JP7121012B2 - 電気フォームステンシル印刷を使用するledパッケージ - Google Patents
電気フォームステンシル印刷を使用するledパッケージ Download PDFInfo
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- JP7121012B2 JP7121012B2 JP2019535939A JP2019535939A JP7121012B2 JP 7121012 B2 JP7121012 B2 JP 7121012B2 JP 2019535939 A JP2019535939 A JP 2019535939A JP 2019535939 A JP2019535939 A JP 2019535939A JP 7121012 B2 JP7121012 B2 JP 7121012B2
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- reservoir
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- stencil
- reflector cup
- dimensional
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 38
- 239000006260 foam Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 24
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 229920006336 epoxy molding compound Polymers 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000013021 overheating Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
Description
Claims (10)
- 発光デバイスを製造するための方法であって、
(i)キャビティを画定する反射器カップおよび(ii)該キャビティの底面に配置された複数の金属パッドを含む、パッケージ本体を提供するステップと、
前記反射器カップの前記キャビティの中へ置かれた3次元電気フォームステンシルのリザーバを使用して、前記金属パッドそれぞれの上にそれぞれの半田パターンをデポジットするためにリザーバステンシル印刷を実行するステップであり、該3次元電気フォームステンシルのリップは、前記反射器カップの1つまたはそれ以上の側面の上部と係合するように置かれ、前記リザーバは、該リップから離れて、前記キャビティの中へ延在している、ステップと、
前記金属パッド上に形成された前記半田パターンの上にLEDダイを配置するステップであり、かつ、前記金属パッドに対して該LEDダイを取り付けるために半田リフローを使用する、ステップと、
を含む、方法。 - 前記リザーバは、第1開口部グループおよび第2開口部グループを含み、
前記第1開口部グループは、前記リザーバの底面の第1位置に形成されており、かつ、前記第2開口部グループは、前記リザーバの底面の第2位置に形成されている、
請求項1に記載の方法。 - 前記反射器カップは、反射性シリコーン成形コンパウンド(SMC)を含む、
請求項1に記載の方法。 - 前記キャビティは、4mm以下の深さを有している、
請求項1に記載の方法。 - 前記キャビティは、上部開口部を含み、該上部開口部は、前記LEDダイのフットプリントよりも30%以下だけ大きい、
請求項1に記載の方法。 - 前記リザーバステンシル印刷を実行するステップは、
前記3次元電気フォームステンシルの前記リザーバを半田ペーストで充填するステップと、
前記リザーバの底面に形成されている1つまたはそれ以上の開口部を通して前記半田ペーストを押し出すステップと、
を含む、請求項1に記載の方法。 - 前記半田ペーストは、金を含む、
請求項6に記載の方法。 - 前記方法は、さらに、
前記キャビティの形状に一致するマンドレルを使用して、前記3次元電気フォームステンシルを形成するステップ、
を含む、請求項1に記載の方法。 - 前記金属パッドの上面が、前記キャビティの前記底面の中央部分に配置されている、
請求項1に記載の方法。 - 前記3次元電気フォームステンシルは、少なくとも部分的にニッケルで形成されている、
請求項1に記載の方法。
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662440930P | 2016-12-30 | 2016-12-30 | |
US62/440,930 | 2016-12-30 | ||
EP17161845.7 | 2017-03-20 | ||
EP17161845 | 2017-03-20 | ||
US15/851,401 | 2017-12-21 | ||
US15/851,401 US10686109B2 (en) | 2016-12-30 | 2017-12-21 | LED package using electroform stencil printing |
PCT/US2017/068678 WO2018125985A1 (en) | 2016-12-30 | 2017-12-28 | Led package using electroform stencil printing |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020504906A JP2020504906A (ja) | 2020-02-13 |
JP7121012B2 true JP7121012B2 (ja) | 2022-08-17 |
Family
ID=60997579
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019535939A Active JP7121012B2 (ja) | 2016-12-30 | 2017-12-28 | 電気フォームステンシル印刷を使用するledパッケージ |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP3563428B1 (ja) |
JP (1) | JP7121012B2 (ja) |
KR (1) | KR102433236B1 (ja) |
CN (1) | CN110462852A (ja) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001177228A (ja) | 1999-12-17 | 2001-06-29 | Suzuka Fuji Xerox Co Ltd | 電子部品局部ハンダ印刷装置 |
JP2004228170A (ja) | 2003-01-20 | 2004-08-12 | Matsushita Electric Works Ltd | 配線板及び発光装置 |
WO2006112695A3 (en) | 2005-04-18 | 2006-12-14 | Stork Veco Bv | Method for electroforming a stencil, and a stencil of this type |
JP2010541208A (ja) | 2007-09-20 | 2010-12-24 | フライズ・メタルズ・インコーポレイテッド | 太陽電池表側のメタライズのための電気鋳造されたステンシル |
JP2013076780A (ja) | 2011-09-29 | 2013-04-25 | Stanley Electric Co Ltd | 光偏向器 |
JP2016515310A (ja) | 2014-03-05 | 2016-05-26 | ルーメンス カンパニー リミテッド | 発光素子パッケージ、バックライトユニット、照明装置及び発光素子パッケージの製造方法 |
US20160300988A1 (en) | 2013-11-21 | 2016-10-13 | Lumens Co., Ltd. | Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6722275B2 (en) * | 2001-09-28 | 2004-04-20 | Photo Stencil, Llc | Reservoir stencil with relief areas and method of using |
CN102700275B (zh) * | 2012-05-25 | 2015-05-06 | 北京时代民芯科技有限公司 | 一种带腔体器件焊膏印刷的方法 |
CN104723707B (zh) * | 2015-03-24 | 2017-07-21 | 深圳市瑞丰光电子股份有限公司 | 一种钢网印刷工艺及模具 |
-
2017
- 2017-12-28 EP EP17830094.3A patent/EP3563428B1/en active Active
- 2017-12-28 CN CN201780087787.1A patent/CN110462852A/zh active Pending
- 2017-12-28 KR KR1020197022436A patent/KR102433236B1/ko active IP Right Grant
- 2017-12-28 JP JP2019535939A patent/JP7121012B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001177228A (ja) | 1999-12-17 | 2001-06-29 | Suzuka Fuji Xerox Co Ltd | 電子部品局部ハンダ印刷装置 |
JP2004228170A (ja) | 2003-01-20 | 2004-08-12 | Matsushita Electric Works Ltd | 配線板及び発光装置 |
WO2006112695A3 (en) | 2005-04-18 | 2006-12-14 | Stork Veco Bv | Method for electroforming a stencil, and a stencil of this type |
JP2010541208A (ja) | 2007-09-20 | 2010-12-24 | フライズ・メタルズ・インコーポレイテッド | 太陽電池表側のメタライズのための電気鋳造されたステンシル |
JP2013076780A (ja) | 2011-09-29 | 2013-04-25 | Stanley Electric Co Ltd | 光偏向器 |
US20160300988A1 (en) | 2013-11-21 | 2016-10-13 | Lumens Co., Ltd. | Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package |
JP2016515310A (ja) | 2014-03-05 | 2016-05-26 | ルーメンス カンパニー リミテッド | 発光素子パッケージ、バックライトユニット、照明装置及び発光素子パッケージの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR102433236B1 (ko) | 2022-08-19 |
JP2020504906A (ja) | 2020-02-13 |
CN110462852A (zh) | 2019-11-15 |
EP3563428B1 (en) | 2021-02-17 |
KR20190104047A (ko) | 2019-09-05 |
EP3563428A1 (en) | 2019-11-06 |
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