JP7128202B2 - 密封シール・カバー・キャップ付き移植可能光学センサ - Google Patents
密封シール・カバー・キャップ付き移植可能光学センサ Download PDFInfo
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- A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
- A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
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- A61B5/1459—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using optical sensors, e.g. spectral photometrical oximeters invasive, e.g. introduced into the body by a catheter
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- A61B5/14532—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue for measuring glucose, e.g. by tissue impedance measurement
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Description
2 基板
3 光学微細構造
4 光学的相互作用エリア
5 表面
6 カバー・キャップ
8 能動構成要素
9 シールされたキャビティ
10 光フィードスルー
12 アンダー・バンプ金属化
13 カプラ
14 導波路
15 アンテナ、マルチループ・アンテナ
16 電源ユニット、エネルギ供給デバイス
17 インターフェース回路
18 接合ワイヤ
19 保護層、電磁遮蔽層
20 電気フィードスルー
25 保護層
Claims (17)
- 基板(2)および前記基板(2)とともに集積される光学微細構造(3)を包含するフォトニック集積回路(1)を備えた移植可能な光学センサであって、
前記光学微細構造(3)が、前記基板(2)の表面(5)の一部の上に露出された光学的相互作用エリア(4)を形成するべく位置決めされ、
前記フォトニック集積回路(1)には、前記光学的相互作用エリア(4)に隣接する前記基板(2)の一部の上にカバー・キャップ(6)が設けられ、
前記カバー・キャップが、ウェファ対ウェファ接合テクノロジまたは別のウェファ・レベルの密封パッケージング・テクニックによって前記基板に密封シールされ、
前記表面(5)と前記カバー・キャップ(6)との間に形成されるシールされたキャビティ(9)内に少なくとも1つの能動構成要素(8)が位置決めされ、
前記基板(2)が、前記シールされたキャビティ(9)から前記光学的相互作用エリア(4)まで延びる少なくとも1つの光フィードスルー(10)を包含し、
前記光フィードスルー(10)が、前記シールされたキャビティ(9)内から前記光学的相互作用エリア(4)への、およびその逆の光通信を提供し、かつ、
前記光フィードスルー(10)が、前記基板内に埋め込まれた導波路とされている
ことを特徴とする移植可能な光学センサ。 - 前記シールされたキャビティ(9)から前記シールされたキャビティ(9)の外側の前記基板(2)のエリアまで延びる少なくとも1つの電気フィードスルー(20)が備えられている、請求項1に記載の移植可能な光学センサ。
- 少なくとも1つの電気フィードスルー(20)が、前記シールされたキャビティ(9)から前記カバー・キャップ(6)とは反対側の前記基板(2)の表面まで延びている、請求項1または2に記載の移植可能な光学センサ。
- 前記カバー・キャップ(6)が、流体シール材料、たとえば、ガラス、金属、シリコン、ポリマ、またはこれらの組み合わせから作られる、請求項1ないし3のいずれか一項に記載の移植可能な光学センサ。
- 前記カバー・キャップ(6)が、電磁遮蔽層(19)を包含する、請求項1ないし4のいずれか一項に記載の移植可能な光学センサ。
- 前記光学センサの周りに内部損傷を防止する保護層(25)が備えられている、請求項1ないし5のいずれか一項に記載の移植可能な光学センサ。
- 前記保護層(25)が、前記露出される光学的相互作用エリアのための開口を有する、請求項6に記載の移植可能な光学センサ。
- 前記シールされたキャビティ9内に位置決めされたエネルギ供給デバイス(16)が備えられている、請求項1ないし7のいずれか一項に記載の移植可能な光学センサ。
- 前記少なくとも1つの能動構成要素(8)が、前記シールされたキャビティ9内の前記表面(5)に取り付けられている、請求項1ないし8のいずれか一項に記載の移植可能な光学センサ。
- アンテナ(15)が備えられている、請求項1ないし9のいずれか一項に記載の移植可能な光学センサ。
- 前記光学的相互作用エリア(4)が、検知エリアである、請求項1ないし10のいずれか一項に記載の移植可能な光学センサ。
- 前記カバー・キャップ(6)の、前記カバー・キャップが前記基板に密封シールされるボトム・エッジがフランジなしであり、かつ前記基板(2)の前記表面(5)と直接接触する、請求項1ないし11のいずれか一項に記載の移植可能な光学センサ。
- 移植可能な光学センサ、たとえば、請求項1ないし12のいずれか一項に記載のセンサを製造する方法であって、
(a)露出される光学的相互作用エリア(4)を形成するべく位置決めされた集積光学微細構造(3)と少なくとも1つの光フィードスルー(10)とを有する基板(2)を備えたフォトニック集積回路であって、前記光フィードスルーが、前記光学的相互作用エリア(4)から前記光学的相互作用エリア(4)に隣接する前記基板の一部まで延びていて、前記光フィードスルーが、前記基板内に埋め込まれた導波路である、該フォトニック集積回路を提供することと、
(b)前記光学的相互作用エリア(4)に隣接する前記一部の前記表面(5)上に少なくとも1つの能動構成要素(8)を提供することと、
(c)前記基板(2)の前記一部の上に、前記少なくとも1つの能動構成要素(8)が位置決めされるシールされたキャビティ(9)を形成するべくカバー・キャップ(6)を提供することと、
(d)前記カバー・キャップ(6)を前記基板(2)にシールすることであって、前記カバー・キャップを、ウェファ対ウェファ接合テクノロジまたは別のウェファ・レベルの密封パッケージング・テクニックによって前記基板に密封シールすることと、
を包含し、かつ、
前記光フィードスルー(10)が前記シールされたキャビティ(9)内から前記光学的相互作用エリア(4)への、およびその逆の光通信を提供するように、前記カバー・キャップ(6)が提供される
ことを特徴とする方法。 - 前記シールされたキャビティ(9)から前記シールされたキャビティ(9)の外側の前記基板(2)のエリアまで延びる少なくとも1つの電気フィードスルー(20)を提供することを包含する、請求項13に記載の方法。
- 前記光学センサ(1)の周りに、前記光学的相互作用エリア(4)のための開口を残した保護層(25)を提供することを包含する、請求項13または14に記載の方法。
- 前記カバー・キャップが前記基板に、レーザ接合または陽極接合によって密封シールされる、請求項13ないし15のいずれか一項に記載の方法。
- 前記カバー・キャップ(6)の、前記カバー・キャップが前記基板に密封シールされるボトム・エッジがフランジなしであり、かつ、
前記シールに先行して、前記ボトム・エッジと前記基板(2)の前記表面(5)の直接接触がもたらされる、
請求項13ないし15のいずれか一項に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17164567.4A EP3385762A1 (en) | 2017-04-03 | 2017-04-03 | Optical assembly with hermetically sealed cover cap |
EP17164567.4 | 2017-04-03 | ||
PCT/EP2018/058325 WO2018185032A1 (en) | 2017-04-03 | 2018-03-30 | Implantable optical sensor with hermetically sealed cover cap |
Publications (2)
Publication Number | Publication Date |
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JP2020515870A JP2020515870A (ja) | 2020-05-28 |
JP7128202B2 true JP7128202B2 (ja) | 2022-08-30 |
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Application Number | Title | Priority Date | Filing Date |
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JP2019555230A Active JP7128202B2 (ja) | 2017-04-03 | 2018-03-30 | 密封シール・カバー・キャップ付き移植可能光学センサ |
Country Status (9)
Country | Link |
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US (1) | US11372176B2 (ja) |
EP (2) | EP3385762A1 (ja) |
JP (1) | JP7128202B2 (ja) |
KR (1) | KR20190136007A (ja) |
CN (1) | CN110709743A (ja) |
BR (1) | BR112019020720A2 (ja) |
CA (1) | CA3056519A1 (ja) |
IL (1) | IL269823A (ja) |
WO (1) | WO2018185032A1 (ja) |
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CN112394457B (zh) * | 2020-11-17 | 2022-01-07 | 深圳市万兆通光电技术有限公司 | 一种光传输模块生产用基板封装装置 |
CN113985533A (zh) * | 2021-10-18 | 2022-01-28 | 上海曦智科技有限公司 | 光子半导体装置及其制造方法 |
EP4223213A1 (en) * | 2022-02-04 | 2023-08-09 | Indigo Diabetes N.V. | Sensor device |
EP4368098A1 (en) * | 2022-11-11 | 2024-05-15 | Stichting IMEC Nederland | A sensor device and a method for manufacturing a sensor device |
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EP2685297B1 (en) * | 2012-07-13 | 2017-12-06 | Huawei Technologies Co., Ltd. | A process for manufacturing a photonic circuit with active and passive structures |
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CN205262665U (zh) * | 2015-06-22 | 2016-05-25 | 意法半导体股份有限公司 | 压力传感器 |
US20170017050A1 (en) * | 2015-07-15 | 2017-01-19 | Lumentum Operations Llc | Optical transmitter assembly for vertical coupling |
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- 2018-03-30 CN CN201880023836.XA patent/CN110709743A/zh active Pending
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JP2002523774A (ja) | 1998-08-26 | 2002-07-30 | センサーズ・フォー・メデセン・アンド・サイエンス・インコーポレーテッド | 光学式検知装置 |
US20040245425A1 (en) | 2003-05-23 | 2004-12-09 | Franco Delpiano | Hermetic mounting arrangement for optical and optoelectronic sub-assemblies |
JP2005183903A (ja) | 2003-12-22 | 2005-07-07 | Rohm & Haas Electronic Materials Llc | 電子デバイスおよび電子デバイスを形成する方法 |
JP2005315871A (ja) | 2004-03-31 | 2005-11-10 | Terumo Corp | 体内物質測定用構成物、体内物質測定用構成物の製造方法、および埋込型物質センサー |
JP2006013484A (ja) | 2004-06-24 | 2006-01-12 | Agilent Technol Inc | ウエハスケール・パッケージ用のリッドおよびその形成方法 |
JP2006043120A (ja) | 2004-08-04 | 2006-02-16 | Nippon Telegr & Teleph Corp <Ntt> | 生体センサ及び測定方法 |
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EP3385762A1 (en) | 2018-10-10 |
US20200310051A1 (en) | 2020-10-01 |
KR20190136007A (ko) | 2019-12-09 |
WO2018185032A1 (en) | 2018-10-11 |
IL269823A (en) | 2019-11-28 |
US11372176B2 (en) | 2022-06-28 |
CN110709743A (zh) | 2020-01-17 |
CA3056519A1 (en) | 2018-10-11 |
BR112019020720A2 (pt) | 2020-05-12 |
EP3607368A1 (en) | 2020-02-12 |
JP2020515870A (ja) | 2020-05-28 |
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