |
| JP2016083671A (ja) | 2014-10-23 | 2016-05-19 | オムロン株式会社 | リード線の接合方法、リード線の接合装置、及び加圧型枠 |
| US10505286B2 (en) | 2017-03-24 | 2019-12-10 | Shibaura Electronics Co., Ltd. | Sensor element and manufacturing method of sensor element |
| JP2018190617A (ja) | 2017-05-09 | 2018-11-29 | Smk株式会社 | 端子付き電線 |
-
2021
- 2021-03-17 WO PCT/JP2021/010810 patent/WO2021200154A1/ja not_active Ceased
- 2021-03-17 US US17/909,758 patent/US12510421B2/en active Active
- 2021-03-17 CN CN202180019264.XA patent/CN115315617A/zh active Pending
- 2021-03-17 DE DE112021000628.2T patent/DE112021000628T5/de active Pending
- 2021-03-17 JP JP2022500122A patent/JP7128381B2/ja active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019087755A1 (ja) | 2017-10-30 | 2019-05-09 | Semitec株式会社 | 温度センサ及び温度センサを備えた装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2021200154A1 (https=) | 2021-10-07 |
| CN115315617A (zh) | 2022-11-08 |
| DE112021000628T5 (de) | 2022-11-24 |
| WO2021200154A1 (ja) | 2021-10-07 |
| US12510421B2 (en) | 2025-12-30 |
| US20230093829A1 (en) | 2023-03-30 |
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