JP7113271B2 - 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 - Google Patents
樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 Download PDFInfo
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- JP7113271B2 JP7113271B2 JP2019529026A JP2019529026A JP7113271B2 JP 7113271 B2 JP7113271 B2 JP 7113271B2 JP 2019529026 A JP2019529026 A JP 2019529026A JP 2019529026 A JP2019529026 A JP 2019529026A JP 7113271 B2 JP7113271 B2 JP 7113271B2
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Description
本実施例において、樹脂組成物を調製する際に用いる各成分について説明する。
変性PPE-1:ポリフェニレンエーテルの末端水酸基をメタクリル基で変性した変性ポリフェニレンエーテル(式(14)に示す構造を有し、式(14)中、R8がメチル基であり、Yがジメチルメチレン基(式(8)で表され、式(8)中のR9及びR10がメチル基である基)である変性ポリフェニレンエーテル化合物、SABICイノベーティブプラスチックス社製のSA9000、重量平均分子量Mw1700、末端官能基数2個)
変性PPE-2:
ポリフェニレンエーテルとクロロメチルスチレンとを反応させて得られた変性ポリフェニレンエーテルである。
ここで、εは、吸光係数を示し、4700L/mol・cmである。また、OPLは、セル光路長であり、1cmである。
TAIC:トリアリルイソシアヌレート(日本化成株式会社製のTAIC、分子量249、末端二重結合数3個)
DVB:ジビニルベンゼン(新日鐵住金株式会社製のDVB810、分子量130、末端二重結合数2個)
(反応開始剤)
過酸化物:1,3-ビス(ブチルパーオキシイソプロピル)ベンゼン(日油株式会社製のパーブチルP)
(シランカップリング剤)
ビニル基:分子中にビニル基を有するシランカップリング剤(ビニルトリエトキシシラン、信越化学工業株式会社製のKBM-1003)
グリシドキシ基:分子中にグリシドキシ基を有するシランカップリング剤(3-グリシドキシプロピルトリエトキシシラン、信越化学工業株式会社製のKBM-403)
メタクリロキシ基:分子中にメタクリロキシ基を有するシランカップリング剤(3-メタクリロキシプロピルトリメトキシシラン、信越化学工業株式会社製のKBM-503)
アミノ基:分子中にアミノ基を有するシランカップリング剤(3-アミノプロピルトリエトキシシラン、信越化学工業株式会社製のKBM-903)
フェニルアミノ基:分子中にフェニルアミノ基を有するシランカップリング剤(N-フェニル-3-アミノプロピルトリメトキシシラン、信越化学工業株式会社製のKBM-573)
ウレイド基:分子中にウレイド基を有するシランカップリング剤(3-ウレイドプロピルトリエトキシシラン、信越化学工業株式会社製のKBE-585)
(難燃剤:相溶性リン化合物)
ホスファゼン化合物:環状ホスファゼン化合物(大塚化学株式会社製のSPB-100:リン濃度13質量%)
(難燃剤:非相溶性リン化合物)
ホスフィンオキサイド化合物:パラキシリレンビスジフェニルホスフィンオキサイド(晋一化工有限公司製のPQ60)
ホスフィン酸塩化合物:トリスジエチルホスフィン酸アルミニウム(クラリアントジャパン株式会社製のエクソリットOP-935:リン濃度23質量%)
(分散剤)
分散剤1:リン酸エステル系分散剤(リン酸基とイミダゾリン基とを有する分散剤、ビックケミー・ジャパン株式会社製のBYK-W969、酸価(固形分換算)75mgKOH/g、アミン価(固形分換算)75mgKOH/g)
分散剤2:高級脂肪酸エステル系分散剤(カルボキシル基とアミノ基とを有する分散剤、ビックケミー・ジャパン株式会社製のBYK-W966、酸価(固形分換算)50mgKOH/g、アミン価(固形分換算)37mgKOH/g)
(シリカ)
シリカ粒子:株式会社アドマテックス製のSC-2300SVJ
破砕状シリカ:シベルコ社製のMegasil525
まず、各成分を表1~3に記載の配合割合(質量部)で、固形分濃度が60質量%となるように、トルエンに添加し、混合させた、その混合物を、80℃になるまで加熱し、80℃のままで60分間攪拌することによって、ワニス状の樹脂組成物(ワニス)が得られた。
各プリプレグの樹脂流れ性は、IPC法(IPC-TM-650 2.3.17.2に準拠の方法)で測定した。
前記銅張積層板の両面の銅箔に対して、それぞれ、残銅率が20、40、50、60、80%となるように、格子状のパターンを形成して、回路を形成した。すなわち、残銅率の異なる格子状のパターン回路を積層体面内に形成した。この回路が形成された基板の両面に、プリプレグを1枚ずつ積層し、銅張積層板を製造したときと同じ条件で、加熱加圧を行った。この形成された積層体(評価用積層体)において、すべての異なる残銅率の回路間に、プリプレグ由来の樹脂等が充分に入り込み、ボイドが形成されていなければ、「○」と評価した。すなわち、回路間に、ボイドが確認できなければ、「○」と評価した。また、異なる残銅率の回路間で、一部の回路においてボイドが確認されれば、「△」と評価し、また、すべての回路間でボイドが確認されれば「×」と評価した。ボイドは目視で確認できる。
セイコーインスツルメンツ株式会社製の粘弾性スペクトロメータ「DMS100」を用いて、プリプレグのTgを測定した。このとき、曲げモジュールで周波数を10Hzとして動的粘弾性測定(DMA)を行い、昇温速度5℃/分の条件で室温から280℃まで昇温した際のtanδが極大を示す温度をTgとした。
まず、前記プリプレグを硬化して得られた絶縁層をコア材とし、このコア材を、温度85℃、相対湿度85%の条件下で240時間放置し、コア材を吸湿させた。この吸湿後のコア材の上に、前記プリプレグを積層して得られた、多層の金属張積層板における、最上面にあるプリプレグを引き剥がした。このとき、通常の接着状態であれば、「○」と評価し、異常な接着状態であれば、「×」と評価した。また、全面的には接着されている状態であるが、部分的に異常な接着状態の箇所が存在すれば、「△」と評価した。
耐熱性(T-288)は、JIS C 6481に準拠の方法で測定する。具体的には、評価基板を、121℃、2気圧(0.2MPa)、6時間のプレッシャークッカーテスト(PCT)を行う。そのPCT後の評価基板を、288℃の半田槽中に浸漬した。浸漬した評価基板に、デラミネーションが発生するまでの時間を測定した。なお、120秒以上であれば、表1~3において「↑120」と表記する。
1GHzにおける評価基板の比誘電率及び誘電正接を、IPC-TM650-2.5.5.9に準拠の方法で測定した。具体的には、インピーダンスアナライザ(アジレント・テクノロジー株式会社製のRFインピーダンスアナライザ HP4291B)を用い、1GHzにおける評価基板の比誘電率及び誘電正接を測定した。
Claims (11)
- 炭素-炭素不飽和二重結合を有する置換基により末端変性された変性ポリフェニレンエーテル化合物と、
炭素-炭素不飽和二重結合を分子中に有し、前記変性ポリフェニレンエーテル化合物と反応する架橋型硬化剤と、
フェニルアミノ基を分子中に有するシランカップリング剤と、
シリカとを含有し、
前記変性ポリフェニレンエーテル化合物の含有量は、前記変性ポリフェニレンエーテル化合物と前記架橋型硬化剤との合計100質量部に対して、70~85質量部であり、
前記シリカの含有量が、前記変性ポリフェニレンエーテル化合物及び前記架橋型硬化剤の合計100質量部に対して、60~250質量部であり、
前記シランカップリング剤の含有量が、前記シリカ100質量部に対して、0.3~5質量部であることを特徴とする樹脂組成物。 - 難燃剤をさらに含有し、
前記難燃剤は、前記変性ポリフェニレンエーテル化合物及び前記架橋型硬化剤の混合物に相溶する相溶性リン化合物と、前記混合物に相溶しない非相溶性リン化合物とを含む請求項1に記載の樹脂組成物。 - 前記相溶性リン化合物の含有量が、前記相溶性リン化合物及び前記非相溶性リン化合物の合計含有量に対して、3~19質量%である請求項2に記載の樹脂組成物。
- 前記相溶性リン化合物が、ホスファゼン化合物である請求項2又は請求項3に記載の樹脂組成物。
- 前記置換基が、ビニルベンジル基、アクリレート基、及びメタクリレート基からなる群から選ばれる少なくとも1種を有する置換基である請求項1~4のいずれか1項に記載の樹脂組成物。
- 前記シリカが、破砕状シリカ又はシリカ粒子である請求項1~5のいずれか1項に記載の樹脂組成物。
- 請求項1~6のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物と、繊維質基材とを備えることを特徴とするプリプレグ。
- 請求項1~6のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物を含む樹脂層と、支持フィルムとを備えることを特徴とする樹脂付きフィルム。
- 請求項1~6のいずれか1項に記載の樹脂組成物又は前記樹脂組成物の半硬化物を含む樹脂層と、金属箔とを備えることを特徴とする樹脂付き金属箔。
- 請求項1~6のいずれか1項に記載の樹脂組成物の硬化物を含む絶縁層と、金属箔とを備えることを特徴とする金属張積層板。
- 請求項1~6のいずれか1項に記載の樹脂組成物の硬化物を含む絶縁層と、配線とを備えることを特徴とする配線板。
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WO2019012954A1 (ja) | 2019-01-17 |
CN110869403A (zh) | 2020-03-06 |
JPWO2019012954A1 (ja) | 2020-05-07 |
TW201908408A (zh) | 2019-03-01 |
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