JP7115582B2 - 複合構造物および複合構造物を備えた半導体製造装置 - Google Patents

複合構造物および複合構造物を備えた半導体製造装置 Download PDF

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Publication number
JP7115582B2
JP7115582B2 JP2021045299A JP2021045299A JP7115582B2 JP 7115582 B2 JP7115582 B2 JP 7115582B2 JP 2021045299 A JP2021045299 A JP 2021045299A JP 2021045299 A JP2021045299 A JP 2021045299A JP 7115582 B2 JP7115582 B2 JP 7115582B2
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less
depth
composite structure
fluorine
plasma
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English (en)
Japanese (ja)
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JP2021177542A (ja
Inventor
宏明 芦澤
亮人 滝沢
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Toto Ltd
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Toto Ltd
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Priority to TW110114028A priority Critical patent/TWI778587B/zh
Priority to TW111131887A priority patent/TW202302910A/zh
Priority to US17/244,247 priority patent/US11802085B2/en
Priority to KR1020210055503A priority patent/KR102582528B1/ko
Priority to CN202110485046.7A priority patent/CN113582726A/zh
Publication of JP2021177542A publication Critical patent/JP2021177542A/ja
Priority to JP2022119989A priority patent/JP2022169531A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
    • C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
    • C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
    • C23C4/11—Oxides

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Structural Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Physical Vapour Deposition (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
JP2021045299A 2020-04-30 2021-03-18 複合構造物および複合構造物を備えた半導体製造装置 Active JP7115582B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW110114028A TWI778587B (zh) 2020-04-30 2021-04-20 複合結構物及具備複合結構物之半導體製造裝置
TW111131887A TW202302910A (zh) 2020-04-30 2021-04-20 複合結構物及具備複合結構物之半導體製造裝置
US17/244,247 US11802085B2 (en) 2020-04-30 2021-04-29 Composite structure and semiconductor manufacturing apparatus including composite structure
KR1020210055503A KR102582528B1 (ko) 2020-04-30 2021-04-29 복합 구조물 및 복합 구조물을 구비한 반도체 제조 장치
CN202110485046.7A CN113582726A (zh) 2020-04-30 2021-04-30 复合结构物以及具备复合结构物的半导体制造装置
JP2022119989A JP2022169531A (ja) 2020-04-30 2022-07-27 複合構造物および複合構造物を備えた半導体製造装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020080287 2020-04-30
JP2020080288 2020-04-30
JP2020080288 2020-04-30
JP2020080287 2020-04-30

Related Child Applications (1)

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JP2022119989A Division JP2022169531A (ja) 2020-04-30 2022-07-27 複合構造物および複合構造物を備えた半導体製造装置

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JP2021177542A JP2021177542A (ja) 2021-11-11
JP7115582B2 true JP7115582B2 (ja) 2022-08-09

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JP2021045299A Active JP7115582B2 (ja) 2020-04-30 2021-03-18 複合構造物および複合構造物を備えた半導体製造装置

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JP (1) JP7115582B2 (ko)
KR (1) KR102582528B1 (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202237397A (zh) * 2021-03-29 2022-10-01 日商Ｔｏｔｏ股份有限公司 複合結構物及具備複合結構物之半導體製造裝置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297809A (ja) 2002-03-29 2003-10-17 Shinetsu Quartz Prod Co Ltd プラズマエッチング装置用部材及びその製造方法
JP2013512573A (ja) 2009-11-25 2013-04-11 グリーン， ツイード オブ デラウェア， インコーポレイテッド プラズマ耐性コーティングで基板をコーティングする方法および関連するコーティングされた基板
JP2016528380A (ja) 2013-06-20 2016-09-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマ耐食性希土類酸化物系薄膜コーティング
JP2019176593A (ja) 2018-03-28 2019-10-10 株式会社デンソー スタータ、及び、整流子表面の黒鉛皮膜形成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000290066A (ja) * 1999-04-05 2000-10-17 Nissei Mecs Corp 半導体製造装置用セラミックス部品
US7479464B2 (en) * 2006-10-23 2009-01-20 Applied Materials, Inc. Low temperature aerosol deposition of a plasma resistive layer
US20130288037A1 (en) * 2012-04-27 2013-10-31 Applied Materials, Inc. Plasma spray coating process enhancement for critical chamber components
US9916998B2 (en) * 2012-12-04 2018-03-13 Applied Materials, Inc. Substrate support assembly having a plasma resistant protective layer
US9976211B2 (en) * 2014-04-25 2018-05-22 Applied Materials, Inc. Plasma erosion resistant thin film coating for high temperature application
KR102395660B1 (ko) * 2017-12-19 2022-05-10 (주)코미코 용사 재료 및 그 용사 재료로 제조된 용사 피막

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297809A (ja) 2002-03-29 2003-10-17 Shinetsu Quartz Prod Co Ltd プラズマエッチング装置用部材及びその製造方法
JP2013512573A (ja) 2009-11-25 2013-04-11 グリーン， ツイード オブ デラウェア， インコーポレイテッド プラズマ耐性コーティングで基板をコーティングする方法および関連するコーティングされた基板
JP2016528380A (ja) 2013-06-20 2016-09-15 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ プラズマ耐食性希土類酸化物系薄膜コーティング
JP2019176593A (ja) 2018-03-28 2019-10-10 株式会社デンソー スタータ、及び、整流子表面の黒鉛皮膜形成方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
鈴木雅人ら，プラズマ溶射により作製したAl2O3/YAGコンポジットコーティングの構造制御と特性，日本金属学会誌，日本，2005年，第69巻,第1号，p.23-30

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JP2021177542A (ja) 2021-11-11
KR102582528B1 (ko) 2023-09-26

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