JP7088435B2 - ベイパーチャンバー - Google Patents

ベイパーチャンバー Download PDF

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Publication number
JP7088435B2
JP7088435B2 JP2022504714A JP2022504714A JP7088435B2 JP 7088435 B2 JP7088435 B2 JP 7088435B2 JP 2022504714 A JP2022504714 A JP 2022504714A JP 2022504714 A JP2022504714 A JP 2022504714A JP 7088435 B2 JP7088435 B2 JP 7088435B2
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JP
Japan
Prior art keywords
wick
area
microchannel
vapor chamber
plan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022504714A
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English (en)
Japanese (ja)
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JPWO2021229961A5 (https=
JPWO2021229961A1 (https=
Inventor
朗人 内藤
信人 椿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/874,853 external-priority patent/US11013145B1/en
Priority claimed from US16/874,878 external-priority patent/US20210356214A1/en
Priority claimed from US16/874,782 external-priority patent/US11473849B2/en
Priority claimed from US16/874,937 external-priority patent/US11585606B2/en
Priority claimed from US16/874,801 external-priority patent/US11473850B2/en
Priority claimed from US16/874,898 external-priority patent/US20210356211A1/en
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2021229961A1 publication Critical patent/JPWO2021229961A1/ja
Publication of JPWO2021229961A5 publication Critical patent/JPWO2021229961A5/ja
Application granted granted Critical
Publication of JP7088435B2 publication Critical patent/JP7088435B2/ja
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
JP2022504714A 2020-05-15 2021-04-07 ベイパーチャンバー Active JP7088435B2 (ja)

Applications Claiming Priority (15)

Application Number Priority Date Filing Date Title
US202016874749A 2020-05-15 2020-05-15
US16/874,749 2020-05-15
US16/874,878 US20210356214A1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,782 US11473849B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,898 2020-05-15
US16/874,801 2020-05-15
US16/874,937 2020-05-15
US16/874,937 US11585606B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,853 2020-05-15
US16/874,801 US11473850B2 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,853 US11013145B1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,782 2020-05-15
US16/874,898 US20210356211A1 (en) 2020-05-15 2020-05-15 Vapor chamber
US16/874,878 2020-05-15
PCT/JP2021/014797 WO2021229961A1 (ja) 2020-05-15 2021-04-07 ベイパーチャンバー

Publications (3)

Publication Number Publication Date
JPWO2021229961A1 JPWO2021229961A1 (https=) 2021-11-18
JPWO2021229961A5 JPWO2021229961A5 (https=) 2022-04-26
JP7088435B2 true JP7088435B2 (ja) 2022-06-21

Family

ID=78525759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022504714A Active JP7088435B2 (ja) 2020-05-15 2021-04-07 ベイパーチャンバー

Country Status (3)

Country Link
JP (1) JP7088435B2 (https=)
CN (1) CN219037720U (https=)
WO (1) WO2021229961A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN218483134U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件以及电子设备
CN218483131U (zh) * 2022-01-25 2023-02-14 株式会社村田制作所 热扩散器件和电子设备
JP2023150314A (ja) * 2022-03-31 2023-10-16 住友精密工業株式会社 沸騰式冷却器の製造方法および沸騰式冷却器
CN223965937U (zh) * 2022-10-06 2026-03-03 株式会社村田制作所 热扩散装置和电子设备
WO2024122400A1 (ja) * 2022-12-07 2024-06-13 株式会社村田製作所 熱拡散デバイス及び電子機器

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243035A (ja) 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
US20150226493A1 (en) 2009-03-06 2015-08-13 Kelvin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
WO2018003957A1 (ja) 2016-07-01 2018-01-04 古河電気工業株式会社 ベーパーチャンバ
JP2018503058A (ja) 2015-01-22 2018-02-01 ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． 高いパフォーマンスを有する２相冷却装置
WO2018199216A1 (ja) 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
JP2018189349A (ja) 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
JP2019020001A (ja) 2017-07-12 2019-02-07 株式会社村田製作所 ベーパーチャンバー
WO2020026907A1 (ja) 2018-07-31 2020-02-06 株式会社村田製作所 ベーパーチャンバー
US20200103176A1 (en) 2018-09-28 2020-04-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150226493A1 (en) 2009-03-06 2015-08-13 Kelvin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
JP2010243035A (ja) 2009-04-03 2010-10-28 Sony Corp 熱輸送装置、電子機器及び熱輸送装置の製造方法
JP2018503058A (ja) 2015-01-22 2018-02-01 ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． 高いパフォーマンスを有する２相冷却装置
WO2018003957A1 (ja) 2016-07-01 2018-01-04 古河電気工業株式会社 ベーパーチャンバ
WO2018199216A1 (ja) 2017-04-28 2018-11-01 株式会社村田製作所 ベーパーチャンバー
JP2018189349A (ja) 2017-04-28 2018-11-29 株式会社村田製作所 ベーパーチャンバー
JP2019020001A (ja) 2017-07-12 2019-02-07 株式会社村田製作所 ベーパーチャンバー
WO2020026907A1 (ja) 2018-07-31 2020-02-06 株式会社村田製作所 ベーパーチャンバー
US20200103176A1 (en) 2018-09-28 2020-04-02 Microsoft Technology Licensing, Llc Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid

Also Published As

Publication number Publication date
JPWO2021229961A1 (https=) 2021-11-18
CN219037720U (zh) 2023-05-16
WO2021229961A1 (ja) 2021-11-18

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