JPWO2021229961A1 - - Google Patents
Info
- Publication number
- JPWO2021229961A1 JPWO2021229961A1 JP2022504714A JP2022504714A JPWO2021229961A1 JP WO2021229961 A1 JPWO2021229961 A1 JP WO2021229961A1 JP 2022504714 A JP2022504714 A JP 2022504714A JP 2022504714 A JP2022504714 A JP 2022504714A JP WO2021229961 A1 JPWO2021229961 A1 JP WO2021229961A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (15)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202016874749A | 2020-05-15 | 2020-05-15 | |
| US16/874,749 | 2020-05-15 | ||
| US16/874,878 US20210356214A1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,782 US11473849B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,898 | 2020-05-15 | ||
| US16/874,801 | 2020-05-15 | ||
| US16/874,937 | 2020-05-15 | ||
| US16/874,937 US11585606B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,853 | 2020-05-15 | ||
| US16/874,801 US11473850B2 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,853 US11013145B1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,782 | 2020-05-15 | ||
| US16/874,898 US20210356211A1 (en) | 2020-05-15 | 2020-05-15 | Vapor chamber |
| US16/874,878 | 2020-05-15 | ||
| PCT/JP2021/014797 WO2021229961A1 (ja) | 2020-05-15 | 2021-04-07 | ベイパーチャンバー |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021229961A1 true JPWO2021229961A1 (https=) | 2021-11-18 |
| JPWO2021229961A5 JPWO2021229961A5 (https=) | 2022-04-26 |
| JP7088435B2 JP7088435B2 (ja) | 2022-06-21 |
Family
ID=78525759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022504714A Active JP7088435B2 (ja) | 2020-05-15 | 2021-04-07 | ベイパーチャンバー |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7088435B2 (https=) |
| CN (1) | CN219037720U (https=) |
| WO (1) | WO2021229961A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN218483134U (zh) * | 2022-01-25 | 2023-02-14 | 株式会社村田制作所 | 热扩散器件以及电子设备 |
| CN218483131U (zh) * | 2022-01-25 | 2023-02-14 | 株式会社村田制作所 | 热扩散器件和电子设备 |
| JP2023150314A (ja) * | 2022-03-31 | 2023-10-16 | 住友精密工業株式会社 | 沸騰式冷却器の製造方法および沸騰式冷却器 |
| CN223965937U (zh) * | 2022-10-06 | 2026-03-03 | 株式会社村田制作所 | 热扩散装置和电子设备 |
| WO2024122400A1 (ja) * | 2022-12-07 | 2024-06-13 | 株式会社村田製作所 | 熱拡散デバイス及び電子機器 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010243035A (ja) * | 2009-04-03 | 2010-10-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
| US20150226493A1 (en) * | 2009-03-06 | 2015-08-13 | Kelvin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
| WO2018003957A1 (ja) * | 2016-07-01 | 2018-01-04 | 古河電気工業株式会社 | ベーパーチャンバ |
| JP2018503058A (ja) * | 2015-01-22 | 2018-02-01 | ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． | 高いパフォーマンスを有する２相冷却装置 |
| WO2018199216A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
| JP2018189349A (ja) * | 2017-04-28 | 2018-11-29 | 株式会社村田製作所 | ベーパーチャンバー |
| JP2019020001A (ja) * | 2017-07-12 | 2019-02-07 | 株式会社村田製作所 | ベーパーチャンバー |
| WO2020026907A1 (ja) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | ベーパーチャンバー |
| US20200103176A1 (en) * | 2018-09-28 | 2020-04-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
-
2021
- 2021-04-07 WO PCT/JP2021/014797 patent/WO2021229961A1/ja not_active Ceased
- 2021-04-07 JP JP2022504714A patent/JP7088435B2/ja active Active
- 2021-04-07 CN CN202190000458.0U patent/CN219037720U/zh active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150226493A1 (en) * | 2009-03-06 | 2015-08-13 | Kelvin Thermal Technologies, Inc. | Flexible thermal ground plane and manufacturing the same |
| JP2010243035A (ja) * | 2009-04-03 | 2010-10-28 | Sony Corp | 熱輸送装置、電子機器及び熱輸送装置の製造方法 |
| US9835383B1 (en) * | 2013-03-15 | 2017-12-05 | Hrl Laboratories, Llc | Planar heat pipe with architected core and vapor tolerant arterial wick |
| JP2018503058A (ja) * | 2015-01-22 | 2018-02-01 | ピメムズ インコーポレイテッドＰｉＭＥＭＳ， Ｉｎｃ． | 高いパフォーマンスを有する２相冷却装置 |
| WO2018003957A1 (ja) * | 2016-07-01 | 2018-01-04 | 古河電気工業株式会社 | ベーパーチャンバ |
| WO2018199216A1 (ja) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | ベーパーチャンバー |
| JP2018189349A (ja) * | 2017-04-28 | 2018-11-29 | 株式会社村田製作所 | ベーパーチャンバー |
| JP2019020001A (ja) * | 2017-07-12 | 2019-02-07 | 株式会社村田製作所 | ベーパーチャンバー |
| WO2020026907A1 (ja) * | 2018-07-31 | 2020-02-06 | 株式会社村田製作所 | ベーパーチャンバー |
| US20200103176A1 (en) * | 2018-09-28 | 2020-04-02 | Microsoft Technology Licensing, Llc | Two-phase thermodynamic system having a porous microstructure sheet to increase an aggregate thin-film evaporation area of a working fluid |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7088435B2 (ja) | 2022-06-21 |
| CN219037720U (zh) | 2023-05-16 |
| WO2021229961A1 (ja) | 2021-11-18 |
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