JP7086986B2 - 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 - Google Patents

保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 Download PDF

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Publication number
JP7086986B2
JP7086986B2 JP2019551240A JP2019551240A JP7086986B2 JP 7086986 B2 JP7086986 B2 JP 7086986B2 JP 2019551240 A JP2019551240 A JP 2019551240A JP 2019551240 A JP2019551240 A JP 2019551240A JP 7086986 B2 JP7086986 B2 JP 7086986B2
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Japan
Prior art keywords
protective film
forming
sensitive adhesive
meth
pressure
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JP2019551240A
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Japanese (ja)
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JPWO2019082966A1 (ja
Inventor
力也 小橋
洋一 稲男
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Lintec Corp
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Lintec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/16—Layered products comprising a layer of synthetic resin specially treated, e.g. irradiated
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Dicing (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Formation Of Insulating Films (AREA)
JP2019551240A 2017-10-27 2018-10-25 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法 Active JP7086986B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017208437 2017-10-27
JP2017208437 2017-10-27
PCT/JP2018/039660 WO2019082966A1 (ja) 2017-10-27 2018-10-25 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法

Publications (2)

Publication Number Publication Date
JPWO2019082966A1 JPWO2019082966A1 (ja) 2020-12-17
JP7086986B2 true JP7086986B2 (ja) 2022-06-20

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JP2019551240A Active JP7086986B2 (ja) 2017-10-27 2018-10-25 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法

Country Status (5)

Country Link
JP (1) JP7086986B2 (ko)
KR (1) KR102448152B1 (ko)
CN (1) CN111279468B (ko)
TW (1) TWI791650B (ko)
WO (1) WO2019082966A1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7457513B2 (ja) 2020-02-03 2024-03-28 リンテック株式会社 保護膜形成フィルム、保護膜形成用複合シートおよび装置の製造方法
JP2022152297A (ja) 2021-03-29 2022-10-12 リンテック株式会社 支持シート、樹脂膜形成用複合シート、キット、及び、樹脂膜付きチップの製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148496A1 (ja) 2013-03-19 2014-09-25 リンテック株式会社 保護膜形成用フィルム
WO2017163971A1 (ja) 2016-03-24 2017-09-28 リンテック株式会社 支持シート及び保護膜形成用複合シート

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007084722A (ja) * 2005-09-22 2007-04-05 Nitto Denko Corp 粘着シートとその製造方法、及び、製品の加工方法
JP5144433B2 (ja) 2008-08-28 2013-02-13 古河電気工業株式会社 チップ保護用フィルム
SG11201607716PA (en) * 2014-03-24 2016-11-29 Lintec Corp Protection membrane forming film, protection membrane forming utilization sheet, production method and inspection method for workpiece or processed product, workpiece determined as adequate product, and processed product determined as adequate product
CN113980535A (zh) * 2014-10-29 2022-01-28 琳得科株式会社 保护膜形成膜、保护膜形成用复合片、以及带保护膜的半导体芯片的制造方法
JP6659308B2 (ja) * 2015-11-04 2020-03-04 リンテック株式会社 第１保護膜形成用シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014148496A1 (ja) 2013-03-19 2014-09-25 リンテック株式会社 保護膜形成用フィルム
WO2017163971A1 (ja) 2016-03-24 2017-09-28 リンテック株式会社 支持シート及び保護膜形成用複合シート

Also Published As

Publication number Publication date
JPWO2019082966A1 (ja) 2020-12-17
CN111279468B (zh) 2023-10-20
KR20200080237A (ko) 2020-07-06
WO2019082966A1 (ja) 2019-05-02
TW201936827A (zh) 2019-09-16
TWI791650B (zh) 2023-02-11
CN111279468A (zh) 2020-06-12
KR102448152B1 (ko) 2022-09-27

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